1
2
3
4
5
6
7
89
10
11
12
13
14
15
16
R
RE
D
GND1
nc
Vcc2
B
A
nc
GND2
DE
DWPACKAGE
Vcc1
GND1 GND2
GND2
GND1
functiondiagram
D
R
B
A
13
12
DE
6
5
3
4
RE
GALVANIC ISOLATION
ISO3082,ISO3088
1
2
3
4
5
6
7
89
10
11
12
13
14
15
16
R
RE
D
GND1
Y
Vcc2
B
Z
A
GND2
DE
DWPACKAGE
Vcc1
GND1 GND2
GND2
GND1
DE 5
D6
R3
4
RE
Y
Z
B
A
14
11
12
13
functiondiagram
N
GALVANIC ISOLATIO
ISO3080,ISO3086
ISO3080, ISO3086
ISO3082, ISO3088
www.ti.com
SLOS581E –MAY 2008–REVISED SEPTEMBER 2011
ISOLATED 5-V FULL AND HALF-DUPLEX RS-485 TRANSCEIVERS
Check for Samples: ISO3080, ISO3086,ISO3082, ISO3088
1FEATURES APPLICATIONS
•4000-VPEAK Isolation, 560-Vpeak VIORM •Security Systems
–UL 1577, IEC 60747-5-2 (VDE 0884, Rev. 2), •Chemical Production
IEC 61010-1, IEC 60950-1 and CSA •Factory Automation
Approved •Motor/Motion Control
•Bus-Pin ESD Protection •HVAC and Building Automation Networks
–12 kV HBM Between Bus Pins and GND2 •Networked Security Stations
–6 kV HBM Between Bus Pins and GND1 ISO3080 Full-Duplex 200 kbps
•1/8 Unit Load –Up to 256 Nodes on a Bus ISO3086 Full-Duplex 20 Mbps
•Meets or Exceeds TIA/EIA RS-485 ISO3082 Half-Duplex 200 kbps
Requirements ISO3088 Half-Duplex 20 Mbps
•Signaling Rates up to 20 Mbps
•Thermal Shutdown Protection
•Low Bus Capacitance –16 pF (Typ)
•50 kV/μs Typical Transient Immunity
•Fail-safe Receiver for Bus Open, Short, Idle
•3.3-V Inputs are 5-V Tolerant
DESCRIPTION
The ISO3080, and ISO3086 are isolated full-duplex differential line drivers and receivers while the ISO3082, and
ISO3088 are isolated half-duplex differential line transceivers for TIA/EIA 485/422 applications.
These devices are ideal for long transmission lines since the ground loop is broken to allow for a much larger
common-mode voltage range. The symmetrical isolation barrier of the device is tested to provide 2500 Vrms of
isolation for 60s between the bus-line transceiver and the logic-level interface.
Any cabled I/O can be subjected to electrical noise transients from various sources. These noise transients can
cause damage to the transceiver and/or near-by sensitive circuitry if they are of sufficient magnitude and
duration. These isolated devices can significantly increase protection and reduce the risk of damage to
expensive control circuits.
The ISO3080, SO3082, ISO3086 and ISO3088 are qualified for use from –40°C to 85°C.
