LP2954AIM/NOPB - Texas Instruments High-Performance Analog

LP2954, LP2954A

www.ti.com

SNVS096D –JUNE 1999–REVISED MARCH 2013

LP2954/LP2954A 5V and Adjustable Micropower Low-Dropout Voltage Regulators

Check for Samples: LP2954,LP2954A

1FEATURES DESCRIPTION

The LP2954 is a 5V micropower voltage regulator

2• 5V Output within 1.2% Over Temperature with very low quiescent current (90 μA typical at 1 mA

(A Grade) load) and very low dropout voltage (typically 60 mV at

• Adjustable 1.23 to 29V Output Voltage light loads and 470 mV at 250 mA load current).

Available (LP2954IM and LP2954AIM) The quiescent current increases only slightly at

• Ensured 250 mA Output Current dropout (120 μA typical), which prolongs battery life.

• Extremely Low Quiescent Current The LP2954 with a fixed 5V output is available in the

• Low Dropout Voltage three-lead TO-220 and DDPAK/TO-263 packages.

• Reverse Battery Protection The adjustable LP2954 is provided in an 8-lead

surface mount, small outline package. The adjustable

• Extremely Tight Line and Load Regulation version also provides a resistor network which can be

• Very Low Temperature Coefficient pin strapped to set the output to 5V.

• Current and Thermal Limiting Reverse battery protection is provided.

• Pin Compatible with LM2940 and LM340 The tight line and load regulation (0.04% typical), as

(5V Version Only) well as very low output temperature coefficient make

• Adjustable Version Adds Error Flag to Warn of the LP2954 well suited for use as a low-power

Output Drop and a Logic-Controlled Shutdown voltage reference.

Output accuracy is ensured at both room temperature

APPLICATIONS and over the entire operating temperature range.

• High-Efficiency Linear Regulator

• Low Dropout Battery-Powered Regulator

Package Outline and Ordering Information

Figure 1. TO-220 3–Lead Plastic Package (Front Figure 2. SO-8 Small Outline Surface Mount (Top

View) View)

Figure 3. TO-263 3-Lead Plastic Surface-Mount Figure 4. TO-263 3-Lead Plastic Surface-Mount

Package (Top View) Package (Side View)

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator

LP2954, LP2954A

SNVS096D –JUNE 1999–REVISED MARCH 2013

www.ti.com

Absolute Maximum Ratings(1)(2)

Operating Junction Temperature Range LP2954AI/LP2954I −40°C to +125°C

Storage Temperature Range −65°C to +150°C

Lead Temperature (Soldering, 5 seconds) 260°C

Power Dissipation(3) Internally Limited

Input Supply Voltage −20V to +30V

ESD Rating(4) 2 kV

(1) Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply

when operating the device outside of its rated operating conditions.

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal

resistance, θJ-A, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated

using:

will go into thermal shutdown. The junction-to-ambient thermal resistance of the TO-220 (without heatsink) is 60°C/W, 73°C/W for the

DDPAK/TO-263, and 160°C/W for the SOIC-8. If the DDPAK/TO-263 package is used, the thermal resistance can be reduced by

increasing the P.C. board copper area thermally connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with

1 square inch of copper area, θJA is 37°C/W; and with 1.6 or more square inches of copper area, θJA is 32°C/W. The junction-to-case

thermal resistance is 3°C/W. If an external heatsink is used, the effective junction-to-ambient thermal resistance is the sum of the

junction-to-case resistance (3°C/W), the specified thermal resistance of the heatsink selected, and the thermal resistance of the interface

between the heatsink and the LP2954. Some typical values are listed for interface materials used with TO-220:

(4) Human body model, 200pF discharged through 1.5kΩ.

