DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 1
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Features
• In-System Programmable PROMs for Configuration of
Xilinx® FPGAs
• Low-Power Advanced CMOS NOR Flash Process
• Endurance of 20,000 Program/Erase Cycles
• Operation over Full Industrial Temperature Range
(–40°C to +85°C)
• IEEE Standard 1149.1/1532 Boundary-Scan (JTAG)
Support for Programming, Prototyping, and Testing
• JTAG Command Initiation of Standard FPGA
Configuration
• Cascadable for Storing Longer or Multiple Bitstreams
• Dedicated Boundary-Scan (JTAG) I/O Power Supply (V
CCJ
)
• I/O Pins Compatible with Voltage Levels Ranging From
1.8V to 3.3V
• Design Support Using the Xilinx ISE® Alliance and
Foundation™ Software Packages
• XCF01S/XCF02S/XCF04S
• 3.3V Supply Voltage
• Serial FPGA Configuration Interface
• Available in Small-Footprint VO20 and VOG20
Packages
• XCF08P/XCF16P/XCF32P
• 1.8V Supply Voltage
• Serial or Parallel FPGA Configuration Interface
• Available in Small-Footprint VOG48, FS48, and
FSG48 Packages
• Design Revision Technology Enables Storing and
Accessing Multiple Design Revisions for
Configuration
• Built-In Data Decompressor Compatible with Xilinx
Advanced Compression Technology
Description
Xilinx introduces the Platform Flash series of in-system
programmable configuration PROMs. Available in
1 to 32 Mb densities, these PROMs provide an easy-to-use,
cost-effective, and reprogrammable method for storing large
Xilinx FPGA configuration bitstreams. The Platform Flash
PROM series includes both the 3.3V XCFxxS PROM and
the 1.8V XCFxxP PROM. The XCFxxS version includes
4 Mb, 2 Mb, and 1 Mb PROMs that support Master Serial
and Slave Serial FPGA configuration modes (Figure 1,
page 2). The XCFxxP version includes 32 Mb, 16 Mb, and
8 Mb PROMs that support Master Serial, Slave Serial,
Master SelectMAP, and Slave SelectMAP FPGA
configuration modes (Figure 2, page 2).
When driven from a stable, external clock, the PROMs can
output data at rates up to 33 MHz. Refer to "AC Electrical
Characteristics," page 16 for timing considerations.
A summary of the Platform Flash PROM family members
and supported features is shown in Ta bl e 1 .
35 Platform Flash In-System Programmable
Configuration PROMs
DS123 (v2.18) May 19, 2010 Product Specification
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Tabl e 1 : Platform Flash PROM Features
Device Density
(Mb)
VCCINT
(V)
VCCO Range
(V)
VCCJ Range
(V) Packages
Program In-system
via JTAG
Serial
Config.
Parallel
Config.
Design
Revisioning Compression
XCF01S 1 3.3 1.8 – 3.3 2.5 – 3.3 VO20/VOG20 33
XCF02S 2 3.3 1.8 – 3.3 2.5 – 3.3 VO20/VOG20 33
XCF04S 4 3.3 1.8 – 3.3 2.5 – 3.3 VO20/VOG20 33
XCF08P 8 1.8 1.8 – 3.3 2.5 – 3.3 VO48/VOG48
FS48/FSG48 3333
(1) 3
XCF16P 16 1.8 1.8 – 3.3 2.5 – 3.3 VO48/VOG48
FS48/FSG48 3333 3
XCF32P 32 1.8 1.8 – 3.3 2.5 – 3.3 VO48/VOG48
FS48/FSG48 3333 3
Notes:
1. XCF08P supports storage of a design revision only when cascaded with another XCFxxP PROM. See "Design Revisioning," page 8 for details.
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 2
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When the FPGA is in Master Serial mode, it generates a
configuration clock that drives the PROM. With CF High, a
short access time after CE and OE are enabled, data is
available on the PROM DATA (D0) pin that is connected to
the FPGA DIN pin. New data is available a short access
time after each rising clock edge. The FPGA generates the
appropriate number of clock pulses to complete the
configuration.
When the FPGA is in Slave Serial mode, the PROM and the
FPGA are both clocked by an external clock source, or
optionally, for the XCFxxP PROM only, the PROM can be
used to drive the FPGA’s configuration clock.
The XCFxxP version of the Platform Flash PROM also
supports Master SelectMAP and Slave SelectMAP (or
Slave Parallel) FPGA configuration modes. When the FPGA
is in Master SelectMAP mode, the FPGA generates a
configuration clock that drives the PROM. When the FPGA
is in Slave SelectMAP Mode, either an external oscillator
generates the configuration clock that drives the PROM and
the FPGA, or optionally, the XCFxxP PROM can be used to
drive the FPGA’s configuration clock. With BUSY Low and
CF High, after CE and OE are enabled, data is available on
the PROMs DATA (D0-D7) pins. New data is available a
short access time after each rising clock edge. The data is
clocked into the FPGA on the following rising edge of the
CCLK. A free-running oscillator can be used in the Slave
Parallel/Slave SelectMAP mode.
The XCFxxP version of the Platform Flash PROM provides
additional advanced features. A built-in data decompressor
supports utilizing compressed PROM files, and design
revisioning allows multiple design revisions to be stored on
a single PROM or stored across several PROMs. For design
revisioning, external pins or internal control bits are used to
select the active design revision.
Multiple Platform Flash PROM devices can be cascaded to
support the larger configuration files required when
targeting larger FPGA devices or targeting multiple FPGAs
daisy chained together. When utilizing the advanced
features for the XCFxxP Platform Flash PROM, such as
design revisioning, programming files which span cascaded
PROM devices can only be created for cascaded chains
containing only XCFxxP PROMs. If the advanced XCFxxP
features are not enabled, then the cascaded chain can
include both XCFxxP and XCFxxS PROMs.
X-Ref Target - Figure 1
Figure 1: XCFxxS Platform Flash PROM Block Diagram
X-Ref Target - Figure 2FI
Figure 2: XCFxxP Platform Flash PROM Block Diagram
Control
and
JTAG
Interface
Memory Serial
Interface
DATA (D0)
Serial Mode
Data
Address
CLK CE
TCK
TMS
TDI
TDO
OE/RESET
CEO
Data
ds123_01_30603
CF
CLKOUT
CEO
DATA (D0)
(Serial/Parallel Mode)
D[1:7]
(Parallel Mode)
TCK
TMS
TDI
TDO
CLK CE EN_EXT_SEL OE/RESET BUSY
Data
Data
Address
REV_SEL [1:0]
CF
Control
and
JTAG
Interface
Memory
OSC
Serial
or
Parallel
Interface
Decompressor
DS123_19_031908
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 3
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See UG161, Platform Flash PROM User Guide, for detailed
guidelines on PROM-to-FPGA configuration hardware
connections, for software usage, for a reference list of Xilinx
FPGAs, and for the respective compatible Platform Flash
PROMs. Ta b l e 2 lists the Platform Flash PROMs and their
capacities.
Programming
The Platform Flash PROM is a reprogrammable NOR flash
device (refer "Quality and Reliability Characteristics,"
page 14 for the program/erase specifications).
Reprogramming requires an erase followed by a program
operation. A verify operation is recommended after the
program operation to validate the correct transfer of data
from the programmer source to the Platform Flash PROM.
Several programming solutions are available.
In-System Programming
In-System Programmable PROMs can be programmed
individually, or two or more can be daisy-chained together
and programmed in-system via the standard 4-pin JTAG
protocol as shown in Figure 3.
In-system programming offers quick and efficient design
iterations and eliminates unnecessary package handling or
socketing of devices. The programming data sequence is
delivered to the device using either Xilinx iMPACT software
and a Xilinx download cable, a third-party JTAG
development system, a JTAG-compatible board tester, or a
simple microprocessor interface that emulates the JTAG
instruction sequence. The iMPACT software also outputs
serial vector format (SVF) files for use with any tools that
accept SVF format, including automatic test equipment.
During in-system programming, the CEO output is driven
High. All other outputs are held in a high-impedance state or
held at clamp levels during in-system programming. All
non-JTAG input pins are ignored during in-system
programming, including CLK, CE, CF, OE/RESET, BUSY,
EN_EXT_SEL, and REV_SEL[1:0]. In-system programming
is fully supported across the recommended operating
voltage and temperature ranges.
Embedded, in-system programming reference designs,
such as XAPP058, Xilinx In-System Programming Using an
Embedded Microcontroller, are available on the Xilinx web
page for PROM Programming and Data Storage Application
Notes. See UG161, Platform Flash PROM User Guide, for
an advanced update methodology that uses the Design
Revisioning feature in the Platform Flash XCFxxP PROMs.
OE/RESET
The 1/2/4 Mb XCFxxS Platform Flash PROMs in-system
programming algorithm results in issuance of an internal
device reset that causes OE/RESET to pulse Low.
External Programming
In traditional manufacturing environments, third-party
device programmers can program Platform Flash PROMs
with an initial memory image before the PROMs are
assembled onto boards. Contact a preferred third-party
programmer vendor for Platform Flash PROM support
information. A sample list of third-party programmer
vendors with Platform Flash PROM support is available on
the Xilinx web page for Third-Party Programmer Device
Support. See UG161, Platform Flash PROM User Guide,
for the PROM data file format required for programmers.
Pre-programmed PROMs can be assembled onto boards
using the typical soldering process guidelines in UG112,
Device Package User Guide. A pre-programmed PROM’s
memory image can be updated after board assembly using
an in-system programming solution.
Reliability and Endurance
Xilinx in-system programmable products provide a
guaranteed endurance level of 20,000 in-system
program-erase cycles and a minimum data retention of 20
years. Each device meets all functional, performance, and
data retention specifications within this endurance limit.
See UG116, Xilinx Device Reliability Report, for device
quality, reliability, and process node information.
Tabl e 2 : Platform Flash PROM Capacity
Platform
Flash PROM
Configuration
Bits
Platform
Flash PROM
Configuration
Bits
XCF01S 1,048,576 XCF08P 8,388,608
XCF02S 2,097,152 XCF16P 16,777,216
XCF04S 4,194,304 XCF32P 33,554,432
X-Ref Target - Figure 3
Figure 3: JTAG In-System Programming Operation
(a)SolderDevicetoPCB
(b) Program Using Download Cable
DS123_33_031908
GND
V
CC
(a) (b)
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 4
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Design Security
The Xilinx in-system programmable Platform Flash PROM
devices incorporate advanced data security features to fully
protect the FPGA programming data against unauthorized
reading via JTAG. The XCFxxP PROMs can also be
programmed to prevent inadvertent writing via JTAG.
Ta bl e 3 and Ta b l e 4 show the security settings available for
the XCFxxS PROM and XCFxxP PROM, respectively.
Read Protection
The read protect security bit can be set by the user to
prevent the internal programming pattern from being read or
copied via JTAG. Read protection does not prevent write
operations. For the XCFxxS PROM, the read protect
security bit is set for the entire device, and resetting the read
protect security bit requires erasing the entire device. For
the XCFxxP PROM the read protect security bit can be set
for individual design revisions, and resetting the read
protect bit requires erasing the particular design revision.
Write Protection
The XCFxxP PROM device also allows the user to write
protect (or lock) a particular design revision or PROM option
settings. Write protection helps to prevent an inadvertent
JTAG instruction from modifying an area by write protecting
the area and by locking the erase instruction. The write-
protection setting can be cleared by erasing the protected
area. However, an XSC_UNLOCK instruction must first be
issued to the XCFxxP PROM to unlock the ISC_ERASE
instruction. Refer to the XCFxxP PROM BSDL file for the
XSC_UNLOCK and ISC_ERASE instructions.
Caution! The iMPACT software always issues a
XSC_UNLOCK when performing an Erase operation on an
XCFxxP PROM and, thus, always unlocks the write
protection.
Table 3: XCFxxS Device Data Security Options
Read Protect Read/Verify
Inhibited
Program
Inhibited
Erase
Inhibited
Reset (default)
Set 3
Tabl e 4 : XCFxxP Design Revision Data Security Options
Read Protect Write Protect Read/Verify
Inhibited Program Inhibited Erase Inhibited
Reset (default) Reset (default)
Reset (default) Set 33
Set Reset (default) 3
Set Set 333
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 5
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IEEE 1149.1 Boundary-Scan (JTAG)
The Platform Flash PROM family is compatible with the IEEE
1149.1 Boundary-Scan standard and the IEEE 1532 in-
system configuration standard. A Test Access Port (TAP) and
registers are provided to support all required Boundary-Scan
instructions, as well as many of the optional instructions
specified by IEEE Std. 1149.1. In addition, the JTAG interface
is used to implement in-system programming (ISP) to facilitate
configuration, erasure, and verification operations on the
Platform Flash PROM device. Table 5 lists the required and
optional Boundary-Scan instructions supported in the
Platform Flash PROMs. Refer to the IEEE Std. 1149.1
specification for a complete description of Boundary-Scan
architecture and the required and optional instructions.
