Product Folder Order Now Support & Community Tools & Software Technical Documents Reference Design LM50, LM50-Q1 SNIS118G - JULY 1999 - REVISED JANUARY 2017 LM50 and LM50-Q1 SOT-23 Single-Supply Centigrade Temperature Sensor 1 Features 3 Description * The LM50 and LM50-Q1 devices are precision integrated-circuit temperature sensors that can sense a -40C to 125C temperature range using a single positive supply. The output voltage of the device is linearly proportional to temperature (10 mV/C) and has a DC offset of 500 mV. The offset allows reading negative temperatures without the need for a negative supply. 1 * * * * * * * * * * * LM50-Q1 is AEC-Q100 Grade 1 Qualified and is Manufactured on an Automotive Grade Flow Calibrated Directly in Degrees Celsius (Centigrade) Linear + 10 mV/C Scale Factor 2C Accuracy Specified at 25C Specified for Full -40 to 125C Range Suitable for Remote Applications Low Cost Due to Wafer-Level Trimming Operates From 4.5 V to 10 V Less Than 130-A Current Drain Low Self-Heating: Less Than 0.2C in Still A Nonlinearity Less Than 0.8C Over Temp UL Recognized Component 2 Applications * * * * * * * * * Automotive Computers Disk Drives Battery Management FAX Machines Printers Portable Medical Instruments HVAC Power Supply Modules SPACER Simplified Schematic The ideal output voltage of the LM50 or LM50-Q1 ranges from 100 mV to 1.75 V for a -40C to 125C temperature range. The LM50 and LM50-Q1 do not require any external calibration or trimming to provide accuracies of 3C at room temperature and 4C over the full -40C to 125C temperature range. Trimming and calibration of the LM50 and LM50-Q1 at the wafer level assure low cost and high accuracy. The linear output, 500 mV offset, and factory calibration of the LM50 and LM50-Q1 simplify the circuitry requirements in a single supply environment where reading negative temperatures is necessary. Because the quiescent current of the LM50 and LM50-Q1 is less than 130 A, self-heating is limited to a very low 0.2C in still air. Device Information(1) PART NUMBER LM50, LM50-Q1 PACKAGE BODY SIZE (NOM) SOT-23 (3) 2.92 mm x 1.30 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Full-Range Centigrade Temperature Sensor (-40C to 125C) +VS (4.5 V to 10 V) 2.00 LM50 LM50-Q1 Output Copyright (c) 2016, Texas Instruments Incorporated Output Voltage (V) 1.75 1.50 1.750 1.25 0.750 1.00 0.75 0.50 0.100 VO = (+10 mV/C x T C) + 500 mV 0.25 0.00 50 25 0 25 50 75 DUT Temperature (C) 100 125 150 C001 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM50, LM50-Q1 SNIS118G - JULY 1999 - REVISED JANUARY 2017 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 6.1 6.2 6.3 6.4 6.5 6.6 6.7 3 3 4 4 4 5 6 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics: LM50B ............................. Electrical Characteristics: LM50C and LM50-Q1 ...... Typical Characteristics .............................................. Detailed Description .............................................. 8 7.1 7.2 7.3 7.4 Overview ................................................................... Functional Block Diagram ......................................... Feature Description................................................... Device Functional Modes.......................................... 8 8 8 8 8 Application and Implementation .......................... 9 8.1 Application Information.............................................. 9 8.2 Typical Application .................................................... 9 8.3 System Examples ................................................... 11 9 Power Supply Recommendations...................... 12 10 Layout................................................................... 12 10.1 Layout Guidelines ................................................. 12 10.2 Layout Example .................................................... 12 10.3 Thermal Considerations ........................................ 13 11 Device and Documentation Support ................. 14 11.1 11.2 11.3 11.4 11.5 11.6 Related Links ........................................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 14 14 14 14 14 14 12 Mechanical, Packaging, and Orderable Information ........................................................... 14 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision F (December 2016) to Revision G * Page Changed LMT90 to LM50 in VO description of Equation 1 .................................................................................................... 8 Changes from Revision E (September 2013) to Revision F Page * Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Detailed Description section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ............................... 1 * Added Thermal Information table ........................................................................................................................................... 