TC4626/TC4627 Power CMOS Drivers With Voltage Tripler Features * * * * * * Package Type Power Driver With On Board Voltage Booster Low IDD - <4mA Small Package - 8-Pin PDIP Under-Voltage Circuitry Fast Rise-Fall Time - <40nsec @1000pF Below-Rail Input Protection 8-Pin PDIP/CERDIP C1- 1 8 C1+ 2 7 IN C2 3 GND 4 TC4626 TC4627 VDD 6 VBOOST 5 OUT 16-Pin SOIC (Wide) Applications * Raises 5V to drive higher - Vgs (ON) MOSFETs * Eliminates one system power supply Device Selection Table Part Number Package TC4626COE 16-Pin SOIC (Wide) -55C to +125C TC4626CPA 8-Pin PDIP -40C to +85C TC4626EOE 16-Pin SOIC (Wide) -40C to +85C TC4626EPA 8-Pin PDIP 0C to +70C TC4626MJA 8-Pin CERDIP 0C to +70C TC4627COE 16-Pin SOIC (Wide) -55C to +125C TC4627CPA 8-Pin PDIP -40C to +85C TC4627EOE 16-Pin SOIC (Wide) -40C to +85C TC4627EPA 8-Pin PDIP 0C to +70C TC4627MJA 8-Pin CERDIP 0C to +70C Temp. Range C1- 1 16 VDD NC 2 15 NC C1+ 3 14 NC NC 4 13 IN C2 5 NC 6 11 VBOOST NC 7 10 NC GND 8 9 OUT TC4626 TC4627 12 NC General Description The TC4626/TC4627 are single CMOS high speed drivers with an on-board voltage boost circuit. These parts work with an input supply voltage from 4 to 6 volts. The internal voltage booster will produce a VBOOST potential up to 12 volts above VIN. This VBOOST is not regulated, so its voltage is dependent on the input VDD voltage and output drive loading requirements. An internal undervoltage lockout circuit keeps the output in a low state when VBOOST drops below 7.8 volts. Output is enabled when VBOOST is above 11.3 volts. Functional Block Diagram EXT + C1 EXT + C2 C1+ C1- 2 3 C2 VBOOST (Unregulated 3 x VDD) 6 1 V = 2 x VDD EXT + C3 Voltage Booster UV LOCK Noninverting TC4627 5 VDD In GND 8 Output Clock 7 Inverting TC4626 4 NOTE: Pin numbers correspond to 8-pin package. 2001-2012 Microchip Technology Inc. DS21426C-page 1 TC4626/TC4627 1.0 ELECTRICAL CHARACTERISTICS *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings* Supply Voltage ......................................................6.2V Input Voltage, Any Terminal ..................................... VS + 0.3V to GND - 0.3V Package Power Dissipation (TA 70C) PDIP .........................................................730mW CERDIP....................................................800mW SOIC ........................................................760mW Derating Factor PDIP .......5.6 mW/C Above 36C CERDIP................................................6.0mW/C Operating Temperature Range (Ambient) C Version......................................... 0C to +70C E Version ......................................-40C to +85C M Version ...................................-55C to +125C Storage Temperature Range ..............