TLP627M,TLP627MF
1
Photocouplers Infrared LED & Photo Darlington Transistor
TLP627M,TLP627MF
TLP627M,TLP627MF
TLP627M,TLP627MF
TLP627M,TLP627MF
Start of commercial production
2018-12
1.
1.
1.
1. Applications
Applications
Applications
Applications
• Programmable Logic Controllers (PLCs)
• I/O Interface Boards
• Home Electric Appliances
2.
2.
2.
2. General
General
General
General
TLP627M is a photocoupler that consists of an infrared emitting diode optically coupled to a photo darlington
transistor. Housed in a 4pin DIP, it has a high noise immunity and high insulation. With the high breakdown
voltage between the collector and emitter, TLP627M is suitable in applications such as 100 V DC output modules
of programmable controllers.
TLP627MF is a lead forming type for the long creepage mounting of TLP627M.
3.
3.
3.
3. Features
Features
Features
Features
(1) Collector-emitter voltage: 300 V (min)
(2) Current transfer ratio: 1000 % (min) (@IF = 1 mA, VCE = 1 V)
(3) Isolation voltage: 5000 Vrms (min)
(4) Operating temperature: -55 to 110
(5) Safety standards
UL-recognized: UL 1577, File No.E67349
cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349
VDE-approved: EN 60747-5-5, EN 62368-1 (Note 1)
(Note 1)
(Note 1)
(Note 1)
CQC-approved: GB4943.1, GB8898 Japan Factory (Pending)
Note 1: When a VDE approved type is needed, please designate the Option (D4)
Option (D4)
Option (D4)
Option (D4).
2018-12-06
Rev.1.0
©2018
Toshiba Electronic Devices & Storage Corporation
TLP627M,TLP627MF
2
4.
4.
4.
4. Packaging (Note)
Packaging (Note)
Packaging (Note)
Packaging (Note)
TLP627M
11-5B2S
TLP627M(LF1,TP1)
11-5B201S
TLP627M(LF5,TP5)
11-5B205S
TLP627MF
11-5B202S
TLP627MF(LF4,TP4)
11-5B204S
Note: Through-hole type: TLP627M, TLP627MF
Lead forming option: (LF1), (LF4), (LF5)
Taping option: (TP1), (TP4), (TP5)
5.
5.
5.
5. Pin Assignment
Pin Assignment
Pin Assignment
Pin Assignment
1: Anode
2: Cathode
3: Emitter
4: Collector
6.
6.
6.
6. Mechanical Parameters
Mechanical Parameters
Mechanical Parameters
Mechanical Parameters
Characteristics
Creepage distances
Clearance
Internal isolation thickness
7.62 mm pitch
TLP627M type
(Min)
7.0
7.0
0.4
10.16 mm pitch
TLP627MF type
(Min)
8.0
8.0
0.4
Unit
mm
2018-12-06
Rev.1.0
©2018
Toshiba Electronic Devices & Storage Corporation
TLP627M,TLP627MF
3
7.
7.
7.
7. Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
LED
Detector
Common
Characteristics
Input forward current
Input forward current derating
Input forward current (pulsed)
Input reverse voltage
Input power dissipation
Input power dissipation derating
Junction temperature
Collector-emitter voltage
Emitter-collector voltage
Collector current
Collector power dissipation
Collector power dissipation derating
Junction temperature
Operating temperature
Storage temperature
Lead soldering temperature
Total power dissipation
Total power dissipation derating
Isolation voltage
(Ta ≥ 90 )
(Ta ≥ 90 )
(Ta ≥ 25 )
(10 s)
(Ta ≥ 25 )
(AC, 60 s, R.H. ≤ 60 %)
Symbol
IF
∆IF/∆Ta
IFP
VR
PD
∆PD/∆Ta
Tj
VCEO
VECO
IC
PC
∆PC/∆Ta
Tj
Topr
Tstg
Tsol
PT
∆PT/∆Ta
BVS
Note
(Note 1)
(Note 2)
Rating
50
-1.42
1
5
100
-2.85
125
300
0.3
150
150
-1.5
125
-55 to 110
-55 to 125
260
250
-2.5
5000
Unit
mA
mA/
A
V
mW
mW/
V
V
mA
mW
mW/
mW
mW/
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width (PW) ≤ 0.1 ms, f = 100 Hz
Note 2: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are
shorted together.
8.
8.
8.
