TPS22941, TPS22942, TPS22943, TPS22944, TPS22945
www.ti.com
SLVS832C –NOVEMBER 2008–REVISED NOVEMBER 2009
LOW-INPUT-VOLTAGE CURRENT-LIMITED LOAD SWITCHES
WITH SHUT OFF AND AUTO-RESTART FEATURE
Check for Samples: TPS22941 TPS22942 TPS22943 TPS22944 TPS22945
1FEATURES DESCRIPTION
• Input Voltage Range: 1.62 V to 5.5 V
• Low ON resistance The TPS2294x load switches provide protection to
systems and loads in high-current conditions. The
– rON = 0.4 Ωat VIN = 5.5 V devices contain a 400-mΩcurrent-limited P-channel
– rON = 0.5 Ωat VIN = 3.3 V MOSFET that can operate over an input voltage
– rON = 0.6 Ωat VIN = 2.5 V range of 1.62 V to 5.5 V. Current is prevented from
flowing when the MOSFET is off. The switch is
– rON = 0.8 Ωat VIN = 1.8 V controlled by an on/off input (ON), which is capable of
• Minimum Current Limit: 40 mA or 100 mA interfacing directly with low-voltage control signals.
• Undervoltage Lockout The TPS2294x includes thermal shutdown protection
that prevents damage to the device when a
• Thermal Shutdown continuous over-current condition causes excessive
• Shutdown Current < 1 μAheating by turning off the switch.
• Fast Current Limit Response Time When the switch current reaches the maximum limit,
• Fault Blanking the TPS22941/2/3/4/5 operates in a constant-current
• Auto Restart mode to prohibit excessive currents from causing
damage. TPS22941/3 has a current limit of 40 mA
• 1.8-V Compatible Control Input Thresholds and TPS22942/4/5 has a current limit of 100 mA.
• ESD Performance Tested Per JESD 22 For the TPS22941/2/5, if the constant current
– 4000-V Human-Body Model condition still persists after 10ms, these parts shut off
(A114-B, Class II) the switch and pull the fault signal pin (OC) low. The
– 1000-V Charged-Device Model (C101) TPS22941/2/5, have an auto-restart feature that turns
• Tiny SC-70 (DCK) Package the switch on again after 80 ms if the ON pin is still
active. A current limit condition on the TPS22943 and
on the TPS22944 immediately pull the fault signal pin
APPLICATIONS low (OC pin) and the part remains in the
• Low-Current Sensor Protection constant-current mode until the switch current falls
• HDMI Connector Protection below the current limit.
• Notebooks The TPS2294x is available in a SC70-5 (DCK)
• PDAs package. It is characterized for operation over the
• GPS Devices free-air temperature range of –40°C to 85°C.
• MP3 Players
• Peripheral Ports
Table 1. Feature List
MINIMUM CURRENT LIMIT CURRENT LIMIT
DEVICE AUTO-RESTART TIME (ms) ON PIN ACTIVITY
(mA) BLANKING TIME (ms)
TPS22941 40 10 80 Active LOW
TPS22942 100 10 80 Active LOW
TPS22943 40 0 N/A Active HIGH
TPS22944 100 0 N/A Active HIGH
TPS22945 100 10 80 Active HIGH
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2008–2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
UVLO
VIN
ON
VOUT
OC
GND
Current
Limit
Thermal
Shutdown
Control
Logic
5
4
2
3
1
TPS22941, TPS22942, TPS22943, TPS22944, TPS22945
SLVS832C –NOVEMBER 2008–REVISED NOVEMBER 2009
www.ti.com
ORDERING INFORMATION(1)
TAPACKAGE(2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3)
TPS22941DCKR 4A_
TPS22942DCKR 4B_
–40°C to 85°C SOT (SC70) – DCK Tape and reel TPS22943DCKR 4C_
TPS22944DCKR 4D_
TPS22945DCKR 4E_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) The actual top-side marking has one additional character that designates the wafer fab/assembly site.
BLOCK DIAGRAM
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Product Folder Link(s): TPS22941 TPS22942 TPS22943 TPS22944 TPS22945
DCK PACKAGE
(TOP VIEW)
VOUT 15
GND 2
OC
VIN
ON
34
TPS22941, TPS22942, TPS22943, TPS22944, TPS22945
www.ti.com
SLVS832C –NOVEMBER 2008–REVISED NOVEMBER 2009
TERMINAL FUNCTIONS
TERMINAL TYPE DESCRIPTION
SOT (DCK) NAME
PIN NO.
