RF01001-2, Rev. A (xxxx) ©2012 Microsemi Corporation Page 1 of 6
MSMCJ5.0A thru MXLSMCJ170CA, e3
Available Surface Mount 1500 Watt
Transient Voltage Suppressor
Screening in
reference to
MIL-PRF-19500
available
DESCRIPTION
The MSMCJ5.0A thru MXLSMCJ170A series of 1500 watt high-reliability controlled Transient
Voltage Suppressors (TVSs) protects a variety of voltage-sensitive components. This J-bend
design (SMCJ) in the DO-214AB package allows for greater PC board mounting density.
Selections include unidirectional and bidirectional as well as RoHS compliant versions. These are
available in a variety of screened versions. They can protect from secondary lightning effects per
IEC61000-4-5 and class levels defined herein, or for inductive switching environments and induced
RF protection. Since their response time is virtually instantaneous, they can also be used in
protection from ESD and EFT per IEC61000-4-2 and IEC61000-4-4. Microsemi also offers
numerous other products to meet higher and lower power voltage regulation applications.
DO-214AB
J-Bend Package
NOTE: All SMC series are
equivalent to prior SMM package
identifications.
Also available in:
Commercial DO-214AB
package
(J-bend surface mount)
SMCJ5.0A thru
SMCJ170CAe3
Commercial DO-215AB
package
(Gull-Wing surface mount)
SMCG5.0A thru
SMCG170CAe3
Hi-Rel DO-215AB
package
(Gull-Wing surface mount)
MSMCG5.0A thru
MXLSMCG170CAe3
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
• High reliability controlled devices with fabrication and assembly lot traceability.
• 100% surge tested devices.
• 3σ lot norm screening per for m ed on standby current ID.
• Available in both unidirectional and bidirectional con stru ctio n.
• Moisture classification is “Level 1” with no dry pack required per IPC/JEDEC J-STD-020B.
• Other screening options are available in reference to MIL-PRF-19500.
(See part nomenclature for all available options).
Refer to MicroNote 129 f or mo re details on the screening options.
• RoHS compliant versions available.
• Axial-lead equivalent packages for thru-h ole mo unting are available as 1.5KE 6. 8A to 1.5KE200CA
or 1N6267 thru 1N6303A and 1N5908 (contact Microsemi for other surface mount options).
APPLICATIONS / BENEFITS
• High-reliability controlled dev ic es.
• Selections for 5.0 to 170 volts standoff voltages (VWM).
• Protect ion from switch ing tr an sien ts and indu ced RF.
• Protection from ESD, and EFT per IEC 61000-4-2 and IEC 61000-4-4.
• Secondary lightning protection per IEC61000-4-5 with 42 ohms source imp edan ce:
Class 1: MSMCJ 5.0A to MXLSMCJ 170A or CA
Class 2: MSMCJ 5.0A to MXLSMCJ 150A or CA
Class 3: MSMCJ 5.0A to MXLSMCJ 75A or CA
Class 4: MSMCJ 5.0A to MXLSMCJ 36A or CA
• Secondary lightning protection per IEC61000-4-5 with 12 ohms source imp edan ce:
Class 1: MSMCJ 5.0A to MXLSMCJ 90A or CA
Class 2: MSMCJ 5.0A to MXLSMCJ 45A or CA
Class 3: MSMCJ 5.0A to MXLSMCJ 24A or CA
Class 4: MSMCJ 5.0A to MXLSMCJ 11A or CA
• Secondary lightning protection per IEC61000-4-5 with 2 ohms source impedance:
Class 2: MSMCJ 5.0A to MXLSMCJ 22A or CA
Class 3: MSMCJ 5.0A to MXLSMCJ 10A or CA
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
RF01001-2, Rev. A (xxxx) ©2012 Microsemi Corporation Page 2 of 6
MSMCJ5.0A thru MXLSMCJ170CA, e3
MAXIMUM RATINGS
Parameters/Test Conditions
Symbol
Value
Unit
Junction and Storage Temperature
TJ and TSTG
-65 to +150
ºC
Thermal Resi stan ce Jun cti on-to-Lead
RӨJL
20
ºC/W
Thermal Resi stan ce Jun cti on-to-Ambient (1)
RӨJA
80
ºC/W
Peak Pulse Power dissipation @ 25 ºC (at 10/1000 µs,
see Figures 1, 2, and 3)
P
PP
1500
W
Impulse Repetition Rate (duty factor)
df
0.01
%
t
clamping
(0 volts to V
(BR)
min.)
Unidirectional
Bidirectional
t
clamping
<100
<5
ps
ns
Off-State Power Dissipation
T
L
= +30 ºC
TA = +25 ºC
P
D
6
1.56
(1)
W
Maximum Forward Surge Current (2)
I
FSM
200
A (pk)
Solder Temperature @ 10 s
TSP
260
oC
Notes: 1. When mounted on FR4 PC board (1oz Cu) with recommended footprint (see last page).