spacer
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright ©2008–2011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
ISO3080, ISO3086
ISO3082, ISO3088
SLOS581E –MAY 2008–REVISED SEPTEMBER 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS(1)
VALUE UNIT
VCC Input supply voltage, (2) VCC1, VCC2 –0.3 to 6 V
VOVoltage at any bus I/O terminal –9 to 14 V
VIT Voltage input, transient pulse, A, B, Y, and Z (through 100Ω, see Figure 11)–50 to 50 V
VIVoltage input at any D, DE or RE terminal –0.5 to 7 V
IOReceiver output current ±10 mA
Bus pins and GND1 ±6
JEDEC Standard 22,
Human Body Model Bus pins and GND2 ±12 kV
Test Method A114-C.01 All pins ±4
Electrostatic
ESD discharge JEDEC Standard 22,
Charged Device ±1 kV
Model Test Method C101 All pins
Machine Model ANSI/ESDS5.2-1996 ±200 V
TJMaximum junction temperature 150 °C
TSTG Operating junction temperature –65 to 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values except differential I/O bus voltages are with respect to network ground terminal and are peak voltage values
RECOMMENDED OPERATING CONDITIONS MIN TYP MAX UNIT
VCC1 Logic-side supply voltage (1) 3.15 5.5 V
VCC2 Bus-side supply voltage(1) 4.5 5 5.5 V
VOC Voltage at either bus I/O terminal A, B –7 12 V
VIH High-level input voltage 2 VCC
D, DE, RE V
VIL Low-level input voltage 0 0.8
A with respect to B –12 12
VID Differential input voltage V
Dynamic (ISO3086) see Figure 14
RLDifferential input resistance 54 60 Ω
Driver –60 60
IOOutput current mA
Receiver –8 8
TJOperating junction temperature –40 85 °C
(1) For 5-V operation, VCC1 or VCC2 is specified from 4.5 V to 5.5 V. For 3.3-V operation, VCC1 is specified from 3.15 V to 3.6V.
SUPPLY CURRENT
over recommended operating condition (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
RE at 0 V or VCC, DE at 0 V or VCC1 3.3-V VCC1 8
ICC1 Logic-side supply current mA
RE at 0 V or VCC, DE at 0 V or VCC1 5-V VCC1 10
ICC2 Bus-side supply current RE at 0 V or VCC, DE at 0 V, No load 15 mA
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ISO3080, ISO3086
ISO3082, ISO3088
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SLOS581E –MAY 2008–REVISED SEPTEMBER 2011
DRIVER ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IO= 0 mA, no load 3 4.3 VCC
RL= 54 Ω, See Figure 1 1.5 2.3
Differential output voltage
| VOD | V
magnitude RL= 100 Ω(RS-422), See Figure 1 2 2.3
Vtest from –7 V to +12 V, See Figure 2 1.5
Change in magnitude of the –0.2 0 0.2 V
Δ|VOD| See Figure 1 and Figure 2
differential output voltage
Steady-state common-mode 1 2.6 3
VOC(SS) output voltage See Figure 3 V
Change in steady-state –0.1 0.1
ΔVOC(SS) common-mode output voltage
Peak-to-peak common-mode 0.5 V
VOC(pp) See Figure 3
output voltage
IIInput current D, DE, VIat 0 V or VCC1 –10 10 μA
ISO3082 See receiver input current
ISO3088 VYor VZ= 12 V,
High-impedance state output VCC = 0 V or 5 V, 1
IOZ current DE = 0 V
ISO3080 Other input at 0 V μA
ISO3086 VYor VZ=–7 V.