Caution! The XCFxxP JTAG TAP pause states are not fully
compliant with the JTAG 1149.1 specification. If a temporary
pause of a JTAG shift operation is required, then stop the
JTAG TCK clock and maintain the JTAG TAP within the JTAG
Shift-IR or Shift-DR TAP state. Do not transition the XCFxxP
JTAG TAP through the JTAG Pause-IR or Pause-DR TAP state
to temporarily pause a JTAG shift operation.
Instruction Register
The Instruction Register (IR) for the Platform Flash PROM
is connected between TDI and TDO during an instruction
scan sequence. In preparation for an instruction scan
sequence, the instruction register is parallel loaded with a
fixed instruction capture pattern. This pattern is shifted out
onto TDO (LSB first), while an instruction is shifted into the
instruction register from TDI.
XCFxxS Instruction Register (8 bits wide)
The Instruction Register (IR) for the XCFxxS PROM is eight
bits wide and is connected between TDI and TDO during an
instruction scan sequence. The detailed composition of the
instruction capture pattern is illustrated in Table6, page6.
The instruction capture pattern shifted out of the XCFxxS
device includes IR[7:0]. IR[7:5] are reserved bits and are set
to a logic 0. The ISC Status field, IR[4], contains logic 1 if
the device is currently in In-System Configuration (ISC)
mode; otherwise, it contains logic 0. The Security field,
IR[3], contains logic 1 if the device has been programmed
with the security option turned on; otherwise, it contains
logic 0. IR[2] is unused, and is set to '0'. The remaining bits
IR[1:0] are set to '01' as defined by IEEE Std. 1149.1.
XCFxxP Instruction Register (16 bits wide)
The Instruction Register (IR) for the XCFxxP PROM is sixteen
bits wide and is connected between TDI and TDO during an
instruction scan sequence. The detailed composition of the
instruction capture pattern is illustrated in Table 7, page 6.
The instruction capture pattern shifted out of the XCFxxP
device includes IR[15:0]. IR[15:9] are reserved bits and are set
to a logic 0. The ISC Error field, IR[8:7], contains a 10 when an
ISC operation is a success; otherwise a 01 when an In-System
Configuration (ISC) operation fails. The Erase/Program
(ER/PROG) Error field, IR[6:5], contains a 10 when an erase
or program operation is a success; otherwise a 01 when an
erase or program operation fails. The Erase/Program
(ER/PROG) Status field, IR[4], contains a logic 0 when the
device is busy performing an erase or programming operation;
otherwise, it contains a logic 1. The ISC Status field, IR[3],
contains logic 1 if the device is currently in In-System
Configuration (ISC) mode; otherwise, it contains logic 0. The
DONE field, IR[2], contains logic 1 if the sampled design
revision has been successfully programmed; otherwise, a logic
0 indicates incomplete programming. The remaining bits
IR[1:0] are set to 01 as defined by IEEE Std. 1149.1.
Tabl e 5 : Platform Flash PROM Boundary-Scan Instructions
Boundary-Scan Command XCFxxS IR[7:0]
(hex)
XCFxxP IR[15:0]
(hex) Instruction Description
Required Instructions
BYPASS FF FFFF Enables BYPASS
SAMPLE/PRELOAD 01 0001 Enables Boundary-Scan SAMPLE/PRELOAD operation
EXTEST 00 0000 Enables Boundary-Scan EXTEST operation
Optional Instructions
CLAMP FA 00FA Enables Boundary-Scan CLAMP operation
HIGHZ FC 00FC Places all outputs in high-impedance state simultaneously
IDCODE FE 00FE Enables shifting out 32-bit IDCODE
USERCODE FD 00FD Enables shifting out 32-bit USERCODE
Platform Flash PROM Specific Instructions
CONFIG EE 00EE
Initiates FPGA configuration by pulsing CF pin Low once.
(For the XCFxxP this command also resets the selected
design revision based on either the external REV_SEL[1:0]
pins or on the internal design revision selection bits.)(1)
Notes:
1. For more information see "Initiating FPGA Configuration," page 10.
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 6
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Boundary-Scan Register
The Boundary-Scan register is used to control and observe
the state of the device pins during the EXTEST,
SAMPLE/PRELOAD, and CLAMP instructions. Each output
pin on the Platform Flash PROM has two register stages which
contribute to the Boundary-Scan register, while each input pin
has only one register stage. The bidirectional pins have a total
of three register stages which contribute to the Boundary-Scan
register. For each output pin, the register stage nearest to TDI
controls and observes the output state, and the second stage
closest to TDO controls and observes the High-Z enable state
of the output pin. For each input pin, a single register stage
controls and observes the input state of the pin. The
bidirectional pin combines the three bits, the input stage bit is
first, followed by the output stage bit and finally the output
enable stage bit. The output enable stage bit is closest to TDO.
See Table 12, page 24 and Table 13, page 26 for the
Boundary-Scan bit order for all connected device pins, or see
the appropriate BSDL file for the complete Boundary-Scan bit
order description under the “attribute
BOUNDARY_REGISTER” section in the BSDL file. The bit
assigned to Boundary-Scan cell 0 is the LSB in the Boundary-
Scan register, and is the register bit closest to TDO.
Identification Registers
IDCODE Register
The IDCODE is a fixed, vendor-assigned value that is used to
electrically identify the manufacturer and type of the device
being addressed. The IDCODE register is 32 bits wide. The
IDCODE register can be shifted out for examination by using
the IDCODE instruction. The IDCODE is available to any
other system component via JTAG. Tabl e 8 lists the IDCODE
register values for the Platform Flash PROMs.
The IDCODE register has the following binary format:
vvvv:ffff:ffff:aaaa:aaaa:cccc:cccc:ccc1
where
v = the die version number
f = the PROM family code
a = the specific Platform Flash PROM product ID
c = the Xilinx manufacturer's ID
The LSB of the IDCODE register is always read as logic 1
as defined by IEEE Std. 1149.1.
USERCODE Register
The USERCODE instruction gives access to a 32-bit user
programmable scratch pad typically used to supply
information about the device's programmed contents. By
using the USERCODE instruction, a user-programmable
identification code can be shifted out for examination. This
code is loaded into the USERCODE register during
programming of the Platform Flash PROM. If the device is
blank or was not loaded during programming, the
USERCODE register contains FFFFFFFFh.
Customer Code Register
For the XCFxxP Platform Flash PROM, in addition to the
USERCODE, a unique 32-byte Customer Code can be
assigned to each design revision enabled for the PROM.
The Customer Code is set during programming, and is
typically used to supply information about the design
revision contents. A private JTAG instruction is required to
read the Customer Code. If the PROM is blank, or the
Customer Code for the selected design revision was not
loaded during programming, or if the particular design
revision is erased, the Customer Code contains all ones.
Tabl e 6 : XCFxxS Instruction Capture Values Loaded into IR as part of an Instruction Scan Sequence
TDI → IR[7:5] IR[4] IR[3] IR[2] IR[1:0] → TDO
Reserved ISC Status Security 0 0 1
Tabl e 7 : XCFxxP Instruction Capture Values Loaded into IR as part of an Instruction Scan Sequence
TDI →
IR[15:9] IR[8:7] IR[6:5] IR[4] IR[3] IR[2] IR[1:0]
→ TDO
Reserved ISC Error ER/PROG
Error
ER/PROG
Status ISC Status DONE 0 1
Table 8: IDCODES Assigned to Platform Flash PROMs
Device IDCODE(1) (hex)
XCF01S <v>5044093
XCF02S <v>5045093
XCF04S <v>5046093
XCF08P <v>5057093
XCF16P <v>5058093
XCF32P <v>5059093
Notes:
1. The <v> in the IDCODE field represents the device’s revision
code (in hex) and can vary.
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 7
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Platform Flash PROM TAP Characteristics
The Platform Flash PROM family performs both in-system
programming and IEEE 1149.1 Boundary-Scan (JTAG) testing
via a single 4-wire Test Access Port (TAP). This simplifies
system designs and allows standard Automatic Test
Equipment to perform both functions. The AC characteristics
of the Platform Flash PROM TAP are described as follows.
TAP Timing
Figure 4 shows the timing relationships of the TAP signals.
These TAP timing characteristics are identical for both
Boundary-Scan and ISP operations.
TAP AC Parameters
Ta bl e 9 shows the timing parameters for the TAP waveforms shown in Figure 4.
X-Ref Target - Figure 4
Figure 4: Test Access Port Timing
Tabl e 9 : Test Access Port Timing Parameters
Symbol Description Min Max Units
TCKMIN TCK minimum clock period when VCCJ = 2.5V or 3.3V 67 – ns
TMSS TMS setup time when VCCJ = 2.5V or 3.3V 8 – ns
TMSH TMS hold time when VCCJ = 2.5V or 3.3V 25 – ns
TDIS TDI setup time when VCCJ = 2.5V or 3.3V 8 – ns
TDIH TDI hold time when VCCJ = 2.5V or 3.3V 25 – ns
TDOV TDO valid delay when VCCJ = 2.5V or 3.3V – 22 ns
TCK
TCKMIN
TMSS
TMS
TDI
TDO
TMSH
T
DIH
TDOV
TDIS
DS123_04_031808
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 8
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Additional Features for the XCFxxP
Internal Oscillator
The 8/16/32 Mb XCFxxP Platform Flash PROMs include an
optional internal oscillator which can be used to drive the
CLKOUT and DATA pins on FPGA configuration interface.
The internal oscillator can be enabled when programming
the PROM, and the oscillator can be set to either the default
frequency or to a slower frequency. Refer to the “XCFxxP
Decompression and Clock Options” chapter of UG161,
Platform Flash PROM User Guide, for internal oscillator
recommendations.
CLKOUT
The 8/16/32 Mb XCFxxP Platform Flash PROMs include the
programmable option to enable the CLKOUT signal which
allows the PROM to provide a source synchronous clock
aligned to the data on the configuration interface. The
CLKOUT signal is derived from one of two clock sources: the
CLK input pin or the internal oscillator. The input clock source
is selected during the PROM programming sequence. Output
data is available on the rising edge of CLKOUT.
The CLKOUT signal is enabled during programming, and is
active when CE is Low and OE/RESET is High. On CE
rising edge transition, if OE/RESET is High and the PROM
terminal count has not been reached, then CLKOUT
remains active for an additional eights clock cycles before
being disabled. On a OE/RESET falling edge transition,
CLKOUT is immediately disabled. When disabled, the
CLKOUT pin is put into a high-impedance state and should
be pulled High externally to provide a known state.
When cascading Platform Flash PROMs with CLKOUT
enabled, after completing it's data transfer, the first PROM
disables CLKOUT and drives the CEO pin enabling the next
PROM in the PROM chain. The next PROM begins driving
the CLKOUT signal once that PROM is enabled and data is
available for transfer.
During high-speed parallel configuration without
compression, the FPGA drives the BUSY signal on the
configuration interface. When BUSY is asserted High, the
PROMs internal address counter stops incrementing, and
the current data value is held on the data outputs. While
BUSY is High, the PROM continues driving the CLKOUT
signal to the FPGA, clocking the FPGA’s configuration logic.
When the FPGA deasserts BUSY, indicating that it is ready
to receive additional configuration data, the PROM begins
driving new data onto the configuration interface.
Decompression
The 8/16/32 Mb XCFxxP Platform Flash PROMs include a
built-in data decompressor compatible with Xilinx advanced
compression technology. Compressed Platform Flash
PROM files are created from the target FPGA bitstream(s)
using the iMPACT software. Only Slave Serial and Slave
SelectMAP (parallel) configuration modes are supported for
FPGA configuration when using a XCFxxP PROM
programmed with a compressed bitstream. Compression
rates vary depending on several factors, including the target
device family and the target design contents.
