
UCD9090
www.ti.com
SLVSA30A –APRIL 2011–REVISED AUGUST 2011
THERMAL INFORMATION UCD9090
THERMAL METRIC(1) RGZ UNITS
48 PINS
θJA Junction-to-ambient thermal resistance(2) 25
θJCtop Junction-to-case (top) thermal resistance(3) 8.9
θJB Junction-to-board thermal resistance(4) 5.5 °C/W
ψJT Junction-to-top characterization parameter(5) 0.3
ψJB Junction-to-board characterization parameter(6) 1.5
θJCbot Junction-to-case (bottom) thermal resistance(7) 1.7
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific
JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT
Supply voltage during operation (V33D, V33DIO, V33A) 3 3.3 3.6 V
Operating free-air temperature range, TA–40 110 °C
Junction temperature, TJ125 °C
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
SUPPLY CURRENT
IV33A VV33A = 3.3 V 8 mA
IV33DIO VV33DIO = 3.3 V 2 mA
Supply current(1)
IV33D VV33D = 3.3 V 40 mA
VV33D = 3.3 V, storing configuration parameters in
IV33D 50 mA
flash memory
ANALOG INPUTS (MON1–MON13)
VMON Input voltage range MON1–MON10 0 2.5 V
MON11 0.2 2.5 V
INL ADC integral nonlinearity –4 4 LSB
DNL ADC differential nonlinearity -2 2 LSB
Ilkg Input leakage current 3 V applied to pin 100 nA
IOFFSET Input offset current 1-kΩsource impedance –5 5 μA
MON1–MON10, ground reference 8 MΩ
RIN Input impedance MON11, ground reference 0.5 1.5 3 MΩ
CIN Input capacitance 10 pF
tCONVERT ADC sample period 12 voltages sampled, 3.89 μsec/sample 400 μsec
ADC 2.5 V, internal reference accuracy 0°C to 125°C–0.5 0.5 %
VREF –40°C to 125°C–1 1 %
ANALOG INPUT (PMBUS_ADDRx)
IBIAS Bias current for PMBus Addr pins 9 11 μA
(1) Typical supply current values are based on device programmed but not configured, and no peripherals connected to any pins.
Copyright ©2011, Texas Instruments Incorporated 3