HLMP-C115, HLMP-C117, HLMP-C123, HLMP-C215,
HLMP-C223, HLMP-C315, HLMP-C323, HLMP-C415,
HLMP-C423, HLMP-C515, HLMP-C523, HLMP-C615,
HLMP-C623
T-1¾ Super Ultra-Bright LED Lamps
Data Sheet
Description
These non-di used lamps are designed to produce a bright
light source and smooth radiation pat tern. This lamp has
been designed with a 20 mil lead frame, enhanced ange,
and tight meniscus controls, making it compatible with
radial lead automated insertion equipment.
Applications
Ideal for backlighting front panels*
Used for lighting switches
Adapted for indoor and outdoor signs
Features
Very high intensity
Exceptional uniformity
Consistent viewability
All colors:
AlGaAs Red
High E ciency Red
Yellow
Orange
Green
Emerald Green
15° and 25° family
Tape and reel options available
Binned for color and intensity
2
Selection Guide
Part Number Luminous Intensity Iv (mcd)
Color 21/2[1] Stando Leads HLMP- Min. Max.
DH AS AlGaAs 15 No C115 290.0 –
C115-O00xx 290.0 –
C115-OP0xx 290.0 1000.0
Yes C117-OP0xx 290.0 1000.0
25 No C123 90.2 –
C123-L00xx 90.2 –
Red 15 No C215 138.0 –
C215-M00xx 138.0 –
C215-MN0xx 138.0 400.0
25 No C223 90.2 –
C223-L00xx 90.2 –
C223-MN0xx 138.0 400.0
Yellow 15 No C315 147.0 –
C315-L00xx 147.0 –
C315-LM0xx 147.0 424.0
25 No C323 96.2 –
C323-K00xx 96.2 –
C323-KL0xx 96.2 294.0
Orange 15 No C415 138.0 –
C415-M00xx 138.0 –
C415-M0D0xx 138.0 –
C415-MN0xx 138.0 400.0
25 No C423 90.2 –
C423-L00xx 90.2 –
C423-LM0xx 90.2 276.0
Green 15 No C515 170.0 –
C515-L00xx 170.0
C515-LM0xx 170.0 490.0
25 No C523 69.8 –
C523-J00xx 69.8 –
C523-KL0xx 111.7 340.0
Emerald Green 15 No C615 17.0 –
C615-G00xx 17.0 –
25 No C623 6.7 –
C623-E00xx 6.7 –
3
HLMP - C x xx - x x x xx
Mechanical Options
00: Bulk
01: Tape & Reel, Crimped Leads
02: Tape & Reel, Straight Leads
B2: Right Angle Housing, Even Leads
UQ: Ammo Pack, Horizontal Leads
Color Bin Options
0: Full Color Bin Distribution
D: Color Bins 4 & 5 only
Maximum Iv Bin Options
0: Open (No Maximum Limit)
Others: Please refer to the Iv Bin Table
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Viewing Angle & Stando s Options
15: 15 Degree, without Stando s
17: 15 Degree, with Stando s
23: 25 Degree, without Stando s
Color Options
1. AS AlGaAs Red
2. High E ciency Red
3. Yellow
4. Orange
5. Green
6. Emerald Green
Package Options
C: T-1 3/4 (5 mm)
Part Numbering System
4
Absolute Maximum Ratings at TA = 25°C
High High
DH AS E ciency Performance
AlGaAs Red and Green and
Parameter Red Orange Yellow Emerald Green Units
DC Forward Current1 30 30 20 30 mA
Transient Forward Current2 500 500 500 500 mA
(10 sec Pulse)
Reverse Voltage (Ir = 100 A) 5 5 5 5 V
LED Junction Temperature 110 110 110 110 °C
Operating Temperature Range –20 to +100 –40 to +100 –40 to +100 –20 to +100 °C
Storage Temperature Range –40 to +100 –40 to +100 –40 to +100 –40 to +100 °C
Notes:
1. See Figure 5 for maximum current derating vs. ambient temperature.
2. The transient current is the maximum nonrecurring peak current the device can withstand without damaging the LED die and wire bond.
