Model
Width
Length
Height
Pad
Wire Form
°C/W
°C/W
[mm]
[mm]
[mm]
Size
Natural
Forced
[mm]
2M/s
BGA-STD-010
13.5
13.0
10.0
12x12
-
27.00
14.50
BGA-STD-015
14.0
14.0
10.0
18x18
-
26.50
14.00
BGA-STD-020
21.0
21.0
9.0
20X20
-
24.50
13.00
BGA-STD-025
23.0
23.0
6.0
20x20
-
22.00
10.50
BGA-STD-030
27.0
27.0
6.0
20x20
WF700/WF300
20.00
10.00
BGA-STD-035
26.0
26.0
8.0
20x20
WF700/WF300
18.50
9.70
BGA-STD-040
27.0
27.0
6.0
20x20
WF700/WF300
16.00
10.20
BGA-STD-045
23.0
23.0
18.0
20x20
WF700/WF300
14.70
7.30
BGA-STD-050
20.0
20.0
19.1
18x18
-
14.00
5.80
BGA-STD-055
25.9
23.9
10.0
20x20
WF700/WF300/WF151
14.00
6.00
BGA-STD-060
40.0
40.0
10.0
30x30
-
13.50
7.50
BGA-STD-065
27.8
27.8
11.2
20x20
WF700/WF300
12.20
5.80
*BGA-STD-070
40.0
40.0
25.0
30x30
WF700/WF300/WF151
11.50
6.00
BGA-STD-075
40.0
40.0
23.0
18x18
WF700/WF300/WF151
11.00
5.60
BGA-STD-080
27.0
27.0
25.0
20x20
WF700/WF300/WF151
10.50
4.50
BGA-STD-085
30.7
30.7
14.1
20x20
WF700/WF300
10.00
5.20
BGA-STD-090
40.0
23.9
10.0
20x20
-
10.00
5.20
BGA-STD-095
40.0
40.0
10.0
18x18
WF700/WF300
9.70
4.00
BGA-STD-100
38.1
38.1
16.0
30x30
-
9.20
4.10
BGA-STD-105
35.0
35.0
18.0
30x30
WF700/WF300/WF151
9.20
5.20
BGA-STD-110
35.0
35.0
25.0
30x30
WF700/WF300/WF151
8.50
5.00
BGA-STD-115
40.0
40.0
18.0
30x30
WF700/WF300/WF151
8.20
5.10
BGA-STD-120
40.6
38.8
30.5
30x30
-
7.00
3.70
Thermally Conductive Aluminium Foil
Tape
All ABL's BGA heatsinks are supplied with
thermal tape.
With excellent thermal conductivity,
cushioning and gap filling properties, the pad
is an ideal thermal interface material
specifically designed for heat sink attachment
to MPU, chip set and other plastic
encapsulated components.
It consists of an aluminium foil backing
coated, on both sides, with a very high
temperature resistance acrylic adhesive. Due
to its high heat performance and adhesive
properties this tape can also be use to attach
components to a vertical heatsink and to
metal enclosure surfaces.
Colour
-
White
Backing Type / Thickness
Mm
Aluminium Foil / 0.10
Adhesive Type / Thickness
Mm
Arylic 0.075 (on clear liner side)
Total Thickness
mm
0,27
Adhesion
Kg/25mm
1,5
Thermal Conductivity
W/m-K
0,95
Thermal Resistance
°C-in2/W
0,2
Holding Power@23°C
Hour
>72
Holding Power @ 130°C
Hour
>2
All ABL's BGA heatsinks are supplied with thermal tape
*