-65C to +150C TC4626/TC4627 ELECTRICAL SPECIFICATIONS Electrical Characteristics: TA = +25C, VDD= 5V, C1 = C2 = C3 10F unless otherwise noted. Symbol Parameter Min Typ Max Units V Test Conditions Input VIH Logic 1, High Input Voltage 2.4 -- -- VIL Logic 0, Low Input Voltage -- -- 0.8 V IIN Input Current -1 -- 1 A -- -- V 0VVINVDRIVE Output VOH High Output Voltage VBOOST - 0.025 VOL Low Output Voltage -- -- 0.025 V RO Output Resistance, High -- 10 15 IOUT = 10mA, VDD = 5V RO Output Resistance, Low -- 8 10 IOUT = 10mA, VDD = 5V IPK Peak Output Current -- 1.5 -- A tR Rise Time -- 33 40 nsec tF Fall Time -- 27 35 nsec Figure 3-1, Figure 3-2 tD1 Delay Time -- 35 45 nsec Figure 3-1, Figure 3-2 tD2 Delay Time -- 45 55 nsec Figure 3-1, Figure 3-2 FMAX Maximum Switching Frequency 1.0 -- -- MHz VDD = 5V, VBOOST > 8.5V, Figure 3-1 R3 Voltage Tripler Output Source Resistance -- 300 400 R2 Voltage Doubler Output Source Resistance -- 120 200 FOSC Oscillator Frequency 12 -- 28 kHz VOSC Oscillator Amplitude Measured at C1- 4.5 -- 10 V UV @VBOOST Undervoltage Threshold 7.0 7.8 8.5 V VSTART @VBOOST Start Up Voltage 10.5 11.3 12 V VBOOST @VDD = 5V 14.6 -- -- V Switching Time Figure 3-1, Figure 3-2 Voltage Booster DS21426C-page 2 IL = 10mA, VDD = 5V RLOAD = 10k No Load 2001-2012 Microchip Technology Inc. TC4626/TC4627 TC4626/TC4627 ELECTRICAL SPECIFICATIONS (CONTINUED) Symbol Parameter Min Typ Max Units Test Conditions Power Supply IDD Power Supply Current -- -- 2.5 mA VDD Supply Voltage 4.0 -- 6.0 V VIN = LOW or HIGH Electrical Characteristics: Over operating temperature range, VDD= 5V, C1 = C2 = C3 10F unless otherwise noted. Symbol Parameter Min Typ Max Units Test Conditions Input VIH Logic 1, High Input Voltage 2.4 -- -- V VIL Logic 0, Low Input Voltage -- -- 0.8 V IIN Input Current -10 -- 1 A 0VVINVBOOST Output VOH High Output Voltage VDRIVE - 0.025 -- -- V VOL Low Output Voltage -- -- 0.025 V RO Output Resistance, High -- 15 15 20 25 10 10 13 15 RO IPK Output Resistance, Low -- IOUT = 10mA, VDD = 5V C & E Version (TA = 70C or 85C) M Version (TA = 125C) IOUT = 10mA, VDD = 5V C & E Version (TA = 70C or 85C) M Version (TA = 125C) Peak Output Current -- 1.5 -- A tR Rise Time -- -- 55 nsec Figure 3-1, Figure 3-2 tF Fall Time -- -- 50 nsec Figure 3-1, Figure 3-2 tD1 Delay Time -- -- 60 nsec Figure 3-1, Figure 3-2 tD2 Delay Time -- -- 70 nsec Figure 3-1, Figure 3-2 FMAX Maximum Switching Frequency 750 -- -- kHz VDD = 5V, VBOOST > 8.5V, Figure 3-1 Switching Time Voltage Booster R3 Voltage Boost Output Source Resistance -- 400 500 R2 Voltage Doubler Output Source Resistance -- 170 300 FOSC Oscillator Frequency 5 -- 50 kHz VOSC Oscillator Amplitude Measured at C1- 4.5 -- 10 V UV @VBOOST Undervoltage Threshold 7.0 7.8 8.5 V VSTART @VBOOST Start Up Voltage 10.5 11.3 12 V VBOOST @VDD = 5V 14.6 -- -- V IL = 10mA, VDD = 5V RLOAD = 10k No Load Power Supply IDD Power Supply Current -- -- 4 mA VDD Supply Voltage 4.0 -- 6.0 V 2001-2012 Microchip Technology Inc. VIN = LOW or HIGH DS21426C-page 3 TC4626/TC4627 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: Pin No. (8-Pin PDIP, CERDIP) PIN FUNCTION TABLE Symbol 1 C1- 2 C1+ 3 C2 4 GND 5 OUT 6 VBOOST 7 IN 8 VDD Pin No. (16-Pin SOIC Wide) Symbol 1 C1- 2 NC 3 C1+ 4 NC 5 C2 6 NC 7 NC 8 GND 9 OUT 10 NC 11 VBOOST 12 NC Description Ground. Description No connect. No connect. No connect. No connect. Ground. No connect. No connect. 