Product Folder Links: LP2954 LP2954A

LP2954, LP2954A

www.ti.com

SNVS096D –JUNE 1999–REVISED MARCH 2013

Electrical Characteristics

Limits in standard typeface are for TJ= 25°C, bold typeface applies over the −40°C to +125°C temperature range. Limits

are specified by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. Unless

otherwise noted: VIN = 6V, IL= 1 mA, CL= 2.2 μF. 2954AI 2954I

Symbol Parameter Conditions Typical Units

Min Max Min Max

VO5.0 4.975 5.025 4.950 5.050

Output Voltage(1) 4.940 5.060 4.900 5.100 V

1 mA ≤IL≤250 mA 5.0 4.930 5.070 4.880 5.120

Output Voltage Temp. See(2) 20 100 150 ppm/°C

Coefficient(1)

VIN = 6V to 30V 0.03 0.10 0.20

Line Regulation %

0.20 0.40

IL= 1 to 250 mA 0.16 0.20

Load Regulation %

IL= 0.1 to 1 mA(3) 0.04 0.20 0.30

VIN–VOIL= 1 mA 60 100 100

150 150

IL= 50 mA 240 300 300

420 420

Dropout Voltage(4) mV

IL= 100 mA 310 400 400

520 520

IL= 250 mA 470 600 600

800 800

IGND IL= 1 mA 90 150 150 μA

180 180

IL= 50 mA 1.1 2 2

2.5 2.5

Ground Pin Current(5) IL= 100 mA 4.5 6 6 mA

8 8

IL= 250 mA 21 28 28

33 33

IGND VIN = 4.5V 170 170

Ground Pin Current at μA

Dropout(5) 120 210 210

ILIMIT VOUT = 0V 380 500 500

Current Limit mA

530 530

Thermal Regulation See(6) 0.05 0.2 0.2 %/W

enCL= 2.2 μF 400

Output Noise Voltage

(10 Hz to 100 kHz) CL= 33 μF 260 μV RMS

IL= 100 mA CL=33μF(7) 80

(1) When used in dual-supply systems where the regulator load is returned to a negative supply, the output voltage must be diode-clamped

to ground.

(2) Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range.

(3) Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested separately for load

regulation in the load ranges 0.1 mA–1 mA and 1 mA–250 mA. Changes in output voltage due to heating effects are covered by the

thermal regulation specification.

(4) Dropout voltage is defined as the input to output differential at which the output voltage drops 100 mV below the value measured with a

1V differential.

(5) Ground pin current is the regulator quiescent current. The total current drawn from the source is the sum of the load current plus the

ground pin current.

(6) Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load

or line regulation effects. Specifications are for 200 mA load pulse at VIN = 20V (3W pulse) for T = 10 ms.

(7) Connect a 0.1μF capacitor from the output to the feedback pin.

Product Folder Links: LP2954 LP2954A

LP2954, LP2954A

SNVS096D –JUNE 1999–REVISED MARCH 2013

www.ti.com

Electrical Characteristics (continued)

Limits in standard typeface are for TJ= 25°C, bold typeface applies over the −40°C to +125°C temperature range. Limits

are specified by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. Unless

otherwise noted: VIN = 6V, IL= 1 mA, CL= 2.2 μF. 2954AI 2954I

Symbol Parameter Conditions Typical Units

Min Max Min Max

Additional Specifications for the Adjustable Device (LP2954AIM and LP2954IM)

VREF See(8) 1.230 1.215 1.245 1.205 1.255

Reference Voltage V

1.205 1.255 1.190 1.270

ΔVREF/ VIN=2.5V to 0.03 0.1 0.2 %

VREF VO(NOM)+1V

Reference Voltage

Line Regulation VIN=2.5V to 0.2 0.4 %

VO(NOM)+1V to 30V(9)

ΔVREF/ΔT Reference Voltage

Temperature See(2) 20 ppm/°C

Coefficient

IB(FB) Feedback Pin Bias 20 40 40 nA

Current 60 60

IGND Ground Pin Current at VSHUTDOWN≤1.1V 105 140 140 μA

Shutdown(5)