8. Electrical Characteristics (Unless otherwise specified, T
Electrical Characteristics (Unless otherwise specified, T
Electrical Characteristics (Unless otherwise specified, T
Electrical Characteristics (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
LED
Detector
Characteristics
Input forward voltage
Input reverse current
Input capacitance
Collector-emitter breakdown voltage
Emitter-collector breakdown voltage
Dark Current
Collector-emitter capacitance
Symbol
VF
IR
Ct
V(BR)CEO
V(BR)ECO
IDARK
CCE
Note Test Condition
IF = 10 mA
VR = 5 V
V = 0 V, f = 1 MHz
IC = 0.1 mA
IE = 0.1 mA
VCE = 200 V
VCE = 200 V, Ta = 85
V = 0 V, f = 1 MHz
Min
1.1
300
0.3
Typ.
1.25
30
0.002
900
Max
1.4
10
0.2
20
Unit
V
µA
pF
V
V
µA
pF
9.
9.
9.
9. Coupled Electrical Characteristics (Unless otherwise specified, T
Coupled Electrical Characteristics (Unless otherwise specified, T
Coupled Electrical Characteristics (Unless otherwise specified, T
Coupled Electrical Characteristics (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Current transfer ratio
Saturated current transfer ratio
Collector-emitter saturation voltage
OFF-state collector current
Symbol
IC/IF
IC/IF(sat)
VCE(sat)
IC(off)
Note Test Condition
IF = 1 mA, VCE = 1 V
IF = 10 mA, VCE = 1 V
IC = 10 mA, IF = 1 mA
IC = 100 mA, IF = 10 mA
VF = 0.7 V, VCE = 200 V
Min
1000
500
0.3
Typ.
6000
Max
1.0
1.2
20
Unit
%
%
V
µA
2018-12-06
Rev.1.0
©2018
Toshiba Electronic Devices & Storage Corporation
TLP627M,TLP627MF
4
10.
10.
10.
10. Isolation Characteristics (Unless otherwise specified, T
Isolation Characteristics (Unless otherwise specified, T
Isolation Characteristics (Unless otherwise specified, T
Isolation Characteristics (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Total capacitance (input to output)
Isolation resistance
Isolation voltage
Symbol
CS
RS
BVS
Note
(Note 1)
(Note 1)
(Note 1)
Test Condition
VS = 0 V, f = 1 MHz
VS = 500 V, R.H. ≤ 60 %
AC, 60 s
Min
1 × 1012
5000
Typ.
0.6
1014
Max
Unit
pF
Ω
Vrms
Note 1: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are
shorted together.
11.
11.
11.
11. Switching Characteristics (Unless otherwise specified,T
Switching Characteristics (Unless otherwise specified,T
Switching Characteristics (Unless otherwise specified,T
Switching Characteristics (Unless otherwise specified,Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Rise time
Fall time
Turn-on time
Turn-off time
Turn-on time
Storage time
Turn-off time
Symbol
tr
tf
ton
toff
ton
ts
toff
Note Test Condition
VCC = 10 V, IC = 10 mA,
RL = 100 Ω
See Fig. 11.1.
RL = 180 Ω, VCC = 10 V,
IF = 16 mA
Min
Typ.
60
30
110
30
2
25
80
Max
Unit
µs
Fig.
Fig.
Fig.
Fig. 11.1
11.1
11.1
11.1 Switching Time Test Circuit and Waveform
Switching Time Test Circuit and Waveform
Switching Time Test Circuit and Waveform
Switching Time Test Circuit and Waveform
2018-12-06
Rev.1.0
©2018
Toshiba Electronic Devices & Storage Corporation
TLP627M,TLP627MF
5
12.
12.
12.
12. Characteristics Curves (Note)
Characteristics Curves (Note)
Characteristics Curves (Note)
Characteristics Curves (Note)
Fig.
Fig.
Fig.
Fig. 12.1
12.1
12.1
12.1 I
I
I
IF
F
F
F - T
- T
- T
- Ta
a
a
aFig.
Fig.
Fig.
Fig. 12.2
12.2
12.2
12.2 P
P
P
PC
C
C
C - T
- T
- T
- Ta
a
a
a
Fig.
Fig.
Fig.
Fig. 12.3
12.3
12.3
12.3 I
I
I
IFP
FP
FP
FP - D
- D
- D
- DR
R
R
RFig.
Fig.
Fig.
Fig. 12.4
12.4
12.4
12.4 I
I
I
IF
F
F
F - V
- V
- V
- VF
F
F
F
Fig.
Fig.
Fig.
Fig. 12.5
12.5
12.5
12.5 ∆
∆
∆
∆V
V
V
VF
F
F
F/
/
/
/∆
∆
∆
∆T
T
T
Ta
a
a
a - I
- I
- I
- IF
F
F
FFig.
Fig.
Fig.
