PACKAGE SCHEMATIC
4/14/03
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© 2003 Fairchild Semiconductor Corporation
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MOC3081M MOC3082M MOC3083M
DESCRIPTION
The MOC3081M, MOC3082M and MOC3083M devices consist of a GaAs infrared emitting diode optically coupled to a monolithic
silicon detector performing the function of a zero voltage crossing bilateral triac driver.
They are designed for use with a discrete power triac in the interface of logic systems to equipment powered from 240 VAC lines,
such as solid-state relays, industrial controls, motors, solenoids and consumer appliances, etc.
FEATURES
• Underwriters Laboratories (UL) recognized - file #E90700, Volume 2
• VDE recognized - file #102497 - add option V (e.g., MOC3083VM)
• Simplifies logic control of 240 VAC power
• Zero voltage crossing
• dv/dt of 1500 V/µs typical, 600 V/µs guaranteed
• Compatible with Fairchild’s FKPF12N80 discrete power triac
APPLICATIONS
• Solenoid/valve controls
• Lighting controls
• Static power switches
•AC motor drives
•Temperature controls
• E.M. contactors
•AC motor starters
• Solid state relays
MAIN TERM.
NC*
N/C
*DO NOT CONNECT
(TRIAC SUBSTRATE)
1
2
3
ANODE
CATHODE
4
5
6MAIN TERM.
ZERO
CROSSING
CIRCUIT
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MOC3081M MOC3082M MOC3083M
ABSOLUTE MAXIMUM RATINGS
(T
A
= 25°C unless otherwise noted)
Parameters Symbol Value Units
TOTAL DEVICE
Storage Temperature T
STG
-40 to +150 °C
Operating Temperature T
OPR
-40 to +85 °C
Lead Solder Temperature T
SOL
260 for 10 sec °C
Junction Temperature Range T
J
-40 to +100 °C
Isolation Surge Voltage
(4)
(peak AC voltage, 60Hz, 1 sec duration) V
ISO
7500 Vac(pk)
Total Device Power Dissipation @ 25°C
Derate above 25°C P
D
250 mW
2.94 mW/°C
EMITTER
Continuous Forward Current I
F
60 mA
Reverse Voltage V
R
6V
Total Power Dissipation 25°C Ambient P
D
120 mW
Derate above 25°C 1.41 mW/°C
DETECTOR
Off-State Output Terminal Voltage V
DRM
800 V
Peak Repetitive Surge Current (PW = 100 µs, 120 pps) I
TSM
1A
Total Power Dissipation @ 25°C Ambient P
D
150 mW
Derate above 25°C 1.76 mW/°C
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MOC3081M MOC3082M MOC3083M
*Typical values at T
A
= 25°C
Note
1. Test voltage must be applied within dv/dt rating.
2. All devices are guaranteed to trigger at an I
F
value less than or equal to max I
FT
. Therefore, recommended operating I
F
lies
between max I
FT
(15 mA for MOC3081M, 10 mA for MOC3082M, 5 mA for MOC3083M) and absolute max I
F
(60 mA).
3. This is static dv/dt. See Figure 9 for test circuit. Commutating dv/dt is a function of the load-driving thyristor(s) only.
4. Isolation surge voltage, V
ISO
, is an internal device dielectric breakdown rating. For this test, Pins 1 and 2 are common,
and Pins 4, 5 and 6 are common.
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C Unless otherwise specified)
INDIVIDUAL COMPONENT CHARACTERISTICS
Parameters Test Conditions Symbol Min Typ* Max Units
EMITTER
Input Forward Voltage I
F
= 30 mA V
F
1.3 1.5 V
Reverse Leakage Current V
R
= 6 V I
R
0.005 100 µA
DETECTOR
Peak Blocking Current, Either Direction V
DRM
= 800V, I
F
= 0 (note 1) I
DRM1
10 500 nA
Critical Rate of Rise of Off-State Voltage I
F
= 0 (figure 9, note 3) dv/dt 600 1500 V/µs
TRANSFER CHARACTERISTICS
(T
A
= 25°C Unless otherwise specified.)
DC Characteristics Test Conditions Symbol Device Min Typ* Max Units
LED Trigger Current Main Terminal
Voltage = 3V (note 2) I
FT
MOC3081M 15
mAMOC3082M 10
MOC3083M 5
Peak On-State Voltage,
Either Direction
I
TM
= 100 mA peak,
I
F
= rated I
FT
V
TM
All 1.8 3 V
Holding Current, Either Direction I
H
All 500 µA
ZERO CROSSING CHARACTERISTICS
(T
A
= 25°C Unless otherwise specified.)
