The following document contains information on Cypress products.
S6SAP412A
Programable Evaluation board for Multi-phase
2ch Buck + 1ch Buck/Boost DC/DC with I2C Interface
Operation Manual
Publication Number S6SAP412A_SS901-00025 Revision 2.0 Issue Date July 22, 2014
O p e r a t i o n M a n u a l
2 S6SAP412A_SS901-00025-2v0-E, July 22, 2014
CONFIDENTIAL
PREFACE
This manual explains how to use the evaluation board. Be sure to read this manual before using the product. For this
product, please consult with sales representatives or support representatives.
Handling and use
Handling and use of this product and notes regarding its safe use are described in the manuals.
Follow the instructions in the manuals to use this product.
Keep this manual at hand so that you can refer to it anytime during use of this product.
Notice on this document
All information included in this document is current as of the date it is issued. Such information is subject to change
without any prior notice.
Please confirm the latest relevant information with the sales representatives.
O p e r a t i o n M a n u a l
S6AP412A_SS901-00025-2v0-E, July 22, 2014 3
CONFIDENTIAL
Caution of the products described in this document
The following precautions apply to the product described in this manual.
WARNING
Indicates a potentially hazardous situation which could result in death or serious injury
and/or a fault in the users system if the product is not used correctly.
Electric shock,
Damage
Before performing any operation described in this manual, turn off all the power supplies to
the system.
Performing such an operation with the power on may cause an electric shock or device fault.
Electric shock,
Damage
Once the product has been turned on, do not touch any metal part of it.
Doing so may cause an electric shock or device fault.
CAUTION
Indicates the presence of a hazard that may cause a minor or moderate injury, damages to
this product or devices connected to it, or may cause to loose software resources and other
properties such as data, if the device is not used appropriately.
Cuts, Damage
Before moving the product, be sure to turn off all the power supplies and unplug the cables. Watch your
step when carrying the product. Do not use the product in an unstable location such as a place exposed to
strong vibration or a sloping surface. Doing so may cause the product to fall, resulting in an injury or
fault.
Cuts
The product contains sharp edges that are left unavoidably exposed, such as jumper plugs.
Handle the product with due care not to get injured with such pointed parts.
Damage
Do not place anything on the product or expose the product to physical shocks. Do not carry
the product after the power has been turned on.
Doing so may cause a malfunction due to overloading or shock.
Damage
Since the product contains many electronic components, keep it away from direct sunlight,
high temperature, and high humidity to prevent condensation. Do not use or store the product
where it is exposed to much dust or a strong magnetic or electric field for an extended period
of time. Inappropriate operating or storage environments may cause a fault.
Damage
Use the product within the ranges given in the specifications.
Operation over the specified ranges may cause a fault.
Damage
To prevent electrostatic breakdown, do not let your finger or other object come into contact with the
metal parts of any of the connectors. Before handling the product, touch a metal object (such as a door
knob) to discharge any static electricity from your body.
Damage
When turning the power on or off, follow the relevant procedure as described in this
document. Before turning the power on, in particular, be sure to finish making all the
required connections. Furthermore, be sure to configure and use the product by following the
instructions given in this document. Using the product incorrectly or inappropriately may
cause a fault.
Damage
Because the product has no casing, it is recommended that it be stored in the original packaging.
Transporting the product may cause a damage or fault. Therefore, keep the packaging materials and use
them when re-shipping the product.