The decompression option is enabled during the PROM
programming sequence. The PROM decompresses the
stored data before driving both clock and data onto the
FPGA's configuration interface. If Decompression is
enabled, then the Platform Flash clock output pin
(CLKOUT) must be used as the clock signal for the
configuration interface, driving the target FPGA's
configuration clock input pin (CCLK). Either the PROM's
CLK input pin or the internal oscillator must be selected as
the source for CLKOUT. Any target FPGA connected to the
PROM must operate as slave in the configuration chain,
with the configuration mode set to Slave Serial mode or
Slave SelectMap (parallel) mode.
When decompression is enabled, the CLKOUT signal
becomes a controlled clock output with a reduced maximum
frequency. When decompressed data is not ready, the
CLKOUT pin is put into a high-Z state and must be pulled
High externally to provide a known state.
The BUSY input is automatically disabled when
decompression is enabled.
See the "Decompression Setups" section in the Platform
Flash PROM User Guide for setup details.
Design Revisioning
Design Revisioning allows the user to create up to four
unique design revisions on a single PROM or stored across
multiple cascaded PROMs. Design Revisioning is supported
for the 8/16/32 Mb XCFxxP Platform Flash PROMs in both
serial and parallel modes. Design Revisioning can be used
with compressed PROM files, and also when the CLKOUT
feature is enabled. The PROM programming files along with
the revision information files (.cfi) are created using the
iMPACT software. The .cfi file is required to enable design
revision programming in iMPACT.
A single design revision is composed of from 1 to n 8Mb
memory blocks. If a single design revision contains less
than 8 Mb of data, then the remaining space is padded with
all ones. A larger design revision can span several 8 Mb
memory blocks, and any space remaining in the last 8 Mb
memory block is padded with all ones.
• A single 32 Mb PROM contains four 8 Mb memory
blocks, and can therefore store up to four separate
design revisions: one 32 Mb design revision, two 16 Mb
design revisions, three 8 Mb design revisions, four
8 Mb design revisions, and so on.
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 9
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• Because of the 8 Mb minimum size requirement for
each revision, a single 16 Mb PROM can only store up
to two separate design revisions: one 16 Mb design
revision, one 8 Mb design revision, or two 8 Mb design
revisions.
• A single 8 Mb PROM can store only one 8 Mb design
revision.
Larger design revisions can be split over several cascaded
PROMs. For example, two 32 Mb PROMs can store up to four
separate design revisions: one 64 Mb design revision, two
32 Mb design revisions, three 16 Mb design revisions, four
16 Mb design revisions, and so on. When cascading one
16 Mb PROM and one 8 Mb PROM, there are 24 Mb of
available space, and therefore up to three separate design
revisions can be stored: one 24 Mb design revision, two 8 Mb
design revisions, or three 8 Mb design revisions.
See Figure 5 for a few basic examples of how multiple
revisions can be stored. The design revision partitioning is
handled automatically during file generation in iMPACT.
During the PROM file creation, each design revision is
assigned a revision number:
Revision 0 = '00'
Revision 1 = '01'
Revision 2 = '10'
Revision 3 = '11'
After programming the Platform Flash PROM with a set of
design revisions, a particular design revision can be
selected using the external REV_SEL[1:0] pins or using the
internal programmable design revision control bits. The
EN_EXT_SEL pin determines if the external pins or internal
bits are used to select the design revision. When
EN_EXT_SEL is Low, design revision selection is controlled
by the external Revision Select pins, REV_SEL[1:0]. When
EN_EXT_SEL is High, design revision selection is
controlled by the internal programmable Revision Select
control bits. During power up, the design revision selection
inputs (pins or control bits) are sampled internally. After
power up, the design revision selection inputs are sampled
again when any of the following events occur:
• On the rising edge of CE.
• On the falling edge of OE/RESET (when CE is Low).
• On the rising edge of CF (when CE is Low).
• When reconfiguration is initiated by using the JTAG
CONFIG instruction.
The data from the selected design revision is then
presented on the FPGA configuration interface.
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 10
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Initiating FPGA Configuration
The options for initiating FPGA configuration via the
Platform Flash PROM include:
• Automatic configuration on power up
• Applying an external pulse to the FPGA PROGRAM_B
pin
• Applying the JTAG CONFIG instruction to the PROM
Following the FPGA’s power-on sequence or the assertion
of the PROGRAM_B pin, the FPGA’s configuration memory
is cleared, the configuration mode is selected, and the
FPGA is ready to accept a new configuration bitstream. The
FPGA’s PROGRAM_B pin can be controlled by an external
source, or alternatively, the Platform Flash PROMs
incorporate a CF pin that can be tied to the FPGA’s
PROGRAM_B pin. Executing the CONFIG instruction
through JTAG pulses the CF output Low once for
300-500 ns, resetting the FPGA and initiating configuration.
The iMPACT software can issue the JTAG CONFIG
command to initiate FPGA configuration by setting the
“Load FPGA” option.
When using the XCFxxP Platform Flash PROM with design
revisioning enabled, the CF pin should always be connected
to the PROGRAM_B pin on the FPGA to ensure that the
current design revision selection is sampled when the
FPGA is reset. The XCFxxP PROM samples the current
design revision selection from the external REV_SEL pins
or the internal programmable Revision Select bits on the
rising edge of CF
. When the JTAG CONFIG command is
executed, the XCFxxP samples the new design revision
selection before initiating the FPGA configuration
sequence. When using the XCFxxP Platform Flash PROM
without design revisioning, if the CF pin is not connected to
the FPGA PROGRAM_B pin, then the XCFxxP CF pin must
be tied High.
X-Ref Target - Figure 5
Figure 5: Design Revision Storage Examples
REV 0
(8 Mbits)
REV 1
(8 Mbits)
REV 2
(8 Mbits)
REV 3
(8 Mbits)
REV 0
(8 Mbits)
REV 1
(8 Mbits)
REV 2
(16 Mbits)
REV 0
(16 Mbits)
REV 1
(16 Mbits)
REV 0
(8 Mbits)
REV 1
(24 Mbits)
REV 0
(32 Mbits)
4 Design Revisions 3 Design Revisions 2 Design Revisions 1 Design Revision
(a) Design Revision storage examples for a single XCF32P PROM
REV 0
(16 Mbits)
REV 1
(16 Mbits)
REV 2
(16 Mbits)
REV 3
(16 Mbits)
REV 0
(16 Mbits)
REV 1
(16 Mbits)
REV 2
(32 Mbits)
REV 0
(32 Mbits)
REV 1
(32 Mbits)
REV 0
(16 Mbits)
REV 1
(16 Mbits)
REV 0
(32 Mbits)
4 Design Revisions 3 Design Revisions 2 Design Revisions 1 Design Revision
(b) Design Revision storage examples spanning two XCF32P PROMs
PROM 0 PROM 0 PROM 0 PROM 0 PROM 0
PROM 0 PROM 0 PROM 0 PROM 0 PROM 0
REV 0
(32 Mbits)
REV 1
(32 Mbits)
PROM 1 PROM 1 PROM 1 PROM 1 PROM 1
ds123_20_102103
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 11
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Reset and Power-On Reset Activation
At power up, the device requires the VCCINT power supply to
monotonically rise to the nominal operating voltage within
the specified VCCINT rise time. If the power supply cannot
meet this requirement, then the device might not perform
power-on reset properly. During the power-up sequence,
OE/RESET is held Low by the PROM. Once the required
supplies have reached their respective POR (Power On
Reset) thresholds, the OE/RESET release is delayed (TOER
minimum) to allow more margin for the power supplies to
stabilize before initiating configuration. The OE/RESET pin
is connected to an external 4.7 kΩ pull-up resistor and also
to the target FPGA's INIT pin. For systems utilizing slow-
rising power supplies, an additional power monitoring circuit
can be used to delay the target configuration until the
system power reaches minimum operating voltages by
holding the OE/RESET pin Low. When OE/RESET is
released, the FPGA’s INIT pin is pulled High allowing the
FPGA's configuration sequence to begin. If the power drops
below the power-down threshold (VCCPD), the PROM resets
and OE/RESET is again held Low until the after the POR
threshold is reached. OE/RESET polarity is not
programmable. These power-up requirements are shown
graphically in Figure 6.
For a fully powered Platform Flash PROM, a reset occurs
whenever OE/RESET is asserted (Low) or CE is deasserted
(High). The address counter is reset, CEO is driven High, and
the remaining outputs are placed in a high-impedance state.
Note:
1. The XCFxxS PROM only requires VCCINT to rise above
its POR threshold before releasing OE/RESET.
2. The XCFxxP PROM requires both VCCINT to rise above its
POR threshold and for VCCO to reach the recommended
operating voltage level before releasing OE/RESET.
I/O Input Voltage Tolerance and Power Sequencing
The I/Os on each re-programmable Platform Flash PROM
are fully 3.3V-tolerant. This allows 3V CMOS signals to
connect directly to the inputs without damage. The core
power supply (VCCINT), JTAG pin power supply (VCCJ),
output power supply (VCCO), and external 3V CMOS I/O
signals can be applied in any order.
Additionally, for the XCFxxS PROM only, when VCCO is
supplied at 2.5V or 3.3V and VCCINT is supplied at 3.3V, the
I/Os are 5V-tolerant. This allows 5V CMOS signals to
connect directly to the inputs on a powered XCFxxS PROM
without damage. Failure to power the PROM correctly while
supplying a 5V input signal can result in damage to the
XCFxxS device.
X-Ref Target - Figure 6
Figure 6: Platform Flash PROM Power-Up Requirements
TOER
VCCINT
VCCPOR
VCCPD
200 µs ramp 50 ms ramp
TOER TRST
TIME (ms)
A slow-ramping VCCINT supply may still
be below the minimum operating
voltage when OE/RESET is released.
In this case, the configuration
sequence must be delayed until both
VCCINT and VCCO have reached their
recommended operating conditions.
Recommended Operating Range
Delay or Restart
Configuration
ds123_21_103103
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 12
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Standby Mode
The PROM enters a low-power standby mode whenever CE is
deasserted (High). In standby mode, the address counter is
reset, CEO is driven High, and the remaining outputs are
placed in a high-impedance state regardless of the state of the
OE/RESET input. For the device to remain in the low-power
standby mode, the JTAG pins TMS, TDI, and TDO must not be
pulled Low, and TCK must be stopped (High or Low).
When using the FPGA DONE signal to drive the PROM CE
pin High to reduce standby power after configuration, an
external pull-up resistor should be used. Typically a 330Ω
pull-up resistor is used, but refer to the appropriate FPGA
data sheet for the recommended DONE pin pull-up value. If
the DONE circuit is connected to an LED to indicate FPGA
configuration is complete, and is also connected to the
PROM CE pin to enable low-power standby mode, then an
external buffer should be used to drive the LED circuit to
ensure valid transitions on the PROM’s CE pin. If low-power
standby mode is not required for the PROM, then the CE pin
should be connected to ground.
Tabl e 1 0 : Truth Table for XCFxxS PROM Control Inputs
Control Inputs Internal Address Outputs
OE/RESET CE DATA CEO ICC
High Low If address < TC(2) : increment Active High Active
If address = TC(2) : don't change High-Z Low Reduced
Low Low Held reset High-Z High Active
X(1) High Held reset High-Z High Standby
Notes:
1. X = don’t care.
2. TC = Terminal Count = highest address value.
Tabl e 1 1 : Truth Table for XCFxxP PROM Control Inputs
Control Inputs Internal Address Outputs
OE/RESET CE CF BUSY(5) DATA CEO CLKOUT ICC
High Low High Low
If address < TC(2) and
address < EA(3) : increment Active High Active Active
If address < TC(2) and
address = EA(3) : don't change High-Z High High-Z Reduced
Else
If address = TC(2) : don't change High-Z Low High-Z Reduced
High Low High High Unchanged Active and
Unchanged High Active Active
High Low ↑X(1) Reset(4) Active High Active Active
Low Low X X Held reset(4) High-Z High High-Z Active
X High X X Held reset(4) High-Z High High-Z Standby
Notes:
1. X = don’t care.
2. TC = Terminal Count = highest address value.
3. For the XCFxxP with Design Revisioning enabled, EA = end address (last address in the selected design revision).
4. For the XCFxxP with Design Revisioning enabled, Reset = address reset to the beginning address of the selected bank. If Design
Revisioning is not enabled, then Reset = address reset to address 0.
5. The BUSY input is only enabled when the XCFxxP is programmed for parallel data output and decompression is not enabled.
