QS74FCT16373T, 162373T ADVANCE INFORMATION QS74FCT16373T High-Speed CMOS QS74FCT162373T Q 16-Bit Transparent Latches QUALITY SEMICONDUCTOR, INC. ADVANCE INFORMATION FEATURES/BENEFITS DESCRIPTION * Pin and function compatible with T.I. WidebusTM and IDT Double-DensityTM families * CMOS power levels: <1W typical standby * SSOP (PV) and TSSOP (PA) packages * Low output skew: 0.5ns tSK(O) * Flow-through pinout for easy layout * Power off disable allows hot plugging * Industrial temperature: -40C to +85C * Input hysteresis for noise immunity * Multiple power and ground pins for low noise * Std., A, and C speed grades: 4.2ns tPD for C The FCT16373 family of products are 16-bit buffered latches with three-state outputs that are ideal for driving address and data buses. The output enable and latch enable controls are organized to operate each device as two 8-bit latches, or one 16-bit latch. Easy board layout is facilitated by the use of flowthrough pinouts and byte enable controls provide architectural flexibility for systems designers. All outputs have ground bounce suppression circuitry (see QSI Application Note AN-01) and many power and ground pins provide low ground bounce. To accommodate hot-plug or live insertion applications, both versions of this product were designed not to load an active bus when VCC is removed. In applications where bus signals are point-to-point or driving light capacitance loads, the balanced drive FCT162373 is recommended. FCT16373T * High drive standard FCT-T outputs: IOL = +64mA, IOH = -32mA * Incident switching for driving buses and large loads y n pa m o C FCT162373T * Balanced output drivers: 24mA * Reduced switching noise for point to point signals n a w No Figure 1. Functional Block Diagram 1OE 2OE 1LE 2LE 1D1 2D1 D D 1O1 2O1 C C To 7 Other Channels MDSL-00068-00 MARCH 10, 1998 To 7 Other Channels QUALITY SEMICONDUCTOR, INC. 21 QS74FCT16373T, 162373T ADVANCE INFORMATION Table 1. Pin Description Figure 2. Pin Configuration (All Pins Top View) SSOP, TSSOP 1OE 1O1 1O2 GND 1O3 1O4 VCC 1O5 1O6 GND 1O7 1O8 2O1 2O2 GND 2O3 2O4 VCC 2O5 2O6 GND 2O7 2O8 2OE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 1LE 1D1 1D2 GND 1D3 1D4 VCC 1D5 1D6 GND 1D7 1D8 2D1 2D2 GND 2D3 2D4 VCC 2D5 2D6 GND 2D7 2D8 2LE Name I/O Description xDx I Data Inputs xOx O Data Outputs xLE I Latch Enable xOE I Output Enable y n pa m o C n a w No Table 2. Function Table xDx Internal Q Value Outputs xOx X X X Hi-Z Disable Outputs L L L L X X H L H L Enable Outputs L L H H L H L H L H Pass Inputs L L X Q Q Hold Prior Data xOE Inputs xLE H Function Table 3. Capacitance TA = 25C, f = 1MHz, VIN = 0V, VOUT = 0V Pins Typ Max Unit All 6.0 9.0 pF Note: Capacitance is characterized but not tested. 22 QUALITY SEMICONDUCTOR, INC. MDSL-00068-00 MARCH 10, 1998 QS74FCT16373T, 162373T ADVANCE INFORMATION Table 4. Absolute Maximum Ratings Supply Voltage to Ground ............................................... -0.5V to +7.0V DC Output Voltage VOUT ................................................ -0.5V to +7.0V DC Input Voltage VIN ....................................................... -0.5V to +7.0V AC Input Voltage (for a pulse width 20ns) ................................. -3.0V DC Input Diode Current with VIN < 0 ........................................... -20mA DC Output Diode Current with VOUT < 0 ..................................... -50mA DC Output Current Max. Sink Current/Pin .................................. 120mA Maximum Power Dissipation ................................................... 1.0 watts TSTG Storage Temperature ............................................. -65 to +150C Note: Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to this device resulting in functional or reliability type failures. Table 5. Recommended Operating Conditions Symbol Parameter Min Max Unit VCC Supply Voltage 4.5 5.5 V VIN Input Voltage -0.5 5.5 V VOUT Voltage Applied to Output or I/O 0 VCC V t/v Input Transition Slew Rate -- 10 ns/V -40 +85 C TA Operating Free Air Tempeature y n pa m o C Table 6. DC Electrical Characteristics Over Operating Range n a w Recommended Operating Ranges apply unless otherwise noted. No Symbol Parameter Test Conditions(1) Min Typ(2) Max Unit VIH Input HIGH Voltage Logic HIGH for All Inputs 2.0 -- -- V VIL Input LOW Voltage Logic LOW for All Inputs -- -- 0.8 V VT Input Hysteresis VTLH - VTHL for All Inputs -- 100 -- mV | IIH | | IIL | Input Current Input HIGH or LOW VCC = Max., 0 VIN < VCC -- -- 1 A | IOZ | Off-State Output Current (Hi-Z) VCC = Max., 0 VOUT VCC -- -- 1 A IOS Short Circuit Current VCC = Max., VOUT = GND(3,4) -80 -140 -225 mA VIK Input Clamp Voltage VCC= Min., IIN = -18mA - -0.7 -1.2 V (4) Notes: 1. For conditions shown as Min. or Max. use appropriate value specified under Recommended Operating Conditions for the applicable device type. 2. Typical values indicate VCC = 5.0V and TA = 25C. 3. Not more than one output should be tested at one time. Duration of test should not exceed one second. 4. These parameters are guaranteed by design but not tested. MDSL-00068-00 MARCH 10, 1998 QUALITY SEMICONDUCTOR, INC. 23 QS74FCT16373T, 162373T ADVANCE INFORMATION Table 7. Output Drive Characteristics for FCT16373T Parameter Test Conditions(1) IO Output Drive Current VOH Output HIGH Voltage Symbol Min Typ(2) Max Unit (3) VCC = Max, VOUT = 2.5V -50 -- -180 mA VCC = Min. IOH = -3mA 2.5 -- -- V VIN = VIH or VIL IOH = -15mA 2.4 -- -- V IOH = -32mA 2.0 -- -- V IOL = 64mA -- 0.2 0.55 V -- -- 1.0 A Min Typ(2) Max Unit 115 200 mA -115 -200 mA 3.3 -- V 0.3 0.55 V (4) VOL Output LOW Voltage VCC = Min. VIN = VIH or VIL IOFF Input/Output Power Off Leakage VCC = 0V, VIN or VOUT 4.5V Table 8. Output Drive Characteristics for FCT162373T Parameter Test Conditions(1) IODL Output LOW Current VCC = 5V, VIN = VIH or VIL VOUT = 1.5V(3) 60 IODH Output HIGH Current VCC = 5V, VIN = VIH or VIL VOUT = 1.5V(3) -60 VOH Output HIGH Voltage VCC = Min. VIN = VIH or VIL IOH = -24mA 2.4 VOL Output LOW Voltage VCC = Min. VIN = VIH or VIL IOL = 24mA -- Symbol m o C y n pa Notes: 1. For conditions shown as Min. or Max. use appropriate value specified under Electrical Characteristics for the applicable device type. 2. Typical values indicate VCC = 5.0V and TA = 25C. 3. Not more than one output should be shorted and the duration is 1 second. 