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FEATURES
APPLICATIONS
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1DISCH
1THRES
1CONT
1RESET
1OUT
1TRIG
GND
VCC
2DISCH
2THRES
2CONT
2RESET
2OUT
2TRIG
NA556...D OR N PACKAGE
NE556...D, N, OR NS PACKAGE
SA556...D OR N PACKAGE
SE556...J PACKAGE
(TOP VIEW)
DESCRIPTION/ORDERING INFORMATION
NA556 , NE556 , SA556 , SE556DUAL PRECISION TIMERS
SLFS023G – APRIL 1978 – REVISED JUNE 2006
•Two Precision Timing Circuits Per Package•Astable or Monostable Operation•TTL-Compatible Output Can Sink or Sourceup to 150 mA•Active Pullup or Pulldown•Designed to Be Interchangeable WithSignetics NE556, SA556, and SE556
•Precision Timers From Microseconds toHours
•Pulse-Shaping Circuits•Missing-Pulse Detectors•Tone-Burst Generators•Pulse-Width Modulators•Pulse-Position Modulators•Sequential Timers•Pulse Generators
•Frequency Dividers•Application Timers•Industrial Controls•Touch-Tone Encoders
These devices provide two independent timing circuits of the NA555, NE555, SA555, or SE555 type in eachpackage. These circuits can be operated in the astable or the monostable mode with external resistor-capacitor(RC) timing control. The basic timing provided by the RC time constant can be controlled actively by modulatingthe bias of the control-voltage input.
The threshold (THRES) and trigger (TRIG) levels normally are two-thirds and one-third, respectively, of V
CC
.These levels can be altered by using the control voltage (CONT) terminal. When the trigger input falls belowtrigger level, the flip-flop is set and the output goes high. If the trigger input is above the trigger level and thethreshold input is above the threshold level, the flip-flop is reset, and the output is low. The reset (RESET) inputcan override all other inputs and can be used to initiate a new timing cycle. When RESET goes low, the flip-flopis reset and the output goes low. When the output is low, a low-impedance path is provided between thedischarge (DISCH) terminal and ground (GND).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1978–2006, Texas Instruments IncorporatedProducts conform to specifications per the terms of the Texas
On products compliant to MIL-PRF-38535, all parameters areInstruments standard warranty. Production processing does not
tested unless otherwise noted. On all other products, productionnecessarily include testing of all parameters.
processing does not necessarily include testing of all parameters.
www.ti.com
OUT
RESETVCC
CONT
GND
DISCH
THRES
TRIG
RESET can overrideTRIG, which can overrideTHRES.
NA556 , NE556 , SA556 , SE556DUAL PRECISION TIMERS
SLFS023G – APRIL 1978 – REVISED JUNE 2006
ORDERING INFORMATION
V
T
(MAX)T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKINGV
CC
= 15 V
PDIP – N Tube of 25 NE556N NE556NTube of 50 NE556D0°C to 70 °C 11.2 V SOIC – D NE556Reel of 2500 NE556DRSOP – NS Reel of 2000 NE556NSR NE556–40 °C to 85 °C 11.2 V PDIP – N Tube of 25 SA556N SA556NPDIP – N Tube of 25 NA556N NA556N–40 °C to 105 °C 11.2 V Tube of 50 NA556DSOIC – D NA556Reel of 2500 NA556DR
SE556J SE556J–55 °C to 125 °C 10.6 V CDIP – J Tube of 25
SE556JB SE556JB
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
FUNCTION TABLE(each timer)
TRIGGER THRESHOLD DISCHARGERESET OUTPUTVOLTAGE
(1)
VOLTAGE
(1)
SWITCH
Low Irrelevant Irrelevant Low OnHigh <1/3 V
DD
Irrelevant High OffHigh >1/3 V
DD
>2/3 V
DD
Low OnHigh >1/3 V
DD
<2/3 V
DD
As previously established
(1) Voltage levels shown are nominal.