VCC = 0 V or 5 V, –1
DE = 0 V
VAor VBat –7 V
IOS Short-circuit output current Other input at 0 V –200 200 mA
VAor VBat 12 V
CMTI Common-mode transient immunity See Figure 12 and Figure 13 25 50 kV/μs
DRIVER SWITCHING CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ISO3080/82 0.7 1.3 μs
tPLH,Propagation delay
tPHL ISO3086/88 25 45 ns
ISO3080/82 20 200
PWD(1) Pulse skew (|tPHL –tPLH|) See Figure 4 ns
ISO3086/88 3 7.5
ISO3080/82 0.5 0.9 1.5 μs
tr, tfDifferential output signal rise and fall time ISO3086/88 7 15 ns
Propagation delay, 50% Vo 2.5 7
ISO3080/82 μs
tPZH, high-impedance-to-high-level output 90% Vo 1.8
tPZL Propagation delay, See Figure 5 and
ISO3086/88 25 55
high-impedance-to-low-level output Figure 6,
Propagation delay, ISO3080/82 95 225
DE at 0 V ns
tPHZ, high-level-to-high-impedance output
tPLZ Propagation delay, low-level to ISO3086/88 25 55
high-impedance output
(1) Also known as pulse skew
Copyright ©2008–2011, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088
0 or II
VI
VCC1
DE
A
B
V
OB V
OA
V
OD
IOA
IOB
GND1
GND1 GND2
VCC1
GND2
375 W
60 W
+
VOD
–
D
DE
GND 2
VCC2
A
B
0 V or 3 V
375 W
–7 V to 12 V
ISO3080, ISO3086
ISO3082, ISO3088
SLOS581E –MAY 2008–REVISED SEPTEMBER 2011
www.ti.com
RECEIVER ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIT(+) Positive-going input threshold voltage IO=–8 mA –85 –10 mV
VIT(–)Negative-going input threshold voltage IO= 8 mA –200 –115 mV
Vhys Hysteresis voltage (VIT+ –VIT–) 30 mV
3.3-V VCC1 VCC1-0.4 3.1
VID = 200 mV, IO=–8 mA,
VOH High-level output voltage V
See Figure 7 5-V VCC1 4 4.8
3.3-V VCC1 0.15 0.4
VID =–200 mV, IO= 8 mA,
VOL Low-level output voltage V
See Figure 7 5-V VCC1 0.15 0.4
IO(Z) High-impedance state output current VI=–7 to 12 V, Other input = 0 V –1 1 μA
VAor VB= 12 V 0.04 0.1
VAor VB= 12 V, VCC = 0 0.06 0.13
Other input
IIBus input current mA
at 0 V
VAor VB=–7 V –0.1 –0.04
VAor VB=–7 V, VCC = 0 –0.05 –0.03
IIH High-level input current, RE VIH = 2 V –10 10 μA
IIL Low-level input current, RE VIL = 0.8 V –10 10 μA
RID Differential input resistance A, B 48 kΩ
Test input signal is a 1.5 MHz sine wave with 1Vpp
CDDifferential input capacitance 7 pF
amplitude. CD is measured across A and B.
RECEIVER SWITCHING CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH, tPHL Propagation delay 90 125 ns
PWD(1) Pulse width distortion |tPHL –tPLH| See Figure 8 4 12
tr, tfOutput signal rise and fall time 1 ns
tPHZ, Propagation delay, high-level-to-high-impedance output See Figure 9, DE at 0 V 22 ns
tPZH Propagation delay, high-impedance-to-high-level output
tPZL, Propagation delay, high-impedance-to-low-level output See Figure 10, DE at 0 V 22 ns
tPLZ Propagation delay, low-level-to-high-impedance output
(1) Also known as pulse skew.
PARAMETER MEASUREMENT INFORMATION
Figure 1. Driver VOD Test and Current Definitions Figure 2. Driver VOD With Common-Mode Loading
Test Circuit
Note: Unless otherwise stated, test circuits are shown for half-duplex devices, ISO3082 &ISO3088. For
full-duplex devices, driver output pins are Y and Z.
