Pb
RoHS
ES54K2C20V-16.368M TR
ES54K2 C 20 V -16.368M TR
Series
RoHS Compliant (Pb-free) 2.5V 2mm x 2.5mm Ceramic
SMD Clipped Sinewave TC(VC)XO
Operating Temperature Range
-20°C to +70°C
Frequency Stability vs. Temperature
±2.0ppm Maximum
Packaging Options
Tape & Reel
Nominal Frequency
16.368MHz
Control Voltage
1.4Vdc ±1.0Vdc
ELECTRICAL SPECIFICATIONS
Nominal Frequency 16.368MHz
Frequency Stability vs. Frequency
Tolerance ±1.0ppm Maximum (at 25°C ±2°C, at Vdd=2.5Vdc)
Frequency Stability vs. Temperature ±2.0ppm Maximum (Inclusive of Operating Temperature Range, at Vdd=2.5Vdc)
Frequency Stability vs. Input Voltage ±0.2ppm Maximum (±5%)
Frequency Stability vs. Aging ±1ppm/year Maximum (at 25°C)
Frequency Stability vs. Load ±0.2ppm Maximum (±1kOhm//±1pF)
Frequency Stability vs. Reflow ±1.0ppm Maximum (at 25°C, 1 hour after reflow, 2 times)
Operating Temperature Range -20°C to +70°C
Supply Voltage +2.5Vdc ±5%
Input Current 2.0mA Maximum
Output Voltage 0.8Vp-p Clipped Sinewave Minimum, 0.9Vp-p Typical (External DC-Cut capacitor required, 150pF NPO
recommended)
Load Drive Capability 10kOhms//10pF
Output Logic Type Clipped Sinewave
Control Voltage 1.4Vdc ±1.0Vdc
Frequency Deviation ±5ppm Minimum
Linearity ±10% Maximum
Transfer Function Positive Transfer Characteristic
Input Impedance 500kOhms Minimum
Phase Noise -115dBc/Hz at 100Hz Offset, -135dBc/Hz at 1kHz Offset, and -148dBc/Hz at 10kHz Offset
Start Up Time 2mSec Maximum
Storage Temperature Range -55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test MIL-STD-883, Method 1014 Condition A
Gross Leak Test MIL-STD-883, Method 1014 Condition C
Mechanical Shock MIL-STD-202, Method 213 Condition C
Resistance to Soldering Heat MIL-STD-202, Method 210
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003
Temperature Cycling MIL-STD-883, Method 1010
Vibration MIL-STD-883, Method 2007 Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 1 of 6
ES54K2C20V-16.368M TR
MECHANICAL DIMENSIONS (all dimensions in millimeters)
2.50
±0.15
2.00
±0.15
0.9 MAX
0.50
±0.15 (X4)
0.60 ±0.15
0.70 ±0.15
(X4)
MARKING
ORIENTATION
1
2
4
3
1.45
±0.15
PIN CONNECTION
1 Voltage Control
2 Case/Ground
3 Output
4 Supply Voltage
LINE MARKING
1E16.368
E=Ecliptek Designator
2XXYZZ
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
All Tolerances are ±0.1
Suggested Solder Pad Layout
Solder Land
(X4)
All Dimensions in Millimeters
1.25
0.55
0.9 (X4)
0.8 (X4)
OUTPUT WAVEFORM
0VDC
CLOCK OUTPUT
VP-P
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 2 of 6
ES54K2C20V-16.368M TR
Power
Supply
Oscilloscope
Probe
(Note 2)
Voltage
Meter
Frequency
Counter
0.01µF
(Note 1) 0.1µF
(Note 1)
Supply
Voltage
(VDD)Output
Voltage
Control
Ground
RL = 10kOhms
Test Circuit for Voltage Control Option
Current
Meter
Power
Supply Voltage
Meter
150pF
CL = 10pF
(Note 3)
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency
ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage
pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 3 of 6
DIA 50 MIN
DIA 20.2 MIN
DIA 13.0 ±0.2
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
DIA 40 MIN
Access Hole at
Slot Location
1.5 MIN
Tape & Reel Dimensions
*Compliant to EIA 481A
ES54K2C20V-16.368M TR
8.0 ±0.2
3.5 ±0.1
2.75 ±0.10
4.0 ±0.1
2.0 ±0.1
4.0 ±0.1 2.25 ±0.05
DIA 1.55 ±0.05
2.70
±0.05
0.25 ±0.05
1.15 ±0.05
14.4 MAX
330 MAX
Quantity Per Reel: 1,000 units
8.4 +1.5/-0.0
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 4 of 6
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
ES54K2C20V-16.368M TR
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate) 3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) 150°C
- Temperature Typical (TS TYP) 175°C
- Temperature Maximum (TS MAX) 200°C
- Time (tS MIN) 60 - 180 Seconds
Ramp-up Rate (TL to TP)3°C/second Maximum
Time Maintained Above:
- Temperature (TL)217°C
- Time (tL)60 - 150 Seconds
Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum
Target Peak Temperature (TP Target) 250°C +0/-5°C
Time within 5°C of actual peak (tp)20 - 40 seconds
Ramp-down Rate 6°C/second Maximum
Time 25°C to Peak Temperature (t) 8 minutes Maximum
Moisture Sensitivity Level Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 5 of 6
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
ES54K2C20V-16.368M TR
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate) 5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 60 - 120 Seconds
Ramp-up Rate (TL to TP)5°C/second Maximum
Time Maintained Above:
- Temperature (TL)150°C
- Time (tL)200 Seconds Maximum
Peak Temperature (TP)240°C Maximum
Target Peak Temperature (TP Target) 240°C Maximum 1 Time / 230°C Maximum 2 Times
Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
Ramp-down Rate 5°C/second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 6 of 6