2. Peak impulse of 8.3 ms half-sine wave at 25 ºC (unidirectional only).
MECHANICAL and PACKAGING
• CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0.
• TERMINALS: J-bend, tin-lead (90% Sn, 10% Pb) or RoHS compliant annealed matte-tin (100% Sn) plating. So lder a ble t o M IL-
STD-750, method 2026.
• MARKING: Part number marked on package.
• POLARITY: Cathode indicated by band. No cathode band on bi-directional devices.
• TAPE & REEL option: Standard per EIA-481-2 with 16 mm tape (add “TR” suffix to part number). Consult factory for quantities.
• WEIGHT: 0.25 grams (approximate).
• See Package Dimensions on last page.
PART NOMENCLATURE
MX SM C J 5.0 C A e3
Reliability Level
M (controlled product)
MA (Avionics grade)
MX (reference JANTX)
MXL (MX Lite)
Surface Mount
Package
1500 W Power Level
Modified J-Bend Lead
Frame
RoHS Compli ance
e3 = RoHS Compliant
Blank = non-RoHS Compliant
+/- 5% Tolerance Level
Uni/Bidirectional
C = Bidirectional
Blank = Unidirectional
Reverse Stand-Off Voltage
(see Electrical Characteristics
table)
RF01001-2, Rev. A (xxxx) ©2012 Microsemi Corporation Page 3 of 6
MSMCJ5.0A thru MXLSMCJ170CA, e3
SYMBOLS & DEFINITIONS
Symbol
Definition
I(BR)
Breakdown Current: T he current used for mea suri ng breakdown voltage V(BR).
ID
Standby Current: The current at the rated standoff voltage (VWM).
IF
Forward Current: The forward current dc value, no alternating component.
IO
Average Rectified Output Current: The output current averaged over a full cycle with a 50 Hz or 60 Hz sine-wave input
and a 180 degree conduction angle .
IPP
Peak Impulse Current: The peak current during the impulse.
PPP
Peak Pulse Power: The peak power dissipation resulting from the peak impulse current IPP.
VC
Maximum Clamping Voltage at specified IPP (Peak Pulse Current) at the specified pulse conditions.
V(BR)
Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current.
VWM
Working Peak Voltage: The maximum peak voltage that can be applied over the operating tem perature range. This is
also referred to as standoff voltage.
ELECTRICAL CHARACTERISTICS @ 25 ºC unless otherwise stated
MICROSEMI
PART
NUMBER
REVERSE
STAND-OFF
VOLTAGE
VWM
Volts
BREAKDOWN
VOLTAGE
V(BR) @ I(BR)
Volts
MAXIMUM
CLAMPING
VOLTAGE
@ IPP
Volts
PEAK PULSE
CURRENT
(See Fig . 2 )
IPP
Amps
MAXIMUM
STANDBY
CURRENT
@ VWM
ID
µA
MIN. MAX.
I
(BR)
mA
MSMCJ5.0A
MSMCJ6.0A
5.0
6.0
6.40 – 7.00
6.67 – 7.37
10
10
9.2
10.3
163.0
145.6
1000
1000
MSMCJ6.5A
MSMCJ7.0A
6.5
7.0
7.22 – 7.98
7.78 – 8.60
10
10
11.2
12.0
133.9
125.0
500
200
MSMCJ7.5A
MSMCJ8.0A
7.5
8.0
8.33 – 9.21
8.89 – 9.83
1
1
12.9
13.6
116.3
110.3
100
50
MSMCJ8.5A
MSMCJ9.0A
8.5
9.0
9.44 – 10.4
10.0 – 11.1
1
1
14.4
15.4
104.2
97.4
20
10
MSMCJ10A
MSMCJ11A
10
11
11.1 – 12.3
12.2 – 13.5
1
1
17.0
18.2
88.2
82.4
5
5
MSMCJ12A
MSMCJ13A
12
13
13.3 – 14.7
14.4 – 15.9
1
1
19.9
21.5
75.3
69.7
5
1
MSMCJ14A
MSMCJ15A
14
15
15.6 – 17.2
16.7 – 18.5
1
1
23.2
24.4
64.7
61.5
1
1
MSMCJ16A
MSMCJ17A
16
17
17.8 – 19.7
18.9 – 20.9
1
1
26.0
27.6
57.7
53.3
1
1
MSMCJ18A
MSMCJ20A
18
20
20.0 – 22.1
22.2 – 24.5
1
1
29.2
32.4
51.4
46.3
1
1
MSMCJ22A
MSMCJ24A
22
24
24.4 – 26.9
26.7 – 29.5
1
1
35.5
38.9
42.2
38.6
1
1
MSMCJ26A
MSMCJ28A
26
28
28.9 – 31.9
31.1 – 34.4
1
1
42.1
45.4
35.6
33.0
1
1
MSMCJ30A
MSMCJ33A
30
33
33.3 – 36.8
36.7 – 40.6
1
1
48.4
53.3
31.0
28.1
1
1
MSMCJ36A
MSMCJ40A
36
40
40.0 – 44.2
44.4 – 49.1
1
1
58.1
64.5
25.8
23.2
1
1
MSMCJ43A
MSMCJ45A
43
45
47.8 – 52.8
50.0 – 55.3
1
1
69.4
72.7
21.6
20.6
1
1
MSMCJ48A
MSMCJ51A
48
51
53.3 – 58.9
56.7 – 62.7
1
1
77.4
82.4
19.4
18.2
1
1
MSMCJ54A
MSMCJ58A
54
58
60.0 – 66.3
64.4 – 71.2
1
1
87.1
93.6
17.2
16.0
1
1
MSMCJ60A
MSMCJ64A
60
64
66.7 – 73.7
71.1 – 78.6
1
1
96.8
103.0
15.5
14.6
1
1
MSMCJ70A
MSMCJ75A
70
75
77.8 – 86.0
83.3 – 92.1
1
1
113
121
13.3
12.4
1
1
Continued.