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 13
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DC Electrical Characteristics
Absolute Maximum Ratings
Supply Voltage Requirements for Power-On Reset and Power-Down
Symbol Description XCF01S, XCF02S,
XCF04S
XCF08P, XCF16P,
XCF32P Units
VCCINT Internal supply voltage relative to GND –0.5 to +4.0 –0.5 to +2.7 V
VCCO I/O supply voltage relative to GND –0.5 to +4.0 –0.5 to +4.0 V
VCCJ JTAG I/O supply voltage relative to GND –0.5 to +4.0 –0.5 to +4.0 V
VIN Input voltage with respect to GND VCCO < 2.5V –0.5 to +3.6 –0.5 to +3.6 V
VCCO ≥ 2.5V –0.5 to +5.5 –0.5 to +3.6 V
VTS Voltage applied to High-Z output VCCO < 2.5V –0.5 to +3.6 –0.5 to +3.6 V
VCCO ≥ 2.5V –0.5 to +5.5 –0.5 to +3.6 V
TSTG Storage temperature (ambient) –65 to +150 –65 to +150 °C
TJJunction temperature +125 +125 °C
Notes:
1. Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During transitions, the device
pins can undershoot to –2.0V or overshoot to +7.0V, provided this overshoot or undershoot lasts less then 10 ns and with the forcing current
being limited to 200 mA.
2. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied.
Exposure to Absolute Maximum Ratings conditions for extended periods of time adversely affects device reliability.
3. For soldering guidelines, see the information on "Packaging and Thermal Characteristics" at www.xilinx.com.
Symbol Description
XCF01S, XCF02S,
XCF04S
XCF08P, XCF16P,
XCF32P Units
Min Max Min Max
TVCC VCCINT rise time from 0V to nominal voltage(2) 0.2500.250ms
VCCPOR POR threshold for the VCCINT supply 1 – 0.5 – V
TOER OE/RESET release delay following POR(3) 0.5 3 0.5 30 ms
VCCPD Power-down threshold for VCCINT supply – 1 – 0.5 V
TRST Time required to trigger a device reset when the VCCINT
supply drops below the maximum VCCPD threshold 10 – 10 – ms
Notes:
1. VCCINT
, VCCO, and VCCJ supplies can be applied in any order.
2. At power up, the device requires the VCCINT power supply to monotonically rise to the nominal operating voltage within the specified TVCC rise
time. If the power supply cannot meet this requirement, then the device might not perform power-on-reset properly. See Figure 6, page 11.
3. If the VCCINT and VCCO supplies do not reach their respective recommended operating conditions before the OE/RESET pin is released,
then the configuration data from the PROM is not available at the recommended threshold levels. The configuration sequence must be
delayed until both VCCINT and VCCO have reached their recommended operating conditions.
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 14
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Recommended Operating Conditions
Quality and Reliability Characteristics
Symbol Description XCF01S, XCF02S, XCF04S XCF08P, XCF16P, XCF32P Units
Min Typ Max Min Typ Max
VCCINT Internal voltage supply 3.0 3.3 3.6 1.65 1.8 2.0 V
VCCO Supply voltage
for output
drivers
3.3V Operation 3.0 3.3 3.6 3.0 3.3 3.6 V
2.5V Operation 2.3 2.5 2.7 2.3 2.5 2.7 V
1.8V Operation 1.7 1.8 1.9 1.7 1.8 1.9 V
VCCJ Supply voltage
for JTAG output
drivers
3.3V Operation 3.0 3.3 3.6 3.0 3.3 3.6 V
2.5V Operation 2.3 2.5 2.7 2.3 2.5 2.7 V
VIL
Low-level input
voltage
3.3V Operation 0 – 0.8 0 – 0.8 V
2.5V Operation 0 – 0.7 0 – 0.7 V
1.8V Operation – – 20% VCCO ––20% V
CCO V
VIH
High-level input
voltage
3.3V Operation 2.0 – 5.5 2.0 – 3.6 V
2.5V Operation 1.7 – 5.5 1.7 – 3.6 V
1.8V Operation 70% VCCO – 3.6 70% VCCO –3.6V
TIN Input signal transition time(1) – –500– –500ns
VOOutput voltage 0 – VCCO 0–V
CCO V
TAOperating ambient temperature –40 – 85 –40 – 85 °C
Notes:
1. Input signal transition time measured between 10% VCCO and 90% VCCO.
Symbol Description Min Max Units
TDR Data retention 20 – Years
NPE Program/erase cycles (Endurance) 20,000 – Cycles
VESD Electrostatic discharge (ESD) 2,000 – Volts
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 15
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DC Characteristics Over Operating Conditions
Symbol Description
XCF01S, XCF02S,
XCF04S
XCF08P, XCF16P,
XCF32P Units
Test
Conditions Min Max Test
Conditions Min Max
VOH
High-level output voltage for 3.3V outputs IOH = –4 mA 2.4 – IOH = –4 mA 2.4 – V
High-level output voltage for 2.5V outputs IOH = –500 µAVCCO
– 0.4 –I
OH = –500 µAVCCO
– 0.4 –V
High-level output voltage for 1.8V outputs IOH = –50 µAVCCO
– 0.4 –I
OH = –50 µAVCCO
– 0.4 –V
VOL
Low-level output voltage for 3.3V outputs IOL = 4 mA – 0.4 IOL = 4 mA – 0.4 V
Low-level output voltage for 2.5V outputs IOL = 500 µA–0.4I
OL = 500 µA–0.4 V
Low-level output voltage for 1.8V outputs IOL = 50 µA–0.4I
OL = 50 µA–0.4 V
ICCINT Internal voltage supply current, active mode 33 MHz – 10 33 MHz – 10 mA
ICCO(1) Output driver supply current, active serial mode 33 MHz – 10 33 MHz – 10 mA
Output driver supply current, active parallel mode – – – 33 MHz – 40 mA
ICCJ JTAG supply current, active mode Note (2) – 5 Note (2) – 5 mA
ICCINTS Internal voltage supply current, standby mode Note (3) – 5 Note (3) – 1 mA
ICCOS Output driver supply current, standby mode Note (3) – 1 Note (3) – 1 mA
ICCJS JTAG supply current, standby mode Note (3) – 1 Note (3) – 1 mA
IILJ JTAG pins TMS, TDI, and TDO pull-up current VCCJ = max
VIN = GND –100
VCCJ = max
VIN = GND –100 µA
IIL Input leakage current
VCCINT = max
VCCO = max
VIN = GND or
VCCO
–10 10
VCCINT = max
VCCO = max
VIN = GND or
VCCO
–10 10 µA
IIH Input and output High-Z leakage current
VCCINT = max
VCCO = max
VIN = GND or
VCCO
–10 10
VCCINT = max
VCCO = max
VIN = GND or
VCCO
–10 10 µA
IILP
Source current through internal pull-ups on
EN_EXT_SEL, REV_SEL0, REV_SEL1 –––
VCCINT = max
VCCO = max
VIN = GND or
VCCO
–100 µA
IIHP Sink current through internal pull-down on BUSY – – –
VCCINT = max
VCCO = max
VIN = GND or
VCCO
–100 – µA
CIN Input capacitance VIN = GND
f = 1.0 MHz –8VIN = GND
f = 1.0 MHz –8 pF
COUT Output capacitance VIN = GND
f = 1.0 MHz –14VIN = GND
f = 1.0 MHz –14 pF
Notes:
1. Output driver supply current specification based on no load conditions.
2. TDI/TMS/TCK non-static (active).
3. CE High, OE Low, and TMS/TDI/TCK static.
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 16
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AC Electrical Characteristics
AC Characteristics Over Operating Conditions
XCFxxS and XCFxxP PROM as Configuration Slave with CLK Input Pin as Clock Source
X-Ref Target - Figure 7
Symbol Description
XCF01S, XCF02S,
XCF04S
XCF08P, XCF16P,
XCF32P Units
Min Max Min Max
THCF
CF hold time to guarantee design revision selection is
sampled when VCCO = 3.3V or 2.5V(9) 300 300 ns
CF hold time to guarantee design revision selection is
sampled when VCCO = 1.8V(9) 300 300 ns
TCF
CF to data delay when VCCO = 3.3V or 2.5V(8) –––25ns
CF to data delay when VCCO = 1.8V(8) –––25ns
TOE
OE/RESET to data delay(6) when VCCO = 3.3V or 2.5V – 10 – 25 ns
OE/RESET to data delay(6) when VCCO = 1.8V –30–25ns
TCE
CE to data delay(5) when VCCO = 3.3V or 2.5V – 15 – 25 ns
CE to data delay(5) when VCCO = 1.8V –30–25ns
TCAC
CLK to data delay(7) when VCCO = 3.3V or 2.5V – 15 – 25 ns
CLK to data delay(7) when VCCO = 1.8V –30–25ns
TOH
Data hold from CE, OE/RESET, CLK, or CF
when VCCO = 3.3V or 2.5V(8) 0–5–ns
Data hold from CE, OE/RESET, CLK, or CF
when VCCO = 1.8V(8) 0–5–ns
TDF
CE or OE/RESET to data float delay(2)
when VCCO = 3.3V or 2.5V –25–45ns
CE or OE/RESET to data float delay(2)
when VCCO = 1.8V –30–45ns
CE
OE/RESET
CLK
BUSY
(optional)
DATA
T
CE
T
LC
T
HC
T
SCE
T
OE
T
CAC
T
HCE
T
HOE
T
CYC
T
OH
T
DF
T
OH
T
HB
T
SB
CF
EN_EXT_SEL
REV_SEL[1:0]
T
SXT
T
HXT
T
SRV
T
HRV
ds123_22_122905
T
SXT
T
HXT
T
SRV
T
HRV
T
CF
T
HCF
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 17
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TCYC
Clock period(6) (serial mode) when VCCO = 3.3V or 2.5V 30 – 25 – ns
Clock period(6) (serial mode) when VCCO = 1.8V 67 – 25 – ns
Clock period(6) (parallel mode) when VCCO = 3.3V or 2.5V – – 30 – ns
Clock period(6) (parallel mode) when VCCO = 1.8V – – 30 – ns
TLC
CLK Low time(3) when VCCO = 3.3V or 2.5V 10 – 12 – ns
CLK Low time(3) when VCCO = 1.8V 15 – 12 – ns
THC
CLK High time(3) when VCCO = 3.3V or 2.5V 10 – 12 – ns
CLK High time(3) when VCCO = 1.8V 15 – 12 – ns
TSCE
CE setup time to CLK (guarantees proper counting)(3)
when VCCO = 3.3V or 2.5V 20–30–ns
CE setup time to CLK (guarantees proper counting)(3)
when VCCO = 1.8V 30 30 – ns
THCE
CE hold time (guarantees counters are reset)(5)
when VCCO = 3.3V or 2.5V 250 – 2000 – ns
CE hold time (guarantees counters are reset)(5)
when VCCO = 1.8V 250 – 2000 – ns
THOE
OE/RESET hold time (guarantees counters are reset)(6)
when VCCO = 3.3V or 2.5V 250 – 2000 – ns
OE/RESET hold time (guarantees counters are reset)(6)
when VCCO = 1.8V 250 – 2000 – ns
TSB
BUSY setup time to CLK when VCCO = 3.3V or 2.5V(8) ––12–ns
BUSY setup time to CLK when VCCO = 1.8V(8) ––12–ns
THB
BUSY hold time to CLK when VCCO = 3.3V or 2.5V(8) ––8–ns
BUSY hold time to CLK when VCCO = 1.8V(8) ––8–ns
TSXT
EN_EXT_SEL setup time to CF, CE or OE/RESET
when VCCO = 3.3V or 2.5V(8) – – 300 – ns
EN_EXT_SEL setup time to CF, CE or OE/RESET
when VCCO = 1.8V(8) – – 300 – ns
THXT
EN_EXT_SEL hold time from CF, CE or OE/RESET
when VCCO = 3.3V or 2.5V(8) – – 300 – ns
EN_EXT_SEL hold time from CF, CE or OE/RESET
when VCCO = 1.8V(8) – – 300 – ns
TSRV
REV_SEL setup time to CF, CE or OE/RESET
when VCCO = 3.3V or 2.5V(8) – – 300 – ns
REV_SEL setup time to CF, CE or OE/RESET
when VCCO = 1.8V(8) – – 300 – ns
THRV
REV_SEL hold time from CF, CE or OE/RESET
when VCCO = 3.3V or 2.5V(8) – – 300 – ns
REV_SEL hold time from CF, CE or OE/RESET
when VCCO = 1.8V(8) – – 300 – ns
Notes:
1. AC test load = 50 pF for XCF01S/XCF02S/XCF04S; 30 pF for XCF08P/XCF16P/XCF32P.
2. Float delays are measured with 5 pF AC loads. Transition is measured at ±200 mV from steady-state active levels.
3. All AC parameters are measured with VIL = 0.0V and VIH = 3.0V.
4. If THCE High < 2 µs, TCE = 2 µs.
5. If THOE Low < 2 µs, TOE = 2 µs.
6. This is the minimum possible TCYC. Actual TCYC = TCAC + FPGA Data setup time. Example: With the XCF32P in serial mode with VCCO at
3.3V, if FPGA data setup time = 15 ns, then the actual TCYC = 25 ns +15 ns = 40 ns.
