WJA1510 +5V Active-Bias InGaP HBT Gain Block Product Features * * * * * * * * * Cascadable gain block 50 - 1000 MHz 14 dB Gain +20 dBm P1dB +47 dBm OIP3 +61 dBm OIP2 Operates from +5V @ 95mA Robust 1000V ESD, Class 1C RoHS-compliant SOT-89 package Applications * * * * * IF Amplifier VHF/UHF Transmission Wireless Infrastructure General Purpose CATV / FTTH The WJA1510 is cascadable gain block that offers high linearity in a low-cost surface-mount package. At 200 MHz, the WJA1510 typically provides 14 dB gain, +47 dBm OIP3, and +20 dBm P1dB. The device is housed in a RoHS-compliant SOT-89 industry-standard SMT package using a NiPdAu plating to eliminate the possibility of tin whiskering. Operational Bandwidth Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Output IP2 Noise Figure Device Voltage Device Current GND 4 The WJA1510 consists of Darlington pair amplifiers using a high reliability InGaP/GaAs HBT process technology. The MMIC amplifier is internally matched to 50 and only requires DC-blocking capacitors and a bias inductor for operation. An internal active bias is designed to enable stable performance over temperature. A dropping bias resistor is not required allowing the device to be biased directly from +5V supply voltage. 1 2 3 RF IN GND RF OUT Function Input Output/Bias Ground Pin No. 1 3 2, 4 The amplifier is targeted for high performance IF applications in existing and next generation wireless technologies. The WJA1510 is ideal for general purpose applications such as LO buffering, IF amplifier and pre-driver stages within the 50 to 1000 MHz frequency range. Specifications (1) Parameter Functional Diagram Product Description Typical Performance (3) Units Min MHz MHz dB dB dB dBm dBm dBm dB V mA 50 12.8 +40 82 Typ 200 14.4 11 16 +19.8 +47.0 +61.2 5.4 5 95 Max Parameter Units 1000 Frequency S21 S11 S22 Output P1dB Output IP3 (2) Output IP2 Noise Figure 15.8 MHz dB dB dB dBm dBm dBm dB Typical 70 170 240 500 900 15.0 14.3 14.2 14.1 13.8 -10 -11 -12 -13 -16 -20 -17 -16 -17 -15 +19.6 +19.7 +19.8 +19.8 19.6 +41.6 +48.0 +52.5 +40.8 +36.1 60.1 61.4 61.2 64.1 64.2 5.2 5.3 5.4 5.6 6 3. Listed typical performance parameters measured on evaluation board 102 1. Test conditions: 25 C, Supply Voltage = +5 V, 50 System. S-parameters and 3OIP measured at device pins. All other specifications measured on evaluation board. 2. 3OIP measured with two tones at an output power of 8 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Absolute Maximum Rating Parameter Storage Temperature Supply Voltage Input Power jc (junction to paddle) Maximum Junction Temperature Rating -55 to +150 C +6.5 V +24 dBm 78 C / W 150 C Operation of this device above any of these parameters may cause permanent damage. Ordering Information Part No. WJA1510 WJA1510-PCB Description +5V Active Bias InGaP HBT Gain Block (lead-free/green/RoHS-compliant SOT-89 Package) 50 - 1000 MHz Fully Assembled Eval. Board Standard Tape / Reel size = 1000 pieces on a 7 reel Specifications and information are subject to change without notice Triquint Semiconductor Inc. * Phone 1-800-WJ1-4401 * FAX: 408-577-6633 * e-mail: info-sales@tqs.com * Web site: www.TriQuint.com Page 1 of 4 October 2008 WJA1510 +5V Active-Bias InGaP HBT Gain Block Typical Evaluation Board RF Performance Supply Bias = +5V, Icc = 95 mA 1. Test conditions: T = 25 C, Supply Voltage = +5 V, Icc = 95 mA typical, 50 System. 2. 3OIP measured with two tones at an output power of 8 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Return Loss Gain vs. Frequency Noise Figure vs. Frequency T=25C 10 0 20 9 -5 18 8 16 -15 14 7 NF (dB) S11, S22 (dB) Gain (dB) -10 6 5 -20 4 12 -40C +25C -25 +85C S22 500 1000 Frequency (MHz) 1500 200 400 600 Frequency (MHz) Gain vs. Pout OIP3 vs. Frequency Freq = 200 MHz Pout =8 dBm/tone 55 18 50 OIP3 (dBm) 20 16 14 12 800 0 1000 12 14 16 Pout (dBm) 18 35 800 1000 40 35 30 -40C 200 +25C +85C 400 600 Frequency (MHz) 800 25 4.5 1000 4.6 4.7 4.8 4.9 Vcc (V) 5 5.1 5.2 P1dB vs. Vcc P1dB vs. Frequency OIP2 vs. Frequency 22 22 75 600 OIP3 vs. Vcc 40 0 Pout = 4 dBm/tone 400 50 45 20 200 Frequency (MHz) 25 10 +85C 45 30 10 +25C 2 0 2000 OIP3 (dBm) 0 -40C 3 -30 10 Gain (dB) S11 20 70 65 60 55 P1dB (dBm) P1dB (dBm) OIP2 (dBm) 21 20 18 16 14 19 12 50 -40C 45 +25C +85C 10 4.7 18 0 200 400 600 Frequency (MHz) 800 1000 0 200 400 600 Frequency (MHz) 800 