Technical Data 10493 Effective February 2016
Product description
• Three compact footprint options 0201
(0603 metric), 0402 (1005 metric), and
0603 (1608 metric)
• Zinc oxide ceramic chip
• Provides Electro Static Discharge (ESD)
protection with fast response time (<1 ns)
allowing equipment to pass IEC 61000-4-2
Level 4 test
• 0402 and 0603 meet IEC 61000-4-4 and
61000-4-5
• Compact footprint utilizes less board space
• Low and stable leakage current reduces
power consumption
• Low clamping voltage
• Wide operating voltage range: 5.5 Vdc to
26 Vdc
• Halogen free, lead free, RoHS compliant
Applications
• ESD port protection for mobile/smart phones
• Game console ESD port protection
• Set-top-boxes
• Tablets, notebooks, netbooks, laptops
• Media players
• Digital cameras
• Medical equipment
• Computers and peripherals ESD port protection
• Consumer electronics
MLVA-R
Multilayer varistor ESD suppressor
Pb
HALOGEN
HF
FREE
2
Technical Data 10493
Effective February 2016
MLVA-R
Multilayer varistor ESD suppressor
www.eaton.com/elx
Product specifications
Part number8Package size
Working voltage1, 2
(Vrms) (VDC)
Varistor
voltage3
(V)
Clamping
voltage4
(V)
Capacitance5
(pF) typical
Peak
current6
(A)
Transient
energy7
(J)
MLVA02V05C033-R 0201 (0603 metric) – 5.5 8–14 30 33 – –
MLVA02V05C047-R 0201 (0603 metric) – 5.5 8–14 26 47 – –
MLVA02V05C064-R 0201 (0603 metric) – 5.5 8–14 26 64 – –
MLVA04V05C270-R 0402 (1005 metric) 4 5.5 8–18 28 270 20 0.05
MLVA04V09C130-R 0402 (1005 metric) 7 9 11.5–21.5 41 130 20 0.05
MLVA04V18C085-R 0402 (1005 metric) 14 18 23–33 54 85 20 0.05
MLVA06V05C270-R 0603 (1608 metric) 4 5.5 8–18 31 270 30 0.1
MLVA06V09C210-R 0603 (1608 metric) 7 9 11.5–21.5 41 210 30 0.1
MLVA06V18C150-R 0603 (1608 metric) 14 18 23–33 54 150 30 0.1
MLVA06V26C100-R 0603 (1608 metric) 20 26 32–42 70 100 30 0.1
1. Working voltage Vrms: Maximum AC operating voltage the device can maintain and not exceed
10 μA leakage current.
2. Working voltage VDC: Maximum DC operating voltage the device can maintain and not exceed
10 μA leakage current
3. Varistor voltage: Voltage across the device measured at 1 mA DC current
4. Clamping voltage: Maximum peak voltage across the device with 8/20 μs waveform and
1 A pulse current
5. Capacitance test parameters: Zero volt bias, 1.0 MHz, 1.0 Vrms
Dimensions—mm
Part number A B C D E F G H
MLVA02V05C033-R 0.60 ±0.05 0.30 ±0.05 0.30 ±0.05 0.20± 0.10 0.30 0.80 0.25 0.30
MLVA02V05C047-R 0.60 ±0.05 0.30 ±0.05 0.30 ±0.05 0.20± 0.10 0.30 0.80 0.25 0.30
MLVA02V05C064-R 0.60 ±0.05 0.30 ±0.05 0.30 ±0.05 0.20± 0.10 0.30 0.80 0.25 0.30
MLVA04V05C270-R 0.95 ±0.15 0.50 ±0.10 0.50 ±0.10 0.25± 0.15 0.51 1.73 0.61 0.51
MLVA04V09C130-R 0.95 ±0.15 0.50 ±0.10 0.50 ±0.10 0.25± 0.15 0.51 1.73 0.61 0.51
MLVA04V18C085-R 0.95 ±0.15 0.50 ±0.10 0.50 ±0.10 0.25± 0.15 0.51 1.73 0.61 0.51
MLVA06V05C270-R 1.60 ±0.15 0.80 ±0.10 0.80 ±0.10 0.30± 0.20 0.50 2.54 1.02 0.76
MLVA06V09C210-R 1.60 ±0.15 0.80 ±0.10 0.80 ±0.10 0.30± 0.20 0.50 2.54 1.02 0.76
MLVA06V18C150-R 1.60 ±0.15 0.80 ±0.10 0.80 ±0.10 0.30± 0.20 0.50 2.54 1.02 0.76
MLVA06V26C100-R 1.60 ±0.15 0.80 ±0.10 0.80 ±0.10 0.30± 0.20 0.50 2.54 1.02 0.76
6. Peak current: Maximum peak current which may be applied with 8/20 μs waveform without
device failure.