Package Dimensions
HLMP-Cx15 and HLMP-Cx23 HLMP-Cx17
1.14 ± 0.20
(0.045 ± 0.008)
5.80 ± 0.20
(0.228 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
31.60
(1.244) MIN.
0.70 (0.028)
MAX.
1.00
(0.039) MIN.
8.71 ± 0.20
(0.343 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
0.50 ± 0.10
(0.020 ± 0.004) SQ. TYP.
CATHODE
LEAD
1.85 (0.073)
MAX.
CATHODE
FLAT
(NOTE 1)
1.14 ± 0.20
(0.045 ± 0.008)
5.80 ± 0.20
(0.228 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
31.60
(1.244) MIN.
0.70 (0.028)
MAX.
1.00
(0.039)MIN.
8.71 ± 0.20
(0.343 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
0.50 ± 0.10
(0.020 ± 0.004) SQ. TYP.
CATHODE
LEAD
CATHODE
FLAT
1.50 ± 0.15
(0.059 ± 0.006)
12.60 ± 0.18
(0.496 ± 0.007)
Notes:
1. All dimensions are in millimeters (inches).
2. An epoxy meniscus may extend about 0.5 mm (0.020 in.) down the leads.
5
Electrical Characteristics at TA = 25°C
Forward Reverse Capacitance Speed of Response
Voltage Breakdown C (pF) Thermal s (ns)
Vf (Volts) Vr (Volts) Vf = 0 Resistance Time Constant
@ If = 20 mA @ Ir = 100 A f = 1 MHz RJ-PIN e
-t/s
Part Number Typ. Max. Min. Typ. (°C/W) Typ.
HLMP-C115 1.8 2.2 5 30 210 30
HLMP-C117
HLMP-C123
HLMP-C215 1.9 2.6 5 11 210 90
HLMP-C223
HLMP-C315 2.1 2.6 5 15 210 90
HLMP-C323
HLMP-C415 1.9 2.6 5 4 210 280
HLMP-C423
HLMP-C515 2.2 3.0 5 18 210 260
HLMP-C523
HLMP-C615 2.2 3.0 5 18 210 260
HLMP-C623
Optical Characteristics at TA = 25°C
Luminous Color, Viewing
Intensity Peak Dominant Angle Luminous
Iv (mcd) Wavelength Wavelength 2½ E cacy
@ 20 mA[1] peak (nm) d[2] (nm) (Degrees)[3] v
Part Number Min. Typ. Typ. Typ. Typ. (lm/w)
HLMP-C115 290 600 645 637 11 80
HLMP-C117
HLMP-C123 90 200 26
HLMP-C215 138 300 635 626 17 145
90 170 23
HLMP-C315 146 300 583 585 17 500
96 170 25
HLMP-C415 138 300 600 602 17 380
90 170 23
HLMP-C515 170 300 568 570 20 595
69 170 28
HLMP-C615 17 45 558 560 20 656
6 27 28
Notes:
1. The luminous intensity, Iv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be
aligned with this axis.
2. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the color of the device.
3. 2½ is the o -axis angle where the luminous intensity is ½ the on-axis intensity.
6
ORANGE
WAVELENGTH – nm
RELATIVE INTENSITY
1.0
0.5
0
500 550 600 650 700 750
YELLOW
EMERALD GREEN
HIGH
PERFORMANCE
GREEN
TA = 25° C
TS AlGaAs RED
DH As AlGaAs RED
HIGH EFFICIENCY RED
IF – FORWARD CURRENT – mA
1.0 3.5
300.0
5.0
0.1
VF – FORWARD VOLTAGE – V
1.5 2.0 2.5 3.0
10.0
2.0
1.0
0.2
0.50
0.5
20.0
50.0
100.0
200.0 DH As AlGaAs RED
TS AlGaAs RED
0
100
80
60
40
20
IF – FORWARD CURRENT – mA
2.0 4.03.01.0
VF – FORWARD VOLTAGE – V
0 5.0
YELLOW
HIGH EFFICIENCY RED, ORANGE, YELLOW,
AND HIGH PERFORMANCE GREEN, EMERALD GREEN
HIGH EFFICIENCY
RED/ORANGE
HIGH PERFORMANCE GREEN,
EMERALD GREEN
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
0.1
0.01
IF – DC FORWARD CURRENT – mA
15
5.0
0.2
0.05
0.2 2 50
1.0
10
0.02
0.1
0.5
2.0
0.5 20 30
DH As AlGaAs RED
TS AlGaAs RED
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
0
0
IDC – DC CURRENT PER LED – mA
10 20
1.6
0.8
0.4
515 30
1.2
25
0.2
0.6
1.0
1.4
HER, ORANGE, YELLOW, AND HIGH
PERFORMANCE GREEN, EMERALD GREEN
Figure 1. Relative intensity vs. wavelength.
