SYMBOL PIN NAME
A0~A14 Address Input
Q0~Q7 Data Input/Output
CE Chip Enable Input
OE Output Enable Input
VPP Program Supply Voltage
NC No Internal Connection
VCC Power Supply Pin (+5V)
GND Ground Pin
GENERAL DESCRIPTION
The MX27C256 is a 5V only, 256K-bit, One-Time
Programmable Read Only Memory. It is organized as
32K by 8 bits, operates from a single + 5volt supply, has
a static standby mode, and features fast single address
location programming. All programming signals are TTL
levels, requiring a single pulse. For programming from
outside the system, existing EPROM programmers
FEATURES
• 32K x 8 organization
• Single +5V power supply
• +12.5V programming voltage
• Fast access time: 45/55/70/90/100/120/150 ns
• Totally static operation
• Completely TTL compatible
• Operating current: 30mA
• Standby current: 100uA
• Package type:
- 28 pin plastic DIP
- 32 pin PLCC
- 28 pin 8 x 13.4mm TSOP(I)
1
PIN CONFIGURATIONS
PDIP
may be used. The MX27C256 supports intelligent fast
programming algorithm which can result in program-
ming time of less than ten seconds.
This EPROM is packaged in industry standard 28 pin
dual-in-line packages, 32 lead PLCC, and 28 lead
TSOP(I) packages.
REV. 5.4, APR. 24, 2002P/N: PM0203
BLOCK DIAGRAM
PIN DESCRIPTION
PLCC
8 x 13.4mm 28-TSOP(I)
MX27C256
256K-BIT [32K x 8] CMOS EPROM
1
4
5
9
13
14 17 20
21
25
29
32 30 A8
A9
A11
NC
OE
A10
CE
Q7
Q6
A6
A5
A4
A3
A2
A1
A0
NC
Q0
Q1
Q2
GND
NC
Q3
Q4
Q5
A7
A12
VPP
NC
VCC
A14
A13
MX27C256
1
2
3
4
5
6
7
8
9
10
11
12
13
14
VPP
A12
A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2
GND
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VCC
A14
A13
A8
A9
A11
OE
A10
CE
Q7
Q6
Q5
Q4
Q3
MX27C256
OE
A11
A9
A8
A13
A14
VCC
VPP
A12
A7
A6
A5
A4
A3
22
23
24
25
26
27
28
1
2
3
4
5
6
7
A10
CE
Q7
Q6
Q5
Q4
Q3
GND
Q2
Q1
Q0
A0
A1
A2
21
20
19
18
17
16
15
14
13
12
11
10
9
8
MX27C256
CONTROL
LOGIC OUTPUT
BUFFERS Q0~Q7
CE
OE
A0~A14
ADDRESS
INPUTS
Y-DECODER
X-DECODER
Y-SELECT
256K BIT
CELL
MAXTRIX
VCC
GND VPP
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
2
P/N:PM0203 REV.5.4, APR. 24, 2002
MX27C256
AUTO IDENTIFY MODE
The auto identify mode allows the reading out of a binary
code from an EPROM that will identify its manufacturer
and device type. This mode is intended for use by
programming equipment for the purpose of
automatically matching the device to be programmed
with its corresponding programming algorithm. This
mode is functional in the 25°C ± 5°C ambient
temperature range that is required when programming
the MX27C256.
To activate this mode, the programming equipment
must force 12.0 ± 0.5 (VH) on address line A9 of the
device. Two identifier bytes may then be sequenced
from the device outputs by toggling address line A0 from
VIL to VIH. All other address lines must be held at VIL
during auto identify mode.
Byte 0 ( A0 = VIL) represents the manufacturer code,
and byte 1 (A0 = VIH), the device identifier code. For the
MX27C256, these two identifier bytes are given in the
Mode Select Table. All identifiers for manufacturer and
device codes will possess odd parity, with the MSB (Q7)
defined as the parity bit.
READ MODE
The MX27C256 has two control functions, both of which
must be logically satisfied in order to obtain data at the
outputs. Chip Enable (CE) is the power control and
should be used for device selection. Output Enable
(OE) is the output control and should be used to gate
data to the output pins, independent of device selection.
Assuming that addresses are stable, address access
time (tACC) is equal to the delay from CE to output (tCE).
Data is available at the outputs tOE after the falling edge
of OE, assuming that CE has been LOW and addresses
have been stable for at least tACC - tOE.
STANDBY MODE
The MX27C256 has a CMOS standby mode which
reduces the maximum Vcc current to 100 uA. It is
placed in CMOS standby when CE is at VCC ± 0.3 V.
The MX27C256 also has a TTL-standby mode which
reduces the maximum VCC current to 1.5 mA. It is
placed in TTL-standby when CE is at VIH. When in
standby mode, the outputs are in a high-impedance
state, independent of the OE input.
FUNCTIONAL DESCRIPTION
THE PROGRAMMING OF THE MX27C256
When the MX27C256 is delivered, or it is erased, the
chip has all 256K bits in the "ONE" or HIGH state.
"ZEROs" are loaded into the MX27C256 through the
procedure of programming.
For programming, the data to be programmed is applied
with 8 bits in parallel to the data pins.
VCC must be applied simultaneously or before VPP, and
removed simultaneously or after VPP. When
programming an MXIC EPROM, a 0.1uF capacitor is
required across VPP and ground to suppress spurious
voltage transients which may damage the device.
FAST PROGRAMMING
The device is set up in the fast programming mode when
the programming voltage VPP = 12.75V is applied, with
VCC = 6.25 V and OE = VIH (Algorithm is shown in
Figure 1). The programming is achieved by applying a
single TTL low level 100us pulse to the CE input after
addresses and data line are stable. If the data is not
verified, an additional pulse is applied for a maximum of
25 pulses. This process is repeated while sequencing
through each address of the device. When the
programming mode is completed, the data in all address
is verified at VCC = VPP = 5V ± 10%.
PROGRAM INHIBIT MODE
Programming of multiple MX27C256s in parallel with
different data is also easily accomplished by using the
Program Inhibit Mode. Except for CE and OE, all like
inputs of the parallel MX27C256 may be common. A
TTL low-level program pulse applied to an MX27C256
CE input with VPP = 12.5 ± 0.5 V and OE HIGH will
program that MX27C256. A high-level CE input inhibits
the other MX27C256s from being programmed.
PROGRAM VERIFY MODE
Verification should be performed on the programmed
bits to determine that they were correctly programmed.
The verification should be performed with CE and OE
at VIL, and VPP at its programming voltage.
3
P/N:PM0203 REV.5.4, APR. 24, 2002
MX27C256
TWO-LINE OUTPUT CONTROL FUNCTION
To accommodate multiple memory connections, a two-
line control function is provided to allow for:
1. Low memory power dissipation,
2. Assurance that output bus contention will not
occur.
It is recommended that CE be decoded and used as the
primary device-selecting function, while OE be made a
common connection to all devices in the array and
connected to the READ line from the system control bus.
This assures that all deselected memory devices are in
their low-power standby mode and that the output pins
are only active when data is desired from a particular
memory device.
SYSTEM CONSIDERATIONS
During the switch between active and standby
conditions, transient current peaks are produced on the
rising and falling edges of Chip Enable. The magnitude
of these transient current peaks is dependent on the
output capacitance loading of the device. At a minimum,
a 0.1 uF ceramic capacitor (high frequency, low inherent
inductance) should be used on each device between
VCC and GND to minimize transient effects. In addition,
to overcome the voltage drop caused by the inductive
effects of the printed circuit board traces on EPROM
arrays, a 4.7 uF bulk electrolytic capacitor should be
used between Vcc and GND for each eight devices. The
location of the capacitor should be close to where the
power supply is connected to the array.
MODE SELECT TABLE
PINS
MODE CE OE A0 A9 VPP OUTPUTS
Read VIL VIL X X VCC DOUT
Output Disable VIL VIH X X VCC High Z
Standby (TTL) VIH X X X VCC High Z
Standby (CMOS) VCC±0.3V X X X VCC High Z
Program VIL VIH X X VPP DIN
Program Verify VIH VIL X X VPP DOUT
Program Inhibit VIH VIH X X VPP High Z
Manufacturer Code(3) VIL VIL VIL VH VCC C2H
Device Code(3) VIL VIL VIH VH VCC 10H
NOTES:
1. VH = 12.0 V ± 0.5 V
2. X = Either VIH or VIL
3. A1 - A8 = A10 - A14 = VIL (For auto select)
4. See DC Programming characteristics for VPP voltage during programming.
4
P/N:PM0203 REV.5.4, APR. 24, 2002
MX27C256
START
ADDRESS = FIRST LOCATION
VCC = 6.25V
VPP = 12.75V
X = 0
PROGRAM ONE 100us PULSE
INCREMENT X
X = 25?