RF01001-2, Rev. A (xxxx) ©2012 Microsemi Corporation Page 4 of 6
MSMCJ5.0A thru MXLSMCJ170CA, e3
ELECTRICAL CHARACTERISTICS @ 25 ºC unless otherwise stated (continued)
MICROSEMI
PART
NUMBER
REVERSE
STAND-OFF
VOLTAGE
VWM
Volts
BREAKDOWN
VOLTAGE
V(BR) @ I(BR)
Volts
MAXIMUM
CLAMPING
VOLTAGE
@ IPP
Volts
PEAK PULSE
CURRENT
(See Fig . 2 )
IPP
Amps
MAXIMUM
STANDBY
CURRENT
@ VWM
ID
µA
MIN. MAX.
I
(BR)
mA
MSMCJ78A
MSMCJ85A
78
85
86.7 – 95.8
94.4 – 104.0
1
1
126
137
11.4
10.4
1
1
MSMCJ90A
MSMCJ100A
90
100
100 – 111
111 – 123
1
1
146
162
10.3
9.3
1
1
MSMCJ110A
MSMCJ120A
110
120
122 – 135
133 – 147
1
1
177
193
8.4
7.8
1
1
MSMCJ130A
MSMCJ150A
130
150
144 – 159
167 – 185
1
1
209
243
7.2
6.2
1
1
MSMCJ160A
MSMCJ170A
160
170
178 – 197
189 – 209
1
1
259
275
5.8
5.5
1
1
NOTE 1: For bidi rect i onal device types indicate a CA suffix after t he part number. (i.e.: MASMCJ170CA). Bidirectional capacitance is
half that shown in Figure 4 at zero volts.
NOTE 2: Micros em i Corp’s MSMC series (1500 W) surface mountable packages are designed specifical l y for transient voltage suppression.
The wide leads assure a large surface contact for good heat dissipation, and a low resistanc e path for surge current flow to ground.
These high speed transient volt age suppress ors c an be used to effectively protect sensitive components s uch as integrated circuits
and MOS device.
RF01001-2, Rev. A (xxxx) ©2012 Microsemi Corporation Page 5 of 6
MSMCJ5.0A thru MXLSMCJ170CA, e3
GRAPHS
t – Time (msec)
tp – Pulse Time – sec
FIGURE 2 – Pulse Waveform
FIGURE 1 – Peak Pulse Power vs. Pulse Time
TL Lead Temperature oC BV – Breakdown Voltage (V)
FIGURE 3 – Derating Curve FIGURE 4
Typical Capacitance vs.
Break do wn Voltag e
1µs 10µsec 100µsec 1ms 10ms
(P
PP
) – Peak Pulse Power - kW
(Waveform – See Figure 2)
Non-repetitive
Test wave form
parameters
tr = 10
µ
sec.
tp = 1000 µsec.
Peak Pulse Power (
P
PP) or continuous
Power in Percent of 25
o
C Rating
100
10
1.0
0
I
PP
– Peak Pulse Current - % I
PP
C – Capacitance (pF)
RF01001-2, Rev. A (xxxx) ©2012 Microsemi Corporation Page 6 of 6
MSMCJ5.0A thru MXLSMCJ170CA, e3
PACKAGE DIMENSIONS
NOTES: Dimension “E” exceeds the JEDEC outline in height as shown.
Typical Standoff Height: 0.004” – 0.008” (0.1 mm – 0.2 mm).
PAD LAYOUT
Dimensions
Ltr
Inch
Millimeters
Min
Max
Min
Max
A
.115
.121
2.92
3.07
B
.260
.280
6.60
7.11
C
.220
.245
5.59
6.22
D
.305
.320
7.75
8.13
E
.077
.110
1.95
2.80
L
.030
.060
.760
1.52
Ltr
Inch
Millimeters
A
.390
9.90
B
.110
2.79
C
.150
3.81
