2001-2012 Microchip Technology Inc. DS21426C-page 1
TC4626/TC4627
Features
• Power Driver With On Board Voltage Booster
•Low I
DD – <4mA
• Small Package – 8-Pin PDIP
• Under-Voltage Circuitry
• Fast Rise-Fa ll Time – <40nsec @1000pF
• Below-Ra il Inpu t Protec tio n
Applications
• Raises 5V to drive higher – Vgs (ON) MOSFETs
• Eliminates one system power supply
Device Selection Table
Package Type
General Description
The TC4626/TC4627 are single CMOS high speed
drivers with an on-board voltage boost circuit. These
parts work with an input supply voltage from 4 to 6 volts.
The internal voltage booster will produce a VBOOST
potential up to 12 volts above VIN. This VBOOST is no t
regulate d, s o its voltage is dependen t on the in put VDD
voltage and output drive loading requirements. An
internal undervolta ge lockout ci rcuit keep s the output in
a low s tate w hen VBOOST drops below 7.8 volts. Output
is en abled when VBOOST is above 11.3 volts.
Functional Block Diagram
Part
Number Package Temp. Range
TC4626 CO E 16-Pin SOIC (W i de ) -55°C to +125°C
TC4626CPA 8-Pin PDIP -40°C to +85°C
TC4626 EOE 16-Pin SOIC (W i de ) -40°C to +85°C
TC4626EPA 8-Pin PDIP 0°C to +70°C
TC4626MJA 8-Pin CERDIP 0°C to +70°C
TC4627 CO E 16-Pin SOIC (W i de ) -55°C to +125°C
TC4627CPA 8-Pin PDIP -40°C to +85°C
TC4627 EOE 16-Pin SOIC (W i de ) -40°C to +85°C
TC4627EPA 8-Pin PDIP 0°C to +70°C
TC4627MJA 8-Pin CERDIP 0°C to +70°C
1
2
3
45
6
7
8
IN
OUT
C1+
C2
GND
1
2
3
413
14
15
16
V
BOOST
NC
IN
C1–
NC
C1+
NC
NC
V
DD
C1–
V
DD
5
6
7
89
10
11
12
C2
NC
NC
GND
NC
V
BOOST
NC
OUT
TC4626
TC4627
TC4626
TC4627
8-Pin PDIP/CERDIP
16-Pin SOIC (Wide)
Voltage
Booster
Clock
C1+
C1-
C2
In
GND
EXT
Output
V
BOOST
EXT
V = 2 x V
DD
V
DD
1
2
3
8
7
4
6
5
C
3
Noninverting
TC4627
Inverting
TC4626
(Unregulated 3 x V
DD
)
UV LOCK
C
2
EXT
C
1
+
+
+
NOTE: Pin numbers correspond to 8-pin package.
Power CMOS Drivers With Voltage Tripler
TC4626/TC4627
DS21426C-page 2 2001-2012 Microchip Technology Inc.
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Supply Voltage ......................................................6.2V
Input Voltage, Any Terminal
.....................................VS + 0.3V to GND – 0.3V
Package Power Dissipation (TA 70°C)
PDIP.........................................................730mW
CERDIP....................................................800mW
SOIC ........................................................760mW
Derating Factor PDIP.......5.6 mW/°C Above 36°C
CERDIP................................................6.0mW/°C
Operating Temperature Range (Ambient)
C Version.........................................0°C to +70°C
E Version......................................-40°C to +85°C
M Version...................................-55°C to +125°C
Storage Temperature Range..............-65°C to +150°C
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and funct ional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
TC4626/TC4 627 EL E CTRICAL SPECIFICATIO NS
Electrical Characteristics: TA = +25°C, VDD= 5V, C 1 = C2 = C3 10F unless otherwise noted.