4 * Changed Junction-to-ambient, RJA, value in Thermal Information table From: 450C/W To: 291.9C/W ............................ 4 * Deleted the Temperature To Digital Converter (Parallel TRI-STATE Outputs for Standard Data Bus to P Interface) (125C Full Scale) figure ...................................................................................................................................................... 11 Changes from Revision C (February 2013) to Revision E * 2 Page Added LM50-Q1 option throughout document ....................................................................................................................... 1 Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM50 LM50-Q1 LM50, LM50-Q1 www.ti.com SNIS118G - JULY 1999 - REVISED JANUARY 2017 5 Pin Configuration and Functions DBZ Package 3-Pin SOT-23 Top View +VS 1 3 VO GND 2 Pin Functions PIN NO. TYPE NAME DESCRIPTION 1 +VS Power Positive power supply pin. 2 VOUT Output Temperature sensor analog output. 3 GND Ground Device ground pin, connected to power supply negative terminal. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage -0.2 12 V Output voltage -1 +VS + 0.6 V Output current 10 mA Maximum junction temperature, TJ 150 C 150 C Storage temperature, Tstg (1) -65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions(). Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE UNIT LM50 V(ESD) Electrostatic discharge Human body model (HBM) (1) 2000 Charged-device model (CDM) 750 Machine model (1) 250 Human-body model (HBM), per AEC Q100-002 (2) 2000 Charged-device model (CDM), per AEC Q100-011 750 V LM50-Q1 V(ESD) (1) (2) Electrostatic discharge V The human body model is a 100-pF capacitor discharged through a 1.5-k resistor into each pin. Machine model is a 200-pF capacitor discharged directly into each pin. AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM50 LM50-Q1 3 LM50, LM50-Q1 SNIS118G - JULY 1999 - REVISED JANUARY 2017 www.ti.com 6.3 Recommended Operating Conditions (1) +VS MIN MAX 4.5 10 LM50C, LM50-Q1 -40 125 LM50B -25 100 -40 150 Supply voltage TMIN, TMAX Specified temperature Operating temperature (1) UNIT V C C Soldering process must comply with the Reflow Temperature Profile specifications. Reflow temperature profiles are different for leadfree and non-lead-free packages. Refer to www.ti.com/packaging. 6.4 Thermal Information LM50, LM50-Q1 THERMAL METRIC (1) DBZ (SOT-23) UNIT 3 PINS RJA Junction-to-ambient thermal resistance 291.9 C/W RJC(top) Junction-to-case (top) thermal resistance 114.3 C/W RJB Junction-to-board thermal resistance 62.3 C/W JT Junction-to-top characterization parameter 7.4 C/W JB Junction-to-board characterization parameter 61 C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.5 Electrical Characteristics: LM50B +VS = 5 V (DC) and ILOAD = 0.5 A, in the circuit of Figure 12, TA = TJ = 25C (unless otherwise noted) (1) PARAMETER Accuracy (2) Nonlinearity (3) TEST CONDITIONS MIN TYP MAX UNIT TA = 25C -2 2 C TA = TMAX -3 3 C TA = TMIN -3.5 3 C TA = TJ = TMIN to TMAX -0.8 0.8 C Sensor gain (average slope) TA = TJ = TMIN to TMAX 9.7 10.3 mV/C Output resistance TA = TJ = TMIN to TMAX Line regulation (4) +VS = 4.5 V to 10 V, TA = TJ = TMIN to TMAX Quiescent current (5) Change of quiescent current Temperature coefficient of quiescent current TA = TJ = TMIN to TMAX Long term stability (6) TJ = 125C, for 1000 hours (1) (2) (3) (4) (5) (6) 4 2000 -1.2 4000 1.2 mV/V +VS = 4.5 V to 10 V, TA = TJ = TMIN to TMAX 180 A +VS = 4.5 V to 10 V, TA = TJ = TMIN to TMAX 2 1 0.08 A A/C C Limits are specified to TI's AOQL (Average Outgoing Quality Level). Accuracy is defined as the error between the output voltage and 10 mv/C multiplied by the device's case temperature plus 500 mV, at specified conditions of voltage, current, and temperature (expressed in C). Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device's rated temperature range. Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance. Quiescent current is defined in the circuit of Figure 12. For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, and/or temperature cycled for at least 46 hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered; allow time for stress relaxation to occur. The majority of the drift occurs in the first 1000 hours at elevated temperatures. The drift after 1000 hours does not continue at the first 1000 hour rate. Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM50 LM50-Q1 LM50, LM50-Q1 www.ti.com SNIS118G - JULY 1999 - REVISED JANUARY 2017 6.6 Electrical Characteristics: LM50C and LM50-Q1 +VS = 5 V (DC) and ILOAD = 0.5 A, in the circuit of Figure 12. TA = TJ = 25C, unless otherwise noted. (1) PARAMETER Accuracy (2) TEST CONDITIONS MIN -3 3 C -4 4 C TA = TMIN -4 4 C 0.8 C 10.3 mV/C -0.8 Sensor gain(average slope) TA = TJ = TMIN to TMAX 9.7 Output resistance TA = TJ = TMIN to TMAX Line regulation (4) +VS = 4.5 V to 10 V, TA = TJ = TMIN to TMAX Quiescent current (5) Change of quiescent current Temperature coefficient of quiescent current TA = TJ = TMIN to TMAX Long term stability (6) TJ = 125C, for 1000 hours (4) (5) (6) UNIT TA = TMAX TA = TJ = TMIN to TMAX (3) MAX TA = 25C Nonlinearity (3) (1) (2) TYP 2000 -1.2 4000 1.2 mV/V +VS = 4.5 V to 10 V, TA = TJ = TMIN to TMAX 180 A +VS = 4.5 V to 10 V, TA = TJ = TMIN to TMAX 2 2 A A/C 0.08 C Limits are specified to TI's AOQL (Average Outgoing Quality Level). Accuracy is defined as the error between the output voltage and 10 mv/C multiplied by the device's case temperature plus 500 mV, at specified conditions of voltage, current, and temperature (expressed in C). Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device's rated temperature range. Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance. Quiescent current is defined in the circuit of Figure 12. For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, and/or temperature cycled for at least 46 hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered; allow time for stress relaxation to occur. The majority of the drift occurs in the first 1000 hours at elevated temperatures. The drift after 1000 hours does not continue at the first 1000 hour rate. Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM50 LM50-Q1 5 LM50, LM50-Q1 SNIS118G - JULY 1999 - REVISED JANUARY 2017 www.ti.com 6.7 Typical Characteristics To generate these curves the device was mounted to a printed circuit board as shown in Figure 20. Figure 1. Junction-to-Ambient Thermal Resistance Figure 2. Thermal Time Constant see Figure 20 6 Figure 3. Thermal Response in Still Air With Heat Sink Figure 4. Thermal Response in Stirred Oil Bath With Heat Sink Figure 5. Start-Up Voltage vs Temperature Figure 6. Thermal Response in Still Air Without a Heat Sink Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM50 LM50-Q1 LM50, LM50-Q1 www.ti.com SNIS118G - JULY 1999 - REVISED JANUARY 2017 Typical Characteristics (continued) To generate these curves the device was mounted to a printed circuit board as shown in Figure 20. see Figure 12 Figure 7. Quiescent Current vs Temperature Figure 8. Accuracy vs Temperature Figure 9. Noise Voltage Figure 10. Supply Voltage vs Supply Current Figure 11. Start-Up Response Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM50 LM50-Q1 7 LM50, LM50-Q1 SNIS118G - JULY 1999 - REVISED JANUARY 2017 www.ti.com 7 Detailed Description 7.1 Overview The LM50 and LM50-Q1 devices are precision integrated-circuit temperature sensors that can sense a -40C to 125C temperature range using a single positive supply. The output voltage of the LM50 and LM50-Q1 has a positive temperature slope of 10 mV/C. A 500-mV offset is included enabling negative temperature sensing when biased by a single supply. The temperature-sensing element is comprised of a delta-VBE architecture. The temperature-sensing element is then buffered by an amplifier and provided to the VOUT pin. The amplifier has a simple class A output stage with typical 2-k output impedance as shown in the Functional Block Diagram. 7.2 Functional Block Diagram *R2 2k with a typical 1300-ppm/C drift. 7.3 Feature Description 7.3.1 LM50 and LM50-Q1 Transfer Function The LM50 and LM50-Q1 follow a simple linear transfer function to achieve the accuracy as listed in the Electrical Characteristics: LM50B table and the Electrical Characteristics: LM50C and LM50-Q1 table. Use Equation 1 to calculate the value of VO. VO = 10 mV/C x T C + 500 mV where * * T is the temperature in C VO is the LM50 output voltage (1) 7.4 Device Functional Modes The only functional mode of the device has an analog output directly proportional to temperature. 8 Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM50 LM50-Q1 LM50, LM50-Q1 www.ti.com SNIS118G - JULY 1999 - REVISED JANUARY 2017 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The LM50 and LM50-Q1 have a wide supply range and a 10 mV/C output slope with a 500-mV DC offset. Therefore, it can be easily applied in many temperature-sensing applications where a single supply is required for positive and negative temperatures. 8.2 Typical Application 8.2.1 Full-Range Centigrade Temperature Sensor +VS (4.5 V to 10 V) LM50 LM50-Q1 Output Copyright (c) 2016, Texas Instruments Incorporated Figure 12. Full-Range Centigrade Temperature Sensor Diagram(-40C to 125C) 8.2.1.1 Design Requirements For this design example, use the parameters listed in Table 1 as the input parameters. Table 1. Design Parameters PARAMETER VALUE Power supply voltage 3C (maximum) Output impedance 4C (maximum) Accuracy at 25C 10 mV/C Accuracy over -40C to 125C 4.5 V to 10 V Temperature slope 4 k (maximum) 8.2.1.2 Detailed Design Procedure The LM50 and LM50-Q1 are simple temperature sensors that provides an analog output. Therefore design requirements related to layout are more important than other requirements. See Layout for more information. 