O p e r a t i o n M a n u a l
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CONFIDENTIAL
Table of Contents
1. Description ..................................................................................................................................... 5
2. Evaluation board specification ........................................................................................................ 5
3. PIN descriptions ............................................................................................................................. 6
3.1 Input/output pin descriptions ............................................................................................... 6
3.2 Jumper, Switch descriptions ................................................................................................ 6
4. Setup and verification ..................................................................................................................... 7
5. Component and wiring layout ......................................................................................................... 8
5.1 Component layout ............................................................................................................... 8
5.2 Wiring layout ....................................................................................................................... 9
6. Circuit schematic .......................................................................................................................... 11
7. Component list.............................................................................................................................. 12
8. Evaluation board picture ............................................................................................................... 13
9. Ordering Information ..................................................................................................................... 14
10. Major Changes ............................................................................................................................. 15
Figures
Figure1-1 Board outline .............................................................................................................................. 5
Figure4-1 For Control switch evaluation ..................................................................................................... 7
Figure5-1 Component layout (layer 1) ........................................................................................................ 8
Figure5-2 Component layout (layer 4) ........................................................................................................ 8
Figure5-3 Wiring layout (layer 1) ................................................................................................................ 9
Figure5-4 Wiring layout (layer 2) ................................................................................................................ 9
Figure5-5 Wiring layout (layer 3) .............................................................................................................. 10
Figure5-6 Wiring layout (layer 4) .............................................................................................................. 10
Figure6-1 Circuit schematic for power block ............................................................................................. 11
Figure8-1 Picture (top) ............................................................................................................................. 13
Figure8-2 Picture (back) ........................................................................................................................... 13
Tables
Table2-1 Evaluation board specification ..................................................................................................... 5
Table3-1 Input/output pin descriptions ........................................................................................................ 6
Table3-2 Jumper, Switch Descriptions ........................................................................................................ 6
Table7-1 Component list ........................................................................................................................... 12
Table9-1 Ordering Information .................................................................................................................. 14
S6SAP412A
Programable Evaluation board for Multi-phase
2ch Buck + 1ch Buck/Boost DC/DC with I2C Interface
Operation Manual
S6SAP412A_SS901-00025-2v0-E, July 22, 2014 5
CONFIDENTIAL
1. Description
The S6SAP412A is the evaluation board for 2ch Buck + 1ch Buck/Boost DC/DC, S6AP412A. This board implements
S6AP412A : Option-code 78, and output preset voltage DD1:1.0V, DD2:1.8V, DD2:3.3V. Also, this board implements
the I2C interface. The separated communication tool is sold, and it can select the output voltage, soft-start time,
ON/OFF sequence, PFM/PWM mode easily with I2C communication using windows PC and prepared software.
Figure1-1 Board outline
2. Evaluation board specification
Table2-1 Evaluation board specification
Item
Symbol
Min
MAx
Unit
Input voltage
VIN
2.5
5.5
V
Output voltage
Vo1
0.988
1.012
V
Output current
Io1
-
4000
mA
Output voltage
Vo2
1.778
1.822
V
Output current
Io2
-
1200
mA
Output voltage
Vo3
3.23
3.37
V
Output current
Io3
-
600
mA
Board size:28mm × 28mm
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CONFIDENTIAL
3. PIN descriptions
3.1 Input/output pin descriptions
Table3-1 Input/output pin descriptions
Block
Pin symbol
I/O
Function description
DD1
Vo1
O
DD1 output terminal
PG1
O
DD1 POWERGOOD output monitor terminal
DD2
Vo2
O
DD2 output terminal
PG2
O
DD2 POWERGOOD output monitor terminal
DD3
Vo3
O
DD3 output terminal
PG3
O
DD3 POWERGOOD output monitor terminal
CTL
CTL1
I
DD1 control terminal
CTL2
I
DD2 control terminal
CTL3
I
DD3 control terminal
CTLM
I
Control terminal for common block and logic block
MODE
MODE
I
MODE signal output terminal
I2C
DVCC
I
Power supply terminal for I2C.
SCL
I
I2C clock terminal
SDA
I/O
I2C data I/O terminal
ADDS
I
Select terminal for slave address
COMMON
VIN
I
Control circuit block power supply terminal
GND
-
Control circuit block ground terminal
GND3
-
Control circuit block ground terminal
3.2 Jumper, Switch descriptions
Table3-2 Jumper, Switch Descriptions
Jumper,
Switch
Description
Initial
setting
JP1
Short VIN terminal and VBUS pin (2 pin)
Open
CN1
1,8,12,14,17 : GND pin
2 : VIN pin
4 : DVCC pin
5 : SCL pin
6 : SDA pin
3,7,9,10,11,13,15,16,18,19,20 : open
-
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CONFIDENTIAL
4. Setup and verification
S6AP412A preset value can be evaluated with stabilized power supply.
1. 3.3V is applied to VIN terminal.