Fig. 12.6
12.6
12.6
12.6 I
I
I
IFP
FP
FP
FP - V
- V
- V
- VFP
FP
FP
FP
2018-12-06
Rev.1.0
©2018
Toshiba Electronic Devices & Storage Corporation
TLP627M,TLP627MF
6
Fig.
Fig.
Fig.
Fig. 12.7
12.7
12.7
12.7 I
I
I
IC
C
C
C - V
- V
- V
- VCE
CE
CE
CE Fig.
Fig.
Fig.
Fig. 12.8
12.8
12.8
12.8 I
I
I
IDARK
DARK
DARK
DARK - T
- T
- T
- Ta
a
a
a
Fig.
Fig.
Fig.
Fig. 12.9
12.9
12.9
12.9 V
V
V
VCE(sat)
CE(sat)
CE(sat)
CE(sat) - T
- T
- T
- Ta
a
a
aFig.
Fig.
Fig.
Fig. 12.10
12.10
12.10
12.10 I
I
I
IC
C
C
C - I
- I
- I
- IF
F
F
F
Fig.
Fig.
Fig.
Fig. 12.11
12.11
12.11
12.11 I
I
I
IC
C
C
C/I
/I
/I
/IF
F
F
F - I
- I
- I
- IF
F
F
FFig.
Fig.
Fig.
Fig. 12.12
12.12
12.12
12.12 I
I
I
IC
C
C
C - T
- T
- T
- Ta
a
a
a
2018-12-06
Rev.1.0
©2018
Toshiba Electronic Devices & Storage Corporation
TLP627M,TLP627MF
7
Fig.
Fig.
Fig.
Fig. 12.13
12.13
12.13
12.13 Switching Time - R
Switching Time - R
Switching Time - R
Switching Time - RL
L
L
LFig.
Fig.
Fig.
Fig. 12.14
12.14
12.14
12.14 Switching Time - T
Switching Time - T
Switching Time - T
Switching Time - Ta
a
a
a
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
2018-12-06
Rev.1.0
©2018
Toshiba Electronic Devices & Storage Corporation
TLP627M,TLP627MF
8
13.
13.
13.
13. Soldering and Storage
Soldering and Storage
Soldering and Storage
Soldering and Storage
13.1.
13.1.
13.1.
13.1. Precautions for Soldering
Precautions for Soldering
Precautions for Soldering
Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
• When using soldering reflow.
The soldering temperature profile is based on the package surface temperature.
(See the figure shown below, which is based on the package surface temperature.)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
• When using soldering flow
Preheat the device at a temperature of 150 (package surface temperature) for 60 to 120 seconds.
Mounting condition of 260 within 10 seconds is recommended.
Flow soldering must be performed once.
• When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not
exceeding 350
Heating by soldering iron must be done only once per lead.
13.2.
13.2.
13.2.
13.2. Precautions for General Storage
Precautions for General Storage
Precautions for General Storage
Precautions for General Storage
• Avoid storage locations where devices may be exposed to moisture or direct sunlight.
• Follow the precautions printed on the packing label of the device for transportation and storage.
• Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %,
respectively.
• Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
• Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
• When restoring devices after removal from their packing, use anti-static containers.
• Do not allow loads to be applied directly to devices while they are in storage.
• If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
2018-12-06
Rev.1.0
©2018
Toshiba Electronic Devices & Storage Corporation
TLP627M,TLP627MF
9
14.
14.
14.
14. Marking (Note)
Marking (Note)
Marking (Note)
Marking (Note)
Fig.
Fig.
Fig.
Fig. 14.1
14.1
14.1
14.1 Marking example of TLP627M
Marking example of TLP627M
Marking example of TLP627M
Marking example of TLP627M Fig.
Fig.
Fig.
Fig. 14.2
14.2
14.2
14.2 Marking example of TLP627MF
Marking example of TLP627MF
Marking example of TLP627MF
Marking example of TLP627MF
Note: A different marking is used for photocouplers that have been qualified according to option (D4) of EN 60747.
See Fig.15.4 and Fig.15.5.
2018-12-06
Rev.1.0
©2018
Toshiba Electronic Devices & Storage Corporation
TLP627M,TLP627MF
10
15.
15.
15.
15. EN 60747-5-5 Option (D4) Specification
EN 60747-5-5 Option (D4) Specification
EN 60747-5-5 Option (D4) Specification
EN 60747-5-5 Option (D4) Specification
• Part number: TLP627M, TLP627MF (Note 1)
(Note 1)
(Note 1)
(Note 1)
• The following part naming conventions are used for the devices that have been qualified according to
option (D4) of EN 60747.