VERIFY BYTE
LAST ADDRESS
VCC = VPP = 5.25V
DEVICE PASSED
VERIFY ALL BYTES
?DEVICE FAILED
INCREMENT ADDRESS
INTERACTIVE
SECTION
VERIFY SECTION FAIL
PASS
YES
PASS
NO
YES
NO
FAIL
FIGURE 1. FAST PROGRAMMING FLOW CHART
FAIL
?
5
P/N:PM0203 REV.5.4, APR. 24, 2002
MX27C256
SWITCHING TEST CIRCUITS
SWITCHING TEST WAVEFORMS
DEVICE
UNDER
TEST
DIODES = IN3064
OR EQUIVALENT
CL = 100 pF including jig capacitance(30pF for 45/55/70ns parts)
6.2K ohm
1.8K ohm +5V
CL
2.0V
0.8V TEST POINTS
INPUT
2.0V
0.8V
OUTPUT
AC TESTING: AC driving levels are 2.4V/0.4V for commercial grade, 3.0V/0V for industrial grade.
Input pulse rise and fall times are < 10ns.
AC driving levels
1.5V TEST POINTS
INPUT
1.5V
OUTPUT
AC TESTING: (1) AC driving levels are 3.0V/0V for both commercial grade and industrial grade.
Input pulse rise and fall times are < 10ns.
(2) For MX27C256-45, MX27C256-55, MX27C256-70.
AC driving levels
6
P/N:PM0203 REV.5.4, APR. 24, 2002
MX27C256
ABSOLUTE MAXIMUM RATINGS
RATING VALUE
Ambient Operating Temperature -40oC to 85oC
Storage Temperature -65oC to 125oC
Applied Input Voltage -0.5V to 7.0V
Applied Output Voltage -0.5V to VCC + 0.5V
VCC to Ground Potential -0.5V to 7.0V
A9 & Vpp -0.5V to 13.5V
NOTICE:
Stresses greater than those listed under ABSOLUTE
MAXIMUM RATINGS may cause permanent damage to the
device. This is a stress rating only and functional operation
of the device at these or any other conditions above those
indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions for
extended period may affect reliability.
NOTICE:
Specifications contained within the following tables are sub-
ject to change.
DC CHARACTERISTICS
SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS
VOH Output High Voltage 2.4 V IOH = -0.4mA
VOL Output Low Voltage 0.4 V IOL = 2.1mA
VIH Input High Voltage 2.0 VCC + 0.5 V
VIL Input Low Voltage -0.3 0.8 V
ILI Input Leakage Current -10 10 uA VIN = 0 to 5.5V
ILO Output Leakage Current -10 10 uA VOUT = 0 to 5.5V
ICC3 VCC Power-Down Current 100 uA CE = VCC ± 0.3V
ICC2 VCC Standby Current 1.5 mA CE = VIH
ICC1 VCC Active Current 30 mA CE = VIL, f=5MHz, Iout =0mA
IPP VPP Supply Current Read 10 uA CE = OE = VIL, VPP = 5.5V
CAPACITANCE TA = 25oC, f = 1.0 MHz (Sampled only)
SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS
CIN Input Capacitance 8 12 pF VIN = 0V
COUT Output Capacitance 8 12 pF VOUT = 0V
VPP VPP Capacitance 18 25 pF VPP = 0V
DC/AC Operating Conditions for Read Operation
MX27C256
-45 -55 -70 -90 -10 -12 -15
Operating Commercial 0°C to 70°C0°C to 70°C0°C to 70°C0°C to 70°C0°C to 70°C0°C to 70°C0°C to 70°C
Temperature Industrial -45°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C
Vcc Power Supply 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10% 5V ±10% 5V ± 10% 5V ± 10%
7
P/N:PM0203 REV.5.4, APR. 24, 2002
MX27C256
AC CHARACTERISTICS
27C256-45 27C256-55 27C256-70 27C256-90