IO(SINK) Output "OFF" Pulldown See(10) 30 30 mA

Current 20 20

Dropout Detection Comparator

IOH Output "HIGH" VOH=30V 0.01 1 1 μA

Leakage Current 2 2

VOL VIN=VO(NOM)−0.5V 150 250 250

Output "LOW" Voltage mV

IO(COMP)=400μA400 400

VTHR(MAX) Upper Threshold See(11) −60 −80 −35 −80 −35 mV

Voltage −95 −25 −95 −25

VTHR(MIN) Lower Threshold See(12) −85 −110 −55 −110 −55 mV

Voltage −160 −40 −160 −40

HYST Hysteresis See(12) 15 mV

Shutdown Input

VOS (Referred to VREF) ±3 −7.5 7.5 −7.5 7.5

Input Offset Voltage mV

−10 10 −10 10

HYST Hysteresis 6 mV

IBVIN(S/D)=0V to 5V 10 −30 30 −30 30

Input Bias Current nA

−50 50 −50 50

(8) VREF≤VOUT≤(VIN−1V), 2.3V≤VIN≤30V, 100μA≤IL≤250mA.

(9) Two seperate tests are performed, one covering VIN=2.5V to VO(NOM)+1V and the other test for VIN=2.5V to VO(NOM)+1V to 30V.

(10) VSHUTDOWN≤1.1V, VOUT=VO(NOM).

(11) Comparator thresholds are expressed in terms of a voltage differential at the Feedback terminal below the nominal reference voltage

measured at VIN=VO(NOM)+1V. To express these thresholds in terms of output voltage change, multiply by the Error amplifier gain,

which is VOUT/VREF=(R1+R2)/R2.

(12) Comparator thresholds are expressed in terms of a voltage differential at the Feedback terminal below the nominal reference voltage

measured at VIN=VO(NOM)+1V. To express these thresholds in terms of output voltage change, multiply by the Error amplifier gain,

which is VOUT/VREF=(R1+R2)/R2.

Product Folder Links: LP2954 LP2954A

LP2954, LP2954A

www.ti.com

SNVS096D –JUNE 1999–REVISED MARCH 2013

Table 1. Typical Values of Case-to-Heatsink

Thermal Resistance (°C/W) (Data from AAVID Eng.)

Silicone grease 1.0

Dry interface 1.3

Mica with grease 1.4

Table 2. Typical Values of Case-to-Heatsink

Thermal Resistance (°C/W) (Data from Thermalloy)

Thermasil III 1.3

Thermasil II 1.5

Thermalfilm (0.002) with grease 2.2

Product Folder Links: LP2954 LP2954A

LP2954, LP2954A

SNVS096D –JUNE 1999–REVISED MARCH 2013

www.ti.com

Typical Performance Characteristics

Quiescent Current Quiescent Current

Figure 5. Figure 6.

Ground Pin Current vs Load Ground Pin Current

Figure 7. Figure 8.

Ground Pin Current Output Noise Voltage

Figure 9. Figure 10.

Product Folder Links: LP2954 LP2954A

LP2954, LP2954A

www.ti.com

SNVS096D –JUNE 1999–REVISED MARCH 2013

Typical Performance Characteristics (continued)

Ripple Rejection Ripple Rejection

Figure 11. Figure 12.

Ripple Rejection Line Transient Response

Figure 13. Figure 14.

Line Transient Response Output Impedance

Figure 15. Figure 16.

Product Folder Links: LP2954 LP2954A

LP2954, LP2954A

SNVS096D –JUNE 1999–REVISED MARCH 2013

www.ti.com

Typical Performance Characteristics (continued)

Load Transient Response Load Transient Response

Figure 17. Figure 18.

Dropout Characteristics Thermal Response

Figure 19. Figure 20.

Product Folder Links: LP2954 LP2954A

. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator

LP2954, LP2954A

www.ti.com

SNVS096D –JUNE 1999–REVISED MARCH 2013

Typical Performance Characteristics (continued)

Short-Circuit Output

Current and Maximum Maximum Power Dissipation

Output Current (DDPAK/TO-263)(1)

Figure 21. Figure 22.