8.2.1.2.1 Capacitive Loads The LM50 and LM50-Q1 handle capacitive loading very well. Without any special precautions, the LM50 and LM50-Q1 can drive any capacitive load. The device has a nominal 2-k output impedance (shown in Functional Block Diagram). The temperature coefficient of the output resistors is around 1300 ppm/C. Taking into account this temperature coefficient and the initial tolerance of the resistors the output impedance of the device will not exceed 4 k. In an extremely noisy environment it may be necessary to add some filtering to minimize noise pickup. TI recommends adding a 0.1-F capacitor between +VS and GND to bypass the power supply voltage, Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM50 LM50-Q1 9 LM50, LM50-Q1 SNIS118G - JULY 1999 - REVISED JANUARY 2017 www.ti.com as shown in Figure 14. It may also be necessary to add a capacitor from VOUT to ground. A 1-F output capacitor with the 4-k output impedance will form a 40-Hz low-pass filter. Since the thermal time constant of the LM50 and LM50-Q1 is much slower than the 25-ms time constant formed by the RC, the overall response time of the device will not be significantly affected. For much larger capacitors this additional time lag will increase the overall response time of the LM50 and LM50-Q1. Heavy Capacitive Load, Wiring, Etc. LM50/ LM50-Q1 To A HighImpedance Load OUT Copyright (c) 2016, Texas Instruments Incorporated Figure 13. LM50 and LM50-Q1 No Decoupling Required for Capacitive Load Heavy Capacitive Load, Wiring, Etc. OUT LM50/ LM50-Q1 0.1 F Bypass Optional 1 F Copyright (c) 2016, Texas Instruments Incorporated Figure 14. LM50C and LM50-Q1 with Filter for Noisy Environment 8.2.1.3 Application Curve 2.00 Output Voltage (V) 1.75 1.50 1.750 1.25 0.750 1.00 0.75 0.50 0.100 VO = (+10 mV/C x T C) + 500 mV 0.25 0.00 50 25 0 25 50 75 100 125 DUT Temperature (C) 150 C001 Figure 15. Output Transfer Function 10 Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM50 LM50-Q1 LM50, LM50-Q1 www.ti.com SNIS118G - JULY 1999 - REVISED JANUARY 2017 8.3 System Examples Figure 16 to Figure 18 show application circuit examples using the LM50 or LM50-Q1 devices. Customers must fully validate and test any circuit before implementing a design based on an example in this section. Unless otherwise noted, the design procedures in Full-Range Centigrade Temperature Sensor are applicable. R3 V+ 5V + R4 R1 4.1 V VT LM50/ LM50-Q1 + U3 R2 0.1 F - IN REF VOUT U1 LM4040 3.9 k OUT 1.750 V GND LM7101 Serial Data Output ADC08031 100 k FB + LM4041ADJ CLOCK + V+ 1 F LM50/ LM50-Q1 ENABLE 10 k VTemp - U2 GND Copyright (c) 2016, Texas Instruments Incorporated Copyright (c) 2016, Texas Instruments Incorporated 125C full scale Figure 16. Centigrade Thermostat or Fan Controller Figure 17. Temperature To Digital Converter (Serial Output) 6V 6.8 K 1K fOUT 4N28 + 8 100 K 7 LM50/ LM50-Q1 5 LM131 6 GND 3 1 0.01 F 2 4 12 K 100 K 47 1 F FULL SCALE ADJ 0.01 F 5k Copyright (c) 2016, Texas Instruments Incorporated -40C to 125C; 100 Hz to 1750 Hz Figure 18. LM50 or LM50-Q1 With Voltage-To-Frequency Converter and Isolated Output Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM50 LM50-Q1 11 LM50, LM50-Q1 SNIS118G - JULY 1999 - REVISED JANUARY 2017 www.ti.com 9 Power Supply Recommendations In an extremely noisy environment, it may be necessary to add some filtering to minimize noise pickup. TI recommends that a 0.1-F capacitor be added from +VS to GND to bypass the power supply voltage, as shown in Figure 14. 10 Layout 10.1 Layout Guidelines The LM50 and LM50-Q1 can be applied easily in the same way as other integrated-circuit temperature sensors. The device can be glued or cemented to a surface and its temperature will be within about 0.2C of the surface temperature. This presumes that the ambient air temperature is almost the same as the surface temperature; if the air temperature were much higher or lower than the surface temperature, the actual temperature of the LM50 or LM50-Q1 die would be at an intermediate temperature between the surface temperature and the air temperature. To ensure good thermal conductivity the backside of the LM50 and LM50-Q1 die is directly attached to the GND pin. The lands and traces to the device will, of course, be part of the printed-circuit board, which is the object whose temperature is being measured. These printed-circuit board lands and traces will not cause the LM50 or LM50-Q1's temperature to deviate from the desired temperature. Alternatively, the LM50 and LM50-Q1 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LM50 and LM50-Q1 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy paints or dips are often used to ensure that moisture cannot corrode the device or its connections. 