SYMBOL PARAMETER MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. UNIT CONDITIONS
tACC Address to Output Delay 45 55 70 90 ns CE = OE = VIL
tCE Chip Enable to Output Delay 45 55 70 90 ns OE = VIL
tOE Output Enable to Output 22 30 35 40 ns CE = VIL
Delay
tDF OE High to Output Float, 0 16 0 20 0 20 0 25 ns
or CE High to Output Float
tOH Output Hold from Address, 0 0 0 0 ns
CE or OE which ever occurred
first
27C256-10 27C256-12 27C256-15
SYMBOL PARAMETER MIN. MAX. MIN. MAX. MIN. MAX. UNIT CONDITIONS
tACC Address to Output Delay 100 120 150 n s CE = OE = VIL
tCE Chip Enable to Output Delay 100 120 150 ns OE = VIL
tOE Output Enable to Output 45 50 55 ns CE = VIL
Delay
tDF OE High to Output Float, 0 30 0 35 0 50 ns
or CE High to Output Float
tOH Output Hold from Address, 0 0 0 ns
CE or OE which ever occurred
first
DC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C
SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS
VOH Output High Voltage 2.4 V IOH = -0.40mA
VOL Output Low Voltage 0.4 V IOL = 2.1mA
VIH Input High Voltage 2.0 VCC + 0.5 V
VIL Input Low Voltage -0.3 0.8 V
ILI Input Leakage Current -10 1 0 uA VIN = 0 to 5.5V
VH A9 Auto Select Voltage 11.5 12.5 V
ICC3 VCC Supply Current(Program & Verify) 40 mA
IPP2 VPP Supply Current(Program) 30 mA CE = VIL, OE = VIH
VCC1 Fast Programming Supply Voltage 6.00 6.50 V
VPP1 Fast Programming Voltage 12.5 13.0 V
8
P/N:PM0203 REV.5.4, APR. 24, 2002
MX27C256
AC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C
SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS
tAS Address Setup Time 2.0 us
tOES OE Setup Time 2.0 us
tDS Data Setup Time 2.0 us
tAH Address Hold Time 0 us
tDH Data Hold Time 2.0 us
tDFP Output Enable to Output Float Delay 0 130 ns
tVPS VPP Setup Time 2.0 us
tVCS VCC Setup Time 2.0 us
tOE Data Valid from OE 150 ns
tPW PGM Program Pulse Width 95 10 5 us
9
P/N:PM0203 REV.5.4, APR. 24, 2002
MX27C256
WAVEFORMS
READ CYCLE
FAST PROGRAMMING ALGORITHM WAVEFORM
ADDRESS
INPUTS
DATA
OUT
OE
CE
DATA ADDRESS
VALID DATA
tDF
tACC
tCE
tOE tOH
Addresses
CE
OE
DATA
VPP
VCC
VIH
VIL
VPP1
VCC
VCC1
VCC
VIH
VIL
VIH
VIL
DATA OUT VALID
Hi-z
DATA IN STABLE
tAS
tVPS
tVCS
tOE
Max
tPW
tDS tDH
tOES
tDFP
tAH
PROGRAM VERIFY
PROGRAM
10
P/N:PM0203 REV.5.4, APR. 24, 2002
MX27C256
PLASTIC PACKAGE
PART NO. ACCESS TIME(ns) OPERATING STANDBY OPERATING PACKAGE
CURRENT MAX.(mA) CURRENT MAX.(uA) TEMPERATURE
MX27C256PC-45 45 30 100 0°C to 70°C 28 Pin DIP
MX27C256QC-45 45 30 100 0°C to 70°C 32 Pin PLCC
MX27C256TC-45 45 30 100 0°C to 70°C 28 Pin TSOP(I)
MX27C256PC-55 55 30 100 0°C to 70°C 28 Pin DIP
MX27C256QC-55 55 30 100 0°C to 70°C 32 Pin PLCC
MX27C256TC-55 55 30 100 0°C to 70°C 28 Pin TSOP(I)
MX27C256PC-70 70 30 100 0°C to 70°C 28 Pin DIP
MX27C256QC-70 70 30 100 0°C to 70°C 32 Pin PLCC
MX27C256TC-70 70 30 100 0°C to 70°C 28 Pin TSOP(I)
MX27C256PC-90 90 30 100 0°C to 70°C 28 Pin DIP
MX27C256QC-90 90 30 100 0°C to 70°C 32 Pin PLCC