(1) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal

resistance, θJ-A, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated

using:

will go into thermal shutdown. The junction-to-ambient thermal resistance of the TO-220 (without heatsink) is 60°C/W, 73°C/W for the

DDPAK/TO-263, and 160°C/W for the SOIC-8. If the DDPAK/TO-263 package is used, the thermal resistance can be reduced by

increasing the P.C. board copper area thermally connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with

1 square inch of copper area, θJA is 37°C/W; and with 1.6 or more square inches of copper area, θJA is 32°C/W. The junction-to-case

thermal resistance is 3°C/W. If an external heatsink is used, the effective junction-to-ambient thermal resistance is the sum of the

junction-to-case resistance (3°C/W), the specified thermal resistance of the heatsink selected, and the thermal resistance of the interface

between the heatsink and the LP2954. Some typical values are listed for interface materials used with TO-220:

Product Folder Links: LP2954 LP2954A

LP2954, LP2954A

SNVS096D –JUNE 1999–REVISED MARCH 2013

www.ti.com

APPLICATION HINTS

EXTERNAL CAPACITORS

A 2.2 μF (or greater) capacitor is required between the output pin and the ground to assure stability (refer to

Figure 23). Without this capacitor, the part may oscillate. Most types of tantalum or aluminum electrolytics will

work here. Film types will work, but are more expensive. Many aluminum electrolytics contain electrolytes which

freeze at −30°C, which requires the use of solid tantalums below −25°C. The important parameters of the

capacitor are an ESR of about 5Ωor less and a resonant frequency above 500 kHz (the ESR may increase by a

factor of 20 or 30 as the temperature is reduced from 25°C to −30°C). The value of this capacitor may be

increased without limit. At lower values of output current, less output capacitance is required for stability. The

capacitor can be reduced to 0.68 μF for currents below 10 mA or 0.22 μF for currents below 1 mA.

A 1 μF capacitor should be placed from the input pin to ground if there is more than 10 inches of wire between

the input and the AC filter capacitor or if a battery input is used.

Programming the output for voltages below 5V runs the error amplifier at lower gains requiring more output

capacitance for stability. At 3.3V output, a minimum of 4.7 μF is required. For the worst case condition of 1.23V

output and 250 mA of load current, a 6.8 μF (or larger) capacitor should be used.

Stray capacitance to the Feedback terminal can cause instability. This problem is most likely to appear when

using high value external resistors to set the output voltage. Adding a 100 pF capacitor between the Output and

Feedback pins and increasing the output capacitance to 6.8 μF (or greater) will cure the problem.

MINIMUM LOAD

When setting the output voltage using an external resistive divider, a minimum current of 1 μA is recommended

through the resistors to provide a minimum load.

It should be noted that a minimum load current is specified in several of the electrical characteristic test

conditions, so this value must be used to obtain correlation on these tested limits. The part is parametrically

tested down to 100 μA, but is functional with no load.

DROPOUT VOLTAGE

The dropout voltage of the regulator is defined as the minimum input-to-output voltage differential required for the

output voltage to stay within 100 mV of the output voltage measured with a 1V differential. The dropout voltages

for various values of load current are listed under Electrical Characteristics.

If the regulator is powered from a rectified AC source with a capacitive filter, the minimum AC line voltage and

maximum load current must be used to calculate the minimum voltage at the input of the regulator. The minimum

input voltage, including AC ripple on the filter capacitor, must not drop below the voltage required to keep the

LP2954 in regulation. It is also advisable to verify operating at minimum operating ambient temperature, since

the increasing ESR of the filter capacitor makes this a worst-case test for dropout voltage due to increased ripple

amplitude.

HEATSINK REQUIREMENTS

A heatsink may be required with the LP2954 depending on the maximum power dissipation and maximum

ambient temperature of the application. Under all possible operating conditions, the junction temperature must be

within the range specified under Absolute Maximum Ratings.

To determine if a heatsink is required, the maximum power dissipated by the regulator, P(max), must be

calculated. It is important to remember that if the regulator is powered from a transformer connected to the AC

line, the maximum specified AC input voltage must be used (since this produces the maximum DC input

voltage to the regulator). Figure 23 shows the voltages and currents which are present in the circuit. The formula

for calculating the power dissipated in the regulator is also shown in Figure 23.

