HLMP-C115, HLMP-C117, HLMP-C123, HLMP-C215, HLMP-C223, HLMP-C315, HLMP-C323, HLMP-C415, HLMP-C423, HLMP-C515, HLMP-C523, HLMP-C615, HLMP-C623 T-13/4 Super Ultra-Bright LED Lamps Data Sheet Description Features These non-diffused lamps are designed to produce a bright light source and smooth radiation pattern. This lamp has been designed with a 20 mil lead frame, enhanced flange, and tight meniscus controls, making it compatible with radial lead automated insertion equipment. Very high intensity Applications Ideal for backlighting front panels* Used for lighting switches Adapted for indoor and outdoor signs Exceptional uniformity Consistent viewability All colors: AlGaAs Red High Efficiency Red Yellow Orange Green Emerald Green 15 and 25 family Tape and reel options available Binned for color and intensity Selection Guide Color 21/2[1] Standoff Leads Part Number HLMP- Luminous Intensity Iv (mcd) Min. Max. DH AS AlGaAs 15 No C115 290.0 - C115-O00xx 290.0 - C115-OP0xx 290.0 1000.0 Yes C117-OP0xx 290.0 1000.0 No C123 90.2 - C123-L00xx 90.2 - C215 138.0 - C215-M00xx 138.0 - C215-MN0xx 138.0 400.0 C223 90.2 - C223-L00xx 90.2 - C223-MN0xx 138.0 400.0 C315 147.0 - C315-L00xx 147.0 - C315-LM0xx 147.0 424.0 C323 96.2 - C323-K00xx 96.2 - C323-KL0xx 96.2 294.0 C415 138.0 - C415-M00xx 138.0 - C415-M0D0xx 138.0 - C415-MN0xx 138.0 400.0 C423 90.2 - C423-L00xx 90.2 - C423-LM0xx 90.2 276.0 C515 170.0 - C515-L00xx 170.0 C515-LM0xx 170.0 490.0 C523 69.8 - C523-J00xx 69.8 - C523-KL0xx 111.7 340.0 C615 17.0 - C615-G00xx 17.0 - 25 Red 15 25 Yellow 15 25 Orange 15 25 Green 15 25 Emerald Green 15 25 2 No No No No No No No No No No C623 6.7 - C623-E00xx 6.7 - Part Numbering System HLMP - C x xx - x x x xx Mechanical Options 00: Bulk 01: Tape & Reel, Crimped Leads 02: Tape & Reel, Straight Leads B2: Right Angle Housing, Even Leads UQ: Ammo Pack, Horizontal Leads Color Bin Options 0: Full Color Bin Distribution D: Color Bins 4 & 5 only Maximum Iv Bin Options 0: Open (No Maximum Limit) Others: Please refer to the Iv Bin Table Minimum Iv Bin Options Please refer to the Iv Bin Table Viewing Angle & Standoffs Options 15: 15 Degree, without Standoffs 17: 15 Degree, with Standoffs 23: 25 Degree, without Standoffs Color Options 1. AS AlGaAs Red 2. High Efficiency Red 3. Yellow 4. Orange 5. Green 6. Emerald Green Package Options C: T-1 3/4 (5 mm) 3 Package Dimensions 5.00 0.20 (0.197 0.008) 5.00 0.20 (NOTE 1) (0.197 0.008) 1.14 0.20 (0.045 0.008) 8.71 0.20 (0.343 0.008) 8.71 0.20 (0.343 0.008) 12.60 0.18 (0.496 0.007) 1.14 0.20 (0.045 0.008) 1.85 (0.073) MAX. 31.60 MIN. (1.244) 0.70 (0.028) MAX. 31.60 MIN. (1.244) 1.50 0.15 (0.059 0.006) CATHODE LEAD CATHODE LEAD 0.50 0.10 SQ. TYP. (0.020 0.004) 1.00 MIN. (0.039) 0.50 0.10 SQ. TYP. (0.020 0.004) 1.00 MIN. (0.039) 5.80 0.20 (0.228 0.008) CATHODE FLAT 0.70 (0.028) MAX. 5.80 0.20 (0.228 0.008) CATHODE FLAT 2.54 0.38 (0.100 0.015) 2.54 0.38 (0.100 0.015) Notes: 1. All dimensions are in millimeters (inches). 2. An epoxy meniscus may extend about 0.5 mm (0.020 in.) down the leads. HLMP-Cx15 and HLMP-Cx23 HLMP-Cx17 Absolute Maximum Ratings at TA = 25C Parameter DH AS AlGaAs Red High Efficiency Red and Orange Yellow High Performance Green and Emerald Green Units DC Forward Current1 30 Transient Forward Current2 30 20 30 mA 500 500 500 500 mA Reverse Voltage (Ir = 100 A) 5 5 5 5 V LED Junction Temperature 110 110 110 110 C (10 sec Pulse) Operating Temperature Range -20 to +100 -40 to +100 -40 to +100 -20 to +100 C Storage Temperature Range -40 to +100 -40 to +100 -40 to +100 -40 to +100 C Notes: 1. See Figure 5 for maximum current derating vs. ambient temperature. 