DATA SH EET
Product specification
File under Integrated Circuits, IC01 July 1994
INTEGRATED CIRCUITS
TDA7073A/AT
Dual BTL power driver
July 1994 2
Philips Semiconductors Product specification
Dual BTL power driver TDA7073A/AT
FEATURES
•No external components
•Very high slew rate
•Single power supply
•Short-circuit proof
•High output current (0.6 A)
•Wide supply voltage range
•Low output offset voltage
•Suited for handling PWM signals up to 176 kHz
•ESD protected on all pins.
GENERAL DESCRIPTION
The TDA7073A/AT are dual power driver circuits in a BTL
configuration, intended for use as a power driver for servo
systems with a single supply. They are specially designed
for compact disc players and are capable of driving focus,
tracking, sled functions and spindle motors.
Missing Current Limiter (MCL)
A MCL protection circuit is built-in. The MCL circuit is
activated when the difference in current between the
output terminal of each amplifier exceeds 100 mA (typical
300 mA). This level of 100 mA allows for headphone
applications (single-ended).
QUICK REFERENCE DATA
ORDERING INFORMATION
Notes
1. SOT38-1; 1996 August 22.
2. SOT162-1; 1996 August 22.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VPpositive supply voltage range 3.0 5.0 18 V
Gvinternal voltage gain 32.5 33.5 34.5 dB
IPtotal quiescent current VP = 5 V; RL = ∞−816mA
SR slew rate −12 −V/µs
IOoutput current −−0.6 A
Ibias input bias current −100 300 nA
fco cut-off frequency −3 dB −1.5 −MHz
EXTENDED TYPE
NUMBER PACKAGE
PINS PIN POSITION MATERIAL CODE
TDA7073A 16 DIL plastic SOT38
TDA7073AT 16 mini-pack plastic SOT162A
July 1994 3
Philips Semiconductors Product specification
Dual BTL power driver TDA7073A/AT
Fig.1 Block diagram.
handbook, full pagewidth
positive input 1
5
2
VP
1
16I + i
13I – i
negative input 1
positive output 1
negative output 1
MCD382 - 1
positive input 2 6
TDA7073A
TDA7073AT
7
12
9I + i
I – i
negative input 2
10
positive output 2
negative output 2
14
ground 1 n.c.
ground 2
3, 4, 8, 11, 15
ΙΙ
Ι
SHORT - CIRCUIT AND
THERMAL PROTECTION
July 1994 4
Philips Semiconductors Product specification
Dual BTL power driver TDA7073A/AT
PINNING
SYMBOL PIN DESCRIPTION
IN1−1 negative input 1
IN1+2 positive input 1
n.c. 3 not connected
n.c. 4 not connected
VP5 positive supply voltage
IN2+6 positive input 2
IN2−7 negative input 2
n.c. 8 not connected
OUT2+9 positive output 2
GND2 10 ground 2
n.c. 11 not connected
OUT2−12 negative output 2
OUT1−13 negative output 1
GND1 14 ground 1
n.c. 15 not connected
OUT1+16 positive output 1
Fig.2 Pin configuration.
handbook, halfpage
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
TDA7073A
TDA7073AT
OUT1+
GND1
P
V
n.c.
IN1–
IN1+
n.c.
OUT1 –
OUT2 –
n.c.
GND2
OUT2 +
n.c.
n.c.
IN2 –
IN2 +
MCD381
FUNCTIONAL DESCRIPTION
The TDA7073A/AT are dual power driver circuits in a BTL
configuration, intended for use as a power driver for servo
systems with a single supply. They are particular designed
for compact disc players and are capable of driving focus,
tracking, sled functions and spindle motors.
Because of the BTL configuration, the devices can supply
a bi-directional DC current in the load, with only a single
supply voltage. The voltage gain is fixed by internal
feedback at 33.5 dB and the devices operate in a wide
supply voltage range (3 to 18 V). The devices can supply
a maximum output current of 0.6 A. The outputs can be
short-circuited over the load, to the supply and to ground
at all input conditions. The differential inputs can handle
common mode input voltages from ground level up to
(VP−2.2 V with a maximum of 10 V). The devices have a
very high slew rate. Due to the large bandwidth, they can
handle PWM signals up to 176 kHz.
July 1994 5
Philips Semiconductors Product specification
Dual BTL power driver TDA7073A/AT
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
Note to the limiting values
1. The outputs can be short-circuited over the load, to the supply and to ground at all input conditions.
THERMAL RESISTANCE
Notes to the thermal resistance
1. TDA7073A: VP = 5 V; RL = 8 Ω; The typical voltage swing = 5.8 V and Vloss is 2.1 V therefore IO = 0.36 A and
Ptot =2×0.76 W = 1.52 W; Tamb (max) = 150 − 1.52 × 50 = 74 °C.