1000 4.8 4.9 5 5.1 5.2 Vcc (V) Icc vs. Vcc Icc vs. Temperature Vcc = +5V 160 100 140 95 Icc (mA) Icc (mA) 120 90 85 100 80 60 80 75 -50 40 -25 0 25 Temperature (C) 50 75 100 20 4.0 -40C 4.5 +25C 5.0 Vcc (V) +85C 5.5 6.0 Specifications and information are subject to change without notice Triquint Semiconductor Inc. * Phone 1-800-WJ1-4401 * FAX: 408-577-6633 * e-mail: info-sales@tqs.com * Web site: www.TriQuint.com Page 2 of 4 October 2008 WJA1510 +5V Active-Bias InGaP HBT Gain Block Vcc=+5.00V Icc = 95 mA Application Circuit R4 0 C3 Bypass Capacitor L1 RF Choke RF IN RF OUT WJA1510 C1 Blocking Capacitor R1 0 R2 0 C2 Blocking Capacitor Recommended Component Values (1) Ref. Name Value / Type L1 470 nH ferrite core wire wound inductor (2) C1, C2 1000 pF NPO chip capacitor C3 0.018 F chip capacitor R1, R2, R4 0 (3) C4, C5, C6, Do Not Place (3) R3, R5, R6, R7, R8 1. 2. 3. Size 0805 0603 0603 0603 The listed values are contained on the evaluation board to achieve optimal broadband performance For lower cost and performance (100 - 1000 MHz) option use 470 nH air core wire wound inductor. Place holders for the 0 resistors and "Do Not Place" references are not needed for final design. Typical Device Data S-Parameters (Vdevice = +5V, ICC = 95 mA, T = 25 C, calibrated to device leads) Freq (MHz) 10 50 100 150 200 250 300 350 400 450 500 550 600 650 700 750 800 850 900 950 1000 1050 1100 1150 1200 S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) -12.77 -11.98 -11.87 -11.93 -11.87 -11.90 -11.89 -11.89 -11.94 -11.98 -11.99 -12.07 -12.12 -12.27 -12.31 -12.47 -12.57 -12.76 -13.04 -13.23 -13.42 -13.61 -13.77 -14.14 -14.41 -64.38 -145.22 -163.57 -170.62 -174.76 -177.65 -179.69 179.27 177.23 177.47 175.53 173.93 173.55 173.05 172.54 171.88 170.01 169.51 168.70 167.72 165.38 163.73 163.33 162.01 160.56 18.95 15.46 14.75 14.56 14.46 14.44 14.42 14.45 14.43 14.44 14.41 14.41 14.37 14.38 14.34 14.33 14.29 14.32 14.25 14.33 14.32 14.25 14.23 14.25 14.21 166.61 163.24 166.21 165.57 163.82 162.12 159.72 156.83 154.00 151.77 148.73 146.00 143.20 140.60 137.35 135.52 132.20 128.96 126.41 123.61 120.57 117.69 114.82 111.79 108.31 -22.12 -19.23 -19.02 -18.93 -18.91 -18.87 -18.91 -18.93 -18.89 -18.89 -18.83 -18.94 -18.95 -18.89 -18.91 -18.84 -18.88 -18.88 -18.82 -18.89 -18.92 -18.82 -18.85 -18.84 -18.92 17.45 6.80 2.10 -0.28 -2.15 -3.79 -5.44 -6.35 -7.81 -9.08 -10.20 -12.28 -13.22 -14.33 -15.26 -17.12 -18.53 -19.15 -20.48 -22.20 -23.12 -24.34 -26.17 -27.43 -28.23 -9.47 -14.81 -16.15 -16.59 -16.66 -16.80 -16.91 -16.99 -17.12 -17.09 -17.27 -17.28 -17.44 -17.44 -17.30 -17.44 -17.48 -17.28 -16.99 -16.70 -16.51 -16.14 -15.89 -15.46 -15.17 -43.08 -120.56 -145.12 -154.63 -160.13 -162.79 -163.90 -164.35 -165.69 -164.34 -166.02 -165.90 -166.63 -165.69 -163.67 -163.09 -162.89 -160.27 -158.37 -156.62 -155.86 -153.31 -151.81 -150.31 -148.90 Device S-parameters are available for download from the website at: http://www.triquint.com Specifications and information are subject to change without notice Triquint Semiconductor Inc. * Phone 1-800-WJ1-4401 * FAX: 408-577-6633 * e-mail: info-sales@tqs.com * Web site: www.TriQuint.com Page 3 of 4 October 2008 WJA1510 +5V Active-Bias InGaP HBT Gain Block Mechanical Information This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 C reflow temperature) and leaded (maximum 245 C reflow temperature) soldering processes. The plating material on the leads is NiPdAu. Outline Drawing Product Marking The WJA1510 will be marked with an "A1510" designator with an alphanumeric lot code marked below the part designator. A1510 XXXX-X Tape and reel specifications for this part are located on the website in the "Application Notes" section. MSL / ESD Rating Land Pattern ESD Rating: Value: Test: Standard: Class 1C Passes 1000V min. Human Body Model (HBM) JEDEC Standard JESD22-A114 ESD Rating: Value: Test: Standard: Class IV Passes 1000V min. Charged Device Model (CDM) JEDEC Standard JESD22-C101 MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135") diameter drill and have a final plated thru diameter of .25 mm (.010"). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Specifications and information are subject to change without notice Triquint Semiconductor Inc. * Phone 1-800-WJ1-4401 * FAX: 408-577-6633 * e-mail: info-sales@tqs.com * Web site: www.TriQuint.com Page 4 of 4 October 2008