Figure 2. Forward current vs. forward voltage (non-resistor lamp).
Figure 3. Relative luminous intensity vs. forward current.
7
RELATIVE EFFICIENCY
(NORMALIZED AT 20 mA)
0
IPEAK – PEAK FORWARD CURRENT – mA
0
0.6
0.8
30020 100
1.2
1.0
0.2
0.4
50 20010
DH As AlGaAs RED
PEAK – RELATIVE EFFICIENCY
(NORMALIZED AT 20 mA)
0
IPEAK – PEAK FORWARD CURRENT – mA
0.4
0.6
0.8
1.0
9020 705040
1.3
1.1
HIGH PERFORMANCE GREEN
YELLOW
HIGH EFFICIENCY
RED/ORANGE
HER, ORANGE, YELLOW, HIGH
PERFORMANCE GREEN, EMERALD GREEN
0.5
0.7
0.9
1.2
30 60 8010
EMERALD GREEN
IF – FORWARD CURRENT – mA
IF – FORWARD CURRENT – mA
0
0
TA – AMBIENT TEMPERATURE – °C TA – AMBIENT TEMPERATURE – °C
40 80
40
20
10
20 60
30
100
5
15
25
35
DH As AlGaAs RED
RJA = 559°C/W
RJA = 689°C/W
NORMALIZED LUMINOUS INTENSITY
1.0
0.0
ANGULAR DISPLACEMENT – DEGREES
0.8
0.6
0.5
0.7
0.2
45
0.1
0.3
0.4
35 25 515 -5 -15 -25 -35 -45
0.9
NORMALIZED LUMINOUS INTENSITY
1.0
0.0
ANGULAR DISPLACEMENT – DEGREES
0.8
0.6
0.5
0.7
0.2
45
0.1
0.3
0.4
35 25 515 -5 -15 -25 -35 -45
0.9
0
040 80
40
20
10
20 60
30
100
5
15
25
35
HER, ORANGE, YELLOW, AND HIGH
PERFORMANCE GREEN, EMERALD GREEN
RJA = 470°C/W
RJA = 705°C/W
RJA = 300°C/W
YELLOW
HER, ORANGE, GREEN, EMERALD GREEN
Figure 5. Maximum forward dc current vs. ambient temperature. Derating based on TjMAX = 110°C.
Figure 4. Relative e ciency (luminous intensity per unit current) vs. peak current.
Figure 6. Relative luminous intensity vs. angular displacement.
15 degree family.
Figure 7. Relative luminous intensity vs. angular displacement.
25 degree family.
8
Intensity Bin Limits
Intensity Range (mcd)
Color Bin Min. Max.
L 101.5 162.4
M 162.4 234.6
N 234.6 340.0
O 340.0 540.0
P 540.0 850.0
Q 850.0 1200.0
R 1200.0 1700.0
Red/Orange S 1700.0 2400.0
T 2400.0 3400.0
U 3400.0 4900.0
V 4900.0 7100.0
W 7100.0 10200.0
X 10200.0 14800.0
Y 14800.0 21400.0
Z 21400.0 30900.0
L 173.2 250.0
M 250.0 360.0
N 360.0 510.0
O 510.0 800.0
P 800.0 1250.0
Yellow Q 1250.0 1800.0
R 1800.0 2900.0
S 2900.0 4700.0
T 4700.0 7200.0
U 7200.0 11700.0
V 11700.0 18000.0
W 18000.0 27000.0
E 7.6 12.0
F 12.0 19.1
G 19.1 30.7
H 30.7 49.1
I 49.1 78.5
J 78.5 125.7
K 125.7 201.1
L 201.1 289.0
Green/ M 289.0 417.0
Emerald Green N 417.0 680.0
O 680.0 1100.0
P 1100.0 1800.0
Q 1800.0 2700.0
R 2700.0 4300.0
S 4300.0 6800.0
T 6800.0 10800.0
U 10800.0 16000.0
V 16000.0 25000.0
W 25000.0 40000.0
Maximum tolerance for each bin limit is ± 18%.