MX27C256TC-90 90 30 100 0°C to 70°C 28 Pin TSOP(I)
MX27C256PC-10 100 30 100 0°C to 70°C 28 Pin DIP
MX27C256QC-10 100 30 100 0°C to 70°C 32 Pin PLCC
MX27C256TC-10 100 30 100 0°C to 70°C 28 Pin TSOP(I)
MX27C256PC-12 120 30 100 0°C to 70°C 28 Pin DIP
MX27C256QC-12 120 30 100 0°C to 70°C 32 Pin PLCC
MX27C256TC-12 120 30 100 0°C to 70°C 28 Pin TSOP(I)
MX27C256PC-15 150 30 100 0°C to 70°C 28 Pin DIP
MX27C256QC-15 150 30 100 0°C to 70°C 32 Pin PLCC
MX27C256TC-15 150 30 100 0°C to 70°C 28 Pin TSOP(I)
MX27C256PI-45 45 30 100 -40°C to 85°C 28 Pin DIP
MX27C256QI-45 45 30 100 -40°C to 85°C 32 Pin PLCC
MX27C256TI-45 45 30 100 -40°C to 85°C 28 Pin TSOP(I)
MX27C256PI-55 55 30 100 -40°C to 85°C 28 Pin DIP
MX27C256QI-55 55 30 100 -40°C to 85°C 32 Pin PLCC
MX27C256TI-55 55 30 100 -40°C to 85°C 28 Pin TSOP(I)
MX27C256PI-70 70 30 100 -40°C to 85°C 28 Pin DIP
MX27C256QI-70 70 30 100 -40°C to 85°C 32 Pin PLCC
MX27C256TI-70 70 30 100 -40°C to 85°C 28 Pin TSOP(I)
MX27C256PI-90 90 30 100 -40°C to 85°C 28 Pin DIP
MX27C256QI-90 90 30 100 -40°C to 85°C 32 Pin PLCC
MX27C256TI-90 90 30 100 -40°C to 85°C 28 Pin TSOP(I)
MX27C256PI-10 100 30 100 -40°C to 85°C 28 Pin DIP
MX27C256QI-10 100 30 100 -40°C to 85°C 32 Pin PLCC
MX27C256TI-10 100 30 100 -40°C to 85°C 28 Pin TSOP(I)
MX27C256PI-12 120 30 100 -40°C to 85°C 28 Pin DIP
MX27C256QI-12 120 30 100 -40°C to 85°C 32 Pin PLCC
MX27C256TI-12 120 30 100 -40°C to 85°C 28 Pin TSOP(I)
MX27C256PI-15 150 30 100 -40°C to 85°C 28 Pin DIP
MX27C256QI-15 150 30 100 -40°C to 85°C 32 Pin PLCC
MX27C256TI-15 150 30 100 -40°C to 85°C 28 Pin TSOP(I)
ORDERING INFORMATION
11
P/N:PM0203 REV.5.4, APR. 24, 2002
MX27C256
PACKAGE INFORMATION
28-PIN PLASTIC DIP (600 mil)
12
P/N:PM0203 REV.5.4, APR. 24, 2002
MX27C256
32-PIN PLASTIC LEADED CHIP CARRIER (PLCC)
13
P/N:PM0203 REV.5.4, APR. 24, 2002
MX27C256
28-PIN PLASTIC TSOP (8 x 13.4mm)
14
P/N:PM0203 REV.5.4, APR. 24, 2002
MX27C256
REVISION HISTORY
Revision No. Description Page Date
5.0 1) Reduce operating current from 40mA to 30mA. 6/16/1997
2) Add 28-TSOP(I) and 28-SOP packages offering.
3) Eliminate Interactive Programming Mode.
5.1 1) IPP1 100uA ----> 10uA 7/17/1997
5.2 Cancel ceramic DIP package type P1,2,10,12 FEB/25/2000
5.3 Remove 28-pin SOP Package P1,10 SEP/19/2001
Package Information format changed P11~13
5.4 Remove "ultraviolet erasable" wording P1 APR/24/2002
MX27C256
MACRONIX INTERNATIONAL CO., LTD.
HEADQUARTERS:
TEL:+886-3-578-6688
FAX:+886-3-563-2888
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TEL:+32-2-456-8020
FAX:+32-2-456-8021
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FAX:+65-348-8096
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TEL:+1-408-453-8088
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CHICAGO OFFICE:
TEL:+1-847-963-1900
FAX:+1-847-963-1909
http : //www.macronix.com
MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.
