Mercury Systems reserves the right to change products or specications without notice. © 2017 Mercury Systems. All rights reserved.
Microelectronic Products
Quick Reference Guide
1
Mercury Corp. - Memory and Storage Solutions • (602) 437-1520 • www.mrcy.com Microelectronic Products Quick Reference Guide – 0217 – Rev.35
NAND FLASH — SSD
TRRUST-Stor™ 2.5 in. SATA Secure Storage Device
Size Interface Part Number Read/Write Speed Voltage (V) Package Dimensions Temperature
64GB SATA MSD064AM2R-000I*66/51 MB/s*** 5.0 2.5" 100.45 MAX × 69.85 × 9.5 mm I
128GB SATA MSD128AS0R-000I 174/162 MB/s*** 5.0 2.5" 100.45 MAX × 69.85 × 9.5 mm I
256GB SATA MSD256AM2R-000I 161/200 MB/s*** 5.0 2.5" 100.45 MAX × 69.85 × 9.5 mm I
512GB SATA MSD512AM2R-000I 161/200 MB/s*** 5.0 2.5" 100.45 MAX × 69.85 × 9.5 mm I
1TB SATA MSD01TAM2R-000I 200/200 MB/s*** 5.0 2.5" 100.45 MAX × 69.85 × 9.5 mm I
NAND SSD BGA
Size Interface Part Number Read/Write Speed Voltage (V) Package Dimensions Temperature
64GB SATA MSM064AM2L-M00I 66/51 MB/s*** 3.3-5.0 524 PBGA 32mm x 28mm x 6mm I
128GB SATA MSM128AM2L-M00I*66/51 MB/s*** 3.3-5.0 524 PBGA 32mm x 28mm x 6mm I
mSATA SSD
Size Interface Part Number Read/Write Speed Voltage (V) Package Dimensions Temperature
64GB SATA MM3064AM2R-M00I 66/51 MB/s*** 3.3-5.0 mSATA 30mm x 50mm I
128GB SATA MM3128AM2R-M00I*66/51 MB/s*** 3.3-5.0 mSATA 30mm x 50mm I
XMC SSD
Size Interface Part Number Read/Write Speed Voltage (V) Package Dimensions Temperature
256GB SATA MXMCM256A2L-001I 175/200 MB/s** 5.0 XMC 143.75mm x 74mm I
512GB SATA MXMCM512A2L-001I 175/200 MB/s** 5.0 XMC 143.75mm x 74mm I
Extended Temperature Plastics — Memories
DDR4 SDRAM MCPs
Size Organization Part Number Data Rate (Mb/s) Voltage (V) Package Dimensions Temperature
2GB 512M x 32 4N512M32T-XBX*1333-2400**** 1.2 143 PBGA 8mm x 14mm C, I, M
4GB 512M x 64 4N512M64T-XBX*1333-2400**** 1.2 321 PBGA 13mm x 20mm C, I, M
4GB 512M x 72 4N512M72T-XBX*1333-2400**** 1.2 321 PBGA 13mm x 20mm C, I, M
8GB 512M x 64 4N1G64T-XBX*1333-2400**** 1. 2 321 PBGA 13mm x 20mm C, I, M
8GB 512M x 72 4N1G72T-XBX*1333-2400**** 1. 2 321 PBGA 13mm x 20mm C, I, M
DDR3 SDRAM MCPs
Size Organization Part Number Data Rate (Mb/s) Voltage (V) Package Dimensions Temperature
1GB 128M x 64 W3J128M64X-XPBX 800-1333 K=1.35, G=1.5 375 PBGA 21.5mm x 20.5mm C, I,
1GB 128M x 72 W3J128M72X-XPBX 800-1333 K=1.35, G=1.5 375 PBGA 21.5mm x 20.5mm C, I, M
1GB 128M x 64 W3J128M64X-XLBX 800-1600 K=1.35, G=1.5 375 PBGA 21.5mm x 20.5mm C, I, M
1GB 128M x 72 W3J128M72X-XLBX 800-1600 K=1.35, G=1.5 375 PBGA 21.5mm x 20.5mm C, I, M
2GB 512M x 32 W3J512M32X-XBX 800-1333 K=1.35, G=1.5 136 PBGA 10mm x 14.5mm C, I, M
2GB 512M x 32 W3J512M32X-XB2X 800-1333 K=1.35, G=1.5 204 PBGA 10mm x 14.5mm C, I, M