Color Categories
Lambda (nm)
Color Category# Min. Max.
6 561.5 564.5
5 564.5 567.5
Green 4 567.5 570.5
3 570.5 573.5
2 573.5 576.5
1 582.0 584.5
3 584.5 587.0
Yellow 2 587.0 589.5
4 589.5 592.0
5 592.0 593.0
1 597.0 599.5
2 599.5 602.0
3 602.0 604.5
Orange 4 604.5 607.5
5 607.5 610.5
6 610.5 613.5
7 613.5 616.5
8 616.5 619.5
Tolerance for each bin limit is ± 0.5 nm.
Mechanical Option Matrix
Mechanical
Option Code
De nition
00 Bulk Packaging,
minimum increment 500 pcs/bag
01 Tape & Reel, crimped leads,
minimum increment 1300 pcs/bag
02 Tape & Reel, straight leads,
minimum increment 1300 pcs/bag
B2 Right Angle Housing, even leads,
minimum increment 500 pcs/bag
UQ Ammo Pack, horizontal leads,
in 1K minimum increment
Note:
All categories are established for classi cation of products. Products
may not be available in all categories. Please contact your local Avago
representative for further clari cation/information.
9
Wave Manual Solder
Soldering[1],[2] Dipping
Pre-heat Temperature 105°C Max. –
Pre-heat Time 60 sec Max. –
Peak Temperature 250°C Max. 260°C Max.
Dwell Time 3 sec Max. 5 sec Max.
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
LED Component Plated Through
Lead Size Diagonal Hole Diameter
0.45 x 0.45 mm 0.636 mm 0.98 to 1.08 mm
(0.018 x 0.018 inch) (0.025 inch) (0.039 to 0.043 inch)
0.50 x 0.50 mm 0.707 mm 1.05 to 1.15 mm
(0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause di culty inserting the TH LED.
Refer to application note AN5334 for more information
about soldering and handling of TH LED lamps.
1.59 mm
Precautions:
Lead Forming:
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
LED component may be e ectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
Recommended soldering condition:
Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering pro le to ensure that it is always conforming
to recommended soldering conditions.
Note:
1. PCB with di erent size and design (component density) will
have di erent heat mass (heat capacity). This might cause a
change in temperature experienced by the board if same wave
soldering setting is used. So, it is recommended to re-calibrate
the soldering pro le again before loading a new type of PCB.
2. Customer is advised to take extra precaution during wave
soldering to ensure that the maximum wave temperature
does not exceed 250°C and the solder contact time does not
exceeding 3sec. Over-stressing the LED during soldering process
might cause premature failure to the LED due to delamination.
Any alignment xture that is being applied during
wave soldering should be loosely tted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment xture or pallet.
If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using re ow soldering prior to insertion the TH LED.
Recommended PC board plated through holes (PTH)
size for LED component leads.
10
Example of Wave Soldering Temperature Pro le for TH LED
0 10 20 30 40 50 60 70 80 90 100
250
200
150
100
50
TIME (MINUTES)
PREHEAT
TURBULENT WAVE LAMINAR
HOT AIR KNIFE
TEMPERATURE (°C)
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Color Bin
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e3 max temp 250C
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved. Obsoletes 5989-4251EN
AV02-1561EN - July 23, 2012
(ii) Avago Baby Label (Only available on bulk packaging)
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
Customer P/N:
Supplier Code:
QUANTITY: Packing Quantity
CAT: Intensity Bin
BIN: Color Bin
DATECODE: Date Code
RoHS Compliant
e3 max tem
p
250C
Lam
p
s Bab
y
Label