7. Guaranteed by design; not tested.
8. CF
, EN_EXT_SEL, REV_SEL[1:0], and BUSY are inputs for the XCFxxP PROM only.
9. When JTAG CONFIG command is issued, PROM drives CF Low for at least the THCF minimum.
Symbol Description
XCF01S, XCF02S,
XCF04S
XCF08P, XCF16P,
XCF32P Units
Min Max Min Max
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 18
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XCFxxP PROM as Configuration Master with CLK Input Pin as Clock Source
X-Ref Target - Figure 8
Symbol Description
XCF08P, XCF16P,
XCF32P Units
Min Max
THCF
CF hold time to guarantee design revision selection is sampled
when VCCO = 3.3V or 2.5V(11) 300 300
CF hold time to guarantee design revision selection is sampled
when VCCO = 1.8V(11) 300 300
TCF
CF to data delay when VCCO = 3.3V or 2.5V – ns
CF to data delay when VCCO = 1.8V – ns
TOE
OE/RESET to data delay(6) when VCCO = 3.3V or 2.5V – 25 ns
OE/RESET to data delay(6) when VCCO = 1.8V – 25 ns
TCE
CE to data delay(5) when VCCO = 3.3V or 2.5V – 25 ns
CE to data delay(5) when VCCO = 1.8V – 25 ns
TEOH
Data hold from CE, OE/RESET, or CF when VCCO = 3.3V or 2.5V 5 – ns
Data hold from CE, OE/RESET, or CF when VCCO = 1.8V 5 – ns
TDF
CE or OE/RESET to data float delay(2) when VCCO = 3.3V or 2.5V – 45 ns
CE or OE/RESET to data float delay(2) when VCCO = 1.8V – 45 ns
TOECF
OE/RESET to CLKOUT float delay(2) when VCCO = 3.3V or 2.5V – ns
OE/RESET to CLKOUT float delay(2) when VCCO = 1.8V – ns
TCECF
CE to CLKOUT float delay(2) when VCCO = 3.3V or 2.5V – ns
CE to CLKOUT float delay(2) when VCCO = 1.8V – ns
CE
OE/RESET
CLK
CLKOUT
BUSY
(optional)
DATA
T
CE
T
LC
T
HC
T
OE
T
HCE
T
HOE
T
CYCO
T
HB
T
SB
T
OECC
T
CECC
T
CLKO
T
COH
T
CCDD
ds123_25_110707
T
EOH
T
DF
Note: Typically, 8 CLKOUT cycles are output after CE rising edge, before CLKOUT
tristates, if OE/RESET remains high, and terminal count has not been reached.
CF
EN_EXT_SEL
REV_SEL[1:0]
T
SXT
T
HXT
T
SRV
T
HRV
T
SXT
T
HXT
T
SRV
T
HRV
T
CF
T
CFCC
T
CECF
T
OECF
T
DDC
T
HCF
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 19
R
TCYCO
Clock period(7) (serial mode) when VCCO = 3.3V or 2.5V 30 – ns
Clock period(7) (serial mode) when VCCO = 1.8V 30 – ns
Clock period(7) (parallel mode) when VCCO = 3.3V or 2.5V 35 – ns
Clock period(7) (parallel mode) when VCCO = 1.8V 35 – ns
TLC
CLK Low time(3) when VCCO = 3.3V or 2.5V 12 – ns
CLK Low time(3) when VCCO = 1.8V 12 – ns
THC
CLK High time(3) when VCCO = 3.3V or 2.5V 12 – ns
CLK High time(3) when VCCO = 1.8V 12 – ns
THCE
CE hold time (guarantees counters are reset)(5) when VCCO = 3.3V or 2.5V 2000 – ns
CE hold time (guarantees counters are reset)(5) when VCCO = 1.8V 2000 – ns
THOE
OE/RESET hold time (guarantees counters are reset)(6) when VCCO = 3.3V or 2.5V 2000 – ns
OE/RESET hold time (guarantees counters are reset)(6) when VCCO = 1.8V 2000 – ns
TSB
BUSY setup time to CLKOUT when VCCO = 3.3V or 2.5V 12 – ns
BUSY setup time to CLKOUT when VCCO = 1.8V 12 – ns
THB
BUSY hold time to CLKOUT when VCCO = 3.3V or 2.5V 8 – ns
BUSY hold time to CLKOUT when VCCO = 1.8V 8 – ns
TCLKO
CLK input to CLKOUT output delay when VCCO = 3.3V or 2.5V – 35 ns
CLK input to CLKOUT output delay when VCCO = 1.8V – 35 ns
CLK input to CLKOUT output delay when VCCO = 3.3V or 2.5V
with decompression(12) –35ns
CLK input to CLKOUT output delay when VCCO = 1.8V
with decompression(12) –35ns
TCECC
CE to CLKOUT delay(8) when VCCO = 3.3V or 2.5V 0 2 CLK
cycles
–
CE to CLKOUT delay(8) when VCCO = 1.8V 0 2 CLK
cycles
–
TOECC
OE/RESET to CLKOUT delay(8) when VCCO = 3.3V or 2.5V 02 CLK
cycles
–
OE/RESET to CLKOUT delay(8) when VCCO = 1.8V 02 CLK
cycles
–
TCFCC
CF to CLKOUT delay(8) when VCCO = 3.3V or 2.5V 0 –
CF to CLKOUT delay(8) when VCCO = 1.8V 0 –
TCCDD
CLKOUT to data delay when VCCO = 3.3V or 2.5V(9) –30ns
CLKOUT to data delay when VCCO = 1.8V(9) –30ns
TDDC
Data setup time to CLKOUT when VCCO = 3.3V or 2.5V with decompression(9)(12) 5ns
Data setup time to CLKOUT when VCCO = 1.8V with decompression(9)(12) 5ns
TCOH
Data hold from CLKOUT when VCCO = 3.3V or 2.5V 3 – ns
Data hold from CLKOUT when VCCO = 1.8V 3 – ns
Data hold from CLKOUT when VCCO = 3.3V or 2.5V with decompression(12) 3–ns
Data hold from CLKOUT when VCCO = 1.8V with decompression(12) 3–ns
TSXT
EN_EXT_SEL setup time to CF, CE, or OE/RESET when VCCO = 3.3V or 2.5V 300 – ns
EN_EXT_SEL setup time to CF, CE, or OE/RESET when VCCO = 1.8V 300 – ns
Symbol Description
XCF08P, XCF16P,
XCF32P Units
Min Max
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 20
R
THXT
EN_EXT_SEL hold time from CF, CE, or OE/RESET when VCCO = 3.3V or 2.5V 300 – ns
EN_EXT_SEL hold time from CF, CE, or OE/RESET when VCCO = 1.8V 300 – ns
TSRV
REV_SEL setup time to CF, CE, or OE/RESET when VCCO = 3.3V or 2.5V 300 – ns
REV_SEL setup time to CF
, CE, or OE/RESET when VCCO = 1.8V 300 – ns
THRV
REV_SEL hold time from CF, CE, or OE/RESET when VCCO = 3.3V or 2.5V 300 – ns
REV_SEL hold time from CF
, CE, or OE/RESET when VCCO = 1.8V 300 – ns
Notes:
1. AC test load = 50 pF for XCF01S/XCF02S/XCF04S; 30 pF for XCF08P/XCF16P/XCF32P.
2. Float delays are measured with 5 pF AC loads.Transition is measured at ±200 mV from steady-state active levels.
3. Guaranteed by design, not tested.
4. All AC parameters are measured with VIL = 0.0V and VIH = 3.0V.
5. If THCE High < 2 µs, TCE = 2 µs.
6. If THOE Low < 2 µs, TOE = 2 µs.
7. This is the minimum possible TCYCO. Actual TCYCO = TCCDD + FPGA Data setup time. Example: With the XCF32P in serial mode with VCCO
at 3.3V, if FPGA Data setup time = 15 ns, then the actual TCYCO = 25 ns +15 ns = 40 ns.
8. The delay before the enabled CLKOUT signal begins clocking data out of the device is dependent on the clocking configuration. The delay
before CLKOUT is enabled increases if decompression is enabled.
9. Slower CLK frequency option might be required to meet the FPGA data sheet setup time.
10. When decompression is enabled, the CLKOUT signal becomes a controlled clock output. When decompressed data is available, CLKOUT
toggles at ½ the source clock frequency (either ½ the selected internal clock frequency or ½ the external CLK input frequency). When
decompressed data is not available, the CLKOUT pin is parked High. If CLKOUT is used, then it must be pulled High externally using a
4.7 kΩ pull-up to VCCO.
11. When JTAG CONFIG command is issued, PROM drives CF Low for at least the THCF minimum.
Symbol Description
XCF08P, XCF16P,
XCF32P Units
Min Max
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 21
R
XCFxxP PROM as Configuration Master with Internal Oscillator as Clock Source
X-Ref Target - Figure 9
Symbol Description
XCF08P, XCF16P,
XCF32P Units
Min Max
THCF
CF hold time to guarantee design revision selection is sampled
when VCCO = 3.3V or 2.5V(12) 300 300
CF hold time to guarantee design revision selection is sampled
when VCCO = 1.8V(12) 300 300
TCF
CF to data delay when VCCO = 3.3V or 2.5V – ns
CF to data delay when VCCO = 1.8V – ns
TOE
OE/RESET to data delay(6) when VCCO = 3.3V or 2.5V – 25 ns
OE/RESET to data delay(6) when VCCO = 1.8V – 25 ns
TCE
CE to data delay(5) when VCCO = 3.3V or 2.5V – 25 ns
CE to data delay(5) when VCCO = 1.8V – 25 ns
TEOH
Data hold from CE, OE/RESET, or CF when VCCO = 3.3V or 2.5V 5 – ns
Data hold from CE, OE/RESET, or CF when VCCO = 1.8V 5 – ns
TDF
CE or OE/RESET to data float delay(2) when VCCO = 3.3V or 2.5V – 45 ns
CE or OE/RESET to data float delay(2) when VCCO = 1.8V – 45 ns
TOECF
OE/RESET to CLKOUT float delay(2) when VCCO = 3.3V or 2.5V – ns
OE/RESET to CLKOUT float delay(2) when VCCO = 1.8V – ns
TCECF
CE to CLKOUT float delay(2) when VCCO = 3.3V or 2.5V – ns
CE to CLKOUT float delay(2) when VCCO = 1.8V – ns
THCE
CE hold time (guarantees counters are reset)(5) when VCCO = 3.3V or 2.5V 2000 – ns
CE hold time (guarantees counters are reset)(5) when VCCO = 1.8V 2000 – ns
THOE
OE/RESET hold time (guarantees counters are reset)(6) when VCCO = 3.3V or 2.5V 2000 – ns
OE/RESET hold time (guarantees counters are reset)(6) when VCCO = 1.8V 2000 – ns
CE
OE/RESET
CLKOUT
BUSY
(optional)
DATA
TCE
TOE
THCE
THOE
THB
TSB
TOEC
TCEC
TCOH
TCDD
ds123_26_110707
TEOH
TDF
Note: Typically, 8 CLKOUT cycles are output after CE rising edge, before CLKOUT
tristates, if OE/RESET remains high, and terminal count has not been reached.
