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VGS = 0 |D= 100mA
VDS = 28V VGS = 0
VGS = 20V VDS = 0
ID= 10mA VDS = VGS
VDD = 10V ID= 2A
PO= 40W
VDS = 28V IDQ = 0.8A
f = 400MHz
VDS = 28V VGS = –5V f = 1MHz
VDS = 28V VGS = 0 f = 1MHz
VDS = 28V VGS = 0 f = 1MHz
V
mA
m
A
V
mhos
dB
%
—
pF
pF
pF
PER SIDE
TOTAL DEVICE
LAB
SEME
SMRF1001
Prelim. 11/93
ELECTRICAL CHARACTERISTICS (Tcase = 25°C unless otherwise stated)
Drain–Source
BVDSS Breakdown Voltage
Zero Gate Voltage
IDSS Drain Current
IGSS Gate Leakage Current
VGS(th) Gate Threshold Voltage*
gfs Forward Transconductance*
GPS Common Source Power Gain
h
Drain Efficiency
VSWR Load Mismatch Tolerance
Ciss Input Capacitance
Coss Output Capacitance
Crss Reverse Transfer Capacitance
70
2
1
36
1.6
13
50
20:1
120
60
5
HAZARDOUS MATERIAL WARNING
The ceramic portion of the device between leads and metal flange is beryllium oxide. Beryllium oxide dust is highly
toxic and care must be taken during handling and mounting to avoid damage to this area.
THESE DEVICES MUST NEVER BE THROWN AWAY WITH GENERAL INDUSTRIAL OR DOMESTIC WASTE.
RTHj–case Thermal Resistance Junction – Case Max. 1.0°C / W
THERMAL DATA
* Pulse Test: Pulse Duration = 300
m
s , Duty Cycle
£
2%
Parameter Test Conditions Min. Typ. Max. Unit