Symbo l Para m et er Min Typ Max Unit s Test Conditions
Input
VIH Logic 1, High Input Voltage 2.4 — — V
VIL Logic 0, Low Input Voltage — — 0.8 V
IIN Input Current -1 — 1 A0VVINVDRIVE
Output
VOH High Output V oltage VBOOST – 0.025 — — V
VOL Low Output Voltage — — 0.025 V
ROOutput Resistance, High — 10 15 IOUT = 10mA, VDD = 5V
ROOutput Resistance, Low — 8 10 IOUT = 10mA, VDD = 5V
IPK Peak Output Current — 1.5 — A
Switching Time
tRRise Time — 33 40 nsec Figure 3-1, Figure 3-2
tFFall Time — 27 35 nsec Figure 3-1, Figure 3-2
tD1 Delay Time — 35 45 nsec Figure 3-1, Figure 3-2
tD2 Delay Time — 45 55 nsec Figure 3-1, Figure 3-2
FMAX Maximum Switching Frequency 1.0 — — MHz VDD = 5V, VBOOST > 8.5V,
Figure 3-1
Voltage Booster
R3Voltage Tripler Output
Source Resistance — 300 400 IL = 10mA, VDD = 5V
R2Voltage Doubler Output
Source Resistance — 120 200
FOSC Oscillator Frequency 12 — 28 kHz
VOSC Oscillator Amplitude Measured
at C1- 4.5 — 10 V RLOAD = 10k
UV @VBOOST Undervoltage Threshold 7.0 7.8 8.5 V
VSTART @VBOOST Start Up Voltage 10.5 11.3 12 V
VBOOST @VDD = 5V 14.6 — — V No Load
2001-2012 Microchip Technology Inc. DS21426C-page 3
TC4626/TC4627
TC4626/TC4627 ELECTRICAL SPECIFICATIONS (CONTINUED)
Symbol Parameter Min Typ Max Units Test Conditions
Power Supply
IDD Power Supply Current — — 2.5 mA VIN = LOW or HIGH
VDD Supply Voltage 4.0 — 6.0 V
Electrical Characteristics: Over operating temperature range, VDD= 5V, C1 = C2 = C3 10F unless otherwise noted.
Symbol Parameter Min Typ Max Units Test Conditions
Input
VIH Logic 1, High Input Voltage 2.4 — — V
VIL Logic 0, Low Input Volt age — — 0.8 V
IIN Input Current -10 — 1 A0VVINVBOOST
Output
VOH High Output Voltage VDRIVE – 0.025 — — V
VOL Low Output V oltage — — 0.025 V
ROOutput Resistance, High — 15
15 20
25
IOUT = 10mA, VDD = 5V
C & E Version (TA = 70°C or 85°C)
M V ersion (TA = 125°C)
ROOutput Resistance, Low — 10
10 13
15
IOUT = 10mA, VDD = 5V
C & E Version (TA = 70°C or 85°C)
M V ersion (TA = 125°C)
IPK Peak Output Current — 1.5 — A
Switc hing Time
tRRise Time — — 55 nsec Figure 3-1, Figure 3-2
tFFall Time — — 50 nsec Figure 3-1, Figure 3-2
tD1 Delay Ti me — — 60 nsec Figure 3-1, Figure 3-2
tD2 Delay Ti me — — 70 nsec Figure 3-1, Figure 3-2
FMAX Maximum Swit ching Frequency 750 — — kHz VDD = 5V, VBOOST > 8.5V,
Figure 3-1
Voltage Booster
R3Voltage Boost Output
Source R esistance — 400 500 IL = 10mA, VDD = 5V
R2Voltage Doubler Output
Source R esistance — 170 300
FOSC Oscillator Frequency 5 — 50 kHz
VOSC Oscillator Amplitude
Measured at C1- 4.5 — 10 V RLOAD = 10k
UV @VBOOST Undervoltage Threshold 7.0 7.8 8.5 V
VSTART @VBOOST Start Up Voltage 10.5 11.3 12 V
VBOOST @VDD = 5V 14.6 — — V No Load
Power Supply
IDD Power Supply Current — — 4 mA VIN = LOW or HIGH
VDD Supply Voltage 4.0 — 6.0 V
TC4626/TC4627
DS21426C-page 4 2001-2012 Microchip Technology Inc.
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1: PIN FUNCTION TABLE
Pin No.
(8-P in PD I P,
CERDIP) Symbol Description
1C1-
2C1+
3C2
4 GND Ground.
5OUT
6V
BOOST
7IN
8V
DD
Pin No.