2. CTLM, CTL1, CTL2, CTL3 switch are tern on
3. Vo1:1.0V, Vo2:1.8V, Vo3:3.3V is output.
Figure4-1 For Control switch evaluation
O p e r a t i o n M a n u a l
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CONFIDENTIAL
5. Component and wiring layout
5.1 Component layout
Figure5-1 Component layout (layer 1)
Figure5-2 Component layout (layer 4)
O p e r a t i o n M a n u a l
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CONFIDENTIAL
5.2 Wiring layout
Figure5-3 Wiring layout (layer 1)
Figure5-4 Wiring layout (layer 2)
O p e r a t i o n M a n u a l
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CONFIDENTIAL
Figure5-5 Wiring layout (layer 3)
Figure5-6 Wiring layout (layer 4)
O p e r a t i o n M a n u a l
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CONFIDENTIAL
6. Circuit schematic
Figure6-1 Circuit schematic for power block
LX3_2
PGND3
LX3_1
PVCC3
PVCC2
LX2
PGND2
PGND1A/PGND1
PGND1B/PGND4
LX1B/LX4
PVCC1B/PVCC4ADDSEL/IN4
DVCC
SDA
PG1
AVCC
VREF18
CTLMAIN
IN1 PVCC1A/PVCC1
LX1A/LX1
IN2
CTL1
CTL2
CTL3
MODE/CTL4
GND
SCL
PG2
VO3
PG3
IN3/PG4
EP
M1
MB39C032_033
33
31
30
32
29
14
13
12
11
10
9
8
22
2324
25
26
27
28
15
16
17 18
19
20
21
7
6
5
4
3
2
1
1mH
L1
Vo1
1mH
L4
Vo2
1mH
L2
1mH
L3
DVCC
SCL
SDA
DVCC
ADDS
Vi2
GND1
PG1
SCL
SDA
CTLM
C1
4.7mF
C11
4.7mF
C4
4.7mF4.7mF
C7C16
1mF
C15
0.1mF
PG2
C14
0.1mF
R7
100kΩ
R6
100kΩ
R5
100kΩ
Vo3
PG3
CTL1
CTL2
CTL3
MODE
GND2
GND3
Vi1
VIN
VIN
VIN
VIN
VIN
VIN
VIN
VIN
10kΩ
R4
CN1
1
3
5
7
9
11
13
15
17
19
20
18
16
14
12
10
8
6
4
2VBUS
I2CVCC
SDA
GND2
GND3
GND4
GND5
P15
P21
P23
P22
GND6
P14
P13
P12
P11
P10
SCL
USBVCC
GND1
SDA
SCL
DVCC
VIN
R1
R8
R9
JP1
C2
47mF
C5
22mF
C8
33mF
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CONFIDENTIAL
7. Component list
Table7-1 Component list
No.
Component
Item
Parts number
Vendor
Value
Remarks
1
M1
PMIC
S6AP412A-78
SPANSION
-
-
2
L1
Inductor
1276AS-H-1R0M
TOKO
1.0µH
-
3
L2
Inductor
1276AS-H-1R0M
TOKO
1.0µH
-
4
L3
Inductor
1276AS-H-1R0M
TOKO
1.0µH
-
5
L4
Inductor
1276AS-H-1R0M
TOKO
1.0µH
-
6
C14
Ceramic Capacitor
C1005JB1H104K050BB
TDK
0.1µF
50V
7
C15
Ceramic Capacitor
C1005JB1H104K050BB
TDK
0.1µF
50V
8
C16
Ceramic Capacitor
C1608X5R1H105K080AB
TDK
1µF
50V
9
C1
Ceramic Capacitor
C1608X5R1V475K080AC
TDK
4.7µF
35V
10
C4
Ceramic Capacitor
C1608X5R1V475K080AC
TDK
4.7µF
35V
11
C7
Ceramic Capacitor
C1608X5R1V475K080AC
TDK
4.7µF
35V
12
C11
Ceramic Capacitor
C1608X5R1V475K080AC
TDK
4.7µF
35V
13
C5
Ceramic Capacitor
C2012X5R1A226K125AB
TDK
22µF
10V
14
C8
Ceramic Capacitor
C2012X5R1A336M125AC
TDK
33µF
10V
15
C2
Ceramic Capacitor
C2012X5R1A476M125AC
TDK
47µF
10V
16
R1
Chip Resistor
RK73Z1E
KOA
Under 50mV
17
R4
Chip Resistor
RR0816P103D
SUSUMU
10kΩ
±0.5%, ±25ppm/°C
18
R5
Chip Resistor
RR0510P-104-D
SUSUMU
100kΩ
±0.5%, ±25ppm/°C
19
R6
Chip Resistor
RR0510P-104-D
SUSUMU
100kΩ
±0.5%, ±25ppm/°C
20
R7
Chip Resistor
RR0510P-104-D
SUSUMU
100kΩ
±0.5%, ±25ppm/°C
21
R8
Chip Resistor
RR0510P-222-D
SUSUMU
2.2kΩ
±0.5%, ±25ppm/°C
22
R9
Chip Resistor
RR0510P-222-D
SUSUMU
2.2kΩ
±0.5%, ±25ppm/°C
23
CN1
Connector
2214R-20SG-85-F1
Neltron Industrial
Co., Ltd.
