A1101, A1102, A1103, A1104, and A1106 Continuous-Time Switch Family FEATURES AND BENEFITS DESCRIPTION * AEC-Q100 automotive qualified * Continuous-time operation Fast power-on time Low noise * Stable operation over full operating temperature range * Reverse battery protection * Solid-state reliability * Factory-programmed at end-of-line for optimum performance * Robust EMC performance * High ESD rating * Regulator stability without a bypass capacitor The AllegroTM A1101-A1104 and A1106 Hall-effect switches are next generation replacements for the popular Allegro 312x and 314x lines of unipolar switches. The A110x family, produced with BiCMOS technology, consists of devices that feature fast power-on time and low-noise operation. Device programming is performed after packaging, to ensure increased switchpoint accuracy by eliminating offsets that can be induced by package stress. Unique Hall element geometries and lowoffset amplifiers help to minimize noise and to reduce the residual offset voltage normally caused by device overmolding, temperature excursions, and thermal stress. The A1101-A1104 and A1106 Hall-effect switches include the following on a single silicon chip: voltage regulator, Hallvoltage generator, small-signal amplifier, Schmitt trigger, and NMOS output transistor. The integrated voltage regulator permits operation from 3.8 to 24 V. The extensive on-board protection circuitry makes possible a 30 V absolute maximum voltage rating for superior protection in automotive and industrial motor commutation applications, without adding external components. All devices in the family are identical except for magnetic switchpoint levels. PACKAGES: Not to scale NOT FOR NEW DESIGN The small geometries of the BiCMOS process allow these devices to be provided in ultrasmall packages. The package styles available provide magnetically optimized solutions for most applications. Package LH is an SOT23W, a miniature lowprofile surface-mount package, while package UA is a three-lead ultramini SIP for through-hole mounting. Each package is lead (Pb) free, with 100% matte-tin-plated leadframes. 3-pin SOT23W (suffix LH) 3-pin SIP, matrix HD style (suffix UA) 3-pin SIP, chopper style (suffix UA) VCC To all subcircuits Regulator VOUT Amp Gain Offset Trim Control GND Functional Block Diagram A1101-DS, Rev. 17 October 27, 2016 A1101, A1102, A1103, A1104, and A1106 Continuous-Time Switch Family SPECIFICATIONS SELECTION GUIDE Part Number 1 2 Packing [1] Mounting Ambient, TA A1101ELHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount A1101ELHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount A1101EUA-T [2] Bulk, 500 pieces/bag 3-pin SIP through hole A1101LLHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount A1101LLHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount A1101LUA-T [2] Bulk, 500 pieces/bag 3-pin SIP through hole A1102ELHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount A1102ELHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount A1102EUA-T [2] Bulk, 500 pieces/bag 3-pin SIP through hole A1102LLHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount A1102LLHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount A1102LUA-T [2] Bulk, 500 pieces/bag 3-pin SIP through hole A1103ELHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount A1103ELHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount A1103LLHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount A1103LLHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount A1103LUA-T [2] Bulk, 500 pieces/bag 3-pin SIP through hole A1104EUA-T [2] Bulk, 500 pieces/bag 3-pin SIP through hole A1104LLHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount A1104LLHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount A1104LUA-T [2] Bulk, 500 pieces/bag 3-pin SIP through hole A1106EUA-T Bulk, 500 pieces/bag 3-pin SIP through hole BRP (Min) BOP (Max) 10 175 60 245 150 355 25 450 160 430 -40C to 85C -40C to 150C -40C to 85C -40C to 150C -40C to 85C -40C to 150C -40C to 85C -40C to 150C -40C to 85C A1106LLHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount A1106LLHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount A1106LUA-T Bulk, 500 pieces/bag 3-pin SIP through hole -40C to 