Product Folder Links: LP2954 LP2954A

. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator

LP2954, LP2954A

www.ti.com

SNVS096D –JUNE 1999–REVISED MARCH 2013

*See EXTERNAL CAPACITORS

PTotal = (VIN −5) IL+ (VIN) IG

Figure 23. Basic 5V Regulator Circuit

The next parameter which must be calculated is the maximum allowable temperature rise, TR(max). This is

calculated by using the formula:

TR(max) = TJ(max) −TA(max)

where

• TJ(max) is the maximum allowable junction temperature

• TA(max) is the maximum ambient temperature (1)

Using the calculated values for TR(max) and P(max), the required value for junction-to-ambient thermal

resistance, θ(J-A), can now be found:

θ(J-A) = TR(max)/P(max) (2)

If the calculated value is 60° C/W or higher , the regulator may be operated without an external heatsink. If the

calculated value is below 60° C/W, an external heatsink is required. The required thermal resistance for this

heatsink can be calculated using the formula:

θ(H-A) =θ(J-A) − θ(J-C) − θ(C-H)

where

•θ(J-C) is the junction-to-case thermal resistance, which is specified as 3° C/W maximum for the LP2954

•θ(C-H) is the case-to-heatsink thermal resistance, which is dependent on the interfacing material (if used). For details

and typical values(2)

•θ(H-A) is the heatsink-to-ambient thermal resistance. It is this specification (listed on the heatsink manufacturers data

sheet) which defines the effectiveness of the heatsink. The heatsink selected must have a thermal resistance which

is equal to or lower than the value of θ(H-A) calculated from the above listed formula (3)

PROGRAMMING THE OUTPUT VOLTAGE

The regulator may be pin-strapped for 5V operation using its internal resistive divider by tying the Output and

Sense pins together and also tying the Feedback and 5V Tap pins together.

Alternatively, it may be programmed for any voltage between the 1.23V reference and the 30V maximum rating

using an external pair of resistors (see Figure 24). The complete equation for the output voltage is:

(4)

(2) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal

resistance, θJ-A, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated

using:

will go into thermal shutdown. The junction-to-ambient thermal resistance of the TO-220 (without heatsink) is 60°C/W, 73°C/W for the

DDPAK/TO-263, and 160°C/W for the SOIC-8. If the DDPAK/TO-263 package is used, the thermal resistance can be reduced by

increasing the P.C. board copper area thermally connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with

1 square inch of copper area, θJA is 37°C/W; and with 1.6 or more square inches of copper area, θJA is 32°C/W. The junction-to-case

thermal resistance is 3°C/W. If an external heatsink is used, the effective junction-to-ambient thermal resistance is the sum of the

junction-to-case resistance (3°C/W), the specified thermal resistance of the heatsink selected, and the thermal resistance of the interface

between the heatsink and the LP2954. Some typical values are listed for interface materials used with TO-220:

Product Folder Links: LP2954 LP2954A

LP2954, LP2954A

SNVS096D –JUNE 1999–REVISED MARCH 2013

www.ti.com

where VREF is the 1.23V reference and IFB is the Feedback pin bias current (−20 nA typical). The minimum

recommended load current of 1 μA sets an upper limit of 1.2 MΩon the value of R2 in cases where the regulator

must work with no load (see MINIMUM LOAD). IFB will produce a typical 2% error in VOUT which can be

eliminated at room temperature by trimming R1. For better accuracy, choosing R2 = 100 kΩwill reduce this error

to 0.17% while increasing the resistor program current to 12 μA. Since the typical quiescent current is 120 μA,

this added current is negligible.

* See Application Hints

** Drive with TTL-low to shut down

Figure 24. Adjustable Regulator

DROPOUT DETECTION COMPARATOR

This comparator produces a logic “LOW” whenever the output falls out of regulation by more than about 5%. This

figure results from the comparator's built-in offset of 60 mV divided by the 1.23V reference. The 5% low trip level

remains constant regardless of the programmed output voltage. An out-of-regulation condition can result from

low input voltage, current limiting, or thermal limiting.