(16-Pin SOIC
Wide) Symbol Description
1C1-
2 NC No connect.
3C1+
4 NC No connect.
5C2
6 NC No connect.
7 NC No connect.
8 GND Ground.
9OUT
10 NC No connect.
11 VBOOST
12 NC No connect.
13 IN
14 NC No connect.
15 NC No connect.
16 VDD
2001-2012 Microchip Technology Inc. DS21426C-page 5
TC4626/TC4627
3.0 APPLICATIONS INFORMATION
FIGURE 3-1: INVERTING DRIVER
SWITCHING TIME FIGURE 3-2: NONINVERTING DRIVER
SWITCHING TIME
0.1μF Ceramic
VBOOST
+5V
10%
90%
10%
90%
10%
90%
0V
0V
TC4626
C1+
C1-
VDD = 5V
C2
VBOOST
38
7
1
6
5
2
4
CL = 1000pF
Input
Input
Output
tD1
tF
tD2
Input: 100kHz,
square wave,
tRISE = tFALL ≤ 10nsec
Output
tR
C1
10μF
C2
10μF
C3
10μF
0.1μF Ceramic
V
BOOST
+5V
TC4627
C1+
C1-
V
DD
= 5V
C
2
V
BOOST
38
7
1
6
5
2
4
C
L
= 1000pF
Input
Input
Output
t
D1
t
F
t
D2
Input: 100kHz,
square wave,
t
RISE
= t
FALL
≤ 10nsec
Output t
R
C
1
10μF
C
2
10μF
C
3
10μF
90%
10%
10% 10%
90%
0V
0V
90%
TC4626/TC4627
DS21426C-page 6 2001-2012 Microchip Technology Inc.
3.1 BOOSTER FUNCTION
The voltage booster is an unregulated voltage tripler
circuit. The tripler consists of three sets of internal
switches and three external capacitors. S1a and S1b
charge c apacitor C 1 to VDD potential. S2a and S2b add
C1 potenti al to VDD inpu t to charge C2 t o 2 x V DD. S3a
and S3b add C1 potential to C2 to charge C3 to 3 x
VDD. The position of the switches is controlled by the
internal 4 phase clock.
FIGURE 3-3: VOLTAGE BOOSTER
FIGURE 3-4: POSITION OF SWITCHES
C3
C2
6
3
8
2
C1
S1a
S1b
GND
4
S2a
S2b
2 x VDD
3 x VDD, VBOOST
6
S3b
S3a
1
(4 to 6V)
VDD
+
+
+
Pin 2
Voltage
Pin 1
Voltage
3 x VDD
2 x VDD
VDD
2 x VDD
VDD
0
On
Off
S1
On
Off
S2
On
Off
S3
Pin 1 & 2 Waveforms
2001-2012 Microchip Technology Inc. DS21426C-page 7
TC4626/TC4627
4.0 TYPICAL CHARACTERISTIC S
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are pro vided for informational purp oses only . The performance characteristics l isted herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
V
OUT
HI (Volts)
TC4626 V
OH
vs. Frequency
5500 1,000 1,500 2,000 2,500 3,000 3,500
16
14
12
10
8
6
4
2
0
FREQUENCY (kHz)
470pF
2200pF
1000pF
V
S
= 5V
T
A
= -55
°
C
FREQUENCY (kHz)
TC4626 V
OH
vs. Frequency
5500 1,000 1,500 2,000 2,500 3,000 3,500
14
12
10
8
6
4
2
0
470pF
2200pF 1000pF
V
OUT
HI (Volts)
V
S
= 5V
T
A
= 125
°
C
Time (nsec)
-40 -20 0 20 40 60 80
60
50
40
30
20
0
Delay Time vs. Temperature
100
10
120
VS = 5V
CLOAD = 1000pF
Input = 0-5V;
TR & TF <10nsec;
@ <20kHz
TEMPERATURE (
°
C)
t
D2
t
D1
t
RISE
t
FALL
V
OUT
HI (Volts)
14
12
10
8
6
4
2
0
10 500 1,000 1,500 2,000 2,500 3,000 3,500
FREQUENCY (kHz)
470pF
2200pF 1000pF
V
S
= 5V
T
A
= 25
°
C
TC4626 V
OH
vs. Frequency
Time (nsec)
-40 -20 0 20 40 60 80
100
80
60
40
20
0
Delay Time vs. Temperature
100 120
Input = 0-5V;
T
R
& T
F
<10nsec;
@ <20kHz
V
S
= 4V
C
LOAD
= 1000pF
TEMPERATURE (
°
C)
t
D2
t
D1
t
RISE
t
FALL
Delay Time vs. Temperature
Time (nsec)
-40 -20 0 20 40 60 80
50
40
30
20
0
100
10
120
VS = 6V
CLOAD = 1000pF
Input = 0-5V;
TR & TF <10nsec;
@ <20kHz
TEMPERATURE (°C)
tD2
tD1
tRISE
tFALL
TC4626/TC4627
DS21426C-page 8 2001-2012 Microchip Technology Inc.