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Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088
Input II
VI
VCC1
DE
A
B
VOB VOA
VOD
IOA
IOB
GND2
GND1
GND1 GND2
VOC
27 W
VOC
BVB
VA
A
VOC(SS)
OC(p-p)
V
27 W
Generator: PRR= 100 kHz, 50 % duty
cycle, t r< 6ns , tf<6 ns , ZO= 50 W
Input
VOD
50 W
D
A
B
DE
VCC1
VI
Input
Generator
Generator: PRR = 100 kHz, 50 % duty cycle,
tr< 6ns, t f<6 ns , ZO= 50
3V
tf
tr
tPLH tPHL
10%
90%
VOD
VI
90%
10%
VOD(H)
VOD(L)
includesfixtureand
instrumentationcapacitance
L
C50%50%
GND1
R =54
±1%
LWC =50pF
±20%
L
50% 50%
Input
Generator 50 W
3 Viftesting A output,
0 ViftestingBoutput S1
CLincludesfixtureand
instrumentation
capacitance
D
A
DE
50% 50%
3 V
VOH
tPZH
tPHZ
50%
90%
0 V
VO
VI
3Vor0V
VI
GND1
VO
C =50pF±20%
L
R =110
±1%
LW
GeneratorPRR=50kHz,50%dutycycle,
t <6ns,t <6ns,Z =50
r f O W
0V
~
~
ISO3080, ISO3086
ISO3082, ISO3088
www.ti.com
SLOS581E –MAY 2008–REVISED SEPTEMBER 2011
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 3. Test Circuit and Waveform Definitions For The Driver Common-Mode Output Voltage
Figure 4. Driver Switching Test Circuit and Voltage Waveforms
Figure 5. Driver High-Level Output Enable and Disable Time Test Circuit and Voltage Waveforms
Copyright ©2008–2011, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088
GND 2
Input
Generator 50 W
3 Vor0 V
S1
3V
D
A
B
DE
VIC includesfixtureand
Linstrumentation
capacitance
Generator: PRR =50 kHz ,50% duty cycle,
r< 6ns, tf< 6ns, Z = 50t
0 Viftesting A output,
3 ViftestingBoutput
50%
3V
VOL
tPZL tPLZ
10%
VO
VI
5V
50%
50%
C =50pF±20%
L
R =110
±1%
LW
0V
Input
Generator
1.5 V
C includesfixtureand
L
instrumentationcapacitance
A
B
RVO
VI
RE
50 W
Generator: PRR=100 kHz, 50% duty cycle,
r< 6ns, t f< 6ns, ZO=50 W
t
50% 50%
3 V
VOH
VOL
tf
tr
tPLH tPHL
10%
90%
50% 50%
0 V
VO
VI
C =15pF
±20%
L
50%
VOH
tPZH tpHZ
50%
3 V
90%
VI
VO
0 V
50%
!
VCC
Input
Generator 50 W
R
A
B
C includes fixture
L
and instrumentation
capacitance
RE
VI
VO
CL= 15 pF ±20 %
S1
1kW
1.5 V
0 V
Generator:PRR=100 kHz, 50% duty cycle ,
r<6ns, tf<6ns, ZO=50 W
t
±1%
ISO3080, ISO3086
ISO3082, ISO3088
SLOS581E –MAY 2008–REVISED SEPTEMBER 2011
www.ti.com
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 6. Driver Low-Level Output Enable and Disable Time Test Circuit and Voltage Waveform
Figure 7. Receiver Voltage and Current Definitions
Figure 8. Receiver Switching Test Circuit and Waveforms
Figure 9. Receiver Enable Test Circuit and Waveforms, Data Output High
6Submit Documentation Feedback Copyright ©2008–2011, Texas Instruments Incorporated
Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088
VCC
Input
Generator 50 W
R
A
B
C includesfixture
L
andinstrumentation
capacitance
RE
VI
VO
CL= 15 pF ±20%
S1
0 V
1.5 V
Generator: PRR =100 kHz, 50% dutycycle,
r<6ns, tf< 6ns, ZO=50 W
t
50%
3 V
0 V
VI
VCC
VOL
tPZL tPLZ
VO
50%
50%
10%
1k ±1%W
A
B
PulseGenerator
15 sduration
1%dutycycle
t ,t 100ns
m
£
r f
R
Note:Thistestisconductedtotestsurvivabilityonly.
DatastabilityattheRoutputisnotspecified.