4GB 512M x 64 W3J512M64X-XPBX 800-1333 K=1.35, G=1.5 543 PBGA 23mm x 32mm C, I, M
4GB 512M x 72 W3J512M72X-XPBX 800-1333 K=1.35, G=1.5 543 PBGA 23mm x 32mm C, I, M
4GB 512M x 64 W3J512M64X-XLBX 800-1600 K=1.35, G=1.5 543 PBGA 23mm x 32mm C, I, M
4GB 512M x 72 W3J512M72X-XLBX 800-1600 K=1.35, G=1.5 543 PBGA 23mm x 32mm C, I, M
4GB HD 512M x 64 W3J512M64X-XHDX** 800-1600 K=1.35, G=1.5 399 PBGA 14mm x 21.5mm C, I, M
4GB HD 512M x 72 W3J512M72X-XHDX** 800-1600 K=1.35, G=1.5 399 PBGA 14mm x 21.5mm C, I, M
8GB 8GB x 64 W3J1G64X-XPBX** 800-1600 K=1.35, G=1.5 543 PBGA 24.5mm x 32mm C, I, M
8GB 8GB x 72 W3J1G72X-XPBX** 800-1600 K=1.35, G=1.5 543 PBGA 24.5mm x 32mm C, I, M
DDR2 SDRAM MCPs
Size Organization Part Number Data Rate (Mb/s) Voltage (V) Package Dimensions Temperature
128MB 64M x 16 W3H64M16E-XBX 400-667 1.8 79 PBGA 11mm x 14mm C, I, M
256MB 2 x 64M x 16 W3H264M16E-XSBX 400-667 1.8 79 PBGA 11mm x 14mm C, I, M
256MB 32M x 64 W3H32M64E-XSBX 400-667 1.8 208 PBGA 16mm x 20mm C, I, M
256MB 32M x 72 W3H32M72E-XSB2X 400-667 1.8 208 PBGA 16mm x 20mm C, I, M
512MB 64M x 64 W3H64M64E-XSBX 400-667 1.8 208 PBGA 16mm x 22mm C, I, M
512MB 64M x 72 W3H64M72E-XSBX 400-667 1.8 208 PBGA 16mm x 22mm C, I, M
1GB 128M x 72 W3H128M72E-XSBX 400-667 1.8 208 PBGA 16mm x 22mm C, I, M
1GB 128M x 64 W3H128M64E-XSBX 400-667 1.8 208 PBGA 16mm x 22mm C, I, M
Registered DDR2 SDRAM MCPs
Size Organization Part Number Data Rate (Mb/s) Voltage (V) Package Dimensions Temperature
1GB 128M x 72 W3H128M72ER-XNBX*400-667 1.8 255 PBGA 21mm x 23mm C, I, M
DDR SDRAM MCPs
Size Organization Part Number Data Rate (Mb/s) Voltage (V) Package Dimensions Temperature
128MB 64M x 16 W3E64M16S-XSBX 200-333 2.5 60 PBGA 10mm x 12.5mm C, I, M
256MB 32M x 64 W3E32M64S-XB2X 200-333 2.5 219 PBGA 21mm x 21mm C, I, M
256MB 32M x 64 W3E32M64SA-XB2X 200-333 2.5 219 PBGA 21mm x 21mm C, I, M
256MB 32M x 64 W3E32M64S-XB3X 200-333 2.5 208 PBGA 13mm x 22mm C, I, M
256MB 32M x 72 W3E32M72S-XB2X 200-333 2.5 219 PBGA 21mm x 21mm C, I, M
256MB 32M x 72 W3E32M72S-XB3X 200-333 2.5 208 PBGA 16mm x 22mm C, I, M
512MB 64M x 72 W3E64M72S-XBX 200-266 2.5 219 PBGA 32mm x 25mm C, I, M
* Preliminary product — This product is developmental, is not fully characterized or qualified and is subject to change without notice. Check with factory for availability.
** Advanced product — This product is developmental, is not qualified and is subject to change or cancellation without notice.
*** Performance values based on 128KiB sequential transfers.
**** Proposed data rate.
Microelectronic Products Quick Reference Guide
2
Mercury Corp. - Memory and Storage Solutions • (602) 437-1520 • www.mrcy.com
Mercury Systems reserves the right to change products or specications without notice.
© 2017 Mercury Systems. All rights reserved.