2. The transient current is the maximum nonrecurring peak current the device can withstand without damaging the LED die and wire bond. 4 Electrical Characteristics at TA = 25C Forward Voltage Vf (Volts) @ If = 20 mA Typ. Max. Reverse Breakdown Vr (Volts) @ Ir = 100 A Min. Capacitance C (pF) Vf = 0 f = 1 MHz Typ. Thermal Resistance RJ-PIN (C/W) Speed of Response s (ns) Time Constant e-t/s Typ. HLMP-C115 HLMP-C117 HLMP-C123 1.8 2.2 5 30 210 30 HLMP-C215 HLMP-C223 1.9 2.6 5 11 210 90 HLMP-C315 HLMP-C323 2.1 2.6 5 15 210 90 HLMP-C415 HLMP-C423 1.9 2.6 5 4 210 280 HLMP-C515 HLMP-C523 2.2 3.0 5 18 210 260 HLMP-C615 HLMP-C623 2.2 3.0 5 18 210 260 Luminous Intensity Iv (mcd) @ 20 mA[1] Min. Typ. Peak Wavelength peak (nm) Typ. Color, Dominant Wavelength d[2] (nm) Typ. Viewing Angle 21/2 (Degrees)[3] Typ. Luminous Efficacy v (lm/w) HLMP-C115 HLMP-C117 290 600 645 637 11 80 HLMP-C123 90 200 HLMP-C215 138 300 635 626 90 170 Part Number Optical Characteristics at TA = 25C Part Number HLMP-C315 HLMP-C415 HLMP-C515 HLMP-C615 146 300 96 170 138 300 90 170 170 300 69 170 17 45 6 27 26 17 145 23 583 585 17 500 25 600 602 17 380 23 568 570 20 595 28 558 560 20 656 28 Notes: 1. The luminous intensity, Iv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis. 2. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the color of the device. 3. 21/2 is the off-axis angle where the luminous intensity is 1/2 the on-axis intensity. 5 RELATIVE INTENSITY 1.0 TS AlGaAs RED DH As AlGaAs RED ORANGE EMERALD GREEN HIGH PERFORMANCE GREEN TA = 25 C HIGH EFFICIENCY RED 0.5 YELLOW 0 500 550 600 650 WAVELENGTH - nm 700 750 300.0 200.0 100.0 50.0 HIGH EFFICIENCY RED, ORANGE, YELLOW, AND HIGH PERFORMANCE GREEN, EMERALD GREEN DH As AlGaAs RED TS AlGaAs RED 100 IF - FORWARD CURRENT - mA IF - FORWARD CURRENT - mA Figure 1. Relative intensity vs. wavelength. 20.0 10.0 5.0 2.0 1.0 0.5 0.2 0.1 0 0.5 1.5 2.0 2.5 1.0 VF - FORWARD VOLTAGE - V 3.0 HIGH PERFORMANCE GREEN, EMERALD GREEN 80 60 HIGH EFFICIENCY RED/ORANGE 40 YELLOW 20 0 3.5 1.0 0 2.0 3.0 VF - FORWARD VOLTAGE - V 4.0 5.0 Figure 2. Forward current vs. forward voltage (non-resistor lamp). 2.0 1.0 0.5 TS AlGaAs RED 0.2 0.1 0.05 0.02 0.01 0.1 0.2 10 0.5 1 2 5 IF - DC FORWARD CURRENT - mA Figure 3. Relative luminous intensity vs. forward current. 6 HER, ORANGE, YELLOW, AND HIGH PERFORMANCE GREEN, EMERALD GREEN 1.6 DH As AlGaAs RED RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 5.0 20 30 50 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 5 10 20 15 IDC - DC CURRENT PER LED - mA 25 30 DH As AlGaAs RED 1.2 PEAK - RELATIVE EFFICIENCY (NORMALIZED AT 20 mA) RELATIVE EFFICIENCY (NORMALIZED AT 20 mA) 1.0 0.8 0.6 0.4 0.2 0 0 10 20 50 100 200 300 IPEAK - PEAK FORWARD CURRENT - mA 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 HER, ORANGE, YELLOW, HIGH PERFORMANCE GREEN, EMERALD GREEN EMERALD GREEN YELLOW HIGH EFFICIENCY RED/ORANGE HIGH PERFORMANCE GREEN 20 30 40 50 60 70 80 IPEAK - PEAK FORWARD CURRENT - mA 10 0 90 Figure 4. Relative efficiency (luminous intensity per unit current) vs. peak current. IF - FORWARD CURRENT - mA IF - FORWARD CURRENT - mA 40 35 30 25 RJA = 559C/W 20 RJA = 689C/W 15 10 5 0 HER, ORANGE, YELLOW, AND HIGH PERFORMANCE GREEN, EMERALD GREEN DH As AlGaAs RED 40 0 20 40 60 80 TA - AMBIENT TEMPERATURE - C 35 HER, ORANGE, GREEN, EMERALD GREEN 30 RJA = 470C/W RJA = 300C/W 25 20 15 10 5 0 100 YELLOW RJA = 705C/W 0 20 40 60 80 TA - AMBIENT TEMPERATURE - C 100 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 NORMALIZED LUMINOUS INTENSITY NORMALIZED LUMINOUS INTENSITY Figure 5. Maximum forward dc current vs. ambient temperature. Derating based on TjMAX = 110C. 45 35 25 15 5 -5 -15 -25 ANGULAR DISPLACEMENT - DEGREES Figure 6. Relative luminous intensity vs. angular displacement. 