Figure 25 gives a timing diagram showing the relationship between the output voltage, the ERROR output, and

input voltage as the input voltage is ramped up and down to a regulator programmed for 5V output. The ERROR

signal becomes low at about 1.3V input. It goes high at about 5V input, where the output equals 4.75V. Since the

dropout voltage is load dependent, the input voltage trip points will vary with load current. The output voltage

trip point does not vary.

The comparator has an open-collector output which requires an external pull-up resistor. This resistor may be

connected to the regulator output or some other supply voltage. Using the regulator output prevents an invalid

“HIGH” on the comparator output which occurs if it is pulled up to an external voltage while the regulator input

voltage is reduced below 1.3V. In selecting a value for the pull-up resistor, note that while the output can sink

400 μA, this current adds to battery drain. Suggested values range from 100 kΩto 1 MΩ. This resistor is not

required if the output is unused.

When VIN ≤1.3V, the error flag pin becomes a high impedance, allowing the error flag voltage to rise to its pull-

up voltage. Using VOUT as the pull-up voltage (rather than an external 5V source) will keep the error flag voltage

below 1.2V (typical) in this condition. The user may wish to divide down the error flag voltage using equal-value

resistors (10 kΩsuggested) to ensure a low-level logic signal during any fault condition, while still allowing a valid

high logic level during normal operation.

Product Folder Links: LP2954 LP2954A

LP2954, LP2954A

www.ti.com

SNVS096D –JUNE 1999–REVISED MARCH 2013

* In shutdown mode, ERROR will go high if it has been pulled up to an external supply. To avoid this invalid

response, pull up to regulator output.

** Exact value depends on dropout voltage. (See Application Hints)

Figure 25. ERROR Output Timing

OUTPUT ISOLATION

The regulator output can be left connected to an active voltage source (such as a battery) with the regulator input

power turned off, as long as the regulator ground pin is connected to ground . If the ground pin is left

floating, damage to the regulator can occur if the output is pulled up by an external voltage source.

REDUCING OUTPUT NOISE

In reference applications it may be advantageous to reduce the AC noise present on the output. One method is

to reduce regulator bandwidth by increasing output capacitance. This is relatively inefficient, since large

increases in capacitance are required to get significant improvement.

Noise can be reduced more effectively by a bypass capacitor placed across R1 (refer to Figure 24). The formula

for selecting the capacitor to be used is:

(5)

This gives a value of about 0.1 μF. When this is used, the output capacitor must be 6.8 μF (or greater) to

maintain stability. The 0.1 μF capacitor reduces the high frequency gain of the circuit to unity, lowering the output

noise from 260 μV to 80 μV using a 10 Hz to 100 kHz bandwidth. Also, noise is no longer proportional to the

output voltage, so improvements are more pronounced at high output voltages.

SHUTDOWN INPUT

A logic-level signal will shut off the regulator output when a “LOW” (<1.2V) is applied to the Shutdown input.

To prevent possible mis-operation, the Shutdown input must be actively terminated. If the input is driven from

open-collector logic, a pull-up resistor (20 kΩto 100 kΩrecommended) should be connected from the Shutdown

input to the regulator input.

If the Shutdown input is driven from a source that actively pulls high and low (like an op-amp), the pull-up resistor

is not required, but may be used.

If the shutdown function is not to be used, the cost of the pull-up resistor can be saved by simply tying the

Shutdown input directly to the regulator input.

IMPORTANT: Since the Absolute Maximum Ratings state that the Shutdown input can not go more than 0.3V

below ground, the reverse-battery protection feature which protects the regulator input is sacrificed if the

Shutdown input is tied directly to the regulator input.

If reverse-battery protection is required in an application, the pull-up resistor between the Shutdown input and the

regulator input must be used.