FUNCTIONAL BLOCK DIAGRAM, EACH TIMER
2
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Absolute Maximum Ratings
(1)
Recommended Operating Conditions
NA556 , NE556 , SA556 , SE556DUAL PRECISION TIMERS
SLFS023G – APRIL 1978 – REVISED JUNE 2006
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage
(2)
18 VV
I
Input voltage CONT, RESET, THRES, and TRIG V
CC
VI
O
Output current ±225 mAD package 86θ
JA
Package thermal impedance
(3) (4)
N package 80 °C/WNS package 76θ
JC
Package thermal impedance
(5) (6)
J package 15.05 °C/WT
J
Operating virtual junction temperature 150 °CLead temperature 1,6 mm (1/16 in) from case for 60 s J package 300 °CLead temperature 1,6 mm (1/16 in) from case for 10 s D, N, or NS package 260 °CT
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltage values are with respect to network ground terminal.(3) Maximum power dissipation is a function of T
J
(max), θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambienttemperature is P
D
= (T
J
(max) – T
A
)/ θ
JA
. Operating at the absolute maximum T
J
of 150 °C can affect reliability.(4) The package thermal impedance is calculated in accordance with JESD 51-7.(5) Maximum power dissipation is a function of T
J
(max), θ
JC
, and T
C
. The maximum allowable power dissipation at any allowable casetemperature is P
D
= (T
J
(max) – T
C
)/ θ
JC
. Operating at the absolute maximum T
J
of 150 °C can affect reliability.(6) The package thermal impedance is calculated in accordance with MIL-STD-883.
MIN MAX UNIT
NA556, NE556, SA556 4.5 16V
CC
Supply voltage VSE556 4.5 18V
I
Input voltage CONT, RESET, THRES, and TRIG V
CC
VI
O
Output current ±200 mANA556 –40 105NE556 0 70T
A
Operating free-air temperature °CSA556 –40 85SE556 –55 125
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Electrical Characteristics
NA556 , NE556 , SA556 , SE556DUAL PRECISION TIMERS
SLFS023G – APRIL 1978 – REVISED JUNE 2006
V
CC
= 5 V to 15 V, T
A
= 25 °C (unless otherwise noted)
NA556
NE556 SE556PARAMETER TEST CONDITIONS UNITSA556
MIN TYP MAX MIN TYP MAX
V
CC
= 15 V 8.8 10 11.2 9.4 10 10.6Threshold voltageV
T
Vlevel
V
CC
= 5 V 2.4 3.3 4.2 2.7 3.3 4I
T
Threshold current
(1)
30 250 30 250 nA4.5 5 5.6 4.8 5 5.2V
CC
= 15 V
T
A
= –55 °C to 125 °C 3 6V
TRIG
Trigger voltage level V1.1 1.67 2.2 1.45 1.67 1.9V
CC
= 5 V
T
A
= –55 °C to 125 °C 1.9I
TRIG
Trigger current TRIG at 0 V 0.5 2 0.5 0.9 µA0.3 0.7 1 0.3 0.7 1V
RESET
Reset voltage level VT
A
= –55 °C to 125 °C 1.1RESET at V
CC
0.1 0.4 0.1 0.4I
RESET
Reset current mARESET at 0 V –0.4 1.5 –0.4 –1Discharge switchI
DISCH
20 100 20 100 nAoff-state current
9 10 11 9.6 10 10.4V
CC
= 15 V
T
A
= –55 °C to 125 °C 9.6 10.4Control voltageV
CONT
V(open circuit)
2.6 3.3 4 2.9 3.3 3.8V
CC
= 5 V
T
A
= –55 °C to 125 °C 2.9 3.80.1 0.25 0.1 0.15V
CC
= 15 V,I
OL
= 10 mA
T
A
= –55 °C to 125 °C 0.20.4 0.75 0.4 0.5V
CC
= 15 V,I
OL
= 50 mA
T
A
= –55 °C to 125 °C 12 2.5 2 2.2V
CC
= 15 V,I
OL
= 100 mALow-level T
A
= –55 °C to 125 °C 2.7V
OL
Voutput voltage
V
CC
= 15 V, I
OL
= 200 mA 2.5 2.5V
CC
= 5 V,
T
A
= –55 °C to 125 °C 0.35I
OL
= 3.5 mA
0.1 0.25 0.1 0.15V
CC
= 5 V,I
OL
= 5 mA
T
A
= –55 °C to 125 °C 0.8V
CC
= 5 V, I
OL
= 8 mA 0.15 0.3 0.15 0.2512.75 13.3 13 13.3V
CC
= 15 V,I
OH
= –100 mA
T
A
= –55 °C to 125 °C 12High-levelV
OH
V
CC
= 15 V, I
OH
= –200 mA 12.5 12.5 Voutput voltage
2.75 3.3 3 3.3V
CC
= 5 V,I
OH
= –100 mA
T
A
= –55 °C to 125 °C 2V
CC
= 15 V 20 30 20 24Output low,No load
V
CC
= 5 V 6 12 6 10I
CC
Supply current mAV
CC
= 15 V 18 26 18 20Output high,No load
V
CC
= 5 V 4 10 4 8
(1) This parameter influences the maximum value of the timing resistors R and R
B
in the circuit of Figure 1 . For example, when V
CC
= 5 V,the maximum value is R = R
A
+ R
B
≈3.4 M Ω, and for V
CC
= 15 V, the maximum value is ≈10 M Ω.