150C Contact Allegro for additional packing options. The chopper-style UA package is not for new design; the matrix HD style UA package is recommended for new designs. ABSOLUTE MAXIMUM RATINGS Rating Units Supply Voltage Characteristic Symbol VCC Notes 30 V Reverse Supply Voltage VRCC -30 V Output Off Voltage VOUT 30 V Reverse Output Voltage VROUT -0.5 V Output Current IOUTSINK 25 mA Magnetic Flux Density B Unlimited G Operating Ambient Temperature TA Maximum Junction Temperature Storage Temperature Range E -40 to 85 C Range L -40 to 150 C TJ(max) 165 C Tstg -65 to 170 C Allegro MicroSystems, LLC 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com 2 A1101, A1102, A1103, A1104, and A1106 Continuous-Time Switch Family ELECTRICAL OPERATING CHARACTERISTICS over full operating voltage and ambient temperature ranges, unless otherwise noted Characteristic Supply Symbol Test Conditions Min. Typ. Max. Units Voltage [1] VCC Operating, TJ < 165C 3.8 - 24 V Output Leakage Current IOUTOFF VOUT = 24 V, B < BRP - - 10 A VOUT(SAT) IOUT = 20 mA, B > BOP - 215 400 mV Slew rate (dVCC/dt) < 2.5 V/s, B > BOP + 5 G or B< BRP -5G - - 4 s tr VCC = 12 V, RLOAD = 820 , CS = 12 pF - - 400 ns tf Output On Voltage Power-On Time [2] tPO Output Rise Time [3] Output Fall Time [3] Supply Current Reverse Battery Current VCC = 12 V, RLOAD = 820 , CS = 12 pF - - 400 ns ICCON B > BOP - 4.1 7.5 mA ICCOFF B < BRP - 3.8 7.5 mA VRCC = -30 V - - -10 mA VZ ICC = 10.5 mA; TA = 25C 32 - - V IZ VZ = 32 V; TA = 25C - - 10.5 mA IRCC Supply Zener Clamp Voltage Supply Zener Current [4] Maximum voltage must be adjusted for power dissipation and junction temperature, see Power Derating section. For VCC slew rates greater than 250 V/s, and TA = 150C, the Power-On Time can reach its maximum value. 3 C =oscilloscope probe capacitance. S 4 Maximum current limit is equal to the maximum I CC(max) + 3 mA. 1 2 DEVICE QUALIFICATION PROGRAM Contact Allegro for information. EMC (ELECTROMAGNETIC COMPATABILITY) REQUIREMENTS GND Contact Allegro for information. 2 3 VOUT VOUT Package LH 1 GND 2 VCC 1 VCC 3 Package UA, 3-pin SIP Terminal List Number Package LH Package UA 1 1 2 3 3 2 Name Description VCC VOUT GND Connects power supply to chip Output from circuit Ground Allegro MicroSystems, LLC 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com 3 A1101, A1102, A1103, A1104, and A1106 Continuous-Time Switch Family MAGNETIC OPERATING CHARACTERISTICS [1]: over full operating voltage and ambient temperature ranges, unless otherwise noted Characteristic Symbol Test Conditions A1101 A1102 Operate Point BOP A1103 A1104 A1106 A1101 A1102 Release Point BRP A1103 A1104 A1106 A1101 A1102 Hysteresis BHYS A1103 A1104 A1106 Min. Typ. Max. Units TA = 25C 50 100 160 G Operating Temperature Range 30 100 175 G TA = 25C 130 180 230 G Operating Temperature Range 115 180 245 G TA = 25C 220 280 340 G Operating Temperature Range 205 280 355 G TA = 25C 70 - 350 G Operating Temperature Range 35 - 450 G TA = 25C 280 340 400 G Operating Temperature Range 260 340 430 G TA = 25C 10 45 130 G Operating Temperature Range 10 45 145 G TA = 25C 75 125 175 G Operating Temperature Range 60 125 190 G TA = 25C 165 225 285 G Operating Temperature Range 150 225 300 G TA = 25C 50 - 330 G Operating Temperature Range 25 - 430 G TA = 25C 180 240 300 G Operating Temperature Range 160 240 330 G TA = 25C 20 55 80 G Operating Temperature Range 20 55 80 G TA = 25C 30 55 80 G Operating Temperature Range 30 55 80 G TA = 25C 30 55 80 G Operating Temperature Range 30 55 80 G TA = 25C 20 55 - G Operating Temperature Range 20 55 - G TA = 25C 70 105 140 G Operating Temperature Range 70 105 140 G 1 Magnetic flux density, B, is indicated as a negative value for north-polarity magnetic fields, and as a positive value for south-polarity magnetic fields. This so-called algebraic convention supports arithmetic comparison of north and south polarity values, where the relative strength of the field is indicated by the absolute value of B, and the sign indicates the polarity of the field (for example, a -100 G field and a 100 G field have equivalent strength, but opposite polarity). Allegro MicroSystems, LLC 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com 4 A1101, A1102, A1103, A1104, and A1106 