BY229, BY229X, BY229B Series
Vishay Semiconductors
formerly General Semiconductor
www.vishay.com Document Number 88540
216-Dec-03
Maximum Ratings (TC= 25°C unless otherwise noted)
Parameter Symbol
BY229-200 BY229-400 BY229-600
Unit
Maximum recurrent peak reverse voltage VRRM 200 400 600 V
Maximum RMS voltage VRMS 140 280 420 V
Maximum DC blocking voltage VDC 200 400 600 V
Maximum average forward rectified current at TC=100°C IF(AV) 8.0 A
Peak forward surge current
8.3ms single half sine-wave superimposed IFSM 100 A
on rated load (JEDEC Method)
Maximum slope of reverse recovery current
IF=2.0A, VR=30V, di/dt=20A/µsdir/dt 60 A/µs
Operating junction and storage temperature range TJ, TSTG –40 to +150 °C
RMS Isolation voltage from terminals to heatsink 4500 (Note 1)
with t = 1 second, RH ≤30% (BY229X only) VISOL 3500 (Note 2) V
1500 (Note 3)
Electrical Characteristics (TC= 25°C unless otherwise noted)
Parameter Symbol
BY229-200 BY229-400 BY229-600
Unit
Maximum instantaneous forward voltage at 20A VF1.85 V
Maximum DC reverse current at TJ = 25°C 10
at rated DC blocking voltage TJ = 125°C IR300 µA
Maximum reverse recovery time at
IF=1.0A, VR=30V, di/dt=50A/µs, Irr=10% IRM trr 145 ns
Maximum recovered stored charge (Note 2)
IF=2.0A, VR=30V, di/dt=20A/µsQrr 700 nC
Thermal Characteristics (TC= 25°C unless otherwise noted)
Parameter Symbol
BY229 BY229X BY229B
Unit
Typical thermal resistance, junction to case RΘJC 2.0 4.8 2.0 °C/W
Typical thermal resistance, junction to air RΘJA 20 —20 °C/W
Notes:
(1) Clip mounting, where lead does not overlap heatsink with 0.110” offset.
(2) Clip mounting, where leads do overlap heatsink.
(3) Screw mounting with 4-40 screw, where washer diameter is ≤ 4.9 mm (0.19”).