13 IN 14 NC No connect. 15 NC No connect. 16 VDD DS21426C-page 4 2001-2012 Microchip Technology Inc. TC4626/TC4627 3.0 APPLICATIONS INFORMATION FIGURE 3-1: INVERTING DRIVER SWITCHING TIME FIGURE 3-2: NONINVERTING DRIVER SWITCHING TIME VBOOST VBOOST C3 10F 0.1F Ceramic C3 10F 6 Input 6 7 2 C1 10F 1 3 5 C1+ Output CL = 1000pF Input C1 10F 1 TC4626 C2 10F 8 3 VDD = 5V C1+ Output CL = 1000pF C1- C2 TC4627 8 VDD = 5V 4 +5V 90% Input VBOOST 5 C2 10F 4 +5V 0V 7 2 C1- C2 0.1F Ceramic 90% Input 10% tD1 tF tD2 0V tR VBOOST tD1 90% 90% 90% 10% Input: 100kHz, square wave, tRISE = tFALL 10nsec 2001-2012 Microchip Technology Inc. 10% 0V tD2 90% tF tR Output Output 0V 10% 10% 10% Input: 100kHz, square wave, tRISE = tFALL 10nsec DS21426C-page 5 TC4626/TC4627 3.1 BOOSTER FUNCTION C1 potential to VDD input to charge C2 to 2 x VDD. S3a and S3b add C1 potential to C2 to charge C3 to 3 x VDD. The position of the switches is controlled by the internal 4 phase clock. The voltage booster is an unregulated voltage tripler circuit. The tripler consists of three sets of internal switches and three external capacitors. S1a and S1b charge capacitor C1 to VDD potential. S2a and S2b add FIGURE 3-3: VOLTAGE BOOSTER 3 x VDD, VBOOST 6 6 + C3 S3a 2 x VDD 3 + S2a C2 (4 to 6V) VDD S3b 8 S1a S2b 2 + C1 1 S1b GND 4 FIGURE 3-4: POSITION OF SWITCHES Pin 1 & 2 Waveforms 3 x VDD 2 x VDD Pin 2 Voltage VDD 2 x VDD Pin 1 Voltage VDD 0 On S1 Off S2 On Off S3 On Off DS21426C-page 6 2001-2012 Microchip Technology Inc. TC4626/TC4627 4.0 TYPICAL CHARACTERISTICS Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. TC4626 VOH vs. Frequency TC4626 VOH vs. Frequency 16 VS = 5V TA = -55C 470pF 14 14 12 VOUT HI (Volts) VOUT HI (Volts) 12 10 2200pF 8 1000pF 6 10 8 6 2200pF 4 4 2 2 0 5 10 500 1,000 1,500 2,000 2,500 3,000 3,500 FREQUENCY (kHz) TC4626 VOH vs. Frequency Delay Time vs. Temperature 14 100 VS = 5V TA = 125C 12 10 80 470pF Time (nsec) VOUT HI (Volts) 1000pF 0 500 1,000 1,500 2,000 2,500 3,000 3,500 FREQUENCY (kHz) 8 6 2200pF 1000pF Input = 0-5V; TR & TF <10nsec; @ <20kHz VS = 4V CLOAD = 1000pF tD2 60 tD1 40 tRISE 4 20 2 0 tFALL 0 5 500 1,000 1,500 2,000 2,500 3,000 3,500 -40 -20 30 20 50 VS = 5V CLOAD = 1000pF tD2 tD1 tFALL 40 60 80 100 120 VS = 6V CLOAD = 1000pF 40 Time (nsec) 40 20 Delay Time vs. Temperature Delay Time vs. Temperature 60 50 0 TEMPERATURE (C) FREQUENCY (kHz) Time (nsec) VS = 5V TA = 25C 470pF tD2 30 tD1 20 tRISE tFALL tRISE Input = 0-5V; TR & TF <10nsec; @ <20kHz 10 10 