© 2004 California Micro Devices Corp. All rights reserved.
05/10/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 1
CM1204
4-Channel ESD Array in CSP
Features
• Functionally and pin compatible with CMD’s
CSPESD304
• Optiguard™ coated for improved reliability
• Four channels of ESD protection
•+15kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
•+30kV ESD protection on each channel (HBM)
• Chip Scale Package features extremely low
lead inductance for optimum ESD protection
• 5-bump, 0.960mm X 1.330mm footprint
Chip Scale Package (CSP)
• Lead-free version available
Applications
• ESD protection for sensitive electronic equipment
• I/O port and keypad and button circuitry
protection for portable devices
• Wireless Handsets
• Handheld PCs / PDAs
• MP3 Players
• Digital Camcorders
• Notebooks
• Desktop PCs
Product Description
The CM1204 is a quad ESD transient voltage supres-
sion diode array. Each diode provides a very high level
of protection for sensitive electronic components that
may be subjected to electrostatic discharge (ESD).
These diodes are designed and characterized to safely
dissipate ESD strikes of +15kV, exceeding the maxi-
mum requirement of the IEC 61000-4-2 international
standard. Using the MIL-STD-883 (Method 3015)
specification for Human Body Model (HBM) ESD, the
device provides protection for contact discharges to
greater than +30kV.
The CM1204 is particularly well suited for portable
electronics (e.g., cellular telephones, PDAs, notebook
computers) because of its small package format and
low weight.
The CM1204 features Optiguard™ coating which
results in improved reliability at assembly. It is available
in a space-saving, low-profile chip scale package with
optional lead-free finishing.
Electrical Schematic
B2
ESD_1
GND
C1 C3
A1 A3
ESD_2 ESD_3 ESD_4
© 2004 California Micro Devices Corp. All rights reserved.
2430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 05/10/04
CM1204
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "
+
" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN NAME DESCRIPTION
A1 ESD1 ESD Channel1
A3 ESD2 ESD Channel 2
B2 GND Device Ground
C1 ESD3 ESD Channel 3
C3 ESD4 ESD Channel 4
S
231
C
B
A
Orientation
Marking
(see note 2)
ESD_1 ESD_2
ESD_3 ESD_4
A1 A3
C3C1
GND
B2
Orientation
Marking
A1
PACKAGE / PINOUT DIAGRAMS
CM1204
CSP Package with OptiGuard
™
TOP VIEW BOTTOM VIEW
(Bumps Down View) (Bumps Up View)
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "
+
" character for the top side orientation mark.
PART NUMBERING INFORMATION
Pins Package
Standard Finish Lead-free Finish2
Ordering Part
Number1Part Marking
Ordering Part
Number1Part Marking
5 CSP CM1204-03CS S CM1204-03CP S
© 2004 California Micro Devices Corp. All rights reserved.
05/10/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 3
CM1204
Specifications
Note 1: TA=-40 to +85°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Unused pins are left open
Note 4: These parameters are guaranteed by design and characterization.
ABSOLUTE MAXIMUM RATINGS
PARAMETER RATING UNITS
Storage Temperature Range -65 to +150 °C
DC Package Power Rating 200 mW
STANDARD OPERATING CONDITIONS
PARAMETER RATING UNITS
Operating Temperature Range -40 to +85 °C
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VDIODE Diode Reverse Breakdown Voltage IDIODE = 10µA5.5 V
ILEAK Diode Leakage Current VIN=3.3V, TA=25°C 100 nA
VSIG Signal Voltage
Positive Clamp
Negative Clamp
IDIODE = 10mA
5.6
-0.4
6.8
-0.8
9.0
-1.5
V
V
VESD In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Notes 2, 3 and 4
±30
±15
kV
kV
VCL Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2, 3 and 4
+15
-8
V
V
CDIODE Diode Capacitance At 2.5VDC Reverse Bias,
1MHz, 30mVAC
22 27 32 pF
© 2004 California Micro Devices Corp. All rights reserved.
4430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 05/10/04
CM1204
Performance Information
Diode Characteristics (nominal conditions unless specified otherwise)
Figure 1. Typical Diode Capacitance VS. Input Voltage (normalized to 2.5VDC)
Capacitance (Normalized)
DC Voltage
© 2004 California Micro Devices Corp. All rights reserved.
05/10/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 5
CM1204
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
Figure 2. Recommended Non-Solder Mask Defined Pad Illustration
Figure 3. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 4. Lead-free (SnAgCu) Solder
Ball Reflow Profile
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER VALUE
Pad Size on PCB 0.275mm
Pad Shape Round
Pad Definition Non-Solder Mask defined pads
Solder Mask Opening 0.325mm Round
Solder Stencil Thickness 0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round
Solder Flux Ratio 50/50 by volume
Solder Paste Type No Clean
Pad Protective Finish OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball +50µm
Solder Ball Side Coplanarity +20µm
Maximum Dwell Time Above Liquidous 60 seconds
Soldering Maximum Temperature 260°C
Solder Mask Opening
0.325mm DIA.
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
200
250
150
100
50
0 1:00.0 2:00.0 3:00.0 4:00.0
Time (minutes)
Temperature (°C)
© 2004 California Micro Devices Corp. All rights reserved.
6430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 05/10/04
CM1204
Mechanical Details
CSP Mechanical Specifications
CM1204 devices are packaged in a custom Chip Scale
Package (CSP). Dimensions are presented below. For
complete information on CSP packaging, see the Cali-
fornia Micro Devices CSP Package Information docu-
ment.
Package Dimensions for
CM1204 Chip Scale Packages
CSP Tape and Reel Specifications
Figure 5. Tape and Reel Mechanical Data
PACKAGE DIMENSIONS
Package Custom CSP
Bumps 5
Dim Millimeters Inches
Min Nom Max Min Nom Max
A1 0.915 0.960 1.005 0.0360 0.0378 0.0396
A2 1.285 1.330 1.375 0.0506 0.0524 0.0541
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.245 0.250 0.255 0.0096 0.0098 0.0100
B3 0.430 0.435 0.440 0.0169 0.0171 0.0173
B4 0.430 0.435 0.440 0.0169 0.0171 0.0173
C1 0.180 0.230 0.280 0.0071 0.0091 0.0110
C2 0.180 0.230 0.280 0.0071 0.0091 0.0110
D1 0.600 0.670 0.739 0.0236 0.0264 0.0291
D2 0.394 0.445 0.495 0.0155 0.0175 0.0195
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
DIMENSIONS IN MILLIMETERS
A
B
C
12
C1
B1
A1
B3
C2
D1
D2
A2
BOTTOM VIEW
SIDE
VIEW
3
B2
B4
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
SOLDER BUMPS
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
OptiGuard
TM
Coating
OptiGuard™ Coated CSP
PART NUMBER CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL P0P1
CM1204 1.33 X 0.96 X 0.670 1.42 X 1.07 X 0.740 8mm 178mm (7") 3500 4mm 4mm
Top
For tape feeder reference
Cover
Tape
P
1
only including draft.
Concentric around B.
K
o
Embossment
User Direction of Feed
±
0.2 mm
P
o
Center Lines
of Cavity
W
10 Pitches Cumulative
Tolerance On Tape
A
o
B
o
