Microelectronic Products Quick Reference Guide NAND FLASH -- SSD TRRUST-StorTM 2.5 in. SATA Secure Storage Device Size 64GB 128GB 256GB 512GB 1TB Interface SATA SATA SATA SATA SATA Part Number MSD064AM2R-000I* MSD128AS0R-000I MSD256AM2R-000I MSD512AM2R-000I MSD01TAM2R-000I Read/Write Speed 66/51 MB/s*** 174/162 MB/s*** 161/200 MB/s*** 161/200 MB/s*** 200/200 MB/s*** Voltage (V) 5.0 5.0 5.0 5.0 5.0 Package 2.5" 2.5" 2.5" 2.5" 2.5" Dimensions 100.45 MAX x 69.85 x 9.5 mm 100.45 MAX x 69.85 x 9.5 mm 100.45 MAX x 69.85 x 9.5 mm 100.45 MAX x 69.85 x 9.5 mm 100.45 MAX x 69.85 x 9.5 mm Temperature I I I I I Part Number MSM064AM2L-M00I MSM128AM2L-M00I* Read/Write Speed 66/51 MB/s*** 66/51 MB/s*** Voltage (V) 3.3-5.0 3.3-5.0 Package 524 PBGA 524 PBGA Dimensions 32mm x 28mm x 6mm 32mm x 28mm x 6mm Temperature I I Interface SATA SATA Part Number MM3064AM2R-M00I MM3128AM2R-M00I* Read/Write Speed 66/51 MB/s*** 66/51 MB/s*** Voltage (V) 3.3-5.0 3.3-5.0 Package mSATA mSATA Dimensions 30mm x 50mm 30mm x 50mm Temperature I I Interface SATA SATA Part Number MXMCM256A2L-001I MXMCM512A2L-001I Read/Write Speed 175/200 MB/s** 175/200 MB/s** Voltage (V) 5.0 5.0 Package XMC XMC Dimensions 143.75mm x 74mm 143.75mm x 74mm Temperature I I NAND SSD BGA Size 64GB 128GB Interface SATA SATA mSATA SSD Size 64GB 128GB XMC SSD Size 256GB 512GB Extended Temperature Plastics -- Memories DDR4 SDRAM MCPs Size 2GB Organization 512M x 32 Part Number 4GB 4GB 8GB 8GB 512M x 64 512M x 72 512M x 64 512M x 72 4N512M64T-XBX 4N512M72T-XBX 4N1G64T-XBX 4N1G72T-XBX DDR3 SDRAM MCPs Size 1GB 1GB 1GB 1GB 2GB 2GB 4GB 4GB 4GB 4GB 4GB HD 4GB HD 8GB 8GB Organization 128M x 64 128M x 72 128M x 64 128M x 72 512M x 32 512M x 32 512M x 64 512M x 72 512M x 64 512M x 72 512M x 64 512M x 72 8GB x 64 8GB x 72 DDR2 SDRAM MCPs Size 128MB 256MB 256MB 256MB 512MB 512MB 1GB 1GB Organization 64M x 16 2 x 64M x 16 32M x 64 32M x 72 64M x 64 64M x 72 128M x 72 128M x 64 Data Rate (Mb/s) Voltage (V) 1.2 Package 143 PBGA Dimensions 8mm x 14mm Temperature C, I, M 1333-2400**** 1333-2400**** 1333-2400**** 1333-2400**** 1.2 1.2 1.2 1.2 321 PBGA 321 PBGA 321 PBGA 321 PBGA 13mm x 20mm 13mm x 20mm 13mm x 20mm 13mm x 20mm C, I, M C, I, M C, I, M C, I, M Part Number W3J128M64X-XPBX W3J128M72X-XPBX W3J128M64X-XLBX W3J128M72X-XLBX W3J512M32X-XBX W3J512M32X-XB2X W3J512M64X-XPBX W3J512M72X-XPBX W3J512M64X-XLBX W3J512M72X-XLBX W3J512M64X-XHDX** W3J512M72X-XHDX** W3J1G64X-XPBX** W3J1G72X-XPBX** Data Rate (Mb/s) 800-1333 800-1333 800-1600 800-1600 800-1333 800-1333 800-1333 800-1333 800-1600 800-1600 800-1600 800-1600 800-1600 800-1600 Voltage (V) K=1.35, G=1.5 K=1.35, G=1.5 K=1.35, G=1.5 K=1.35, G=1.5 K=1.35, G=1.5 K=1.35, G=1.5 K=1.35, G=1.5 K=1.35, G=1.5 K=1.35, G=1.5 K=1.35, G=1.5 K=1.35, G=1.5 K=1.35, G=1.5 K=1.35, G=1.5 K=1.35, G=1.5 Package 375 PBGA 375 PBGA 375 PBGA 375 PBGA 136 PBGA 204 PBGA 543 PBGA 543 PBGA 543 PBGA 543 PBGA 399 PBGA 399 PBGA 543 PBGA 543 PBGA Dimensions 21.5mm x 20.5mm 21.5mm x 20.5mm 21.5mm x 20.5mm 21.5mm x 20.5mm 10mm x 14.5mm 10mm x 14.5mm 23mm x 32mm 23mm x 32mm 23mm x 32mm 23mm x 32mm 14mm x 21.5mm 14mm x 21.5mm 24.5mm x 32mm 24.5mm x 32mm Temperature