Example: TLP627M(D4-TP1,E
D4: EN 60747 option
TP1: Tape type
E: [[G]]/RoHS COMPATIBLE (Note 2)
(Note 2)
(Note 2)
(Note 2)
Note 1: Use TOSHIBA standard type number for safety standard application.
e.g., TLP627M(D4-TP1,E → TLP627M
Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's
RoHS compatibility.
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the
restriction of the use of certain hazardous substances in electrical and electronic equipment.
Fig.
Fig.
Fig.
Fig. 15.1
15.1
15.1
15.1 EN 60747 Insulation Characteristics
EN 60747 Insulation Characteristics
EN 60747 Insulation Characteristics
EN 60747 Insulation Characteristics
2018-12-06
Rev.1.0
©2018
Toshiba Electronic Devices & Storage Corporation
TLP627M,TLP627MF
11
Fig.
Fig.
Fig.
Fig. 15.2
15.2
15.2
15.2 Insulation Related Specifications (Note)
Insulation Related Specifications (Note)
Insulation Related Specifications (Note)
Insulation Related Specifications (Note)
Note: If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value.
(e.g., at a standard distance between soldering eye centers of 7.5 mm). If this is not permissible, the user shall
take suitable measures.
Note: This photocoupler is suitable for safe electrical isolation
safe electrical isolation
safe electrical isolation
safe electrical isolation only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuits.
Fig.
Fig.
Fig.
Fig. 15.3
15.3
15.3
15.3 Marking on packing for EN 60747
Marking on packing for EN 60747
Marking on packing for EN 60747
Marking on packing for EN 60747
Fig.
Fig.
Fig.
Fig. 15.4
15.4
15.4
15.4 Marking Example of TLP627M(Note)
Marking Example of TLP627M(Note)
Marking Example of TLP627M(Note)
Marking Example of TLP627M(Note) Fig.
Fig.
Fig.
Fig. 15.5
15.5
15.5
15.5 Marking Example of TLP627MF(Note)
Marking Example of TLP627MF(Note)
Marking Example of TLP627MF(Note)
Marking Example of TLP627MF(Note)
Note: The above marking is applied to the photocouplers that have been qualified according to option (D4) of EN 60747.
2018-12-06
Rev.1.0
©2018
Toshiba Electronic Devices & Storage Corporation
TLP627M,TLP627MF
12
Fig.
Fig.
Fig.
Fig. 15.6
15.6
15.6
15.6 Measurement Procedure
Measurement Procedure
Measurement Procedure
Measurement Procedure
2018-12-06
Rev.1.0
©2018
Toshiba Electronic Devices & Storage Corporation
TLP627M,TLP627MF
13
Package Dimensions
Package Dimensions
Package Dimensions
Package Dimensions
Unit: mm
TLP627M
Weight: 0.24 g (typ.)
Package Name(s)
TOSHIBA: 11-5B2S
2018-12-06
Rev.1.0
©2018
Toshiba Electronic Devices & Storage Corporation
TLP627M,TLP627MF
14
Package Dimensions
Package Dimensions
Package Dimensions
Package Dimensions
Unit: mm
TLP627M(LF1,TP1)
Weight: 0.24 g (typ.)
Package Name(s)
TOSHIBA: 11-5B201S
2018-12-06
Rev.1.0
©2018
Toshiba Electronic Devices & Storage Corporation
TLP627M,TLP627MF
15
Package Dimensions
Package Dimensions
Package Dimensions
Package Dimensions
Unit: mm
TLP627M(LF5,TP5)
Weight: 0.24 g (typ.)
Package Name(s)
TOSHIBA: 11-5B205S
2018-12-06
Rev.1.0
©2018
Toshiba Electronic Devices & Storage Corporation
TLP627M,TLP627MF
16
Package Dimensions
Package Dimensions
Package Dimensions
Package Dimensions
Unit: mm
TLP627MF
Weight: 0.24 g (typ.)
Package Name(s)
TOSHIBA: 11-5B202S
2018-12-06
Rev.1.0
©2018
Toshiba Electronic Devices & Storage Corporation
TLP627M,TLP627MF
17
Package Dimensions
Package Dimensions
Package Dimensions
Package Dimensions
Unit: mm
TLP627MF(LF4,TP4)
Weight: 0.24 g (typ.)
Package Name(s)
TOSHIBA: 11-5B204S
2018-12-06
Rev.1.0
©2018
Toshiba Electronic Devices & Storage Corporation
TLP627M,TLP627MF
18
https://toshiba.semicon-storage.com/
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
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INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and
regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration
Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all
applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
2018-12-06
Rev.1.0
©2018
Toshiba Electronic Devices & Storage Corporation