2. TDA7073AT: VP = 5 V; RL = 16 Ω; typical voltage swing = 5.8 V and Vloss is 2.1 V therefore IO = 0.18 A and
Ptot =2×0.38 W = 0.76 W; Tamb (max) = 150 − 0.76 × 95 = 77 °C.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VPpositive supply voltage range −18 V
IORM repetitive peak output current −1A
I
OSM non repetitive peak output current −1.5 A
Ptot total power dissipation Tamb <25 °C
TDA7073A −2.5 W
TDA7073AT −1.32 W
Tstg storage temperature range −55 +150 °C
Tvj virtual junction temperature −+150 °C
Tsc short-circuit time see note 1 −1hr
SYMBOL PARAMETER THERMAL RESISTANCE
Rth j-a from junction to ambient in free air
TDA7073A; note 1 50 K/W
TDA7073AT; note 2 95 K/W
July 1994 6
Philips Semiconductors Product specification
Dual BTL power driver TDA7073A/AT
CHARACTERISTICS
VP = 5 V ; f = 1 kHz; T amb = 25 °C; unless otherwise specified (see Fig.3]). TDA7073A: RL = 8 Ω; TDA7073AT: RL = 16 Ω.
Notes to the characteristics
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by RL.
2. The output voltage swing is typically limited to 2 × (VP−2.1 V) (see Fig.4).
3. The noise output voltage (RMS value), unweighted (20 Hz to 20 kHz) is measured with RS = 500 Ω.
4. The ripple rejection is measured with RS = 0 Ωand f = 100 Hz to 10 kHz. The ripple voltage of 200 mV (RMS value)
is applied to the positive supply rail.
5. The DC common mode voltage range is limited to (VP −2.2 V with a maximum of 10 V).
6. The common mode rejection ratio is measured at Vref = 1.4 V, VI(CM) = 200 mV and f = 1 kHz.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VPpositive supply voltage range 3.0 5.0 18 V
IORM repetitive peak output current −−0.6 A
IPtotal quiescent current RL = ∞; note1 −816mA
∆V
OUT output voltage swing note 2 5.2 5.8 −V
THD total harmonic distortion VOUT = 1 V (RMS)
TDA7073A −0.3 −%
TDA7073AT −0.1 −%
Gvvoltage gain 32.5 33.5 34.5 dB
Vno(rms) noise output voltage (RMS value) note 3 −75 150 µV
B bandwidth −−1.5 MHz
SVRR supply voltage ripple rejection note 4 40 55 −dB
|∆V16-13, 12-9| DC output offset voltage RS = 500 Ω−−100 mV
VI(CM) DC common mode voltage range note 5 0 −2.8 V
CMRR DC common mode rejection ratio note 6 −100 −dB
ZIinput impedance −100 −kΩ
Ibias input bias current −100 300 nA
αchannel separation 40 50 −dB
|∆GV| channel unbalance −−1dB
SR slew rate −12 −V/µs
July 1994 7
Philips Semiconductors Product specification
Dual BTL power driver TDA7073A/AT
APPLICATION INFORMATION
Fig.3 Test and application diagram.
(1) This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 5.
(2) RL can be: focus, tracking, sled function or spindle motor.
handbook, full pagewidth
16
13
12
9
500 Ω
Rs
driver signal 1
500 Ω
Rs
Vref
driver signal 2
SERVO SYSTEM
ground
MCD383
100 nF 220 µF
V = 5 V
P
(1)
RL
(2)
RL
(2)
5
2
1
I + i
I – i
6
TDA7073A
TDA7073AT
7
I + i
I – i
10 14
n.c.
3, 4, 8, 11, 15
ΙΙ
Ι
July 1994 8
Philips Semiconductors Product specification
Dual BTL power driver TDA7073A/AT
Fig.4 Typical output voltage swing over RL.
handbook, full pagewidth
+ (V – 2.1) V
P
– (V – 2.1) V
P
0 V
MCD380
July 1994 9
Philips Semiconductors Product specification
Dual BTL power driver TDA7073A/AT
PACKAGE OUTLINES
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT38-4 92-11-17
95-01-14
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
b2
e
D
A2
Z
16
1
9
8
E
pin 1 index
b
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT A
max. 12 b
1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A
max. bmax.
w
ME
e1
1.73
1.30 0.53
0.38 0.36
0.23 19.50
18.55 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 0.764.2 0.51 3.2
inches 0.068
0.051 0.021
0.015 0.014
0.009
1.25
0.85
0.049
0.033 0.77
0.73 0.26
0.24 0.14
0.12 0.010.10 0.30 0.32
0.31 0.39
0.33 0.0300.17 0.020 0.13
DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4
July 1994 10
Philips Semiconductors Product specification
Dual BTL power driver TDA7073A/AT
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 10.5
10.1 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT162-1
8
16
wM
bp
D
detail X
Z
e
9
1
y
0.25
075E03 MS-013AA
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.41
0.40 0.30
0.29 0.050
1.4
0.055
0.42
0.39 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
X
θ
A
A1
A2
HE
Lp
Q
E
c
L
vMA
(A )
3
A
0 5 10 mm
scale
92-11-17
95-01-24
SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1
July 1994 11
Philips Semiconductors Product specification
Dual BTL power driver TDA7073A/AT
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
(order code 9398 652 90011).
DIP
SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
•A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
•The longitudinal axis of the package footprint must be
parallel to the solder flow.
•The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
July 1994 12
Philips Semiconductors Product specification
Dual BTL power driver TDA7073A/AT
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