TYPICAL CHARACTERISTICS (CONTINUED)
V
OUT
HI (Volts)
1234567
13
12
11
10
9
8
8
FREQUENCY x 100 kHz
910
0
14
15
16
2,200pF
470pF
1,000pF
V
S
= 5V
T
A
= 25
°
C
TC4626 V
OH
vs. Frequency
V
OUT
HI (Volts)
1234 567
13
12
11
10
9
8
8
FREQUENCY x 100 kHz
910
0
14
15
16
470pF
2,200pF
1,000pF
V
S
= 5V
T
A
= 125°C
TC4626 VOH vs. Frequency
1234567
13
12
11
10
9
8
8
FREQUENCY x 100 kHz
9100
14
15
16
2,200pF
470pF
1,000pF
VS = 5V
TA = -55°C
TC4626 V
OH
vs. Frequency
VOUT HI (Volts)
2001-2012 Microchip Technology Inc. DS21426C-page 9
TC4626/TC4627
5.0 PACKAGING INFORMATION
Pack age marki ng data not available at this time.
TC4626/TC4627
DS21426C-page 10 2001-2012 Microchip Technology Inc.
5.1 Package Dimensions
3
°
MIN.
PIN 1
.260
(
6.60
)
.240
(
6.10
)
.045
(
1.14
)
.030
(
0.76
)
.070
(
1.78
)
.040
(
1.02
)
.400
(
10.16
)
.348
(
8.84
)
.200
(
5.08
)
.140
(
3.56
)
.150
(
3.81
)
.115
(
2.92
)
.110
(
2.79
)
.090
(
2.29
)
.022
(
0.56
)
.015 (0.38
)
.040
(
1.02
)
.020
(
0.51
)
.015
(
0.38
)
.008
(
0.20
)
.310
(
7.87
)
.290
(
7.37
)
.400
(
10.16
)
.
310
(
7.87
)
8-Pin Plastic DIP
Dimensions: inches (mm)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
2001-2012 Microchip Technology Inc. DS21426C-page 11
TC4626/TC4627
Package Dimensions (Continued)
.400
(
10.16
)
.370
(
9.40
)
.300
(
7.62
)
.230
(
5.84
)
.065
(
1.65
)
.045
(
1.14
)
.055
(
1.40
)
MAX
.
.020
(
0.51
)
MIN
.
PIN 1
.200
(
5.08
)
.160
(
4.06
)
.200
(
5.08
)
.125
(
3.18
)
.110
(
2.79
)
.090
(
2.29
)
.020
(
0.51
)
.016
(
0.41
)
.040
(
1.02
)
.020
(
0.51
)
.320
(
8.13
)
.290
(
7.37
)
.150
(
3.81
)
MIN.
3
°
MIN.
8-Pin CDIP
(
Narrow
)
.015
(
0.38
)
.008
(
0.20
)
.400
(
10.16
)
.320
(
8.13
)
Dimensions: inches (mm)
Note: For th e mo s t c urr e nt pac kag e d r awi n gs , plea se se e th e M ic roc hi p Pa c ka gi n g Spe ci fic at i on lo c at ed
at http://www.microchip.com/packaging
TC4626/TC4627
DS21426C-page 12 2001-2012 Microchip Technology Inc.
Package Dimensions (Continued)
°
16-Pin SOIC (Wide)
Dimensions: inches (mm)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
2001-2012 Microchip Technology Inc. DS21426C-page 13
TC4626/TC4627
6.0 REVISION HISTORY
Revision C (December 2012)
Added a note to each package outline drawing.
TC4626/TC4627
DS21426C-page 14 2001-2012 Microchip Technology Inc.
2001-2012 Microchip Technology Inc. DS21426C-page15
TC4626/TC4627
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microc hip sales office
2. The Microchip Worldwide Site (www.micr ochip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip. com /cn) to receive the most current information on our products.
TC4626/TC4627
DS21426C-page16 2001-2012 Microchip Technology Inc.
NOTES:
2001-2012 Microchip Technology Inc. DS21426C-page 17
Information contained in this publication regarding device
applications a nd the lik e is pro vid ed only for your c on ve nience
and may be supers eded by u pdates. It is y our res po ns i bil it y to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip T echnology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SE EVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM ,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONIT OR, FanSense, HI-TIDE , In - Circuit Serial
Programm ing, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver , Wi perLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2001-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620768006
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that it s family of products is one of the most secure families of its kind on the market today, when used in t he
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is c onstantly evolving. We a t Microc hip are co m mitted to continuously improving the code prot ect ion featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperiph erals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS21426C-page 18 2001-2012 Microchip Technology Inc.
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China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
ASIA/PACIFIC
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Japan - Osaka
Tel: 81-66-152-7160
Fax: 81-66-152-9310
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
Taiwan - T aipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Cop e nha gen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-14 4-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08 -91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921- 5820
Worldwide Sales and Service
11/27/12