15 degree family. 7 -35 -45 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 45 35 25 15 5 -5 -15 -25 ANGULAR DISPLACEMENT - DEGREES Figure 7. Relative luminous intensity vs. angular displacement. 25 degree family. -35 -45 Intensity Bin Limits Color Red/Orange Yellow Green/ Emerald Green Color Categories Bin Intensity Range (mcd) Min. Max. L M N O P Q R S T U V W X Y Z L M N O P Q R S T U V W E F G H I J K L M N O P Q R S T U V W 101.5 162.4 234.6 340.0 540.0 850.0 1200.0 1700.0 2400.0 3400.0 4900.0 7100.0 10200.0 14800.0 21400.0 173.2 250.0 360.0 510.0 800.0 1250.0 1800.0 2900.0 4700.0 7200.0 11700.0 18000.0 7.6 12.0 19.1 30.7 49.1 78.5 125.7 201.1 289.0 417.0 680.0 1100.0 1800.0 2700.0 4300.0 6800.0 10800.0 16000.0 25000.0 Maximum tolerance for each bin limit is 18%. 8 162.4 234.6 340.0 540.0 850.0 1200.0 1700.0 2400.0 3400.0 4900.0 7100.0 10200.0 14800.0 21400.0 30900.0 250.0 360.0 510.0 800.0 1250.0 1800.0 2900.0 4700.0 7200.0 11700.0 18000.0 27000.0 12.0 19.1 30.7 49.1 78.5 125.7 201.1 289.0 417.0 680.0 1100.0 1800.0 2700.0 4300.0 6800.0 10800.0 16000.0 25000.0 40000.0 Color Green Yellow Orange Category# Lambda (nm) Min. Max. 6 561.5 564.5 5 564.5 567.5 4 567.5 570.5 3 570.5 573.5 2 573.5 576.5 1 582.0 584.5 3 584.5 587.0 2 587.0 589.5 4 589.5 592.0 5 592.0 593.0 1 597.0 599.5 2 599.5 602.0 3 602.0 604.5 4 604.5 607.5 5 607.5 610.5 6 610.5 613.5 7 613.5 616.5 8 616.5 619.5 Tolerance for each bin limit is 0.5 nm. Mechanical Option Matrix Mechanical Option Code Definition 00 Bulk Packaging, minimum increment 500 pcs/bag 01 Tape & Reel, crimped leads, minimum increment 1300 pcs/bag 02 Tape & Reel, straight leads, minimum increment 1300 pcs/bag B2 Right Angle Housing, even leads, minimum increment 500 pcs/bag UQ Ammo Pack, horizontal leads, in 1K minimum increment Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago representative for further clarification/information. Precautions: Lead Forming: The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Soldering and Handling: Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron's tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59 mm ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. Recommended soldering condition: Wave Soldering[1],[2] Manual Solder Dipping Pre-heat Temperature 105C Max. - Pre-heat Time 60 sec Max. - Peak Temperature 250C Max. 260C Max. Dwell Time 3 sec Max. 5 sec Max. Note: 1. Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. 9 Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. Recommended PC board plated through holes (PTH) size for LED component leads. LED Component Lead Size Diagonal Plated Through Hole Diameter 0.45 x 0.45 mm (0.018 x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020 x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED LAMINAR HOT AIR KNIFE TURBULENT WAVE 250 Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 245C 5C (maximum peak temperature = 250C) TEMPERATURE (C) 200 Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) 150 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) 100 Flux: Rosin flux Solder bath temperature: 245C 5C (maximum peak temperature = 250C) 50 PREHEAT Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) 0 10 20 30 40 50 60 TIME (MINUTES) 70 80 90 100 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. Packaging Label: (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Color Bin (P) Customer Item: 10 (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Color Bin DATECODE: Date Code For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright (c) 2005-2012 Avago Technologies. All rights reserved. Obsoletes 5989-4251EN AV02-1561EN - July 23, 2012