D
+
_
RE
DE
0V
3V
100 ±1%W
D
R
DE
RE
54 W
GND1
VTEST
GND2
A
B
GND1
S1
2V
0.8V
V orV
OH OL 1kW
CL =15pF
(includesprobeand
jigcapacitance)
V orV
OH OL
VCC1 VCC2
C=0.1 F
1%
m
±
C=0.1 F 1%m ±
ISO3080, ISO3086
ISO3082, ISO3088
www.ti.com
SLOS581E –MAY 2008–REVISED SEPTEMBER 2011
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 10. Receiver Enable Test Circuit and Waveforms, Data Output Low
Figure 11. Transient Over-Voltage Test Circuit
Figure 12. Half-Duplex Common-Mode Transient Immunity Test Circuit
Copyright ©2008–2011, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088
D
DE
RE
54 W
GND1
VTEST
GND2
Y
Z
GND1
S 1
1.5 V or0 V
0 V or1.5 V
B
A
2 V
0.8 V
C = 0.1 F
1%
m
±
C = 0.1 F 1%m ±
VCC1 VCC2
1 kW
54 W
CL = 15 pF
(includes probe and
jig capacitance)
V or V
OH OL
V or V
OH OL
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
0 2 4 6 8 10 12 14 16 18 20
Signaling Rate - Mbps
V - Differential Input Voltage - pk
ID
ISO3080, ISO3086
ISO3082, ISO3088
SLOS581E –MAY 2008–REVISED SEPTEMBER 2011
www.ti.com
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 13. Full-Duplex Common-Mode Transient Immunity Test Circuit
DEVICE INFORMATION
Figure 14. ISO3086 Recommended Minimum Differential Input Voltage vs Signaling Rate
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ISO3080, ISO3086
ISO3082, ISO3088
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SLOS581E –MAY 2008–REVISED SEPTEMBER 2011
Table 1. Driver Function Table(1)
ENABLE
INPUT INPUT OUTPUTS(1)
(D)
VCC1 VCC2 (DE)
Y / A Z / B
PU PU H H H L
PU PU L H L H
PU PU X L hi-Z hi-Z
PU PU X OPEN hi-Z hi-Z
PU PU OPEN H H L
PD PU X X hi-Z hi-Z
PU PD X X hi-Z hi-Z
PD PD X X hi-Z hi-Z
(1) Driver output pins are Y &Z for full-duplex devices and A &B for half-duplex devices.
Table 2. Receiver Function Table(1)
DIFFERENTIAL INPUT ENABLE OUTPUT
VCC1 VCC2 VID = (VA–VB) (RE) (R)
PU PU –0.01 V ≤VID L H
PU PU –0.2 V <VID < –0.01 V L ?
PU PU VID ≤ –0.2 V L L
PU PU X H hi-Z
PU PU X OPEN hi-Z
PU PU Open circuit L H
PU PU Short Circuit L H
PU PU Idle (terminated) bus L H
PD PU X X hi-Z
PU PD X L H
(1) PU = Powered Up; PD = Powered Down; H = Logic High; L= Logic Low; X = Irrelevant, hi-Z = High
Impedance (off), ? = Indeterminate
PACKAGE CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER(1) TEST CONDITIONS MIN TYP MAX UNIT
Shortest terminal to terminal distance through
L(I01) Minimum air gap (Clearance) 8.34 mm
air
Shortest terminal to terminal distance across
L(I02) Minimum external tracking (Creepage) 8.1 mm
the package surface
Tracking resistance (Comparative Tracking
CTI DIN IEC 60112 / VDE 0303 Part 1 ≥175 V
Index)
Minimum Internal Gap (Internal Clearance) Distance through the insulation 0.008 mm
Input to output, VIO = 500 V, all pins on each
RIO Isolation resistance side of the barrier tied together creating a >1012 Ω
two-terminal device
CIO Barrier capacitance Input to output VI = 0.4 sin (4E6πt) 2 pF
CIInput capacitance to ground VI = 0.4 sin (4E6πt) 2 pF
(1) Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care
should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on
the printed circuit board do not reduce this distance.