Product Folder Links: LP2954 LP2954A

LP2954, LP2954A

SNVS096D –JUNE 1999–REVISED MARCH 2013

www.ti.com

Typical Applications

Figure 26. Typical Application Circuit

Figure 27. 5V Regulator

*Output voltage equals +VIN minus dropout voltage, which varies with output current. Current limits at 380 mA

(typical).

Figure 28. 5V Current Limiter

Product Folder Links: LP2954 LP2954A

LP2954, LP2954A

www.ti.com

SNVS096D –JUNE 1999–REVISED MARCH 2013

Schematic Diagram

Product Folder Links: LP2954 LP2954A

LP2954, LP2954A

SNVS096D –JUNE 1999–REVISED MARCH 2013

www.ti.com

REVISION HISTORY

Changes from Revision C (March 2013) to Revision D Page

• Changed layout of National Data Sheet to TI format .......................................................................................................... 15

Product Folder Links: LP2954 LP2954A

PACKAGE OPTION ADDENDUM

www.ti.com 1-Nov-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LP2954AIM NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 LP295

4AIM

LP2954AIM/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 125 LP295

4AIM

LP2954AIMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LP295

4AIM

LP2954AIS NRND DDPAK/

TO-263 KTT 3 45 TBD Call TI Call TI -40 to 125 LP2954AIS

LP2954AIS/NOPB ACTIVE DDPAK/

TO-263 KTT 3 45 Pb-Free (RoHS

Exempt) CU SN Level-3-245C-168 HR -40 to 125 LP2954AIS

LP2954AISX NRND DDPAK/

TO-263 KTT 3 500 TBD Call TI Call TI -40 to 125 LP2954AIS

LP2954AISX/NOPB ACTIVE DDPAK/

TO-263 KTT 3 500 Pb-Free (RoHS

Exempt) CU SN Level-3-245C-168 HR -40 to 125 LP2954AIS

LP2954AIT/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS

& no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LP2954AIT

LP2954IM NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 LP29

54IM

LP2954IM/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LP29

54IM

LP2954IMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LP29

54IM

LP2954IS/NOPB ACTIVE DDPAK/

TO-263 KTT 3 45 Pb-Free (RoHS

Exempt) CU SN Level-3-245C-168 HR -40 to 125 LP2954IS

LP2954ISX NRND DDPAK/

TO-263 KTT 3 500 TBD Call TI Call TI -40 to 125 LP2954IS

LP2954ISX/NOPB ACTIVE DDPAK/

TO-263 KTT 3 500 Pb-Free (RoHS

Exempt) CU SN Level-3-245C-168 HR -40 to 125 LP2954IS

LP2954IT/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS

& no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LP2954IT

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PACKAGE OPTION ADDENDUM

www.ti.com 1-Nov-2013

Addendum-Page 2

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LP2954AIMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LP2954AISX DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LP2954AISX/NOPB DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LP2954IMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LP2954ISX DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LP2954ISX/NOPB DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

PACKAGE MATERIALS INFORMATION

www.ti.com 23-Sep-2013

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LP2954AIMX/NOPB SOIC D 8 2500 367.0 367.0 35.0

LP2954AISX DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

LP2954AISX/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

LP2954IMX/NOPB SOIC D 8 2500 367.0 367.0 35.0

LP2954ISX DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

LP2954ISX/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

PACKAGE MATERIALS INFORMATION

www.ti.com 23-Sep-2013

Pack Materials-Page 2

MECHANICAL DATA

NDE0003B

www.ti.com

MECHANICAL DATA

KTT0003B

www.ti.com

BOTTOM SIDE OF PACKAGE

TS3B (Rev F)

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest

issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and

complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale

supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information

published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or

endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration

and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered

documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service

voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements

concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support

that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which

anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause

harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use

of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to

help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and

requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties

have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in

military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components

which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and

regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of

non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products Applications

Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive

Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications

Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers

DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps

DSP dsp.ti.com Energy and Lighting www.ti.com/energy

Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial

Interface interface.ti.com Medical www.ti.com/medical

Logic logic.ti.com Security www.ti.com/security

Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com

Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265