CF
EN_EXT_SEL
REV_SEL[1:0]
TSXT THXT
TSRV THRV
TSXT THXT
TSRV THRV
TCF
TCFC
TCECF
TOECF
TDDC
THCF
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 22
R
TSB
BUSY setup time to CLKOUT when VCCO = 3.3V or 2.5V 12 – ns
BUSY setup time to CLKOUT when VCCO = 1.8V 12 – ns
THB
BUSY hold time to CLKOUT when VCCO = 3.3V or 2.5V 8 – ns
BUSY hold time to CLKOUT when VCCO = 1.8V 8 – ns
TCEC
CE to CLKOUT delay(7) when VCCO = 3.3V or 2.5V 0 1 µs
CE to CLKOUT delay(7) when VCCO = 1.8V 0 1 µs
TOEC
OE/RESET to CLKOUT delay(7) when VCCO = 3.3V or 2.5V 0 1 µs
OE/RESET to CLKOUT delay(7) when VCCO = 1.8V 0 1 µs
TCFC
CF to CLKOUT delay(7) when VCCO = 3.3V or 2.5V 0 –
CF to CLKOUT delay(7) when VCCO = 1.8V 0 –
TCDD
CLKOUT to data delay when VCCO = 3.3V or 2.5V(8) –30ns
CLKOUT to data delay when VCCO = 1.8V(8) –30ns
TDDC
Data setup time to CLKOUT
when VCCO = 3.3V or 2.5V with decompression (8)(11) 5ns
Data setup time to CLKOUT when VCCO = 1.8V with decompression(8)(11) 5ns
TCOH
Data hold from CLKOUT when VCCO = 3.3V or 2.5V 3 – ns
Data hold from CLKOUT when VCCO = 1.8V 3 – ns
Data hold from CLKOUT when VCCO = 3.3V or 2.5V with decompression(11) 3–ns
Data hold from CLKOUT when VCCO = 1.8V with decompression(11) 3–ns
TSXT
EN_EXT_SEL setup time to CF, CE, or OE/RESET when VCCO = 3.3V or 2.5V 300 – ns
EN_EXT_SEL setup time to CF, CE, or OE/RESET when VCCO = 1.8V 300 – ns
THXT
EN_EXT_SEL hold time from CF, CE, or OE/RESET when VCCO = 3.3V or 2.5V 300 – ns
EN_EXT_SEL hold time from CF, CE, or OE/RESET when VCCO = 1.8V 300 – ns
TSRV
REV_SEL setup time to CF, CE, or OE/RESET when VCCO = 3.3V or 2.5V 300 – ns
REV_SEL setup time to CF
, CE, or OE/RESET when VCCO = 1.8V 300 – ns
THRV
REV_SEL hold time from CF, CE, or OE/RESET when VCCO = 3.3V or 2.5V 300 – ns
REV_SEL hold time from CF, CE, or OE/RESET when VCCO = 1.8V 300 – ns
FF
CLKOUT default (fast) frequency(9) 25 50 MHz
CLKOUT default (fast) frequency with decompression(11) 12.5 25 MHz
FS
CLKOUT alternate (slower) frequency(10) 12.5 25 MHz
CLKOUT alternate (slower) frequency with decompression(11) 6 12.5 MHz
Notes:
1. AC test load = 50 pF for XCF01S/XCF02S/XCF04S; 30 pF for XCF08P/XCF16P/XCF32P.
2. Float delays are measured with 5 pF AC loads. Transition is measured at ±200 mV from steady-state active levels.
3. Guaranteed by design, not tested.
4. All AC parameters are measured with VIL = 0.0V and VIH = 3.0V.
5. If THCE High < 2 µs, TCE = 2 µs.
6. If THOE Low < 2 µs, TOE = 2 µs.
7. The delay before the enabled CLKOUT signal begins clocking data out of the device is dependent on the clocking configuration. The delay
before CLKOUT is enabled increases if decompression is enabled.
8. Slower CLK frequency option might be required to meet the FPGA data sheet setup time.
9. Typical CLKOUT default (fast) period = 25 ns (40 MHz).
10. Typical CLKOUT alternate (slower) period = 50 ns (20 MHz).
11. When decompression is enabled, the CLKOUT signal becomes a controlled clock output. When decompressed data is available, CLKOUT
toggles at ½ the source clock frequency (either ½ the selected internal clock frequency or ½ the external CLK input frequency). When
decompressed data is not available, the CLKOUT pin is parked High. If CLKOUT is used, then it must be pulled High externally using a
4.7 kΩ pull-up to VCCO.
12. When JTAG CONFIG command is issued, PROM drives CF Low for at least the THCF minimum.
Symbol Description
XCF08P, XCF16P,
XCF32P Units
Min Max
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 23
R
AC Characteristics Over Operating Conditions When Cascading
X-Ref Target - Figure 10
Symbol Description
XCF01S, XCF02S,
XCF04S
XCF08P, XCF16P,
XCF32P Units
Min Max Min Max
TCDF
CLK to output float delay(2,3)
when VCCO = 2.5V or 3.3V – 25 – 20 ns
CLK to output float delay(2,3) when VCCO = 1.8V – 35 – 20 ns
TOCK
CLK to CEO delay(3,5) when VCCO = 2.5V or 3.3V – 20 – 20 ns
CLK to CEO delay(3,5) when VCCO = 1.8V – 35 – 20 ns
TOCE
CE to CEO delay(3,6) when VCCO = 2.5V or 3.3V – 20 – 80 ns
CE to CEO delay(3,6) when VCCO = 1.8V – 35 – 80 ns
TOOE
OE/RESET to CEO delay(3) when VCCO = 2.5V or 3.3V – 20 – 80 ns
OE/RESET to CEO delay(3) when VCCO = 1.8V – 35 – 80 ns
TCOCE
CLKOUT to CEO delay when VCCO = 2.5V or 3.3V – – – 20 ns
CLKOUT to CEO delay when VCCO = 1.8V – – – 20 ns
TCODF
CLKOUT to output float delay
when VCCO = 2.5V or 3.3V – – – 25 ns
CLKOUT to output float delay when VCCO = 1.8V – – – 25 ns
Notes:
1. AC test load = 50 pF for XCF01S/XCF02S/XCF04S; 30 pF for XCF08P/XCF16P/XCF32P.
2. Float delays are measured with 5 pF AC loads. Transition is measured at ±200 mV from steady state active levels.
3. Guaranteed by design, not tested.
4. All AC parameters are measured with VIL = 0.0V and VIH = 3.0V.
5. For cascaded PROMs, if the FPGA’s dual-purpose configuration data pins are set to persist as configuration pins, the minimum period is
increased based on the CLK to CEO and CE to data propagation delays:
- TCYC minimum = TOCK + TCE + FPGA Data setup time
- TCAC maximum = TOCK + TCE
6. For cascaded PROMs, if the FPGA’s dual-purpose configuration data pins become general I/O pins after configuration; to allow for the
disable to propagate to the cascaded PROMs and to avoid contention on the data lines following configuration, the minimum period is
increased based on the CE to CEO and CE to data propagation delays:
- TCYC minimum = TOCE + TCE
- TCAC maximum = TOCK + TCE
OE/RESET
CE
CLK
CLKOUT
(optional)
DATA
CEO
TOCE
TOOE
First BitLast Bit
TCDF
TCODF
TOCK
TCOCE
ds123_23_102203
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 24
R
Pinouts and Pin Descriptions
The XCFxxS Platform Flash PROM is available in the VO20 and VOG20 packages. The XCFxxP Platform Flash PROM is
available in the VO48, VOG48, FS48, and FSG48 packages. For package drawings, specifications, and additional
information, see UG112, Device Package User Guide, or the Xilinx Package Specifications.
Note:
1. VO20/VOG20 denotes a 20-pin (TSSOP) Plastic Thin Shrink Small Outline Package.
2. VO48/VOG48 denotes a 48-pin (TSOP) Plastic Thin Small Outline Package.
3. FS48/FSG48 denotes a 48-pin (TFBGA) Plastic Thin Fine Pitch Ball Grid Array (0.8 mm pitch).
XCFxxS Pinouts and Pin Descriptions
XCFxxS VO20/VOG20 Pin Names and Descriptions
Ta bl e 1 2 provides a list of the pin names and descriptions for the XCFxxS 20-pin VO20/VOG20 package.
Tabl e 1 2 : XCFxxS Pin Names and Descriptions
Pin Name Boundary
Scan Order
Boundary-Scan
Function Pin Description 20-pin TSSOP
(VO20/VOG20)
D0
4 Data Out D0 is the DATA output pin to provide data for configuring an
FPGA in serial mode. The D0 output is set to a high-
impedance state during ISPEN (when not clamped).
1
3 Output Enable
CLK 0 Data In
Configuration Clock Input. Each rising edge on the CLK input
increments the internal address counter if the CLK input is
selected, CE is Low, and OE/RESET is High.
3
OE/RESET
20 Data In Output Enable/Reset (Open-Drain I/O). When Low, this input
holds the address counter reset and the DATA output is in a
high-impedance state. This is a bidirectional open-drain pin
that is held Low while the PROM completes the internal
power-on reset sequence. Polarity is not programmable.
8
19 Data Out
18 Output Enable
CE 15 Data In
Chip Enable Input. When CE is High, the device is put into
low-power standby mode, the address counter is reset, and
the DATA pins are put in a high-impedance state.
10
CF
22 Data Out Configuration Pulse (Open-Drain Output). Allows JTAG
CONFIG instruction to initiate FPGA configuration without
powering down FPGA. This is an open-drain output that is
pulsed Low by the JTAG CONFIG command.
7
21 Output Enable
CEO
12 Data Out Chip Enable Output. Chip Enable Output (CEO) is connected
to the CE input of the next PROM in the chain. This output is
Low when CE is Low and OE/RESET input is High, AND the
internal address counter has been incremented beyond its
Terminal Count (TC) value. CEO returns to High when
OE/RESET goes Low or CE goes High.
13
11 Output Enable
TMS – Mode Select
JTAG Mode Select Input. The state of TMS on the rising edge
of TCK determines the state transitions at the Test Access
Port (TAP) controller. TMS has an internal 50 kΩ resistive pull-
up to VCCJ to provide a logic 1 to the device if the pin is not
driven.
5
TCK – Clock
JTAG Clock Input. This pin is the JTAG test clock. It
sequences the TAP controller and all the JTAG test and
programming electronics.
6
TDI – Data In
JTAG Serial Data Input. This pin is the serial input to all JTAG
instruction and data registers. TDI has an internal 50 kΩ
resistive pull-up to VCCJ to provide a logic 1 to the device if the
pin is not driven.
4
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 25
R
XCFxxS VO20/VOG20 Pinout Diagram
TDO – Data Out
JTAG Serial Data Output. This pin is the serial output for all
JTAG instruction and data registers. TDO has an internal
50 kΩ resistive pull-up to VCCJ to provide a logic 1 to the
system if the pin is not driven.
17
VCCINT – – +3.3V Supply. Positive 3.3V supply voltage for internal logic. 18
VCCO – –
+3.3V, 2.5V, or 1.8V I/O Supply. Positive 3.3V, 2.5V, or 1.8V
supply voltage connected to the output voltage drivers and
input buffers.
19
VCCJ – –
+3.3V or 2.5V JTAG I/O Supply. Positive 3.3V or 2.5V supply
voltage connected to the TDO output voltage driver and TCK,
TMS, and TDI input buffers.
20
GND – – Ground 11
DNC – – Do not connect. (These pins must be left unconnected.) 2, 9, 12, 14, 15, 16
X-Ref Target - Figure 11
Figure 11: VO20/VOG20 Pinout Diagram (Top View)
with Pin Names
Tabl e 1 2 : XCFxxS Pin Names and Descriptions (Cont’d)
Pin Name Boundary
Scan Order
Boundary-Scan
Function Pin Description 20-pin TSSOP
(VO20/VOG20)
VO20/VOG20
Top View
ds123_02_071304
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
D0
(DNC)
CLK
TDI
TMS
TCK
CF
OE/RESET
(DNC)
CE
VCCJ
VCCO
VCCINT
TDO
(DNC)
(DNC)
CEO
(DNC)
GND
(DNC)
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 26
R
XCFxxP Pinouts and Pin Descriptions
XCFxxP VO48/VOG48 and FS48/FSG48 Pin Names and Descriptions
Ta b l e 1 3 provides a list of the pin names and descriptions for the XCFxxP 48-pin VO48/VOG48 and 48-pin
FS48/FSG48 packages.
Tabl e 1 3 : XCFxxP Pin Names and Descriptions (VO48/VOG48 and FS48/FSG48)
Pin Name Boundary-
Scan Order
Boundary-
Scan
Function
Pin Description
48-pin
TSOP
(VO48/
VOG48)
48-pin
TFBGA
(FS48/
FSG48)
D0 28 Data Out
D0 is the DATA output pin to provide data for configuring an
FPGA in serial mode.
D0-D7 are the DATA output pins to provide parallel data for
configuring a Xilinx FPGA in SelectMap (parallel) mode.
The D0 output is set to a high-impedance state during ISPEN
(when not clamped).