Continuous-Time Switch Family THERMAL CHARACTERISTICS: May require derating at maximum conditions; see application information Characteristic Symbol RJA Maximum Allowable VCC (V) Package Thermal Resistance Test Conditions Value Units Package LH, 1-layer PCB with copper limited to solder pads 228 C/W Package LH, 2-layer PCB with 0.463 in.2 of copper area each side connected by thermal vias 110 C/W Package UA, 1-layer PCB with copper limited to solder pads 165 C/W Power Derating Curve TJ(max) = 165C; ICC = ICC(max) 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 VCC(max) Package LH, 2-layer PCB (RJA = 110 C/W) Package UA, 1-layer PCB (RJA = 165 C/W) Package LH, 1-layer PCB (RJA = 228 C/W) 20 40 60 80 100 VCC(min) 120 140 160 180 Power Dissipation, PD (mW) Temperature (C) Power Dissipation versus Ambient Temperature 1900 1800 1700 1600 1500 1400 1300 1200 1100 1000 900 800 700 600 500 400 300 200 100 0 Pa (R cka ge J A = L 11 H, 2 0 -la Pac C/ ye W (R kage ) r PC UA JA = B , 165 1-la C/ yer W) PC B Pac k (R age LH , JA = 228 1-laye C/W r PC B ) 20 40 60 80 100 120 Temperature (C) 140 160 180 Allegro MicroSystems, LLC 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com 5 A1101, A1102, A1103, A1104, and A1106 Continuous-Time Switch Family CHARACTERISTIC DATA Supply Current (On) versus Ambient Temperature Supply Current (On) versus Supply Voltage (A1101/02/03/04/06) (A1101/02/03/04/06) 8.0 8.0 7.0 7.0 VCC (V) 5.0 24 3.8 4.0 3.0 ICCON (mA) ICCON (mA) 6.0 6.0 TA (C) 5.0 -40 25 150 4.0 3.0 2.0 2.0 1.0 1.0 0 0 -50 0 50 TA (C) 100 150 0 5 20 25 Supply Current (Off) versus Supply Voltage (A1101/02/03/04/06) (A1101/02/03/04/06) 8.0 7.0 7.0 VCC (V) 5.0 24 3.8 4.0 3.0 ICCOFF (mA) 8.0 6.0 ICCOFF (mA) 15 VCC (V) Supply Current (Off) versus Ambient Temperature 6.0 TA (C) 5.0 -40 25 150 4.0 3.0 2.0 2.0 1.0 1.0 0 0 -50 0 50 TA (C) 100 0 150 5 10 15 20 25 VCC (V) Output Voltage (On) versus Ambient Temperature Output Voltage (On) versus Supply Voltage (A1101/02/03/04/06) (A1101/02/03/04/06) 400 400 350 350 300 300 250 VCC (V) 200 24 3.8 150 VOUT(SAT) (mV) VOUT(SAT) (mV) 10 -40 25 150 200 150 100 100 50 50 0 TA (C) 250 0 -50 0 50 TA (C) 100 150 0 5 10 15 20 25 VCC (V) Allegro MicroSystems, LLC 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com 6 A1101, A1102, A1103, A1104, and A1106 Continuous-Time Switch Family FUNCTIONAL DESCRIPTION OPERATION The output of these devices switches low (turns on) when a magnetic field (south polarity) perpendicular to the Hall element exceeds the operate point threshold, BOP. After turn-on, the output is capable of sinking 25 mA and the output voltage is VOUT(SAT). When the magnetic field is reduced below the release point, BRP, the device output goes high (turns off). The difference in the magnetic operate and release points is the hysteresis, Bhys, of the device. This built-in hysteresis allows clean switching of the output, even in the presence of external mechanical vibration and electrical noise. Powering-on the device in the hysteresis region, less than BOP and higher than BRP, allows an indeterminate output state. The correct state is attained after the first excursion beyond BOP or BRP. time devices typically require programming after packaging to tighten magnetic parameter distributions. In contrast, chopperstabilized switches employ an offset cancellation technique on the chip that eliminates these offsets without the need for afterpackaging programming. The tradeoff is a longer settling time and reduced frequency response as a result of the chopper-stabilization offset cancellation algorithm. The choice between continuous-time and chopper-stabilized designs is solely determined by the application. Battery management is an example where continuous-time is often required. In these applications, VCC is chopped with a very small duty cycle in order to conserve power (refer to figure 2). The duty cycle is controlled by the power-on time, tPO, of the device. Because continuous-time devices have the shorter power-on time, they are the clear choice for such applications. CONTINUOUS-TIME BENEFITS For more information on the chopper stabilization technique, refer to Technical Paper STP 97-10, Monolithic Magnetic Hall Continuous-time devices, such as the