IRC Advanced Film Division
General Note
IRC reserves the right to make changes in product specifi cation without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
• Corpus Christi Texas 78411 USA
© IRC Advanced Film Division
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com
WBC Series Issue April 2006
Wire Bondable
Chip Resistors
•
Discrete or tapped schematics
•
MIL inspection available
•
High resistor density
WBC Series
IRC’s WBC series wire bondable chip resistors are ideally suited for
the most demanding hybrid application. The WBC combines IRC’s
TaNSil
®
tantalum nitride thin fi lm technology with silicon substrate processing to produce an extremely small
® tantalum nitride thin fi lm technology with silicon substrate processing to produce an extremely small
®
footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor fi lm.
® resistor fi lm.
®
Available in a wide range of tolerances and temperature coeffi cients to fi t a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Absolute Tolerance
to ±0.1%
Absolute TCR
to ±25ppm/°C
Package Power Rating
(@ 70°C)
250mW
Rated Operating Voltage
(not to exceed P x R )
100V
Operating Temperature
-55°C to +150°C
Noise
<-30dB
Substrate Material
Oxidized Silicon
(10KÅ SiO
2
min)
Substrate Thickness
0.010˝ ±0.001
(0.254mm ±0.025)
Bond Pad
Metallization
Aluminum
10KÅ minimum
Gold
15KÅ
minimum
Backside
R0202 and
T0303
Silicon
(Gold available)
B0202
Gold
3KÅ
minimum
Passivation
Silicon Dioxide or
Silicon Nitride
√
Rated Operating Voltage
√
Rated Operating Voltage
(not to exceed P x R )
√
(not to exceed P x R )
Rated Operating Voltage
√
Rated Operating Voltage
√
Rated Operating Voltage
Electrical Data
0.020˝ ±0.001
(0.508mm ±0.025)
0.020˝ ±0.001
(0.508mm ±0.025)
0.020˝ ±0.001
(0.508mm ±0.025)
0.020˝ ±0.001
(0.508mm ±0.025)
0.030˝ ±0.001
(0.762mm ±0.025)
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
0.004˝ min bond pad size
Back contact
Back contact
Top contact
Physical Data
R0202 - Discrete
T0303 - Tapped network ½R + ½R
B0202 - Discrete back contact
Top contact
pad chamfered
R
R
½R
½R
0.004˝ min bond pad size
IRC Advanced Film Division
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com
WBC Series Issue April 2006
Manufacturing Capabilities Data
Wire Bondable
Chip Resistors
Power Derating Data
Absolute TCR
Commercial
Code
MIL Inspection
Code*
±300ppm/°C
00
04
±100ppm/°C
01
05
±50ppm/°C
02
06
±25ppm/°C
03
07
TCR/Inspection Code Table
Resistance Range
Available Absolute
Tolerances
Available Ratio
Tolerances (T0303 only)
Best Absolute TCR
Tracking TCR
(T0303 only)
10
Ω
-20
Ω
G J K
F G J
±100ppm/°C
±50ppm/°C
21
Ω−
50
Ω
F G J K
F G J
±100ppm/°C
±50ppm/°C
51
Ω
-100
Ω
C D F G J K
C D F G J
±100ppm/°C
±25ppm/°C
101
Ω−
200
Ω
C D F G J K
C D F G J
±50ppm/°C
±10ppm/°C
201
Ω−
500
Ω
B C D F G J K
B C D F G J
±50ppm/°C
±5ppm/°C
501
Ω
-999
Ω
B C D F G J K
B C D F G J
±25ppm/°C
±2ppm/°C
1.0K
Ω
-1.0M
Ω
B C D F G J K
A B C D F G J
±25ppm/°C
±2ppm/°C
*Notes: Product supplied to Class H of MIL-PRF 38534 includes 100% visual inspection
IRC Advanced Film Division
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com
WBC Series Issue April 2006
Wire Bondable
Chip Resistors
Environmental Data
Prefi x WBC - RO2O2 A S - 01 - 1002 - F B
Style
R0202 = Discrete Element
B0202 = Discrete Element with Back Contact
T0303 = Tapped Network
Bonding pads
A = Aluminum; G = Gold
Backside
G = Gold; S = Silicon
TCR/Inspection Code
Reference TCR/Inspection Code Table
Total Resistance (R)
4-Digit Resistance Code Ex: 1002 = 10K
Ω
; 50R1 = 50.1
Ω
Absolute Tolerance Code
K = ±10%; J = ±5%; G = ±2%; F = ±1%; D = ±0.5%; C = ±0.25%; B = ±0.1%
Ratio Tolerance Code (T0303 Only)
J = ±5%; G = ±2%; F = ±1%; D = 0.5%; C = ±0.25%; B = ±0.1%; A = ±0.05%
Packaging
Standard packaging is 2˝ x 2˝ chip tray. For additional information or to discuss your
specific requirements, please contact our Applications Team using the contact details below.
Ordering Data
Test
Method
Max
∆
R
Typical
∆
R
Thermal Shock
MIL-STD-202
Method 107
Test condition F
±0.1%
±0.02%
High Temperature Exposure
MIL-STD-883
Method 1008
150°C, 1000 hours
±0.1%
±0.05%
Low Temperature Storage
-55°C, 1000 hours
±0.03%
±0.01%
Life
MIL-STD-202
Method 108
70°C, 1000 hours
±0.5%
±0.01%
Life at Elevated Temperature
MIL-STD-202
Method 108
125°C, 1000 hours
±0.5%
±0.05%