1 VOUT O Switch output: output of the power switch
2 GND – Ground
Over current output flag: active LOW, open drain output that indicates an over current,
3 OC O supply under voltage, or over temperature state.
4 ON I ON control input
5 VIN I Supply input: input to the power switch and the supply voltage for the IC
– DNU – Do not use
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Product Folder Link(s): TPS22941 TPS22942 TPS22943 TPS22944 TPS22945
TPS22941, TPS22942, TPS22943, TPS22944, TPS22945
SLVS832C –NOVEMBER 2008–REVISED NOVEMBER 2009
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
MIN MAX UNIT
VIInput voltage range VIN, VOUT, ON –0.3 6 V
TJOperating junction temperature range –40 125 °C
Tstg Storage temperature range –65 150 °C
Human-Body Model (HBM) 4
ESD Electrostatic discharge protection kV
Charged-Device Model (CDM) 1
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL IMPEDANCE RATINGS UNIT
θJA Package thermal impedance(1) DCK package 259 °C/W
(1) The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT
VIN Input voltage 1.62 5.5 V
VOUT Output voltage VIN
TAAmbient free-air temperature –40 85 °C
ELECTRICAL CHARACTERISTICS
VIN = 1.62 V to 5.5 V, TA= –40°C to 85°C (unless otherwise noted)
PARAMETER TEST CONDITIONS TAMIN TYP(1) MAX UNIT
IIN Quiescent current IOUT = 0 mA, VIN = 1.62 V to 5.5 V Full 40 80 μA
VON = 0 V (TPS22943/4/5) VIN = 3.6 V,
IIN(OFF) OFF-State supply current or Full 1 μA
VOUT open
VON = VIN (TPS22941/2)
VON = 0 V (TPS22943/4/5) VIN = 3.6 V,
IOUT(LEAKAGE) OFF-State switch current or Full 1 μA
VOUT short to GND
VON = VIN (TPS22941/2) 25°C 0.4 0.5
VIN = 5.5 V Full 0.6
25°C 0.5 0.6
VIN = 3.3 V Full 0.7
25°C 0.6 0.7
rON ON-state resistance IOUT = 20 mA VIN = 2.5 V Ω
Full 0.8
25°C 0.8 0.9
VIN = 1.8 V Full 1.1
25°C 0.9 1.1
VIN = 1.62 V Full 1.2
ION ON input leakage current VON = VIN or GND Full 1 μA
TPS22941/3 40 65 80
ILIM Current limit VIN = 3.3 V, VOUT = 3 V Full mA
TPS22942/4/5 100 150 200
Shutdown threshold 140
Thermal shutdown Return from shutdown Full 130 °C
Hysteresis 10
(1) Typical values are at VIN = 3.3 V and TA= 25°C.
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TPS22941, TPS22942, TPS22943, TPS22944, TPS22945
www.ti.com
SLVS832C –NOVEMBER 2008–REVISED NOVEMBER 2009
ELECTRICAL CHARACTERISTICS (continued)
VIN = 1.62 V to 5.5 V, TA= –40°C to 85°C (unless otherwise noted)
PARAMETER TEST CONDITIONS TAMIN TYP(1) MAX UNIT
UVLO Undervoltage shutdown VIN increasing Full 1.32 1.42 1.52 V
Undervoltage shutdown Full 45 mV
hysteresis
Control Output (OC)
VIN = 5 V, ISINK = 10 mA 0.1 0.2
OC output logic low
Vol Full V
voltage VIN = 1.8 V, ISINK = 10 mA 0.1 0.3
OC output high leakage
Ioz VIN = 5 V, Switch ON Full 0.5 μA
current voltage
Control Input (ON)
VIN = 1.8 V Full 1.1 V
VIN = 2.5 V Full 1.3 V
ON high-level input
Vih voltage VIN = 3.3 V Full 1.4 V
VIN = 5.5 V Full 1.7 V
VIN = 1.8 V Full 0.5 V
VIN = 2.5 V Full 0.7 V
Vil ON low-level input voltage VIN = 3.3 V Full 0.8 V
VIN = 5.5 V Full 0.9 V
ON high-level input
Ii VIN = 1.8 V to 5 V, Switch ON Full 1 μA
leakage current
SWITCHING CHARACTERISTICS
VIN = 3.3 V, RL= 500 Ω, CL= 0.1 μF, TA= 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tON Turn-ON time RL= 500 Ω, CL= 0.1 μF 60 μs
tOFF Turn-OFF time RL= 500 Ω, CL= 0.1 μF 30 μs
trVOUT rise time RL= 500 Ω, CL= 0.1 μF 10 μs
tfVOUT fall time RL= 500 Ω, CL= 0.1 μF 90 μs
tBLANK Over current blanking time TPS22941/2/5 5 10 20 ms
tRSTART Auto-restart time TPS22941/2/5 40 80 160 ms
VIN = VON = 3.3 V, moderate overcurrent condition 9 μs
Short-circuit response time VIN = VON = 3.3 V, hard short 4 μs
Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 5