A110x family, offer the fast- Sensing Using Dynamic Quadrature Offset Cancellation and est available power-on settling time and frequency response. Due Technical Paper STP 99-1, Chopper-Stabilized Amplifiers with a to offsets generated during the IC packaging process, continuous- Track-and-Hold Signal Demodulator. (A) (B) VS V+ A110x VOUT(SAT) BOP B- 0 BRP VOUT 0 VCC Switch to Low Switch to High VCC RL VOUT Output GND B+ BHYS Figure 1: Switching Behavior of Unipolar Switches On the horizontal axis, the B+ direction indicates increasing south polarity magnetic field strength, and the B- direction indicates decreasing south polarity field strength (including the case of increasing north polarity). This behavior can be exhibited when using a circuit such as that shown in Panel B. Allegro MicroSystems, LLC 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com 7 A1101, A1102, A1103, A1104, and A1106 Continuous-Time Switch Family ADDITIONAL APPLICATIONS INFORMATION Extensive applications information for Hall-effect devices is available in: * Hall-Effect IC Applications Guide, Application Note 27701 * Hall-Effect Devices: Guidelines for Designing Subassemblies Using Hall-Effect Devices, Application Note 27703.1 * Soldering Methods for Allegro's Products - SMT and ThroughHole, Application Note 26009 All are provided in Allegro Electronic Data Book, AMS-702, and the Allegro Web site, www.allegromicro.com. 1 2 3 4 5 VCC t VOUT t Output Sampled tPO(max) Figure 2: Continuous-Time Application, B < BRP This figure illustrates the use of a quick cycle for chopping VCC in order to conserve battery power. Position 1, power is applied to the device. Position 2, the output assumes the correct state at a time prior to the maximum Power-On Time, tPO(max). The case shown is where the correct output state is HIGH. Position 3, tPO(max) has elapsed. The device output is valid. Position 4, after the output is valid, a control unit reads the output. Position 5, power is removed from the device. Allegro MicroSystems, LLC 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com 8 A1101, A1102, A1103, A1104, and A1106 Continuous-Time Switch Family POWER DERATING Power Derating The device must be operated below the maximum junction temperature of the device, TJ(max). Under certain combinations of peak conditions, reliable operation may require derating supplied power or improving the heat dissipation properties of the application. This section presents a procedure for correlating factors affecting operating TJ. (Thermal data is also available on the Allegro MicroSystems website.) The Package Thermal Resistance, RJA, is a figure of merit summarizing the ability of the application and the device to dissipate heat from the junction (die), through all paths to the ambient air. Its primary component is the Effective Thermal Conductivity, K, of the printed circuit board, including adjacent devices and traces. Radiation from the die through the device case, RJC, is relatively small component of RJA. Ambient air temperature, TA, and air motion are significant external factors, damped by overmolding. The effect of varying power levels (Power Dissipation, PD), can be estimated. The following formulas represent the fundamental relationships used to estimate TJ, at PD. PD = VIN x IIN T = PD x RJA (2) A worst-case estimate, PD(max), represents the maximum allowable power level (VCC(max), ICC(max)), without exceeding TJ(max), at a selected RJA and TA. Example: Reliability for VCC at TA=150C, package UA, using minimum-K PCB. Observe the worst-case ratings for the device, specifically: RJA=165C/W, TJ(max)=165C, VCC(max)= 24 V, and ICC(max) = 7.5 mA. Calculate the maximum allowable power level, PD(max). First, invert equation 3: Tmax = TJ(max) - TA = 165C-150C = 15C This provides the allowable increase to TJ resulting from internal power dissipation. Then, invert equation 2: PD(max) = Tmax/RJA =15C/165C/W=91mW Finally, invert equation 1 with respect to voltage: VCC(est) = PD(max) /ICC(max)= 91mW/7.5mA=12.1 V (1) The result indicates that, at TA, the application and device can dissipate adequate amounts of heat at voltages VCC(est). Compare VCC(est) to VCC(max). If VCC(est) VCC(max), then reliable operation between VCC(est) and