4
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Operating Characteristics
NA556 , NE556 , SA556 , SE556DUAL PRECISION TIMERS
SLFS023G – APRIL 1978 – REVISED JUNE 2006
V
CC
= 5 V and 15 V
NA556
NE556 SE556TESTPARAMETER UNITSA556CONDITIONS
(1)
MIN TYP MAX MIN TYP MAX
Each timer,
1 3 0.5 1.5
(4)monostable
(3)Initial error of timing
T
A
= 25 °Cinterval
(2)
Each timer, astable
(5)
2.25% 1.5%Timer 1 – Timer 2 ±1±0.5Each timer,
50 30 100
(4)Temperature
monostable
(3)
coefficient of timing T
A
= MIN to MAX ppm/ °CEach timer, astable
(5)
150 90interval
Timer 1 – Timer 2 ±10 ±10Each timer,
0.1 0.5 0.05 0.2
(4)Supply voltage
monostable
(3)
sensitivity of timing T
A
= 25 °C %/VEach timer, astable
(5)
0.3 0.15interval
Timer 1 – Timer 2 ±0.2 ±0.1C
L
= 15 pF,Output-pulse rise time 100 300 100 200
(4)
nsT
A
= 25 °CC
L
= 15 pF,Output-pulse fall time 100 300 100 200
(4)
nsT
A
= 25 °C
(1) For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.(2) Timing-interval error is defined as the difference between the measured value and the average value of a random sample from eachprocess run.(3) Values specified are for a device in a monostable circuit similar to Figure 2 , with the following component values: R
A
= 2 k Ωto 100 k Ω,C = 0.1 µF.(4) On products compliant to MIL-PRF-38535, this parameter is not production tested.(5) Values specified are for a device in an astable circuit similar to Figure 1 , with the following component values: R
A
= 1 k Ωto 100 k Ω,C = 0.1 µF.
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APPLICATION INFORMATION
RA
RL
OUT
VCC
(5V to 15V)
VCC
CONT
RESET
DISCH
THRES
TRIG GND
OUT
Input
0.01 µF
C
RB
C
RA
Open
(see Note A)
RL
OUT
VCC
(5V to 15V)
VCC
CONT
RESET
DISCH
THRES
TRIG GND
OUT
NOTE A: Bypassing the control-voltage input to ground with a
capacitor might improve operation.This should be evaluated
for individual applications.
NA556 , NE556 , SA556 , SE556DUAL PRECISION TIMERS
SLFS023G – APRIL 1978 – REVISED JUNE 2006
Figure 1. Circuit for Astable Operation Figure 2. Circuit for Monostable Operation
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PACKAGE OPTION ADDENDUM
www.ti.com 25-Jan-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
JM38510/10902BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
M38510/10902BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
NA556D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NA556DG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NA556DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NA556DRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NA556N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
NA556NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
NE556D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE556DBR ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE556DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE556DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE556DE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE556DG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE556DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE556DRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE556DRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE556N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
NE556NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 25-Jan-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
NE556NSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE556NSRE4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE556NSRG4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SA556D OBSOLETE SOIC D 14 TBD Call TI Call TI
SA556DR OBSOLETE SOIC D 14 TBD Call TI Call TI
SA556N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SA556NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SE556FKB OBSOLETE LCCC FK 20 TBD Call TI Call TI
SE556J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SE556JB ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 25-Jan-2012
Addendum-Page 3
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
NA556DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
NE556DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
NE556DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
NE556NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
NA556DR SOIC D 14 2500 367.0 367.0 38.0
NE556DBR SSOP DB 14 2000 367.0 367.0 38.0
NE556DR SOIC D 14 2500 367.0 367.0 38.0
NE556NSR SO NS 14 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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