Creepage and clearance on a printed circuit board become equal according to the measurement techniques shown in the Isolation
Glossary. Techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these specifications.
Copyright ©2008–2011, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088
ISO3080, ISO3086
ISO3082, ISO3088
SLOS581E –MAY 2008–REVISED SEPTEMBER 2011
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IEC 60664-1 RATINGS TABLE
PARAMETER TEST CONDITIONS SPECIFICATION
Basic isolation group Material group IIIa
Rated mains voltage ≤150 VRMS I-IV
Installation classification Rated mains voltage ≤300 VRMS I-III
Rated mains voltage ≤400 VRMS I-II
IEC 60747-5-2 INSULATION CHARACTERISTICS (1)
over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS SPECIFICATION UNIT
Maximum working insulation
VIORM 560 V
voltage Method b1, VPR = VIORM ×1.875,
VPR Input to output test voltage 1050 V
100% Production test with t = 1 s, Partial discharge <5 pC
VIOTM Transient overvoltage t = 60 s 4000 V
RSInsulation resistance VIO = 500 V at TS>109Ω
Pollution degree 2
(1) Climatic Classification 40/125/21
REGULATORY INFORMATION
VDE CSA UL
Approved under CSA Component Recognized under 1577 Component
Certified according to IEC 60747-5-2 Acceptance Notice Recognition Program(1)
File Number: 40016131 File Number: 220991 File Number: E181974
(1) Production tested ≥3000 VRMS for 1 second in accordance with UL 1577.
IEC SAFETY LIMITING VALUES
Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.
A failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate
sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system
failures.
PARAMETER MIN TYP MAX UNIT
Safety input, output, or supply θJA = 168°C/W, VI= 5.5 V, TJ= 170°C,
ISDW-16 157 mA
current TA= 25°C
TSMaximum case temperature DW-16 150 °C
The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum
ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the
application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the
Thermal Characteristics table is that of a device installed in the JESD51-3, Low Effective Thermal Conductivity
Test Board for Leaded Surface Mount Packages and is conservative. The power is the recommended maximum
input voltage times the current. The junction temperature is then the ambient temperature plus the power times
the junction-to-air thermal resistance.
10 Submit Documentation Feedback Copyright ©2008–2011, Texas Instruments Incorporated
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0
20
40
60
80
100
120
140
160
180
0 50 100 150 200
T - Case Temperature - °C
C
Safety Limiting Current - mA
V = V = 5.5 V
CC1 CC2
ISO3080, ISO3086
ISO3082, ISO3088
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SLOS581E –MAY 2008–REVISED SEPTEMBER 2011
THERMAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Low-K Thermal Resistance(1) 168
θJA Junction-to-Air °C/W
High-K Thermal Resistance 96.1
θJB Junction-to-Board Thermal Resistance 61 °C/W
θJC Junction-to-Case Thermal Resistance 48 °C/W
VCC1 = VCC2 = 5.25 V, TJ= 150°C, CL= 15 pF,
PDDevice Power Dissipation 220 mW
Input a 20 MHz 50% duty cycle square wave
(1) Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages.