The D1-D7 outputs are set to a high-impedance state during
ISPEN (when not clamped) and when serial mode is selected
for configuration. The D1-D7 pins can be left unconnected
when the PROM is used in serial mode.
28 H6
27 Output Enable
D1 26 Data Out 29 H5
25 Output Enable
D2 24 Data Out 32 E5
23 Output Enable
D3 22 Data Out 33 D5
21 Output Enable
D4 20 Data Out 43 C5
19 Output Enable
D5 18 Data Out 44 B5
17 Output Enable
D6 16 Data Out 47 A5
15 Output Enable
D7 14 Data Out 48 A6
13 Output Enable
CLK 01 Data In
Configuration Clock Input. An internal programmable control bit
selects between the internal oscillator and the CLK input pin as
the clock source to control the configuration sequence. Each
rising edge on the CLK input increments the internal address
counter if the CLK input is selected, CE is Low, OE/RESET is
High, BUSY is Low (parallel mode only), and CF is High.
12 B3
OE/RESET
04 Data In Output Enable/Reset (Open-Drain I/O).
When Low, this input holds the address counter reset and the
DATA and CLKOUT outputs are placed in a high-impedance
state. This is a bidirectional open-drain pin that is held Low
while the PROM completes the internal power-on reset
sequence. Polarity is not programmable.
11 A3
03 Data Out
02 Output Enable
CE
00 Data In Chip Enable Input. When CE is High, the device is put into
low-power standby mode, the address counter is reset, and
the DATA and CLKOUT outputs are placed in a high-
impedance state.
13 B4
CF
11 Data In Configuration Pulse (Open-Drain I/O). As an output, this pin
allows the JTAG CONFIG instruction to initiate FPGA
configuration without powering down the FPGA. This is an
open-drain signal that is pulsed Low by the JTAG CONFIG
command. As an input, on the rising edge of CF
, the current
design revision selection is sampled and the internal address
counter is reset to the start address for the selected revision.
If unused, the CF pin must be pulled High using an external
4.7 kΩ pull-up to VCCO.
6D1
10 Data Out
09 Output Enable
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 27
R
CEO
06 Data Out Chip Enable Output. Chip Enable Output (CEO) is connected
to the CE input of the next PROM in the chain. This output is
Low when CE is Low and OE/RESET input is High, AND the
internal address counter has been incremented beyond its
Terminal Count (TC) value or the PROM does not contain any
blocks that correspond to the selected revision. CEO returns
to High when OE/RESET goes Low or CE goes High.
10 D2
05 Output Enable
EN_EXT_SEL 31 Data In
Enable External Selection Input. When this pin is Low, design
revision selection is controlled by the Revision Select pins.
When this pin is High, design revision selection is controlled
by the internal programmable Revision Select control bits.
EN_EXT_SEL has an internal 50 kΩ resistive pull-up to
VCCO to provide a logic 1 to the device if the pin is not driven.
25 H4
REV_SEL0 30 Data In Revision Select[1:0] Inputs. When the EN_EXT_SEL is Low,
the Revision Select pins are used to select the design
revision to be enabled, overriding the internal programmable
Revision Select control bits. The Revision Select[1:0] inputs
have an internal 50 kΩ resistive pull-up to VCCO to provide a
logic 1 to the device if the pins are not driven.
26 G3
REV_SEL1 29 Data In 27 G4
BUSY 12 Data In
Busy Input. The BUSY input is enabled when parallel mode
is selected for configuration. When BUSY is High, the internal
address counter stops incrementing and the current data
remains on the data pins. On the first rising edge of CLK after
BUSY transitions from High to Low, the data for the next
address is driven on the data pins. When serial mode or
decompression is enabled during device programming, the
BUSY input is disabled. BUSY has an internal 50 kΩ resistive
pull-down to GND to provide a logic 0 to the device if the pin
is not driven.
5C1
CLKOUT
08 Data Out Configuration Clock Output. An internal Programmable
control bit enables the CLKOUT signal, which is sourced from
either the internal oscillator or the CLK input pin. Each rising
edge of the selected clock source increments the internal
address counter if data is available, CE is Low, and
OE/RESET is High. Output data is available on the rising
edge of CLKOUT. CLKOUT is disabled if CE is High or
OE/RESET is Low. If decompression is enabled, CLKOUT is
parked High when decompressed data is not ready. When
CLKOUT is disabled, the CLKOUT pin is put into a high-Z
state. If CLKOUT is used, then it must be pulled High
externally using a 4.7 kΩ pull-up to VCCO.
9C2
07 Output Enable
TMS – Mode Select
JTAG Mode Select Input. The state of TMS on the rising edge
of TCK determines the state transitions at the Test Access Port
(TAP) controller. TMS has an internal 50 kΩ resistive pull-up to
VCCJ to provide a logic 1 to the device if the pin is not driven.
21 E2
TCK – Clock
JTAG Clock Input. This pin is the JTAG test clock. It
sequences the TAP controller and all the JTAG test and
programming electronics.
20 H3
TDI – Data In
JTAG Serial Data Input. This pin is the serial input to all JTAG
instruction and data registers. TDI has an internal 50 kΩ
resistive pull-up to VCCJ to provide a logic 1 to the device if
the pin is not driven.
19 G1
TDO – Data Out
JTAG Serial Data Output. This pin is the serial output for all
JTAG instruction and data registers. TDO has an internal
50 kΩ resistive pull-up to VCCJ to provide a logic 1 to the
system if the pin is not driven.
22 E6
Tabl e 1 3 : XCFxxP Pin Names and Descriptions (VO48/VOG48 and FS48/FSG48) (Cont’d)
Pin Name Boundary-
Scan Order
Boundary-
Scan
Function
Pin Description
48-pin
TSOP
(VO48/
VOG48)
48-pin
TFBGA
(FS48/
FSG48)
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 28
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XCFxxP VO48/VOG48 Pinout Diagram
VCCINT – – +1.8V Supply. Positive 1.8V supply voltage for internal logic. 4, 15, 34 B1, E1,
G6
VCCO – –
+3.3V, 2.5V, or 1.8V I/O Supply. Positive 3.3V, 2.5V, or 1.8V
supply voltage connected to the output voltage drivers and
input buffers.
8, 30,
38, 45
B2, C6,
D6, G5
VCCJ – –
+3.3V or 2.5V JTAG I/O Supply. Positive 3.3V or 2.5V supply
voltage connected to the TDO output voltage driver and TCK,
TMS, and TDI input buffers.
24 H2
GND – – Ground
2, 7,
17, 23,
31, 36, 46
A1, A2,
B6, F1,
F5, F6, H1
DNC – – Do Not Connect. (These pins must be left unconnected.)
1, 3,
14, 16,
18, 35, 37,
39, 40, 41,
42
A4, C3,
C4, D3,
D4, E3,
E4, F2,
F3, F4,
G2
X-Ref Target - Figure 12
Figure 12: VO48/VOG48 Pinout Diagram (Top View) with Pin Names
Tabl e 1 3 : XCFxxP Pin Names and Descriptions (VO48/VOG48 and FS48/FSG48) (Cont’d)
Pin Name Boundary-
Scan Order
Boundary-
Scan
Function
Pin Description
48-pin
TSOP
(VO48/
VOG48)
48-pin
TFBGA
(FS48/
FSG48)
DS123_24_031908
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VO48/VOG48
Top
View
DNC
GND
DNC
VCCINT
BUSY
CF
GND
VCCO
CLKOUT
CEO
OE/RESET
CLK
CE
DNC
VCCINT
DNC
GND
DNC
TDI
TCK
TMS
TDO
GND
D7
D6
GND
VCCO
D5
D4
DNC
DNC
DNC
DNC
VCCO
DNC
GND
DNC
VCCINT
D3
D2
GND
VCCO
D1
D0
REV_SEL1
REV_SEL0
EN_EXT_SEL
VCCJ
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 29
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XCFxxP FS48/FSG48 Pin Names XCFxxP FS48/FSG48 Pinout Diagram
Tabl e 1 4 : XCFxxP Pin Names (FS48/FSG48)
Pin
Number Pin Name Pin
Number Pin Name
A1 GND E1 VCCINT
A2 GND E2 TMS
A3 OE/RESET E3 DNC
A4 DNC E4 DNC
A5 D6 E5 D2
A6 D7 E6 TDO
B1 VCCINT F1 GND
B2 VCCO F2 DNC
B3 CLK F3 DNC
B4 CE F4 DNC
B5 D5 F5 GND
B6 GND F6 GND
C1 BUSY G1 TDI
C2 CLKOUT G2 DNC
C3 DNC G3 REV_SEL0
C4 DNC G4 REV_SEL1
C5 D4 G5 VCCO
C6 VCCO G6 VCCINT
D1 CF H1 GND
D2 CEO H2 VCCJ
D3 DNC H3 TCK
D4 DNC H4 EN_EXT_SEL
D5 D3 H5 D1
D6 VCCO H6 D0
X-Ref Target - Figure 13
Figure 13: FS48/FSG48 Pinout Diagram (Top View)
123456
ds121_01_071604
A
B
C
D
E
F
G
H
FS48/FSG48
Top View
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 30
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Ordering Information
Valid Ordering Combinations
Marking Information
XCF01SVO20C XCF08PFS48C XCF01SVOG20C XCF08PVOG48C XCF08PFSG48C
XCF02SVO20C XCF16PFS48C XCF02SVOG20C XCF16PVOG48C XCF16PFSG48C
XCF04SVO20C XCF32PFS48C XCF04SVOG20C XCF32PVOG48C XCF32PFSG48C
XCF04S VO20 C
Device Number
XCF01S
XCF02S
XCF04SPackage Type
VO20 = 20-pin TSSOP Package
VOG20 = 20-pin TSSOP Package, Pb-free
Operating Range/Processing
C = Industrial (T
A
= –40°C to +85°C)
DS123_27_112407
XCF32P FS48 C
Device Number
XCF08P
XCF16P
XCF32P
Package Type
VO48 = 48-pin TSOP Package
VOG48 = 48-pin TSOP Package, Pb-free
FS48 = 48-pin TFBGA Package
FSG48 = 48-pin TFBGA Package, Pb-free
Operating Range/Processing
C = Industrial (TA = –40°C to +85°C)
DS123_28_112407
XCF04S V
Device Number
XCF01S
XCF02S
XCF04S
XCF08P
XCF16P
XCF32P
Package Type
V = 20-pin TSSOP Package (VO20)
VG = 20-pin TSSOP Package, Pb-free (VOG20)
VO48 = 48-pin TSOP Package (VO48)
VOG48 = 48-pin TSOP Package, Pb-free (VOG48)
F48 = 48-pin TFBGA Package (FS48)
FG48 = 48-pin TFBGA Package, Pb-free (FSG48)
Operating Range/Processing
[No Mark] = Industrial (TA = –40°C to +85°C)
DS123_29_112407
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 31
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Figure 14 through Figure 16 illustrate the part markings for each available package.
Note: Package types can differ from the samples shown.
Note: In Figure 15 and Figure 16, the two-digit traceability code on the bottom line between the country of origin and date code is not
present on all devices.
X-Ref Target - Figure 14
Figure 14: 20-Pin TSSOP Marking
X-Ref Target - Figure 15
Figure 15: 48-Pin TSOP Marking
X-Ref Target - Figure 16
Figure 16: 48-Pin TFBGA Marking
XCF04S™
XX YWW
Device Number
Xilinx Logo
Traceability Code
Date Code
(YWW = 200Y
workweek #WW)
TSSOP Pin 1
XXX
DS123_30_030908
VG Package Type
XCF32P™
XXX
XXXXX XX
Device Number
Xilinx Logo
Country of Origin
Traceability Code
Date Code
(YWW= 200Y
workweek #WW)
TSOP Pin 1
XXX YWW
DS123_31_050610
VOG48Package Type
XX
Fab Code
XCF32P™
XXX
XXXXX XX
Device Number
Xilinx Logo
Country of Origin
Fab Code
Traceability Code
Date Code
(YWW= 200Y
workweek #WW)
TFBGA Ball A1
XXX YWW
DS123_32_050610
FG48Package Type
XX
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 32
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Revision History
The following table shows the revision history for this document.
Date Version Revision
04/29/03 1.0 Xilinx Initial Release.
06/03/03 1.1 Made edits to all pages.
11/05/03 2.0 Major revision.
11/18/03 2.1 Pinout corrections as follows:
•Ta bl e 1 3 :
• For VO48 package, removed 38 from VCCINT and added it to VCCO.