10.2 Layout Example +VS 1 3 VO GND 2 Via to ground plane Via to power plane Figure 19. PCB Layout 12 Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM50 LM50-Q1 LM50, LM50-Q1 www.ti.com SNIS118G - JULY 1999 - REVISED JANUARY 2017 Layout Example (continued) 1/2 in., square printed-circuit board with 2-oz foil or similar Figure 20. Printed-Circuit Board Used for Heat Sink to Generate Thermal Response Curves 10.3 Thermal Considerations Table 2 summarizes the thermal resistance of the LM50 and LM50-Q1 for different conditions. Table 2. Temperature Rise of LM50 and LM50-Q1 Due to Self-Heating RJA (C/W) Still air No heat sink (1) Moving air SOT-23 Small heat fin (2) (1) (2) 450 -- Still air 260 Moving air 180 Part soldered to 30 gauge wire. Heat sink used is 1/2-in., square printed-circuit board with 2-oz foil; part attached as shown in Figure 20. Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM50 LM50-Q1 13 LM50, LM50-Q1 SNIS118G - JULY 1999 - REVISED JANUARY 2017 www.ti.com 11 Device and Documentation Support 11.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to order now. Table 3. Related Links PARTS PRODUCT FOLDER ORDER NOW TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY Click here Click here Click here Click here Click here Click here Click here Click here Click here Click here LM50-Q1 11.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.4 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.6 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 14 Submit Documentation Feedback Copyright (c) 1999-2017, Texas Instruments Incorporated Product Folder Links: LM50 LM50-Q1 PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM50BIM3 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 150 T5B LM50BIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 T5B LM50BIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 T5B LM50CIM3 ACTIVE SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 125 T5C LM50CIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 T5C LM50CIM3X NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 150 T5C LM50CIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 T5C LM50QIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 T5Q LM50QIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 T5Q (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2017 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. 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OTHER QUALIFIED VERSIONS OF LM50, LM50-Q1 : * Catalog: LM50 * Automotive: LM50-Q1 NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Aug-2017 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) LM50BIM3 SOT-23 DBZ 3 1000 178.0 8.4 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.3 2.9 1.22 4.0 8.0 Q3 LM50BIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM50BIM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM50CIM3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM50CIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM50CIM3X SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM50CIM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM50QIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM50QIM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Aug-2017 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM50BIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM50BIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM50BIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM50CIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM50CIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM50CIM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM50CIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM50QIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM50QIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 Pack Materials-Page 2 4203227/C PACKAGE OUTLINE DBZ0003A SOT-23 - 1.12 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 2.64 2.10 1.4 1.2 PIN 1 INDEX AREA 1.12 MAX B A 0.1 C 1 0.95 3.04 2.80 1.9 3X 3 0.5 0.3 0.2 2 (0.95) C A B 0.25 GAGE PLANE 0 -8 TYP 0.10 TYP 0.01 0.20 TYP 0.08 0.6 TYP 0.2 SEATING PLANE 4214838/C 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-236, except minimum foot length. www.ti.com EXAMPLE BOARD LAYOUT DBZ0003A SOT-23 - 1.12 mm max height SMALL OUTLINE TRANSISTOR PKG 3X (1.3) 1 3X (0.6) SYMM 3 2X (0.95) 2 (R0.05) TYP (2.1) LAND PATTERN EXAMPLE SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4214838/C 04/2017 NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DBZ0003A SOT-23 - 1.12 mm max height SMALL OUTLINE TRANSISTOR PKG 3X (1.3) 1 3X (0.6) SYMM 3 2X(0.95) 2 (R0.05) TYP (2.1) SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:15X 4214838/C 04/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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