VCC(max) requires enhanced TJ = TA + T(3) RJA. If VCC(est) VCC(max), then operation between VCC(est) and For example, given common conditions such as: TA= 25C, VCC(max) is reliable under these conditions. VCC = 12V, ICC = 4 mA, and RJA = 140 C/W, then: PD = VCC x ICC = 12 V x 4 mA = 48 mW T = PD x RJA = 48 mW x 140C/W = 7C TJ = TA + T = 25C + 7C = 32C Allegro MicroSystems, LLC 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com 9 A1101, A1102, A1103, A1104, and A1106 Continuous-Time Switch Family CUSTOMER PACKAGE DRAWING For Reference Only - Not for Tooling Use (Reference DWG-2840) Dimensions in millimeters - NOT TO SCALE Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown +0.12 2.98 -0.08 D 1.49 4 4 A 3 +0.020 0.180 -0.053 0.96 D +0.19 1.91 -0.06 +0.10 2.90 -0.20 2.40 0.70 D 0.25 MIN 1.00 2 1 0.55 REF 0.25 BSC 0.95 Seating Plane Branded Face Gauge Plane B PCB Layout Reference View 8X 10 REF 1.00 0.13 A1101, A1102, A1103, A1104, and A1106 NNT +0.10 0.05 -0.05 0.95 BSC 0.40 0.10 N = Last three digits of device part number T = Temperature Code (Letter) A Active Area Depth, 0.28 mm B Reference land pattern layout; all pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary to meet application process requirements and PCB layout tolerances C Branding scale and appearance at supplier discretion A1101, A1102, A1103, A1104, and A1106 NNN D Hall elements, not to scale N = Last three digits of device part number C Standard Branding Reference View Figure 3: Package LH, 3-Pin (SOT-23W) Allegro MicroSystems, LLC 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com 10 A1101, A1102, A1103, A1104, and A1106 Continuous-Time Switch Family +0.08 4.09 -0.05 45 B D Standard Branding Reference View C E 2.04 1.52 0.05 NNN 1.44 E +0.08 3.02 -0.05 Mold Ejector Pin Indent 2X10 E 1 45 = Supplier emblem N = Last three digits of device part number A 1.02 MAX 0.51 REF Branded Face 0.79 REF NNT 1 2 3 1 = Supplier emblem N = Last two digits of device part number T = Temperature code +0.03 0.41 -0.06 14.99 0.25 For Reference Only; not for tooling use (reference DWG-9013) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown +0.05 0.43 -0.07 A Dambar removal protrusion (6X) B Gate and tie bar burr area C Active Area Depth, 0.50 mm REF D Branding scale and appearance at supplier discretion E Hall element, not to scale 1.27 NOM Figure 4: Package UA, 3-Pin SIP, Matrix Style Allegro MicroSystems, LLC 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com 11 A1101, A1102, A1103, A1104, and A1106 Continuous-Time Switch Family +0.08 4.09 -0.05 45 B C E 2.04 1.52 0.05 1.44 E Mold Ejector Pin Indent +0.08 3.02 -0.05 E Branded Face 45 2.16 MAX D Standard Branding Reference View 0.79 REF 0.51 REF A 1 2 3 NOT FOR NEW DESIGN 1 = Supplier emblem N = Last two digits of device part number T = Temperature code +0.03 0.41 -0.06 15.75 0.51 NNT For Reference Only; not for tooling use (reference DWG-9049) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Dambar removal protrusion (6X) B Gate burr area C Active Area Depth, 0.50 mm REF +0.05 0.43 -0.07 D Branding scale and appearance at supplier discretion E Hall element, not to scale 1.27 NOM Figure 5: Package UA, 3-Pin SIP, Chopper Style Allegro MicroSystems, LLC 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com 12 A1101, A1102, A1103, A1104, and A1106 Continuous-Time Switch Family Revision History Number Date 14 May 29, 2012 Description 15 January 1, 2015 16 September 30, 2015 17 October 27, 2016 Add A1106 UA package drawing Added the LX option to Selection Guide Corrected LH package Active Area Depth value and LH package branding; added AEC-Q100 qualification under Features and Benefits Chopper-style UA package designated as not for new design Copyright (c)2018, Allegro MicroSystems, LLC Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. Allegro's products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of Allegro's product can reasonably be expected to cause bodily harm. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Copies of this document are considered uncontrolled documents. For the latest version of this document, visit our website: www.allegromicro.com Allegro MicroSystems, LLC 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com 13