7. Transient energy: Maximum energy which may be dissipated with 10/1000 μs waveform without
device failure.
8. Part Number Definition: MLVAxxVxxCxxx
MLVA xx= Product code and size
Vxx= Working DC voltage
Cxxx= Capacitance value
-R suffix= RoHS compliant.
3
Technical Data 10493
Effective February 2016
MLVA-R
Multilayer varistor ESD suppressor
www.eaton.com/elx
Environmental data
Operating temperature: - 40 °C to +85 °C
Storage temperature (component): +5 °C to +40 °C
Full load volatge: +85 °C at working voltage for 1000 hours
Varistor voltage typical < 10% change
Thermal shock: 5 cycles, - 40 °C to +85 °C, 30 minute dwell time
Varistor voltage typical < 10% change
Humidity bias: +40 °C, 90% relative humidity, at working voltage for 1000 hours
Varistor voltage typical < 10% change
Resistance to solder heat: 260 °C ± 5 °C for 10 seconds ± 1 second
Packaging information—mm
(Drawing not to scale)
Supplied in tape and reel packaging
15 000 parts per 7.0” diameter reel: MLVA02V05C033-R, MLVA02V05C047-R, MLVA02V05C064-R
10 000 parts per 7.0” diameter reel: MLVA04V05C270-R, MLVA04V09C130-R, MLVA04V18C085-R
Supplied in tape and reel packaging
4 000 parts per 7.0” diameter reel
MLVA06V05C270-R, MLVA06V09C210-R, MLVA06V18C150-R, MLVA06V26C100-R
Part number A B C
MLVA02V05C033-R 0.37 0.69 0.42
MLVA02V05C047-R 0.37 0.69 0.42
MLVA02V05C064-R 0.37 0.69 0.42
MLVA04V05C270-R 0.58 1.20 0.60
MLVA04V09C130-R 0.58 1.20 0.60
MLVA04V18C085-R 0.58 1.20 0.60
4
Technical Data 10493
Effective February 2016
MLVA-R
Multilayer varistor ESD suppressor
www.eaton.com/elx
Wave solder profile
Reflow soldering not recommended
Reference EN 61760-1:2006
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat • Temperature min. (Tsmin) 100°C 100°C
• Temperature typ. (Tstyp) 120°C 120°C
• Temperature max. (Tsmax) 130°C 130°C
• Time (Tsmin to Tsmax) (ts)70 seconds 70 seconds
D preheat to max Temperature 150°C max. 150°C max.
Peak temperature (TP)* 235°C – 260°C 250°C – 260°C
Time at peak temperature (tp)10 seconds max
5 seconds max each wave
10 seconds max
5 seconds max each wave
Ramp-down rate ~ 2 K/s min
~3.5 K/s typ
~5 K/s max
~ 2 K/s min
~3.5 K/s typ
~5 K/s max
Time 25°C to 25°C 4 minutes 4 minutes
Manual solder
350°C, 4-5 seconds (by soldering iron), generally manual hand soldering is not recommended.
Temperature
Time
T
smin
Tsmax
Tstyp
Tp
tp
First Wave Second Wave
Preheat area Cool down area
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/elx
© 2016 Eaton
All Rights Reserved
Printed in USA
Publication No. 10493 BU-MC16005
February 2016
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Technical Data 10493
Effective February 2016
MLVA-R
Multilayer varistor ESD suppressor
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25
°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Solder reflow profile
Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C
• Temperature max. (Tsmax) 150°C 200°C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds 60-120 Seconds
Average ramp up rate Tsmax to Tp3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (Tl)
Time at liquidous (tL)
183°C
60-150 Seconds
217°C
60-150 Seconds
Peak package body temperature (TP)* Table 1 Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc)20 Seconds** 30 Seconds**
Average ramp-down rate (Tp to Tsmax)6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm) 235°C 220°C
≥2.5mm 220°C 220°C
Table 2 - Lead (Pb) Free Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
350 - 2000
Volume
mm3
>2000
<1.6mm 260°C 260°C 260°C
1.6 – 2.5mm 260°C 250°C 245°C
>2.5mm 250°C 245°C 245°C