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0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Input Voltage, V (V)
IN
ON-State Resistance, r ( )W
ON
32
33
34
35
36
37
38
39
40
41
42
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Supply Voltage (V)
Quiescent Current (uA)
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
–40 –10 25 50 85
Temperature (°C)
ON-State Resistance ( )W
V = 1.8 V
IN
V = 3.3 V
IN
V = 3.6 V
IN
V = 5 V
IN
TPS22941, TPS22942, TPS22943, TPS22944, TPS22945
SLVS832C –NOVEMBER 2008–REVISED NOVEMBER 2009
www.ti.com
TYPICAL PERFORMANCE
Figure 1. rON vs VIN
Figure 2. rON vs Temperature Figure 3. Quiescent Current vs VIN
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–40 –10 25 50 85
Temperature (°C)
25
30
35
40
45
50
Quiescent Current ( A)m
V = 5.5 V
IN
V = 3.3 V
IN
V = 1.8 V
IN
–40 –10 25 50 85
Temperature (°C)
0
100
200
300
400
500
600
I Current (nA)
IN(leakage)
V = 1.8 V
IN
V = 3.3 V
IN
0
50
100
150
200
250
300
350
400
450
500
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Supply Voltage (V)
I Current (nA)
IN(leakage)
–40 –10 25 50 85
Temperature (°C)
I Current (nA)
IN(off)
0
50
100
150
200
250
V = 1.8 V
IN
V = 3.3 V
IN
TPS22941, TPS22942, TPS22943, TPS22944, TPS22945
www.ti.com
SLVS832C –NOVEMBER 2008–REVISED NOVEMBER 2009
TYPICAL PERFORMANCE (continued)
Figure 4. Quiescent Current vs Temperature Figure 5. IIN(leakage) vs Temperature
Figure 6. IIN(Leakage) vs VIN Figure 7. IIN(off) vs Temperature
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0
50
100
150
200
250
300
350
400
450
500
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Supply Voltage (V)
I Current (nA)
IN(off)
–40 –10 25 50 85
Temperature (°C)
I Current (nA)
OUT(leakage)
–300
–250
–200
–150
–100
–50
0
50
100
V = 1.8 V
IN
V = 3.3 V
IN
0.00
0.02
0.04
0.06
0.08
0.10
0.12
0.14
0.16
0.18
0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2
V -V (V)
IN OUT
Output Current (A)
–40°C
25°C
85°C
TPS22941, TPS22942, TPS22943, TPS22944, TPS22945
SLVS832C –NOVEMBER 2008–REVISED NOVEMBER 2009
www.ti.com
TYPICAL PERFORMANCE (continued)
Figure 8. IIN(off) vs VIN Figure 9. IOUT(leakage) vs Temperature
Figure 10. ON Treshold Figure 11. ILIM vs Output Voltage (TPS22942, TPS22944,
TPS22945)
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–40 25 85
Junction Temperature, T (°C)
J
0
20
40
60
80
100
120
140
160
180
Current Limit (mA)
T = –40°C
A
T = 25°C
A
T = 85°C
A
0 0.5 11.5 22.5 3 3.5
V – V (V)
IN OUT
Current Limit, I (mA)
LIM
80
70
60
50
40
30
20
10
0
–40 25 85
80
75
70
65
60
Current Limit, I (mA)
LIM
Junction Temperature, T (°C)
J
–50 –35 –20 –5 10 25 40 55 70 85 100
Temperature (°C)
t /tfall ( s)
rise m
trise
tfall
0
10
20
30
40
50
60
70
80
90
C = 0.1 F
R = 350
L
L
m
V = 3.3 V
IN
Ω
TPS22941, TPS22942, TPS22943, TPS22944, TPS22945
www.ti.com
SLVS832C –NOVEMBER 2008–REVISED NOVEMBER 2009
TYPICAL PERFORMANCE (continued)
Figure 12. ILIM vs Temperature (TPS22942, TPS22944, Figure 13. ILIM vs Output Voltage (TPS22941, TPS22943)
TPS22945)
Figure 14. ILIM vs Temperature (TPS22941, TPS22943) Figure 15. trise/tfall
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20
25
30
35
40
45
50
55
60
65
70
–50 –35 –20 –5 10 25 40 55 70 85 100
Temperature (°C)
t /t ( s)
OFF ON m
C = 0.1 F
R = 350
L
L
m
V = 3.3 V
IN
Ω
tOFF
tON
–40 –10 25 50 85
Temperature (°C)
10.5
11.0
11.5
12.0
12.5
13.0
13.5
Blanking Time (ms)
2 ms/DIV
IOUT
100 mA/DIV
VOC
2 V/DIV
VOUT
2 V/DIV
VDRV
2 V/DIV
–40 –10 25 50 85
Temperature (°C)
40
50
60
70
80
90
100
Restart Time (ms)
TPS22941, TPS22942, TPS22943, TPS22944, TPS22945
SLVS832C –NOVEMBER 2008–REVISED NOVEMBER 2009
www.ti.com
TYPICAL PERFORMANCE (continued)
Figure 16. tON/tOFF Figure 17. tBLANK vs Temperature (VIN = 3.3 V)
VDRV signal forces the device to go into over-current mode.