C, I, C, I, M C, I, M C, I, M C, I, M C, I, M C, I, M C, I, M C, I, M C, I, M C, I, M C, I, M C, I, M C, I, M Part Number W3H64M16E-XBX W3H264M16E-XSBX W3H32M64E-XSBX W3H32M72E-XSB2X W3H64M64E-XSBX W3H64M72E-XSBX W3H128M72E-XSBX W3H128M64E-XSBX Data Rate (Mb/s) 400-667 400-667 400-667 400-667 400-667 400-667 400-667 400-667 Voltage (V) 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 Package 79 PBGA 79 PBGA 208 PBGA 208 PBGA 208 PBGA 208 PBGA 208 PBGA 208 PBGA Dimensions 11mm x 14mm 11mm x 14mm 16mm x 20mm 16mm x 20mm 16mm x 22mm 16mm x 22mm 16mm x 22mm 16mm x 22mm Temperature C, I, M C, I, M C, I, M C, I, M C, I, M C, I, M C, I, M C, I, M W3H128M72ER-XNBX Data Rate (Mb/s) 400-667 Voltage (V) 1.8 Package 255 PBGA Dimensions 21mm x 23mm Temperature C, I, M Part Number W3E64M16S-XSBX W3E32M64S-XB2X W3E32M64SA-XB2X W3E32M64S-XB3X W3E32M72S-XB2X W3E32M72S-XB3X W3E64M72S-XBX Data Rate (Mb/s) 200-333 200-333 200-333 200-333 200-333 200-333 200-266 Voltage (V) 2.5 2.5 2.5 2.5 2.5 2.5 2.5 Package 60 PBGA 219 PBGA 219 PBGA 208 PBGA 219 PBGA 208 PBGA 219 PBGA Dimensions 10mm x 12.5mm 21mm x 21mm 21mm x 21mm 13mm x 22mm 21mm x 21mm 16mm x 22mm 32mm x 25mm Temperature C, I, M C, I, M C, I, M C, I, M C, I, M C, I, M C, I, M 4N512M32T-XBX Registered DDR2 SDRAM MCPs Size 1GB Organization 128M x 72 DDR SDRAM MCPs Size 128MB 256MB 256MB 256MB 256MB 256MB 512MB Organization 64M x 16 32M x 64 32M x 64 32M x 64 32M x 72 32M x 72 64M x 72 Part Number 1333-2400**** Preliminary product -- This product is developmental, is not fully characterized or qualified and is subject to change without notice. Check with factory for availability. * A dvanced product -- This product is developmental, is not qualified and is subject to change or cancellation without notice. * P erformance values based on 128KiB sequential transfers. **** Proposed data rate. Mercury Systems reserves the right to change products or specifications without notice. Mercury Corp. - Memory and Storage Solutions * (602) 437-1520 * www.mrcy.com (c) 2017 Mercury Systems. All rights reserved. 1 Microelectronic Products Quick Reference Guide - 0217 - Rev.35 Microelectronic Products Quick Reference Guide Extended Temperature Plastics -- Memories Registered DDR SDRAM MCPs Size 256MB Organization 32M x 72 Part Number W3E32M72SR-XBX SSRAM MCPs Size 2MB 2MB 4MB 4MB Organization 512K x 32 256K x 72 512K x 72 NBL 512K x 72 NBL Size Organization Conventional 16MB 2M x 64 Page Mode 32MB 64MB 256MB 512MB 1GB Registered SDRAM MCPs Size 128MB Organization 16M x 72 Dimensions 16mm x 25mm Temperature C, I, M Package 119 PBGA 159 PBGA 152 PBGA 152 PBGA Dimensions 14mm x 22mm 14mm x 22mm 17mm x 23mm 17mm x 23mm Temperature C, I, M C, I, M C, I, M C, I, M Speed (ns) Voltage (V) Package Dimensions Temperature 90-150 3.3 159 PBGA 13mm x 22mm C, I, M 110, 120 110, 120 100, 120 110, 120 110, 120 3.3 3.3 3.3 3.3 3.3 159 PBGA 159 PBGA 107 PBGA 107 PBGA 107 PBGA 13mm x 22mm 13mm x 22mm 14mm x 17mm 14mm x 17mm 14mm x 17mm C, I, M C, I, M C, I, M C, I, M C, I, M Part Number WEDPN16M64V-XB2X WEDPN16M72V-XB2X Speed (MHz) 100-133 100-133 Voltage (V) 3.3 3.3 Package 219 PBGA 219 PBGA