-
1x20pin header (2.54pitch)
Unmounted
24
Vi1/Vi2
Terminal
HIF3H-20PB-2.54DSA
HIROSE
-
-
25
GND1/GND2
Terminal
HIF3H-20PB-2.54DSA
HIROSE
-
-
26
GND3
Terminal
HIF3H-20PB-2.54DSA
HIROSE
-
-
27
DVCC
Terminal
HIF3H-20PB-2.54DSA
HIROSE
-
-
28
SCL
Terminal
HIF3H-20PB-2.54DSA
HIROSE
-
-
29
SDA
Terminal
HIF3H-20PB-2.54DSA
HIROSE
-
-
30
ADDS
Terminal
HIF3H-20PB-2.54DSA
HIROSE
-
-
31
CTLM
Terminal
HIF3H-20PB-2.54DSA
HIROSE
-
-
32
CTL1
Terminal
HIF3H-20PB-2.54DSA
HIROSE
-
-
33
CTL2
Terminal
HIF3H-20PB-2.54DSA
HIROSE
-
-
34
CTL3
Terminal
HIF3H-20PB-2.54DSA
HIROSE
-
-
35
MODE
Terminal
HIF3H-20PB-2.54DSA
HIROSE
-
-
36
Vo1
Terminal
HIF3H-20PB-2.54DSA
HIROSE
-
-
37
PG1
Terminal
HIF3H-20PB-2.54DSA
HIROSE
-
-
38
Vo2
Terminal
HIF3H-20PB-2.54DSA
HIROSE
-
-
39
PG2
Terminal
HIF3H-20PB-2.54DSA
HIROSE
-
-
40
Vo3
Terminal
HIF3H-20PB-2.54DSA
HIROSE
-
-
41
PG3
Terminal
HIF3H-20PB-2.54DSA
HIROSE
-
-
42
JP1
Solder jumper
Solder jumper
-
-
Unmounted
These components are compliant with RoHS, and please ask each vendor for details if necessary.
O p e r a t i o n M a n u a l
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CONFIDENTIAL
8. Evaluation board picture
Figure8-1 Picture (top)
Figure8-2 Picture (back)
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CONFIDENTIAL
9. Ordering Information
Table9-1 Ordering Information
Part number
EVB revision
Note
S6SAP412A78SA1001
Rev 1.0
---
O p e r a t i o n M a n u a l
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CONFIDENTIAL
10. Major Changes
Page
Section
Change Results
Revision 1.0
-
-
Initial release
Revision 2.0
12
7. Component list
Revised the Component of Component list
Vi Vi1/Vi2
GND GND1/GND2
14
9. Ordering Information
Revised the Part number of Ordering Information
S6SPA412A78SA1001 S6SAP412A78SA1001
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CONFIDENTIAL
SS901-00025-2v0-E
Spansion Support Tool Manual
S6SAP412A
Programable Evaluation board for Multi-phase 2ch Buck + 1ch Buck/Boost
DC/DC with I2C Interface
Operation Manual
July 2014 Rev. 2.0
Published: Spansion Inc.
Edited: Communications
O p e r a t i o n M a n u a l
S6SAP412A_SS901-00025-2v0-E, July 22, 2014 17
CONFIDENTIAL
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and
manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could
have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear
reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile
launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and artificial
satellite). Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with
above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury,
damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire
protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document
represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan,
the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the respective
government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion product
under development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The
information in this document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability,
fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or
statutory. Spansion assumes no liability for any damages of any kind arising out of the use of the information in this document.
Copyright © 2014 Spansion All rights reserved. Spansion®, the Spansion logo, MirrorBit®, MirrorBit® EclipseTM, ORNANDTM and
combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names
used are for informational purposes only and may be trademarks of their respective owners.
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S6SAP412A78SA1001