BY229, BY229X, BY229B Series Vishay Semiconductors formerly General Semiconductor Fast Switching Plastic Rectifier Reverse Voltage 200 to 600V Forward Current 8.0A ITO-220AC (BY229X Series) 0.188 (4.77) 0.172 (4.36) 0.405 (10.27) 0.383 (9.72) 0.110 (2.80) 0.100 (2.54) TO-220AC (BY229 Series) 0.175 (4.44) 0.154 (3.91) 0.370 (9.40) 0.360 (9.14) 0.148 (3.74) DIA. 0.055 (1.39) 0.045 (1.14) 0.113 (2.87) 0.103 (2.62) 0.350 (8.89) 0.330 (8.38) 0.350 (8.89) 0.330 (8.38) 0.635 (16.13) 0.625 (15.87) PIN 1 2 0.191 (4.85) 0.171 (4.35) 0.560 (14.22) 0.530 (13.46) 1.148 (29.16) 1.118 (28.40) 0.160 (4.06) 0.140 (3.56) 2 0.603 (15.32) 0.573 (14.55) PIN 1 0.676 (17.2) 0.646 (16.4) 0.600 (15.5) 0.580 (14.5) 0.145 (3.68) 0.135 (3.43) 0.410 (10.41) 0.390 (9.91) PIN 1 0.560 (14.22) 0.530 (13.46) PIN 1 CASE PIN 2 0.037 (0.94) 0.027 (0.69) 0.205 (5.20) 0.195 (4.95) 0.105 (2.67) 0.037 (0.94) 0.027 (0.68) 0.095 (2.41) 0.205 (5.20) 0.195 (4.95) 0.110 (2.80) 0.100 (2.54) 0.060 (1.52) 0.110 (2.79) 0.100 (2.54) PIN 2 0.131 (3.39) DIA. 0.122 (3.08) 0.140 (3.56) DIA. 0.130 (3.30) 0.185 (4.70) 0.415 (10.54) MAX. 0.022 (0.55) 0.014 (0.36) TO-263AB (BY229B Series) 0.022 (0.56) 0.014 (0.36) 0.190 (4.83) 0.411 (10.45) 0.380 (9.65) 0.160 (4.06) 0.055 (1.40) 0.045 (1.14) 0.245 (6.22) MIN Mounting Pad Layout TO-263AB K 0.42 (10.66) 0.047 (1.19) 1 Dimensions in inches and (millimeters) 0.63 (17.02) 0.055 (1.40) 0.360 (9.14) 0.320 (8.13) 0.33 (8.38) K 2 0.624 (15.85) 0.591 (15.00) 0-0.01 (0-0.254) 0.110 (2.79) 0.090 (2.29) 0.027 (0.686) 0.037 (0.940) 0.105 (2.67) 0.08 (2.032) 0.24 (6.096) 0.12 (3.05) 0.095 (2.41) 0.021 (0.53) 0.014 (0.36) PIN 1 PIN 2 0.205 (5.20) K - HEATSINK 0.140 (3.56) 0.110 (2.79) 0.195 (4.95) Features Mechanical Data * Plastic package has Underwriters Laboratories Flammability Classification 94V-0 * Glass passivated chip junction * Low leakage, high voltage * High surge current capability * Superfast recovery time, for high efficiency * High temperature soldering guaranteed: 250C, 0.25" (6.35mm) from case for 10 seconds Case: JEDEC TO-220AC, ITO-220AC and TO-263AB plastic body over passivated chip Terminals: Plated leads, solderable per MIL-STD-750, Method 2026 Polarity: As marked Mounting Position: Any Weight: 0.064 oz., 1.81 g Mounting Torque: 10 in-lbs maximum Document Number 88540 16-Dec-03 www.vishay.com 1 BY229, BY229X, BY229B Series Vishay Semiconductors formerly General Semiconductor Maximum Ratings (TC = 25C unless otherwise noted) Parameter Symbol BY229-200 BY229-400 BY229-600 Unit Maximum recurrent peak reverse voltage VRRM 200 400 600 V Maximum RMS voltage VRMS 140 280 420 V Maximum DC blocking voltage VDC 200 400 600 V Maximum average forward rectified current at TC=100C IF(AV) 8.0 A Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 100 A Maximum slope of reverse recovery current IF=2.0A, VR=30V, di/dt=20A/s dir/dt 60 A/s TJ, TSTG -40 to +150 C 4500 3500 1500 V Operating junction and storage temperature range RMS Isolation voltage from terminals to heatsink with t = 1 second, RH 30% (BY229X only) Electrical Characteristics (T C VISOL (Note 1) (Note 2) (Note 3) = 25C unless otherwise noted) Parameter Symbol Maximum instantaneous forward voltage at 20A BY229-200 BY229-400 BY229-600 Unit VF 1.85 V IR 10 300 A Maximum reverse recovery time at IF=1.0A, VR=30V, di/dt=50A/s, Irr=10% IRM trr 145 ns Maximum recovered stored charge (Note 2) IF=2.0A, VR=30V, di/dt=20A/s Qrr 700 nC Maximum DC reverse current at rated DC blocking voltage at TJ = 25C TJ = 125C Thermal Characteristics (T C Parameter = 25C unless otherwise noted) Symbol BY229 BY229X BY229B Unit Typical thermal resistance, junction to case RJC 2.0 4.8 2.0 C/W Typical thermal resistance, junction to air RJA 20 -- 20 C/W Notes: (1) Clip mounting, where lead does not overlap heatsink with 0.110" offset. (2) Clip mounting, where leads do overlap heatsink. (3) Screw mounting with 4-40 screw, where washer diameter is 4.9 mm (0.19"). www.vishay.com 2 Document Number 88540 16-Dec-03 BY229, BY229X, BY229B Series Vishay Semiconductors formerly General Semiconductor Ratings and Characteristic Curves (TA = 25C unless otherwise noted) Maximum Non-Repetitive Peak Forward Surge Current Forward Current Derating Curve 150 Resistive or Inductive Load Peak Forward Surge Current (A) Average Forward Rectified Current (A) 12 10 8.0 6.0 4.0 2.0 0 TL = 75C 8.3ms Single Half Sine-Wave (JEDEC Method) 125 100 75 50 25 0 0 25 50 75 100 125 150 1 Typical Instantaneous Forward Characteristics Typical Reverse Leakage Characteristics 1000 100 TJ = 150C IR - Instantaneous Reverse Leakage Current (A) IF - Instantaneous Forward Current (A) 100 10 Number of Cycles at 60 HZ Case Ambient Temperature (C) TJ = 25C 10 TJ = 100C 1 TJ = 125C Pulse Width = 300s 1% Duty Cycle 0.1 0.4 TJ = 150C 100 125C 100C 10 1 25C 0.1 0.01 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 20 40 60 80 100 Percent of Rated Peak Reverse Voltage (%) Instantaneous Forward Voltage (V) Typical Junction Capacitance 100 pF - Junction Capacitance TJ = 25C f = 1.0 MHZ Vsig = 50mVp-p 10 1 10 100 Reverse Voltage (V) Document Number 88540 16-Dec-03 www.vishay.com 3