Rev. 1.5 / Feb. 2005 2
Synchronous DRAM Memory 64Mbit (4Mx16bit)
HY57V641620E(L/S)T(P) Series
DESCRIPTION
The Hynix HY57V641620E(L/S)T(P) series is a 67,108,864bit CMOS Synchronous DRAM, ideally suited for the memory
applications which require wide data I/O and high bandwidth. HY57V641620E(L/S)T(P) is organized as 4banks of
1,048,576x16.
HY57V641620E(L/S)T(P) is offering fully synchronous operation referenced to a positive edge of the clock. All inputs
and outputs are s ynchroniz ed with the rising edge of the clock input. The da ta paths are internally pipelined to achiev e
very high bandwidth. All input and output voltage levels are compatible with LVTTL.
Programmable options include the length of pipeline (Read latency of 2 or 3), the number of consecutiv e re ad or write
cycles initiated by a single control command (Burst length of 1,2,4,8 or full page), and the burst count sequence(se-
quential or interleave). A burst of r ead or write cycles in progress can be terminated by a burst terminate command or
can be interrupted and replaced by a new burst read or write command on any cycle. (This pipelined design is not re-
stricted by a '2N' rule)
FEATURES
ORDERING INFORMATION
Note: 1. HY57V641620ET Series: Normal power, Leaded.
2. HY57V641620ELT Series: Low power, Leaded.
3. HY57V641620EST Series: Super Low power, Leaded.
4. HY57V641620ETP Series: Normal power, Lead Free.
5. HY57V641620ELTP Series: Low power, Lead Free.
6. HY57V641620ESTP Series: Super Low Power, Lead Free
Part No. Clock Frequency Organization Interface Package
HY57V641620E(L/S)T(P)-5 200MHz
4Banks x 1Mbits x16 LVTTL 54 Pin TSOPII
HY57V641620E(L/S)T(P)-6 166MHz
HY57V641620E(L/S)T(P)-7 143MHz
HY57V641620E(L/S)T(P)-H 133MHz
• Voltage: VDD, VDDQ 3.3V supply voltage
• All device pins are compatible with LVTTL interface
• 54 Pin TSOPII (Lead or Lead Free Package)
• All inputs and outputs refere nced to positive edge of
system clock
• Data mask function by UDQM, LDQM
• Internal four banks operation
• Auto refresh and self refresh
• 4096 Refresh cycles / 64ms
• Programmable Burst Length and Burst Type
- 1, 2, 4, 8 or full page for Sequential Burst
- 1, 2, 4 or 8 for Interleave Burst
• Programmable CAS Latency; 2, 3 Clocks
• Burst Read Single Write operation