Figure 15. DW-16 θJC Thermal Derating Curve per IEC 60747-5-2
Copyright ©2008–2011, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088
DandREInput DEInput
16V
16V
VCC
Input
A Input
16V
16V
VCC
Input
BInput
36kW
3.3VROutput
36kW
180kW
36kW
180kW
36kW
1MW
Input
VCC1
VCC1
500 W
1MW
Input
VCC1 VCC1
500 W
VCC1
VCC1 VCC1
6.4 W11 W
4W5.5 W
5VROutput
Y andZOutputs
16V
16V
Output
VCC
ISO3080, ISO3086
ISO3082, ISO3088
SLOS581E –MAY 2008–REVISED SEPTEMBER 2011
www.ti.com
EQUIVALENT CIRCUIT SCHEMATICS
12 Submit Documentation Feedback Copyright ©2008–2011, Texas Instruments Incorporated
Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088
ISO3080, ISO3086
ISO3082, ISO3088
www.ti.com
SLOS581E –MAY 2008–REVISED SEPTEMBER 2011
REVISION HISTORY
Changes from Original (May 2008) to Revision A Page
•Changed the Package Characteristics table - L(101) Minimum air gap (Clearance) From 7.7mm To 8.34mm .................. 9
•Deleted the CSA column from the Regulatory Information Table. ..................................................................................... 10
•Changed the file number in the VDE column of the Regulatory Information table From: 40014131 To: 40016131 .......... 10
Changes from Revision A (June 2008) to Revision B Page
•Changed Features bullet From: 4000-VPEAK Isolation, To: 4000-VPEAK Isolation,, 560-VPEAK VIORM ..................................... 1
•Added Features sub bullet: UL 1577, IEC 60747-5-2 (VDE 0884, Rev. 2), IEC 61010-1, IEC 60950-1 and CSA
Approved ............................................................................................................................................................................... 1
•Added the CSA column to the Regulatory Information table .............................................................................................. 10
Changes from Revision B (December 2008) to Revision C Page
•Changed Recommended Operatings Condition table note From: For 3-V operation, VCC1 or VCC2 is specified from
3.15 V to 3.6V. To: For 3-V operation, VCC1 is specified from 3.15 V to 3.6V. ..................................................................... 2
Changes from Revision C (October 2009) to Revision D Page
•Added TSTG row to the abs max table ................................................................................................................................... 2
•Added "Dynamic"conditions to Recommended Operating Conditions VID spec with reference to Figure 14 ...................... 2
•Changed for 3 V to 3.3 V in note 1 of the recommended operating table ............................................................................ 2
•Deleted VI= VCC! or 0 V from CMTI spec. Conditions statement. Added "Figure 13".......................................................... 3
•Changed top row, UNIT column, split into 2 rows, top row µs and second row ns .............................................................. 3
•Added note to bottom of first page of the Parameter Measurement information ................................................................. 4
•Added Figure 14 ................................................................................................................................................................... 8
•Added Footnotes to Driver Function Table and Receiver Function Table ............................................................................ 9
•Changed File Number from '1698195'to '220991 in Regulatory Information table ............................................................ 10
•Changed θJAfrom 212°C/W to 168°C/W in conditions statement for ISspec.; and MAX current from 210 mA to 157
mA ....................................................................................................................................................................................... 10
•Changed graph for "DW-16 θJC Thermal Derating Curve per IEC 60747-5-2",Figure 15 ................................................. 11
Changes from Revision D (January 2011) to Revision E Page
•Changed the second list item in FEATURES from 16 kV to 12 kV ...................................................................................... 1
•Changed ESD HBM spec in the ABS MAX TABLE, value from +/-16 to +/-12 .................................................................... 2
Copyright ©2008–2011, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088
PACKAGE OPTION ADDENDUM
www.ti.com 26-Mar-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
ISO3080DW ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ISO3080DWG4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ISO3080DWR ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ISO3080DWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ISO3082DW ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ISO3082DWG4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ISO3082DWR ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ISO3082DWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ISO3086DW ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ISO3086DWG4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ISO3086DWR ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ISO3086DWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ISO3088DW ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ISO3088DWG4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ISO3088DWR ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ISO3088DWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
PACKAGE OPTION ADDENDUM
www.ti.com 26-Mar-2012
Addendum-Page 2
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
ISO3080DWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
ISO3082DWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
ISO3086DWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Aug-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
ISO3080DWR SOIC DW 16 2000 367.0 367.0 38.0
ISO3082DWR SOIC DW 16 2000 367.0 367.0 38.0
ISO3086DWR SOIC DW 16 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Aug-2012
Pack Materials-Page 2
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