• For FS48 package, removed pin D6 from VCCINT and added it to VCCO.
•Ta bl e 1 4 (FS48 package):
• For pin D6, changed name from VCCINT to VCCO.
• For pin A4, changed name from GND to DNC.
•Figure 8 (VO48 package): For pin 38, changed name from VCCINT to VCCO.
12/15/03 2.2 • Added specification (4.7kΩ) for recommended pull-up resistor on OE/RESET pin to section
"Reset and Power-On Reset Activation," page 11.
• Added paragraph to section "Standby Mode," page 12, concerning use of a pull-up resistor
and/or buffer on the DONE pin.
05/07/04 2.3 • Section "Features," page 1: Added package styles and 33 MHz configuration speed limit to
itemized features.
• Section "Description," page 1 and following: Added state conditions for CF and BUSY to the
descriptive text.
•Table 2, page 3: Updated Virtex®-II configuration bitstream sizes.
• Section "Design Revisioning," page 8: Rewritten.
• Section "Initiating FPGA Configuration," page 10 and following, five instances: Added instruction
to tie CF High if it is not tied to the FPGA’s PROG_B (PROGRAM) input.
•Figure 6, page 16, through Figure 13, page 23: Added footnote indicating the directionality of the
CF pin in each configuration.
• Section "I/O Input Voltage Tolerance and Power Sequencing," page 11: Rewritten.
•Table 12, page 25: Added CF column to truth table, and added an additional row to document
the Low state of CF
.
• Section "Absolute Maximum Ratings," page 13: Revised VIN and VTS for ’P’ devices.
• Section "Supply Voltage Requirements for Power-On Reset and Power-Down," page 13:
• Revised footnote callout number on TOER from Footnote (4) to Footnote (3).
• Added Footnote (2) callout to TVCC.
• Section "Recommended Operating Conditions," page 14:
• Added Typical (Typ) parameter columns and parameters for VCCINT and VCCO/VCCJ.
• Added 1.5V operation parameter row to VIL and VIH, ’P’ devices.
•Revised V
IH Min, 2.5V operation, from 2.0V to 1.7V.
• Added parameter row TIN and Max parameters
• (Continued on next page)
• Section "DC Characteristics Over Operating Conditions," page 15:
• Added parameter row and parameters for parallel configuration mode, ’P’ devices, to ICCO.
• Added Footnote (1) and Footnote (2) with callouts in the Test Conditions column for ICCJ,
ICCINTS, ICCOS, and ICCJS, to define active and standby mode requirements.
• Section "AC Characteristics Over Operating Conditions," page 16:
• Corrected description for second TCAC parameter line to show parameters for 1.8V VCCO.
• Revised Footnote (7) to indicate VCCO = 3.3V.
• Applied Footnote (7) to second TCYC parameter line.
• Section "AC Characteristics Over Operating Conditions When Cascading," page 23: Revised
Footnote (5)TCYC Min and TCAC Min formulas.
•Table 14, page 39:
• Added additional state conditions to CLK description.
• Added function of resetting the internal address counter to CF description.
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 33
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07/20/04 2.4 • Added Pb-free package options VOG20, FSG48, and VOG48.
•Figure 6, page 16, and Figure 7, page 17: Corrected connection name for FPGA DOUT
(OPTIONAL Daisy-chained Slave FPGAs with different configurations) from DOUT to DIN.
• Section "Absolute Maximum Ratings," page 13: Removed parameter TSOL from table. (TSOL
information can be found in Package User Guide.)
•Table 2, page 3: Removed reference to XC2VP125 FPGA.
10/18/04 2.5 • Table 1, page 1: Broke out VCCO / VCCJ into two separate columns.
•Table 9, page 9: Added clarification of ID code die revision bits.
•Table 10, page 10: Deleted TCKMIN2 (bypass mode) and renamed TCKMIN1 to TCKMIN.
•Table "Recommended Operating Conditions," page 14: Separated VCCO and VCCJ parameters.
•Table "DC Characteristics Over Operating Conditions," page 15:
• Added most parameter values for XCF08P, XCF16P, XCF32P devices.
• Added Footnote (1) to ICCO specifying no-load conditions.
•Table "AC Characteristics Over Operating Conditions," page 16:
• Added most parameter values for XCF08P, XCF16P, XCF32P devices.
• Expanded Footnote (1) to include XCF08P, XCF16P, XCF32P devices.
• Added Footnote (8) through (11) relating to CLKOUT conditions for various parameters.
• Added rows to TCYC specifying parameters for parallel mode.
• Added rows specifying parameters with decompression for TCLKO, TCOH, TFF
, TSF
.
• Added TDDC (setup time with decompression).
•Table "AC Characteristics Over Operating Conditions When Cascading," page 23:
• Added most parameter values for XCF08P, XCF16P, XCF32P devices.
• Separated Footnote (5) into Footnotes (5) and (6) to specify different derivations of TCYC,
depending on whether dual-purpose configuration pins persist as configuration pins, or
become general I/O pins after configuration.
03/14/05 2.6 • Added Virtex-4 LX/FX/SX configuration data to Table 2.
• Corrected Virtex-II configuration data in Table 2.
• Corrected Virtex-II Pro configuration data in Table 2.
• Added Spartan®-3L configuration data to Table 2.
• Added Spartan-3E configuration data to Table 2.
• Paragraph added to FPGA Master SelectMAP (Parallel) Mode (1).
• Changes to DC Characteristics
•T
OER changed, Page 15.
•I
OL changed for VOL, Page 15.
•V
CCO added to test conditions for IIL, IILP
, IIHP
,and IIH, Page 15. Values modified for IILP and
IIHP.
• Changes to AC Characteristics
•T
LC and THC modified for 1.8V, Page 19.
• New rows added for TCEC and TOEC, Page 18.
• Minor changes to grammar and punctuation.
• Added explanation of "Preliminary" to DC and AC Electrical Characteristics.
07/11/05 2.7 • Move from "Preliminary" to "Product Specification"
• Corrections to Virtex-4 configuration bitstream values
• Minor changes to Figure 7, page 17, Figure 12, page 22, Figure 13, page 23, and Figure 16,
page 31
• Change to "Internal Oscillator," page 8 description
• Change to "CLKOUT," page 8 description
12/29/05 2.8 • Update to the first paragraph of "IEEE 1149.1 Boundary-Scan (JTAG)," page 5.
• Added JTAG cautionary note to Page 5.
• Corrected logic values for Erase/Program (ER/PROG) Status field, IR[4], listed under "XCFxxP
Instruction Register (16 bits wide)," page 5.
• Sections "XCFxxS and XCFxxP PROM as Configuration Slave with CLK Input Pin as Clock
Source," page 16, "XCFxxP PROM as Configuration Master with CLK Input Pin as Clock
Source," page 18 and "XCFxxP PROM as Configuration Master with Internal Oscillator as Clock
Source," page 21 added to "AC Characteristics Over Operating Conditions," page 16.
Date Version Revision
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 34
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12/29/05
(Cont’d)
2.8 • Notes for Figure 6, page 16, Figure 7, page 17, Figure 8, page 18, Figure 9, page 19, Figure 10,
page 20, Figure 11, page 21, Figure 12, page 22, and Figure 13, page 23 updated to specify the
need for a pull-up resistor if CF is not connected to PROGB.
• Enhanced description under section "CLKOUT," page 8.
• Enhanced description on design revision sampling under section "Design Revisioning," page 8.
• Figure 4 and Figure 5 renamed to Table 7, page 8 and Table 8, page 8 respectively. All tables,
figures, and table and figure references renumber this point forward.
• Value for "ICCINT," page 15 updated from 5mA to 1mA for XCFxxP.
• Block diagram in Figure 2, page 2 updated to show clock source muxing and route clocking to all
functional blocks.
05/09/06 2.9 • Added Virtex-5 LX support to Table 2.
•"VIL" maximum for 2.5V operation in "Recommended Operating Conditions," page 14 updated
to match LVCMOS25 standard.
12/08/06 2.10 • Added Virtex-5 LXT support to Table 2.
• Defined reprogramming operation requirements in "Programming," page 3.
• Corrected statements regarding the FPGA BUSY pin and corrected various references.
02/01/07 2.11 • Removed Spartan-3L support and added Spartan-3A and Virtex-5 SXT support to Table 2.
• Corrected Spartan-3E bitstream sizes in Table 2.
• Correct supported voltages for "VCCJ" in Table12, page24, "VCCO" and "VCCJ" in Ta ble 13 ,
page 26.
03/30/07 2.11.1 Added Spartan-3A DSP support to Table 2.
01/28/08 2.12 • Added support for XC5VLX155, XC5VLX20T, and XC5VLX155T.
• Updated JTAG TAP timing specifications in Table 9, page 7 to reflect improved performance.
• Tied FPGA CS_B and FPGA RDWR_B to GND in the FPGA SelectMAP schematics to ensure
valid logic Low.
• Hardwired external oscillator to FPGA CCLK in the FPGA slave mode schematics.
• Added marking templates (Figure 14, page 31, Figure 15 and Figure 16), and corrected marks
for 48-pin TFBGA packages in "Marking Information," page 30.
• Other edits and updates made.
• Updated document template.
• Updated URLs.
03/31/08 2.13 • Added Virtex-5 FX FPGA support to Table 2.
• Corrected markings for all packaging (Figure 14, page 31, Figure 15, and Figure 16).
• Added note regarding variances in packaging and marking to Page 31.
04/03/08 2.13.1 • Corrected typo.
• Updated trademark notations.
05/14/08 2.14 Added support for XC5VSX240T and Platform Flash XL to Table 2.
07/07/08 2.15 Updated "Write Protection," page 4.
11/14/08 2.16 Added Virtex-5 TXT FPGA to Table 2.
10/26/09 2.17 • Globally changed PROG_B and PROGRAM to PROGRAM_B.
• Removed the following information from this data sheet to UG161, Platform Flash PROM User
Guide:
• Table 2 entitled “Xilinx FPGAs and Compatible Platform Flash PROMs”
• Section entitled “PROM to FPGA Configuration Mode and Connections Summary”
• Section entitled “Configuration PROM-to-FPGA Device Interface Connection Diagrams”
• Moved “up to 33 MHz” from FPGA Configuration Interface bullets in "Features," page 1 to
"Description," page 1, and added reference to related considerations.
•Table 1, page 1: Changed lower bound on VCCO for XCF08P, XCF16P, and XCF32P devices
from 1.5V to 1.8V. Added table note 1 about design revisioning for the XCF08P.
• Added statement about ignoring non-JTAG input pins to second paragraph of "In-System
Programming," page 3.
• Added reference to Platform Flash PROM User Guide in "External Programming," page 3 and
"Internal Oscillator," page 8.
Date Version Revision
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010 www.xilinx.com
Product Specification 35
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Notice of Disclaimer
THE XILINX HARDWARE FPGA AND CPLD DEVICES REFERRED TO HEREIN (“PRODUCTS”) ARE SUBJECT TO THE TERMS AND
CONDITIONS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED AT http://www.xilinx.com/warranty.htm. THIS LIMITED
WARRANTY DOES NOT EXTEND TO ANY USE OF PRODUCTS IN AN APPLICATION OR ENVIRONMENT THAT IS NOT WITHIN THE
SPECIFICATIONS STATED IN THE XILINX DATA SHEET. ALL SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE.
PRODUCTS ARE NOT DESIGNED OR INTENDED TO BE FAIL-SAFE OR FOR USE IN ANY APPLICATION REQUIRING FAIL-SAFE
PERFORMANCE, SUCH AS LIFE-SUPPORT OR SAFETY DEVICES OR SYSTEMS, OR ANY OTHER APPLICATION THAT INVOKES
THE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). USE OF PRODUCTS IN CRITICAL APPLICATIONS IS AT THE SOLE RISK OF CUSTOMER, SUBJECT TO
APPLICABLE LAWS AND REGULATIONS.
10/26/09 2.17
(Cont’d)
• Updated text in second and third bulleted items in "Initiating FPGA Configuration," page 10.
• Removed all references to 1.5V operation from "Features," page 1, "Recommended Operating
Conditions," page 14, "DC Characteristics Over Operating Conditions," page 15, and Table 13 ,
page 26.
05/19/10 2.18 Removed ordering codes for discontinued VO48 package from "Valid Ordering Combinations" (see
XCN09030). Added note to Figure 15 and Figure 16 describing traceability code in top mark (see
XCN08005).
Date Version Revision