4. Duration of the condition should not exceed one second. n a w No 24 QUALITY SEMICONDUCTOR, INC. MDSL-00068-00 MARCH 10, 1998 QS74FCT16373T, 162373T ADVANCE INFORMATION Table 9. Power Supply Characteristics Symbol Parameter Test Conditions(1) ICCQ Quiescent Power Supply Current VCC = Max., Freq = 0 VIN = GND or VCC ICC Supply Current per Input @ TTL HIGH QCCD IC Typ (2) Max Unit 5 500 A VCC = Max., VIN = 3.4V(3) 0.5 1.5 mA Supply Current per Input per MHz(4) VCC = Max., Outputs Open One Bit Toggling @ 50% Duty Cycle xOE = GND 60 100 A/ MHz Total Power Supply Current (6) VCC = Max., Outputs Open One Bit Toggling @ 50% Duty Cycle xOE = GND, fI = 10MHz VIN = VCC VIN = GND VIN = 3.4V VIN = GND 0.6 1.5 mA 0.9 2.3 mA VCC = Max., Outputs Open Sixteen Bits Toggling @ 50% Duty Cycle xOE = GND, fI = 2.5MHz VIN = VCC VIN = GND VIN = 3.4V VIN = GND 2.4 4.5(5) mA 6.4 16.5(5) mA y n pa Notes: 1. For conditions shown as Min. or Max., use the appropriate values specified under Recommended Operating Conditions for applicable device type. 2. Typical values are at VCC = 5.0V, +25C ambient. 3. Per TTL driven input (VIN = 3.4V). All Other Inputs at VCC or GND. 4. This parameter is not directly testable, but is derived for use in Total Power Supply Calculations. 5. Values for these conditions are examples of the ICC formula. These limits are guaranteed by design but not tested. 6. IC = IQUIESCENT + IINPUTS = IDYNAMIC. IC = ICCQ + ICC DHNT + ICCD (fCPNCP/2 + fINI). ICCQ = Quiescent Current (ICCL, ICCH, and ICCZ). ICC = Power Supply Current for a TTL-High Input (VIN = 3.4V). DH = Duty Cycle for TTL High Inputs. NT = Number of TTL High Inputs. ICCD = Dynamic Current Caused by an Input Transition Pair (HLH or LHL). fCP = Clock Frequency for Register devices (Zero for Non-Register Devices). NCP = Number of Clock Inputs at fCP. fI = Input Frequency. NI = Number of Inputs at fI. m o C n a w No MDSL-00068-00 MARCH 10, 1998 QUALITY SEMICONDUCTOR, INC. 25 QS74FCT16373T, 162373T ADVANCE INFORMATION Table 10. Switching Characteristics Over Operating Range Recommended Operating Ranges apply unless otherwise specified. CLOAD = 50pF, RLOAD = 500 unless otherwise noted. FCT16373T FCT162373T Symbol Description(1) FCT16373AT FCT162373AT FCT16373CT FCT162373CT Min Max Min Max Min Max Unit tPHL tPLH Propagation Delay xDx to xOx 1.5 8.0 1.5 5.2 1.5 4.2 ns tPHL tPLH Propagation Delay xLE to xOx 2.0 13.0 2.0 8.5 2.0 5.5 ns tPZH tPZL Output Enable Time xOE to xOx 1.5 12.0 1.5 6.5 1.5 5.5 ns tPHZ tPLZ Output Disable Time(2) xOE to xOx 1.5 7.5 1.5 5.5 1.5 5.0 ns tS Data Setup Time xDx to xLE HIGH to LOW 2.0 -- 2.0 -- 2.0 -- ns tH Data Hold Time xDx to xLE HIGH to LOW 1.5 -- 1.5 -- 1.5 -- ns tW LE Pulse Width HIGH 6.0 -- 5.0 -- 5.0 -- ns tSK(O) Output Skew(3) -- 0.5 -- 0.5 -- 0.5 ns y n pa m o C n a w Notes: 1. Minimums guaranteed but not tested on propagation delays. See Test Circuit and Waveforms. 2. Guaranteed by design, but not tested. 3. Skew between any two outputs of the same package switching in the same direction. This parameter is guaranteed by design but not tested. No 26 QUALITY SEMICONDUCTOR, INC. MDSL-00068-00 MARCH 10, 1998