Input = 0-5V; TR & TF <10nsec; @ <20kHz 0 0 -40 -20 0 20 40 60 TEMPERATURE (C) 2001-2012 Microchip Technology Inc. 80 100 120 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (C) DS21426C-page 7 TC4626/TC4627 TYPICAL CHARACTERISTICS (CONTINUED) TC4626 VOH vs. Frequency TC4626 VOH vs. Frequency 16 16 VS = 5V TA = 25C 15 14 14 VOUT HI (Volts) VOUT HI (Volts) VS = 5V TA = -55C 15 13 12 470pF 11 1,000pF 10 470pF 13 12 1,000pF 11 2,200pF 10 9 9 2,200pF 8 8 0 1 2 3 4 5 6 7 8 9 10 FREQUENCY x 100 kHz 0 1 2 3 4 5 6 7 8 9 10 FREQUENCY x 100 kHz TC4626 VOH vs. Frequency 16 VS = 5V TA = 125C 15 VOUT HI (Volts) 14 13 12 11 470pF 10 1,000pF 9 2,200pF 8 0 1 2 3 4 5 6 7 8 9 10 FREQUENCY x 100 kHz DS21426C-page 8 2001-2012 Microchip Technology Inc. TC4626/TC4627 5.0 PACKAGING INFORMATION Package marking data not available at this time. 2001-2012 Microchip Technology Inc. DS21426C-page 9 TC4626/TC4627 5.1 Package Dimensions Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin Plastic DIP PIN 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .070 (1.78) .040 (1.02) .310 (7.87) .290 (7.37) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .040 (1.02) .020 (0.51) .150 (3.81) .115 (2.92) .110 (2.79) .090 (2.29) .022 (0.56) .015 (0.38) .015 (0.38) .008 (0.20) 3 MIN. .400 (10.16) .310 (7.87) Dimensions: inches (mm) DS21426C-page 10 2001-2012 Microchip Technology Inc. TC4626/TC4627 Package Dimensions (Continued) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin CDIP (Narrow) .110 (2.79) .090 (2.29) PIN 1 .300 (7.62) .230 (5.84) .020 (0.51) MIN. .055 (1.40) MAX. .320 (8.13) .290 (7.37) .400 (10.16) .370 (9.40) .200 (5.08) .160 (4.06) .040 (1.02) .020 (0.51) .150 (3.81) MIN. .200 (5.08) .125 (3.18) .015 (0.38) .008 (0.20) 3 MIN. .400 (10.16) .320 (8.13) .065 (1.65) .020 (0.51) .045 (1.14) .016 (0.41) Dimensions: inches (mm) 2001-2012 Microchip Technology Inc. DS21426C-page 11 TC4626/TC4627 Package Dimensions (Continued) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 16-Pin SOIC (Wide) Dimensions: inches (mm) DS21426C-page 12 2001-2012 Microchip Technology Inc. TC4626/TC4627 6.0 REVISION HISTORY Revision C (December 2012) Added a note to each package outline drawing. 2001-2012 Microchip Technology Inc. DS21426C-page 13 TC4626/TC4627 DS21426C-page 14 2001-2012 Microchip Technology Inc. TC4626/TC4627 Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. Your local Microchip sales office The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2001-2012 Microchip Technology Inc. DS21426C-page15 TC4626/TC4627 NOTES: DS21426C-page16 2001-2012 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2001-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620768006 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2001-2012 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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