Dimensions 21mm x 21mm 21mm x 25mm Temperature C, I, M C, I, M Part Number WEDPN16M72VR-XB2X Speed (MHz) 100-133 Voltage (V) 3.3 Package 219 PBGA Dimensions 25mm x 25mm Temperature C, I, M W78M32VP-XBX W78M64VP-XSBX W764M32V1-XBX W7264M32V1-XSBX W7464M32V1-XSBX Organization 16M x 64 16M x 72 Package 208 PBGA Voltage (V) 3.3 3.3 3.3 2.5 W72M64VB-XBX 8M x 32 8M x 64 64M x 32 2 x 64M x 32 4 x 64M x 32 Voltage (V) 2.5 Speed (MHz) 133-200 100-200 100-150 100-150 Part Number SDRAM MCPs Size 128MB 128MB Speed (MHz) 200-266 Part Number WED2DL32512V-XBX WEDPY256K72V-XBX WEDPZ512K72V-XBX WEDPZ512K72S-XBX NOR Flash MCPs (continued) Ceramics SRAM * Flash * EEPROM * Mixed Memory MCPs Multiple organizations of flash, SRAM and EE in various hermetic sealed ceramic packages including 32 CSOJ, 32 CerDIP, 56 CSOP, 68 CQFP, 66 PGA, CBGA. These are standard hermetic products available as Class H or K compliant. *Hermetic * Mil-PRF * QML Mercury Systems ceramic products are available in industrial, military temperatures and as SMD-5962 qualified components. Applications Engineering Performance, Layout & Design Benefits to Customer This technology reduces PWB real estate, I/O requirements and memory down rounting, by typically 20% to 70%. This frees up real-estate for additional product features and can capture more sales opportunities for the board designer. Reduced memory-down routing can cut design time by up to ~4 weeks, and save the associated opportunity cost. Reduced I/O and routing allows wider pitch on BGA leads and hence easier class 3 PWB rule compliance since 0.5mm - 0.65mm pitch memory parts are not placed on the board. Reduction of memory-down routing can save 2-4 PWB layers Improves parasitic performance (L, Z, C) at first and second level. Use of MCP provides reduced bus capacitance and better signal integrity on the PCB. BOM maintenance costs are reduced since the MCP interface is consistent despite part obsolescence issues which are managed by Mercury Systems. SiP Capabilities and Typical Applications DMEA trusted on shore facility for design, assembly and test. ITAR conformance Plastic encapsulation or hermetic sealing; laminate or ceramic based packages. QFP, BGA or customer specified packages. Data I/O Control Spice (HSpice), ELDO, EBD and IBIS modeling. Configuration NOR Address Complete turnkey assembly; wire bond, flip chip attach, and specialized die processing including redistribution, wafer dicing and die stacking techniques. Processor Environmental and electrical testing: 100% military, industrial or customer defined temperature ranges. Mercury Systems's high reliability products are manufactured and tested in accordance with MILPRF38534 (Class H and K) and MIL-PRF-38535 (Class Q) Certified. DDR2/3 SDRAM DDR2/3 SDRAM DDR2/3 SDRAM DDR2/3 SDRAM DDR2/3 SDRAM x64/x72 FPGA/ASIC/Chipset SATA BGA SSD Anti-tamper Circuit card assembly Mercury Systems reserves the right to change products or specifications without notice. (c) 2017 Mercury Systems. All rights reserved. Mercury Corp. - Memory and Storage Solutions * (602) 437-1520 * www.mrcy.com 2 Microelectronic Products Quick Reference Guide - 0217 - Rev.35