CREAT BY ART
- Glass passivated chip junction
- Ideal for automated placement
- Super fast recovery time for high efficiency
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - green compound (halogen-free)
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
V
RRM
50 100 150 200 300 400 500 600 V
V
RMS
35 70 105 140 210 280 350 420 V
V
DC
50 100 150 200 300 400 500 600 V
I
F(AV)
A
Trr ns
Cj pF
T
JO
C
T
STG O
C
Document Number: DS_D1405069 Version: I14
ES3A thru ES3J
Taiwan Semiconductor
Surface Mount Su
p
er Fast Rectifiers
FEATURES
- Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
ES
3C
ES
3D
MECHANICAL DATA
Case: DO-214AB (SMC) DO-214AB (SMC)
Polarity: Indicated by cathode band
Weight: 0.21 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25℃ unless otherwise noted)
ES
3F
ES
3G
ES
3J Unit
Maximum repetitive peak reverse voltage
Maximum RMS voltage
PARAMETER SYMBOL ES
3A
ES
3B
Maximum DC blocking voltage
Maximum average forward rectified current 3
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load I
FSM
100 A
Maximum instantaneous forward voltage (Note 1)
I
F
= 3 A V
F
V
Maximum reverse current @ rated VR T
J
=25 ℃
T
J
=100 ℃I
R
10 μA
500
- 55 to +150
Storage temperature range - 55 to +150
Note 1: Pulse test with PW=300μs, 1% duty cycle
Maximum reverse recovery time (Note 2) 35
Typical junction capacitance (Note 3)
Typical thermal resistance R
θJL
R
θJA
12
47
Note 2: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.
ES
3H
0.95 1.3 1.7
45 30
O
C/W
Operating junction temperature range
PART NO.
PART NO.
ES3J
ES3J
ES3J
RATINGS AND CHARACTERISTICS CURVES
(TA=25℃ unless otherwise noted)
Document Number: DS_D1405069 Version: I14
PACKING CODE PACKAGE PACKING
R7
AEC-Q101
QUALIFIED PACKING CODE GREEN COMPOUND
CODE DESCRIPTION
SMC 850 / 7" Plastic reel
Note 1: "xx" defines voltage from 50V (ES3A) to 600V (ES3J)
ES3x
(Note 1)
R7
ES3A thru ES3J
Taiwan Semiconductor
ORDERING INFORMATION
AEC-Q101
QUALIFIED
GREEN COMPOUND
CODE
PREFERRED P/N
Green compound
Prefix "H" Suffix "G"R6 SMC 3,000 / 13" Paper reel
M6 SMC 3,000 / 13" Plastic reel
ES3J R7
ES3JHR7 H R7 AEC-Q101 qualified
EXAMPLE
ES3J R7G R7 G
0
0.5
1
1.5
2
2.5
3
3.5
0 255075100125150
AVERAGE FORWARD CURRENT (A)
LEAD TEMPERATURE (oC)
FIG.1 MAXIMUM FORWARD CURRENT
DERATING CURVE
0
10
20
30
40
50
60
70
80
90
100
110100
PEAK FORWARD SURGE CURRENT (A)
NUMBER OF CYCLES AT 60 Hz
FIG. 2 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
8.3ms Half Sin Wave
0.1
1
10
100
1000
0 20 40 60 80 100 120 140
INSTANTANEOUS REVERSE CURRENT
(μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 4 TYPICAL REVERSE CHARACTERISTICS
TJ=25℃
TJ=125℃
TJ=75℃
0.1
1
10
0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
INSTANTANEOUS FORWARD CURRENT
(A)
FORWARD VOLTAGE (V)
FIG. 3 TYPICAL FORWARD CHARACTERISTICS
ES3H-3J
ES3F-3G
ES3A-3D
Min Max Min Max
A 2.90 3.20 0.114 0.126
B 6.60 7.11 0.260 0.280
C 5.59 6.22 0.220 0.245
D 2.00 2.62 0.079 0.103
E 1.00 1.60 0.039 0.063
F 7.75 8.13 0.305 0.320
G 0.10 0.20 0.004 0.008
H 0.15 0.31 0.006 0.012
Document Number: DS_D1405069 Version: I14
ES3A thru ES3J
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DIM. Unit (mm) Unit (inch)
0
15
30
45
60
75
90
105
1 10 100
JUNCTION CAPACITANCE (pF)
REVERSE VOLTAGE (V)
FIG. 5 TYPICAL JUNCTION CAPACITANCE
ES3A-3D
ES3F-3J
f=1.0MHz
Vsig=50mVp-p
0.1
1
10
100
0.01 0.1 1 10 100
TRANSIENT THERMAL IMPEDANCE A
(℃/W)
HEATING TIME (s)
FIG. 6 TYPICAL TRANSIENT THERMAL IMPEDANCE
P/N = Specific Device Code
G = Green Compound
YW = Date Code
F = Factory Code
Document Number: DS_D1405069 Version: I14
ES3A thru ES3J
Taiwan Semiconductor
SUGG ESTED PAD LAYO UT
Symbol Unit (mm) Unit (inch)
A 3.3 0.130
B 2.5 0.098
C 6.8 0.268
MARKING DIAGRAM
D 4.4 0.173
E 9.4 0.370
CREAT BY ART
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1405069 Version: I14
ES3A thru ES3J
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
