© Semiconductor Components Industries, LLC, 2011
October, 2011 − Rev. 6
1Publication Order Number:
BAS20HT1/D
BAS20HT1, SBAS20HT1G
High Voltage
Switching Diode
Features
•AEC−Q101 Qualified and PPAP Capable
•S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating Symbol Value Unit
Continuous Reverse Voltage VR200 Vdc
Repetitive Peak Reverse Voltage VRRM 200 Vdc
Continuous Forward Current IF200 mAdc
Peak Forward Surge Current IFM(surge) 625 mAdc
Repetitive Peak Forward Current IFRM 500 mA
Non−Repetitive Peak Forward Current
(Square Wave, TJ = 25°C prior to surge)
t = 1 ms
t = 1 ms
t = 1 s
IFSM
5.0
2.0
0.5
A
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR−5 Board*
TA = 25°C
Derate above 25°C
PD200
1.57
mW
mW/°C
Thermal Resistance Junction−to−Ambient RqJA 635 °C/W
Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*FR−5 Minimum Pad
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Reverse Voltage Leakage Current
(VR = 200 Vdc)
(VR = 200 Vdc, TJ = 150°C)
IR
−
−
1.0
100
mAdc
Reverse Breakdown Voltage
(IBR = 100 mAdc)
V(BR) 250 −Vdc
Forward Voltage
(IF = 100 mAdc)
(IF = 200 mAdc)
VF
−
−
1000
1250
mV
Diode Capacitance
(VR = 0, f = 1.0 MHz)
CD−5.0 pF
Reverse Recovery Time
(IF = IR = 30 mAdc, RL = 100 W)
trr −50 ns
http://onsemi.com
HIGH VOLTAGE
SWITCHING DIODE
Device Package Shipping†
ORDERING INFORMATION
SOD−323
CASE 477
STYLE 1
1
CATHODE
2
ANODE
MARKING DIAGRAM
JR = Specific Device Code
M = Date Code*
G= Pb−Free Package
1
2
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
JR M G
G
BAS20HT1G SOD−323
(Pb−Free)
3000 / Tape & Reel
(Note: Microdot may be in either location)
*Date Code orientation may vary depending upon
manufacturing location.
SBAS20HT1G SOD−323
(Pb−Free)
3000 / Tape & Reel
BAS20HT1, SBAS20HT1G
http://onsemi.com
2
Notes: 1. A 2.0 kW variable resistor adjusted for a Forward Current (IF) of 30 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 30 mA.
Notes: 3. tp » trr
+10 V 2.0 k
820 W
0.1 mF
D.U.T.
VR
100 mH
0.1 mF
50 W Output
Pulse
Generator
50 W Input
Sampling
Oscilloscope
trtpt
10%
90%
IF
IR
trr t
iR(REC) = 3.0 mA
OUTPUT PULSE
(IF = IR = 30 mA; MEASURED
at iR(REC) = 3.0 mA)
IF
INPUT SIGNAL
Figure 1. Recovery Time Equivalent Test Circuit
Figure 2. Forward Current Figure 3. Leakage Current
1000
I
VF
, FORWARD VOLTAGE (V)
0.1
0.2 0.4 0.6
100
10
1.0
0.8 1.0 1.2 1.40
100
I
VR, REVERSE VOLTAGE (V)
1.0
0.001
500
10
0.1
100 150 200 250
0.01
300
125°C
150°C−40°C
25°C
55°C
, REVERSE CURRENT ( A)
Rm
, FORWARD CURRENT (mA)
F
125°C
150°C
−40°C
25°C
55°C
Figure 4. Total Capacitance
2.0
C
VR, REVERSE VOLTAGE (V)
0
5.0 10 15
1.8
0.4
0.2
20 25 30 35
0
, TOTAL CAPACITANCE (pF)
T
0.8
0.6
1.2
1.0
1.6
1.4
f = 1 MHz
IE = 0 A
TA = 25°C
BAS20HT1, SBAS20HT1G
http://onsemi.com
3
PACKAGE DIMENSIONS
HE
SOD−323
CASE 477−02
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
WITH SOLDER PLATING.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
5. DIMENSION L IS MEASURED FROM END OF RADIUS.
NOTE 3
D
12bE
A3
A1
A
CNOTE 5
L
1.60
0.063
0.63
0.025
0.83
0.033
2.85
0.112
HE
DIM MIN NOM MAX
MILLIMETERS
A0.80 0.90 1.00
A1 0.00 0.05 0.10
A3 0.15 REF
b0.25 0.32 0.4
C0.089 0.12 0.177
D1.60 1.70 1.80
E1.15 1.25 1.35
0.08
2.30 2.50 2.70
L
0.031 0.035 0.040
0.000 0.002 0.004
0.006 REF
0.010 0.012 0.016
0.003 0.005 0.007
0.062 0.066 0.070
0.045 0.049 0.053
0.003
0.090 0.098 0.105
MIN NOM MAX
INCHES
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
BAS20HT1/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
