8CG01-J
Temperature Coefficient Temperature Range
C0G = 0 ± 30 ppm* –55° to +125°C
C0H = 0 ± 60 ppm –55° to +125°C
P2H = N150 ± 60 ppm –55° to +85°C
R2H = N220 ± 60 ppm –55° to +85°C
S2H = N330 ± 60 ppm –55° to +85°C
T2H = N470 ± 60 ppm –55° to +85°C
U2J = N750 ± 120 ppm –55° to +85°C
SL = N1000 to P350 –55° to +85°C
*TC Tolerance for COG
Refer to EIA-RS198E for other limitations
TEST
Capacitance & Q ≤1000pF 1MHz ± 100Hz @ 1.0 ± .2 Vrms
(Frequency & Voltage): >1000pF 1kHz ± 100Hz @ 1.0 ± .2 Vrms
Q Limits ≤30pF: 400 + (20xC (pF))
>30pF: 1000 minimum
Insulation Resistance 100,000 megohms or 1000 megohms – mfd
(I.R.) (whichever is less) with rated voltage applied
for 2 minutes max with 50mA limiting current
Dielectric Strength 250% of rated voltage for 5 seconds with series
resistor limiting charging current to 50mA max.;
(Flash) 200% for 500V
Aging Negligible
GENERAL ELECTRICAL
MECHANICAL
ENVIRONMENTAL
TEST TEST METHOD POST TEST LIMITS
Terminal ≤0603 1.0 lbs.
Adhesion ≥0805 2.2 lbs.
No evidence of termination peeling
1mm deflection (Glass epoxy board)
Deflection No mechanical damage
Cap., DF, IR meet initial limits
Solderability MIL-STD-202 Contact factory for
Method 208F test limits
TEST TEST METHOD POST TEST LIMITS
Thermal MIL-STD-202, Method 107, Condition A Appearance: No visual damage
Shock C: = ±2.0% or ±0.5pF (whichever is greater)
(Air to Air) Post thermal Shock measurement shall be taken after 24 hours Q: >30pF = 1,000 min., ≤30pF = 400 + [20 x C(pF)]
stabilization. I.R.: = 100,000Mmin. or 1,000M•F (whichever is less)
Appearance: No defects
Maintain the capacitor at 40 ± 2°C and 90 to 95% humidity for Capacitance: Within ±5% or ±.0.5pF (whichever is greater)
Humidity, 500 ± 12 hours. Remove and let sit for 24 ± 2 hours at room Q/D.F.: 30pF and over: Q≥350; 10pf to 30pf: Q≥275+5/2C
Steady State temperature, then measure. Q/D.F.: 10pf and below: Q≥200±10C
I.R.: 1,000Mor 50MF (whichever is less)
C: Nominal Capacitance (pF)
Appearance: No defects
Apply the rated voltage at 40 ± 2°C and 90 to 95% humidity for Capacitance: Within ±7.5% or ±.0.75pF (whichever is greater)
Humidity Load 500 ± 12 hours. Remove and let sit for 24 ± 2 hours at room Q/D.F.: 30pF and over: Q≥200;
temperature, then measure. The charge/discharge current is Q/D.F.: 30pf and below: Q≥100±10/3C
less than 50mA..I.R.: 500Mor 25MF (whichever is less)
C: Nominal Capacitance (pF)
Apply 200% of rated voltage for 1000 ± 12 hours at Appearance: No defects
maximum operating temperature; 150% for 500V. Capacitance: ±3% or ±.3pF (whichever is greater)
Life Test Q: >30pF = 500 min., ≤30pF = 200 + [10 x C(pF)]
Upon completion of above test wait 24 hours prior I.R.: 1,000Mor 50MF (whichever is less)
to performing post testing. Flash: 250% rated voltage
Mounting
Capacitor
Supporter
Unit: mm 45 45
Deflection
Capacitance meter
Glass Epoxy Board
10
Load
R340
2n
STORAGE LIFE
Chip component terminations should
generally be protected from moisture.
In addition, they should also be
protected from materials containing
chlorine, sulfur compounds or any
harmful gases that could cause
degradation of the solder.
1. All chip components, including
tape and reel, should be kept in
an area where the temperature
is between 5°C and 40°C and
where the humidity is 20% to 70%.
2. The chip components should be
used within six months.
3. The solderability of the chip
components should be rechecked
in the event that they are not used
in six months.
4. Peel strength and shelf life of tape
are guaranteed for 1 year when
stored under afore said conditions.
SURFACE MOUNT MONOLITHIC CHIP CAPACITORS
COG AND TEMPERATURE COMPENSATING TYPES –
SPECIFICATION
GRM36/39/40/42-6/42-2/43-2/44-1 Series