DC Characteristics Test Conditions Symbol Device Min Typ* Max Units
Inhibit Voltage (MT1-MT2 voltage
above which device will not trigger) I
F
= Rated I
FT
V
INH
All 12 20 V
Leakage in Inhibited State I
F
= Rated I
FT
,
V
DRM
= 800V, off state I
DRM2
All 200 500 µA
ISOLATION CHARACTERISTICS
Characteristics Test Conditions Symbol Min Typ* Max Units
Input-Output Isolation Voltage f = 60 Hz, t = 1 sec (note 4) V
ISO
7500 Vac(pk)
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MOC3081M MOC3082M MOC3083M
Figure 1. LED Forward Voltage vs. Forward Current
Figure 3. LED Current Required to Trigger vs.
LED Pulse Width Figure 4. Leakage Current, IDRM vs. Temperature
Figure 2. Trigger Current Vs. Temperature
IF, LED FORWARD CURRENT (mA)
0.1 1 10 100
VF, FORWARD VOLTAGE (V)
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
TA, AMBIENT TEMPERATURE (°C)
-40 -20 0 20 40 60 80 100
TA, AMBIENT TEMPERATURE (°C)
-40 -20 0 20 40 60 80 100
IFT, NORMALIZED
IDRM, LEAKAGE CURRENT (nA)
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
PWIN, LED TRIGGER PULSE WIDTH (µs)
101 100
IFT, LED TRIGGER CURRENT (NORMALIZED)
0
2
4
6
8
10
12
14
16
0.1
1
10
100
1000
10000
TA = -40°C
VTM = 3V
NORMALIZED TO TA = 25°C
TA = 25°C
NORMALIZED TO PWIN >> 100µs
TA = 25°C
TA = 85°C
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MOC3081M MOC3082M MOC3083M
Figure 5. IDRM2, Leakage in Inhibit State vs. Temperature
Figure 7. IH, Holding Current vs. Temperature Figure 8. Inhibit Voltage vs. Temperature
Figure 6. On-State Characteristics
VTM, ON-STATE VOLTAGE (VOLTS)
TA, AMBIENT TEMPERATURE (°C)
-40 -20 0 20 40 60 80 100
TA, AMBIENT TEMPERATURE (°C)
-40 -20 0 20 40 60 80 100 TA, AMBIENT TEMPERATURE (°C)
-40 -20 0 20 40 60 80 100
IDRM2, NORMALIZED
VINH, NORMALIZED
IH, HOLDING CURRENT (NORMALIZED)
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
IF = RATED IFT
NORMALIZED TO TA = 25°C
-4 -3 -2 -1 0 1 2 3 4
ITM, ON-STATE CURRENT (mA)
TA = 25°C
-800
-600
-400
-200
0
200
400
600
800
0.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
0.80
0.85
0.90
0.95
1.00
1.05
1.10
1.15
1.20
NORMALIZED TO TA = 25°C
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MOC3081M MOC3082M MOC3083M
1. The mercury wetted relay provides a high speed repeated
pulse to the D.U.T.
2. 100x scope probes are used, to allow high speeds and
voltages.
3. The worst-case condition for static dv/dt is established by
triggering the D.U.T. with a normal LED input current, then
removing the current. The variable R
TEST
allows the dv/dt
to be gradually increased until the D.U.T. continues to
trigger in response to the applied voltage pulse, even
after the LED current has been removed. The dv/dt is
then decreased until the D.U.T. stops triggering.
τ
RC
is
measured at this point and recorded.
Typical circuit for use when hot line switching is required. In this circuit the “hot” side of the line is switched and the load connected
to the cold or neutral side. The load may be connected to either the neutral or hot line.
R
in
is calculated so that I
F
is equal to the rated I
FT
of the part, 15 mA for the MOC3081M, 10 mA for the MOC3082M, and 5 mA for
the MOC3083M. The 39 ohm resistor and 0.01 µF capacitor are for snubbing of the triac and may or may not be necessary
depending upon the particular triac and load use.
Figure 9. Static dv/dt Test Circuit
Vdc
800V
10 kΩ
CTEST
X100
SCOPE
PROBE
PULSE
INPUT MERCURY
WETTED
RELAY
RTEST
D.U.T.D.U.T.