Figure 18. tRESTART vs Temperature (VIN = 3.3 V) Figure 19. tBLANK Response
VDRV signal forces the device to go into over-current mode.
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Product Folder Link(s): TPS22941 TPS22942 TPS22943 TPS22944 TPS22945
–2.5
–2.0
–1.5
–1.0
–0.5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
–3.0
3.5
4.0
4.5
5.0
–50 0 50 100 150 200 250 300 350 400 450
Time ( s)m
Control Input Voltage (V)
–5
–4
–3
–2
–1
0
1
2
3
4
5
6
–6
7
8
9
10
Output Current (mA)
C = 0.1 F
Lm
R = 500
V = 3.3 V
L
IN
W
VON
IOUT
20 ms/DIV
IOUT
100 mA/DIV
VOC
2 V/DIV
VOUT
2 V/DIV
VDRV
2 V/DIV
–2.5
–2.0
–1.5
–1.0
–0.5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
–3.0
3.5
4.0
4.5
5.0
–50 0 50 100 150 200 250 300 350 400 450
Time ( s)m
Control Input Voltage (V)
–5
–4
–3
–2
–1
0
1
2
3
4
5
6
–6
7
8
9
10
Output Current (mA)
C = 0.1 F
Lm
R = 500
V = 3.3 V
L
IN
W
VON
IOUT
10 s/DIVm
IOUT
400 mA/DIV
VOUT
2 V/DIV
VIN
2 V/DIV
C = 10 F
= 1 F
IN m
mCOUT
TPS22941, TPS22942, TPS22943, TPS22944, TPS22945
www.ti.com
SLVS832C –NOVEMBER 2008–REVISED NOVEMBER 2009
TYPICAL PERFORMANCE (continued)
Figure 20. tRESTART Response Figure 21. tON Response
Figure 22. tON Response Figure 23. Short-Circuit Response Time (Output Shorted to
Ground)
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20 s/DIVm
IOUT
100 mA/DIV
VOUT
Shorted to
Ground
VIN
2 V/DIV
VON
2 V/DIV
C = 10 F
= 1 F
IN m
mCOUT
20 s/DIVm
IOUT
100 mA/DIV
VIN/VON
1 V/DIV
C = 10 F
= 1 F
IN m
mCOUT
TPS22941, TPS22942, TPS22943, TPS22944, TPS22945
SLVS832C –NOVEMBER 2008–REVISED NOVEMBER 2009
www.ti.com
TYPICAL PERFORMANCE (continued)
Figure 24. Short-Circuit Response Time (Switch Powerup to Figure 25. Current Limit Response Time
Hard Short)
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VIN
GND
OC
VOUT
Off
On
ON
5.5-V
Battery 10 µF
100 kW
0.1 µF 500 W
TPS22941, TPS22942, TPS22943, TPS22944, TPS22945
www.ti.com
SLVS832C –NOVEMBER 2008–REVISED NOVEMBER 2009
APPLICATION INFORMATION
Figure 26. Typical Application Circuit, Active-High Enabled Device
(TPS22943, TPS22944 and TPS22945 Only)
On/Off Control
The ON pin controls the state of the switch. Activating ON continuously holds the switch in the on state as long
as there is no fault. An undervoltage on VIN or a junction temperature in excess of 150°C overrides the ON
control to turn off the switch. ON is active high and has a low threshold, making it capable of interfacing with
low-voltage signals.