Microelectronic Products Quick Reference Guide – 0217 – Rev.35
Extended Temperature Plastics — Memories (continued)
Registered DDR SDRAM MCPs
Size Organization Part Number Speed (MHz) Voltage (V) Package Dimensions Temperature
256MB 32M x 72 W3E32M72SR-XBX 200-266 2.5 208 PBGA 16mm x 25mm C, I, M
SSRAM MCPs
Size Organization Part Number Speed (MHz) Voltage (V) Package Dimensions Temperature
2MB 512K x 32 WED2DL32512V-XBX 133-200 3.3 119 PBGA 14mm x 22mm C, I, M
2MB 256K x 72 WEDPY256K72V-XBX 100-200 3.3 159 PBGA 14mm x 22mm C, I, M
4MB 512K x 72 NBL WEDPZ512K72V-XBX 100-150 3.3 152 PBGA 17mm x 23mm C, I, M
4MB 512K x 72 NBL WEDPZ512K72S-XBX 100-150 2.5 152 PBGA 17mm x 23mm C, I, M
NOR Flash MCPs
Size Organization Part Number Speed (ns) Voltage (V) Package Dimensions Temperature
Conventional
16MB 2M x 64 W72M64VB-XBX 90-150 3.3 159 PBGA 13mm x 22mm C, I, M
Page Mode
32MB 8M x 32 W78M32VP-XBX 110, 120 3.3 159 PBGA 13mm x 22mm C, I, M
64MB 8M x 64 W78M64VP-XSBX 110, 120 3.3 159 PBGA 13mm x 22mm C, I, M
256MB 64M x 32 W764M32V1-XBX 100, 120 3.3 107 PBGA 14mm x 17mm C, I, M
512MB 2 x 64M x 32 W7264M32V1-XSBX 110, 120 3.3 107 PBGA 14mm x 17mm C, I, M
1GB 4 x 64M x 32 W7464M32V1-XSBX 110, 120 3.3 107 PBGA 14mm x 17mm C, I, M
SDRAM MCPs
Size Organization Part Number Speed (MHz) Voltage (V) Package Dimensions Temperature
128MB 16M x 64 WEDPN16M64V-XB2X 100-133 3.3 219 PBGA 21mm x 21mm C, I, M
128MB 16M x 72 WEDPN16M72V-XB2X 100-133 3.3 219 PBGA 21mm x 25mm C, I, M
Registered SDRAM MCPs
Size Organization Part Number Speed (MHz) Voltage (V) Package Dimensions Temperature
128MB 16M x 72 WEDPN16M72VR-XB2X 100-133 3.3 219 PBGA 25mm x 25mm C, I, M
Ceramics
SRAM • Flash • EEPROM • Mixed Memory MCPs • Hermetic • Mil-PRF • QML
Multiple organizations of ash, SRAM and EE in various hermetic sealed ceramic
packages including 32 CSOJ, 32 CerDIP, 56 CSOP, 68 CQFP, 66 PGA, CBGA. These
are standard hermetic products available as Class H or K compliant.
Mercury Systems ceramic products are available in industrial, military
temperatures and as SMD-5962 qualied components.
Applications Engineering Performance, Layout & Design Benefits to Customer
This technology reduces PWB real estate, I/O requirements and memory down
rounting, by typically 20% to 70%. This frees up real-estate for additional product
features and can capture more sales opportunities for the board designer.
Reduction of memory-down routing can save 2-4 PWB layers
Improves parasitic performance (L, Z, C) at rst and second level.Use of MCP
provides reduced bus capacitance and better signal integrity on the PCB.
Reduced memory-down routing can cut design time by up to ~4 weeks, and save
the associated opportunity cost.
Reduced I/O and routing allows wider pitch on BGA leads and hence easier class
3 PWB rule compliance since 0.5mm - 0.65mm pitch memory parts are not placed
on the board.
BOM maintenance costs are reduced since the MCP interface is consistent
despite part obsolescence issues which are managed by Mercury Systems.
SiP Capabilities and Typical Applications
DMEA trusted on shore facility for design, assembly and test.
ITAR conformance
Plastic encapsulation or hermetic sealing; laminate or ceramic based packages. QFP, BGA
or customer specied packages.
Complete turnkey assembly; wire bond, ip chip attach, and specialized die processing
including redistribution, wafer dicing and die stacking techniques.
Spice (HSpice), ELDO, EBD and IBIS modeling.
Environmental and electrical testing: 100% military, industrial or customer dened
temperature ranges.
Mercury Systems’s high reliability products are manufactured and tested in accordance
with MIL-PRF-38534
(Class H and K) and MIL-PRF-38535 (Class Q) Certied.
Anti-tamper
Circuit card assembly
x64/x72
SATA
BGA
SSD
Address
Control
Data I/O
Processor
Configuration
NOR
FPGA/ASIC/Chipset
DDR2/3
SDRAM
DDR2/3
SDRAM
DDR2/3
SDRAM
DDR2/3
SDRAM
DDR2/3
SDRAM