Figure 10. Static dv/dt Test Waveform
504 V
0 VOLTS
APPLIED VOLTAGE
WAVEFORM
Vmax = 800 V
dv/dt = 0.63 Vmax = 504
τRC
τRC τRC
Figure 11. Hot-Line Switching Application Circuit
0.01
VCC
Rin 1
2
3
6
5
4240 VAC
HOT
FKPF12N80
NEUTRAL
360 Ω
* For highly inductive loads (power factor < 0.5), change this value to 360 ohms.
330 Ω
MOC3081M
MOC3082M
MOC3083M 39*
LOAD
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MOC3081M MOC3082M MOC3083M
Suggested method of firing two, back-to-back SCR’s with a Fairchild triac driver. Diodes can be 1N4001; resistors, R1 and R2, are
optional 330 ohm.
Note: This optoisolator should not be used to drive a load directly. It is intended to be a trigger device only.
Figure 12. Inverse-Parallel SCR Driver Circuit
VCC
Rin
1
2
3
6
5
4
240 VAC
SCR
360 Ω
R1 D1
SCR
MOC3081M
MOC3082M
MOC3083M
R2 D2
LOAD
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MOC3081M MOC3082M MOC3083M
NOTE
All dimensions are in inches (millimeters)
Package Dimensions (Through Hole) Package Dimensions (Surface Mount)
Package Dimensions (0.4” Lead Spacing) Recommended Pad Layout for
Surface Mount Leadform
0.350 (8.89)
0.320 (8.13)
0.260 (6.60)
0.240 (6.10)
0.320 (8.13)
0.070 (1.77)
0.040 (1.02) 0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.100 (2.54)
0.015 (0.38)
0.020 (0.50)
0.016 (0.41) 0.100 (2.54) 15°
0.012 (0.30)
0.350 (8.89)
0.320 (8.13)
0.260 (6.60)
0.240 (6.10)
0.390 (9.90)
0.332 (8.43)
0.070 (1.77)
0.040 (1.02)
0.014 (0.36)
0.010 (0.25)
0.320 (8.13)
0.035 (0.88)
0.006 (0.16)
0.012 (0.30)
0.008 (0.20)
0.200 (5.08)
0.115 (2.93)
0.025 (0.63)
0.020 (0.51)
0.020 (0.50)
0.016 (0.41)
0.100 [2.54]
0.350 (8.89)
0.320 (8.13)
0.260 (6.60)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02) 0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.020 (0.50)
0.016 (0.41)
0.100 [2.54]
0.100 (2.54)
0.015 (0.38)
0.012 (0.30)
0.008 (0.21)
0.425 (10.80)
0.400 (10.16)
0.070
(
1.78
)
0.060
(
1.52
)
0.030
(
0.76
)
0.100
(
2.54
)
0.305
(
7.75
)
0.425
(
10.79
)
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MOC3081M MOC3082M MOC3083M
ORDERING INFORMATION
MARKING INFORMATION
Order Entry Identifier Description
S Surface Mount Lead Bend
SR2 Surface Mount; Tape and reel
T 0.4" Lead Spacing
V VDE 0884
TV VDE 0884, 0.4" Lead Spacing
SV VDE 0884, Surface Mount
SR2V VDE 0884, Surface Mount, Tape & Reel
MOC3082
V X YY Q
1
2
6
43 5
*Note – Parts that do not have the ‘V’ option (see definition 3 above) that are marked with
date code ‘325’ or earlier are marked in portrait format.
Definitions
1Fairchild logo
2Device number
3VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4 One digit year code, e.g., ‘3’
5Two digit work week ranging from ‘01’ to ‘53’
6 Assembly package code
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MOC3081M MOC3082M MOC3083M
NOTE
All dimensions are in inches (millimeters)
Reflow Profile
Carrier Tape Specifications
4.0 ± 0.1
Ø1.5 MIN
User Direction of Feed
2.0 ± 0.05
1.75 ± 0.10
11.5 ± 1.0
24.0 ± 0.3
12.0 ± 0.1
0.30 ± 0.05
21.0 ± 0.1
4.5 ± 0.20
0.1 MAX 10.1 ± 0.20
9.1 ± 0.20
Ø1.5 ± 0.1/-0
Ramp up = 2–10°C/sec • Peak reflow temperature: 245°C (package surface temperature)
• Time of temperature higher than 183°C for 120–180 seconds
• One time soldering reflow is recommended
230°C, 10–30 s
Time (Minute)
0
300
250
200
150
100
50
0
0.5 1 1.5 2 2.5 3 3.5 4 4.5
Temperature (°C)
Time above 183°C, 120–180 sec
245°C peak
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
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MOC3081M MOC3082M MOC3083M