Undervoltage Lockout
The undervoltage lockout turns off the switch if the input voltage (VIN) drops below the undervoltage lockout
threshold. With the ON pin active, the input voltage rising above the undervoltage lockout threshold causes a
controlled turn-on of the switch, which limits current overshoots.
Thermal Shutdown
Thermal shutdown protects the part from internally or externally generated excessive temperatures. During an
overtemperature condition the switch is turned off. The switch automatically turns on again if the temperature of
the die drops below the threshold temperature.
Reverse Voltage
If the voltage at the VOUT pin is larger than the VIN pin, large currents may flow and can cause permanent
damage to the device. TPS2294x is designed to control current flow only from VIN to VOUT.
Fault Reporting
When an overcurrent, input undervoltage, or overtemperature condition is detected, OC is set active low to signal
the fault mode. OC is an open-drain MOSFET and requires a pullup resistor between VIN and OC. During
shutdown, the pulldown on OC is disabled, reducing current draw from the supply.
Current Limiting
When the switch current reaches the maximum limit, the TPS22921/2/3/4/5 operates in a constant-current mode
to prohibit excessive currents from causing damage. TPS22921/3 has a current limit of 40 mA and TPS22922/4/5
has a current limit of 100 mA. A current limit condition immediately pulls the fault signal pin low (OC pin), and the
part remains in the constant-current mode until the switch current falls below the current limit.
Input Capacitor
To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns-on into a
discharged load capacitor or a short-circuit, a capacitor needs to be placed between VIN and GND. A 1-μF
ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further
reduce the voltage drop.
Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 13
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SLVS832C –NOVEMBER 2008–REVISED NOVEMBER 2009
www.ti.com
Output Capacitor
A 0.1-μF capacitor, COUT, should be placed between VOUT and GND. This capacitor will prevent parasitic board
inductances from forcing VOUT below GND when the switch turns off. For the TPS2294x, the total output
capacitance needs to be kept below a maximum value, COUT(max), to prevent the part from registering an
over-current condition and turning-off the switch. The maximum output capacitance can be determined from the
following formula, COUT = ILIM(MAX) x tBLANK(MIN) ÷ VIN
Due to the integral body diode in the PMOS switch, a CIN greater than COUT is highly recommended. A COUT
greater than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current
flow through the body diode from VOUT to VIN.
Power Dissipation
During normal operation as a switch, the power dissipation is small and has little effect on the operating
temperature of the part. The parts with the higher current limits will dissipate the most power and that will only
be,
P = (ILIM)2× rON = (0.2)2× 0.4 = 16 mW when VIN= 5.5 V
If the part goes into current limit the maximum power dissipation will occur when the output is shorted to ground.
For TPS22941/2/5, the power dissipation scales by the auto-restart time (tRESTART) and the overcurrent blanking
time (tBLANK) so that the maximum power dissipated is:
P(max) = (tBLANK ÷ (tRESTART + tBLANK)) × (VIN(max)) × ILIM(max) = (10 ÷ (80 + 10) × 5.5 × 0.2 = 122 mW
When using the TPS22943 and TPS22944, a short on the output causes the part to operate in a constant current
state, dissipating a worst-case power as calculated above until the thermal shutdown activates. It then cycles in
and out of thermal shutdown so long as the ON pin is active and the short is present.
Board Layout
For best performance, all traces should be as short as possible. To be most effective, the input and output
capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have
on normal and short-circuit operation. Using wide traces for VIN, VOUT, and GND will help minimize parasitic
electrical effects along with minimizing the case to ambient thermal impedance.
14 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TPS22941 TPS22942 TPS22943 TPS22944 TPS22945
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TPS22941DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS22942DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS22942DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS22943DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS22944DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS22945DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS22945DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 13-Nov-2009
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS22941DCKR SC70 DCK 5 3000 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3
TPS22942DCKR SC70 DCK 5 3000 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3
TPS22943DCKR SC70 DCK 5 3000 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3
TPS22944DCKR SC70 DCK 5 3000 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3
TPS22945DCKR SC70 DCK 5 3000 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Jul-2011
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS22941DCKR SC70 DCK 5 3000 205.0 200.0 33.0
TPS22942DCKR SC70 DCK 5 3000 205.0 200.0 33.0
TPS22943DCKR SC70 DCK 5 3000 205.0 200.0 33.0
TPS22944DCKR SC70 DCK 5 3000 205.0 200.0 33.0
TPS22945DCKR SC70 DCK 5 3000 205.0 200.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Jul-2011
Pack Materials-Page 2
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