HI-SINCERITY Spec. No. : HE6730-B Issued Date : 1997.08.13 Revised Date : 1999.08.01 Page No. : 1/3 MICROELECTRONICS CORP. HTIP125 PNP EPITAXIAL PLANAR TRANSISTOR Description The HTIP125 is designed for medium power linear and switching applications. Absolute Maximum Ratings (Ta=25C) * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature ................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Tc=25C) .................................................................................... 65 W Total Power Dissipation (Ta=25C) ...................................................................................... 2 W * Maximum Voltages and Currents BVCBO Collector to Base Voltage ..................................................................................... -60 V BVCEO Collector to Emitter Voltage.................................................................................. -60 V BVEBO Emitter to Base Voltage .......................................................................................... -5 V IC Collector Current ............................................................................................................. -5 A Characteristics (Ta=25C) Symbol BVCBO *BVCEO ICEO ICBO IEBO *VCE(sat1) *VCE(sat)2 *VBE(on) *hFE1 *hFE2 Cob Min. -60 -60 1000 1000 - Typ. - Max. -0.5 -0.2 -2 -2 -4 -2.5 300 Unit V V mA mA mA V V V FP Test Conditions IC=-1mA, IE=0 IC=-100mA, IB=0 VCE=-30V, IE=0 VCE=-60V, IB=0 VEB=-5V, IC=0 IC=-3A, IB=-12mA IC=-5A, IB=-20mA IC=-3A, VCE=-3V IC=-0.5A, VCE=-3V IC=-3A, VCE=-3V VCB=-10V, f=0.1MHz, IE=0 *Pulse Test : Pulse Width 380us, Duty Cycle2% HSMC Product Specification HI-SINCERITY Spec. No. : HE6730-B Issued Date : 1997.08.13 Revised Date : 1999.08.01 Page No. : 2/3 MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current Saturation Voltage & Collector Current 10000 10000 Saturation Voltage (mV) 1000 hFE hFE @ VCE=4V 100 10 1 VBE(sat) @ IC=100IB4 1000 VCE(sat) @ IC=100IB 100 1 10 100 1000 10000 100 1000 Collector Current (mA) 10000 Collector Current (mA) On Voltage & Collector Current Switching Time & Collector Current 10000 10 1000 Switching Times (us) On Voltage (mV) VCC=30V, IC=250IB1=-250IB2 VBE(on) @ VCE=4V Tstg 1 Tf Ton 100 0.1 1 10 100 1000 10000 1 10 Collector Current (mA) Collector Current (A) Capacitance & Reverse-Biased Voltage Safe Operating Area 100000 1000 PT=1ms PT=100ms Collector Current-IC (mA) Capacitance (pF) 10000 100 Cob PT=1s 1000 100 10 1 10 0.1 1 10 Reverse-Biased Voltage (V) 100 1 10 100 Forward-VCE (V) HSMC Product Specification HI-SINCERITY Spec. No. : HE6730-B Issued Date : 1997.08.13 Revised Date : 1999.08.01 Page No. : 3/3 MICROELECTRONICS CORP. TO-220AB Dimension Marking : A B D E C HSMC Logo Part Number Date Code Product Series Rank H K M I Style : Pin 1.Base 2.Collector 3.Emitter 3 G N 2 1 4 P O 3-Lead TO-220AB Plastic Package HSMC Package Code : E *:Typical Inches Min. Max. 0.2197 0.2949 0.3299 0.3504 0.1732 0.185 0.0453 0.0547 0.0138 0.0236 0.3803 0.4047 *0.6398 - DIM A B C D E G H Millimeters Min. Max. 5.58 7.49 8.38 8.90 4.40 4.70 1.15 1.39 0.35 0.60 9.66 10.28 *16.25 - DIM I K M N O P Inches Min. Max. *0.1508 0.0295 0.0374 0.0449 0.0551 *0.1000 0.5000 0.5618 0.5701 0.6248 Millimeters Min. Max. *3.83 0.75 0.95 1.14 1.40 *2.54 12.70 14.27 14.48 15.87 Notes : 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : * Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : * Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 * Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification