100
110
120
130
140
150
160
170
180
190
200
−40 −15 10 35 60 85
Temperature (°C)
Supply Current (nA)
VDD = 1.2 V
VDD = 3.3 V
VDD = 5.0 V
VDD = 6.5 V
G001
VDD
RESET
GND
TPS383xK33
RST
Microprocessor
3.3 V
C
0.1 F
1
m
MR
TPS3831
Only
Product
Folder
Sample &
Buy
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TPS3831, TPS3839
SBVS193D –JUNE 2012–REVISED JULY 2015
TPS383x 150-nA, Ultralow Power, Supply Voltage Monitor
1 Features 3 Description
The TPS3831 and TPS3839 devices (both referred to
1• Ultralow Supply Current: 150 nA (Typical) as TPS383x) are ultralow current (150 nA, typical),
• Operating Supply Voltage: 0.9 V to 6.5 V voltage supervisory circuits that monitor a single
• Valid Reset for VDD > 0.6 V voltage. Both devices initiate an active-low reset
signal whenever the VDD supply voltage drops below
• Push-Pull RESET Output the factory-trimmed reset threshold voltage. The reset
• Factory-Trimmed Reset Threshold Voltages output remains low for 200 ms (typical) after the VDD
• Temperature Range: –40°C to 85°C voltage rises above the threshold voltage and
hysteresis. These devices are designed to ignore fast
• Packages: 1-mm × 1-mm X2SON or 3-Pin SOT23 transients on the VDD pin. The TPS3831 device
includes a manual reset input that forces RESET low
2 Applications when MR is low.
• Portable and Battery-Powered Equipment The ultralow current consumption of 150 nA makes
• Metering these voltage supervisors ideal for use in low-power
• Industrial Equipment and portable applications. The TPS383x devices are
• Cell Phones specified to have the correct output logic state for
supply voltages down to 0.6 V.
• Glucose Monitors The TPS383x devices feature precision factory-
• Tablets trimmed threshold voltages and extremely low-power
• Wearables operation. The TPS3831 device is available in a 4-
pin, 1-mm × 1-mm (DQN) X2SON package. The
TPS3839 device is available in a 3-pin SOT23 (DBZ)
package or a 4-pin, 1-mm × 1-mm (DQN) X2SON
package.
Device Information(1)
PACKAGE SIZE
PART NUMBER PACKAGE (NOM)
TPS3831 X2SON (4) 1.00 mm x 1.00 mm
SOT-23 (3) 2.92 mm x 2.37 mm
TPS3839 X2SON (4) 1.00 mm x 1.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application Circuit Supply Current vs Temperature
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS3831, TPS3839
SBVS193D –JUNE 2012–REVISED JULY 2015
www.ti.com
Table of Contents
8.4 Device Functional Modes........................................ 12
1 Features.................................................................. 19 Applications and Implementation ...................... 13
2 Applications ........................................................... 19.1 Application Information............................................ 13
3 Description............................................................. 19.2 Typical Application.................................................. 13
4 Revision History..................................................... 210 Power Supply Recommendations ..................... 15
5 Device Options....................................................... 411 Layout................................................................... 15
6 Pin Configuration and Functions......................... 511.1 Layout Guidelines ................................................. 15
7 Specifications......................................................... 611.2 Layout Example .................................................... 15
7.1 Absolute Maximum Ratings ...................................... 612 Device and Documentation Support................. 16
7.2 ESD Ratings.............................................................. 612.1 Device Support...................................................... 16
7.3 Recommended Operating Conditions....................... 612.2 Documentation Support ........................................ 16
7.4 Thermal Information.................................................. 612.3 Related Links ........................................................ 16
7.5 Electrical Characteristics........................................... 712.4 Community Resources.......................................... 16
7.6 Timing Requirements................................................ 812.5 Trademarks........................................................... 16
7.7 Typical Characteristics.............................................. 912.6 Electrostatic Discharge Caution............................ 16
8 Detailed Description............................................ 11 12.7 Glossary................................................................ 17
8.1 Overview................................................................. 11 13 Mechanical, Packaging, and Orderable
8.2 Functional Block Diagram....................................... 11 Information ........................................................... 17
8.3 Feature Description................................................. 11
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (February 2015) to Revision D Page
• Changed µA to nA in document title....................................................................................................................................... 1
• Added TPS3839G25 to document ......................................................................................................................................... 1
• Changed Applications section: moved Metering bullet to second in list, changed Tablets bullet, added Wearables bullet.. 1
• Changed first paragraph of Description section .................................................................................................................... 1
• Changed Device Information table: changed Package Size column heading and value of SOT-23 row ............................. 1
• Added TPS3839G25 row to Device Options table ................................................................................................................ 4
• Changed Thermal Information table ...................................................................................................................................... 6
• Changed VIT– and Vhys parameters in Electrical Characteristics table: changed test conditions, added TPS3839G25 rows 7
Changes from Revision B (April 2013) to Revision C Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
• Changed title of data sheet ................................................................................................................................................... 1
• Changed Operating Supply Voltage bullet from 0.6 V to 0.9 V.............................................................................................. 1
• Changed last sentence of Description section ...................................................................................................................... 1
• Changed front page figure ..................................................................................................................................................... 1
• Added MR parameter to Absolute Maximum Ratings ........................................................................................................... 6
• Changed condition statement for Electrical Characteristics .................................................................................................. 7
• Changed V(VO) parameter symbol to VPOR ............................................................................................................................. 7
• Changed Figure 1................................................................................................................................................................... 8
• Changed Functional Block Diagram; added hysteresis symbol to op amp.......................................................................... 11
• Deleted Typical Application Circuit figure............................................................................................................................. 13
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SBVS193D –JUNE 2012–REVISED JULY 2015
Changes from Revision A (September 2012) to Revision B Page
• Changed VDD test conditions for high-level output voltage parameter................................................................................... 7
Changes from Original (June 2012) to Revision A Page
• Changed data sheet status from product preview to production data.................................................................................... 1
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TPS3831, TPS3839
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5 Device Options
THRESHOLD PACKAGE
PRODUCT PACKAGE-LEAD
VOLTAGE (V) DESIGNATOR(1)
TPS3831A09 0.9 X2SON-4 DQN
TPS3831G12 1.1 X2SON-4 DQN
TPS3831E16 1.52 X2SON-4 DQN
TPS3831G18 1.67 X2SON-4 DQN
TPS3831L30 2.63 X2SON-4 DQN
TPS3831K33 2.93 X2SON-4 DQN
TPS3831G33 3.08 X2SON-4 DQN
TPS3831K50 4.38 X2SON-4 DQN
SOT23-3 DBZ
TPS3839A09 0.9 X2SON-4 DQN
SOT23-3 DBZ
TPS3839G12 1.1 X2SON-4 DQN
SOT23-3 DBZ
TPS3839E16 1.52 X2SON-4 DQN
SOT23-3 DBZ
TPS3839G18 1.67 X2SON-4 DQN
TPS3839G25 2.325 SOT23-3 DBZ
SOT23-3 DBZ
TPS3839L30 2.63 X2SON-4 DQN
SOT23-3 DBZ
TPS3839K33 2.93 X2SON-4 DQN
SOT23-3 DBZ
TPS3839G33 3.08 X2SON-4 DQN
SOT23-3 DBZ
TPS3839K50 4.38 X2SON-4 DQN
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
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GND
RESET
1
2
3VDD
VDD
GND
RESET
NC
1
23
4
Thermal
Pad
VDD
GND
RESET
MR
1
23
4
Thermal
Pad
TPS3831, TPS3839
www.ti.com
SBVS193D –JUNE 2012–REVISED JULY 2015
6 Pin Configuration and Functions
TPS3831 DQN Package TPS3839 DQN Package
1-mm × 1-mm X2SON 1-mm × 1-mm X2SON
Top View Top View
TPS3839 DBZ Package
SOT23-3
Top View
Pin Functions
PIN
NO. I/O DESCRIPTION
NAME TPS3839 TPS3839 TPS3831
(SOT23-3) (X2SON) (X2SON)
GND 1 3 3 — Ground
Manual reset. Pull this pin to a logic low to assert the RESET output.
MR N/A N/A 2 I After the MR pin is deasserted, the RESET output deasserts after the
reset delay (td) elapses.
NC N/A 2 N/A — No internal connection.
Active-low reset output. RESET has a push-pull output drive and is
capable of directly driving input pins. RESET is low as long as VDD
RESET 2 1 1 O remains below the factory threshold voltage, and until the delay time
(td) elapses after VDD rises above the threshold voltage.
Connect to ground or to a floating copper plane for mechanical
Thermal pad N/A Available Available — stability.
VDD 3 4 4 I Supply voltage
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range, unless otherwise noted(1)
MIN MAX UNIT
VDD, RESET –0.3 7 V
Voltage MR –0.3 VDD + 0.3 V
Current RESET pin –10 10 mA
Operating ambient, TA–40 85
Temperature(2) °C
Storage, Tstg –65 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) As a result of the low dissipated power in this device, the junction temperature is assumed to be equal to the ambient temperature.
7.2 ESD Ratings VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000
V(ESD) Electrostatic discharge V
Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT
VDD Input supply voltage 0.9 6.5 V
VMR Manual reset pin voltage 0 VDD V
VRESET RESET pin voltage 0 6.5 V
IRESET RESET pin current 0 8 mA
7.4 Thermal Information TPS3831,
TPS3839 TPS3839
THERMAL METRIC(1) UNIT
DBZ (SOT23-3) DQN (X2SON)
3 PINS 4 PINS
RθJA Junction-to-ambient thermal resistance 346.6 216.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 124.4 161.7 °C/W
RθJB Junction-to-board thermal resistance 78.9 162.1 °C/W
ψJT Junction-to-top characterization parameter 11.5 5.1 °C/W
ψJB Junction-to-board characterization parameter 77.3 161.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 123.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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SBVS193D –JUNE 2012–REVISED JULY 2015
7.5 Electrical Characteristics
At TA= –40°C to 85°C, 0.9 V < VDD < 6.5 V, and C1 = 0.1 µF, unless otherwise noted. Typical values are at 25°C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VDD Input supply voltage 0.9 6.5 V
V(POR) Minimum VDD voltage for valid output IOL = 1 µA 0.6 V
IDD Supply current (into VDD pin) Output not connected 150 500 nA
VDD = 0.9 V to 1.2 V, IOL = 120 µA 0.4
VOL Low-level output voltage (RESET pin) VDD = 1.2 V to 2.8 V, IOL = 0.5 mA 0.4 V
VDD = 2.8 V to 6.5 V, IOL = 2 mA 0.4
VDD = 0.9 V to 1.2 V, IOH = –50 µA VDD – 0.4
VOH High-level output voltage (RESET pin) VDD = 1.2 V to 3.3 V, IOH = –0.5 mA VDD – 0.4 V
VDD = 3.3 V to 6.5 V, IOH = –2 mA VDD – 0.4
VIL Low-level input voltage (MR pin) 0.3VDD V
VIH High-level input voltage (MR pin) 0.7VDD V
RMR MR pin pullup resistance 10 20 30 kΩ
Negative-going input threshold accuracy TA= 25°C ±1%
TPS383xA09 0.874 0.9 0.914
TPS383xG12 1.073 1.1 1.117
TPS383xE16 1.482 1.52 1.543
TPS383xG18 1.628 1.67 1.695
VIT– Negative-going threshold voltage TPS3839G25 2.267 2.325 2.360 V
TPS383xL30 2.564 2.63 2.669
TPS383xK33 2.857 2.93 2.974
TPS383xG33 3.003 3.08 3.126
TPS383xK50 4.271 4.38 4.446
TPS383xA09 54
TPS383xG12 11
TPS383xE16 15
TPS383xG18 17
Vhys Hysteresis voltage TPS383xL30 26 mV
TPS3839G25 23
TPS383xK33 29
TPS383xG33 31
TPS383xK50 44
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7.6 Timing Requirements
At TA= –40°C to 85°C, 0.9 V < VDD < 6.5 V, and C1 = 0.1 µF, unless otherwise noted. Typical values are at 25°C.
MIN TYP MAX UNIT
tdRESET delay time (power-up delay) 120 200 350 ms
tPD_VDD Propagation delay, VDD falling (power-down delay) 20 µs
tPD_MR Propagation delay from MR low to RESET low 46 ns
Figure 1. MR and VDD Reset Timing
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0.5
1.5
2.5
3.5
0 2 4 6 8 10
IOH (mA)
VOH (V)
TA = −40°C
TA = 0°C
TA = +25°C
TA = +85°C
VDD = 3.3 V
G005
2
2.5
3
3.5
4
0 2 4 6 8 10 12
IOH (mA)
VOH (V)
TA = −40°C
TA = 0°C
TA = +25°C
TA = +85°C
VDD =4.0 V
G006
−1
−0.8
−0.6
−0.4
−0.2
0
0.2
−40 −15 10 35 60 85
Temperature (°C)
Change in VIT– (%)
TPS3839A09
TPS3839K50
G003
0.8
1
1.2
1.4
1.6
1.8
0 0.5 1 1.5 2 2.5 3 3.5
IOH (mA)
VOH (V)
TA = −40°C
TA = 0°C
TA = +25°C
TA = +85°C
VDD = 1.8 V
G004
100
110
120
130
140
150
160
170
180
190
200
−40 −15 10 35 60 85
Temperature (°C)
Supply Current (nA)
VDD = 1.2 V
VDD = 3.3 V
VDD = 5.0 V
VDD = 6.5 V
G001
180
190
200
210
220
−40 −15 10 35 60 85
Temperature (°C)
Reset Delay Time (ms)
TPS3839K33
G002
TPS3831, TPS3839
www.ti.com
SBVS193D –JUNE 2012–REVISED JULY 2015
7.7 Typical Characteristics
At TA= 25°C and C1= 0.1 µF, unless otherwise noted.
Figure 2. Supply Current vs Temperature Figure 3. Reset Delay vs Temperature
Figure 4. Threshold Voltage vs Temperature Figure 5. VOH vs IOH and Temperature for VDD = 1.8 V
Figure 6. VOH vs IOH and Temperature for VDD = 3.3 V Figure 7. VOH vs IOH and Temperature for VDD = 4.0 V
Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 9
0
0.2
0.4
0.6
0.8
1
1.2
1.4
0 2 4 6 8 10
IOL (mA)
VOL (V)
TA = −40°C
TA = 0°C
TA = +25°C
TA = +85°C
VDD = 4.0 V
G009
10
15
20
25
30
35
40
45
50
0 5 10 15 20 25 30 35
VDD voltage drop below VIT− (%)
Minimum Pulse Duration Trigger Reset (µs)
Reset Occurs Above Line
G010
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
0 1 2 3 4 5
IOL (mA)
VOL (V)
TA = −40°C
TA = 0°C
TA = +25°C
TA = +25°C
VDD = 1.8 V
G007
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
0 2 4 6 8 10
IOL (mA)
VOL (V)
TA = −40°C
TA = 0°C
TA = +25°C
TA = +85°C
VDD = 3.3 V
G008
TPS3831, TPS3839
SBVS193D –JUNE 2012–REVISED JULY 2015
www.ti.com
Typical Characteristics (continued)
At TA= 25°C and C1= 0.1 µF, unless otherwise noted.
Figure 8. VOL vs IOL and Temperature for VDD = 1.8 V Figure 9. VOL vs IOL and Temperature for VDD = 3.3 V
Figure 10. VOL vs IOL and Temperature for VDD = 4.0 V Figure 11. Maximum Pulse Duration vs Percent of
Threshold Overdrive
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Transient
Duration
(t )
W
Transient
Amplitude
VDD
VIT-
Delay
VREF
VDD
GND
RESET
MR
( Only)TPS3831
VDD
TPS3831, TPS3839
www.ti.com
SBVS193D –JUNE 2012–REVISED JULY 2015
8 Detailed Description
8.1 Overview
The TPS3831 and TPS3839 are ultralow current voltage supervisory circuits that monitor the input supply voltage
of these devices. Both devices assert an active-low reset whenever the VDD supply voltage drops below the
negative-going threshold voltage (VIT–). The output, RESET, remains asserted for approximately
200 ms after the VDD voltage rises above the positive-going threshold voltage (VIT– + Vhys). These devices are
designed to ignore fast transients on the VDD pin.
The TPS3831 device includes a manual reset input (MR) that can be used to force the RESET signal low, even if
the supply voltage is above VIT–.
8.2 Functional Block Diagram
8.3 Feature Description
8.3.1 VDD Transient Rejection
The TPS383x (TPS3831 and TPS3839) devices have built-in rejection of fast transients on the VDD pin.
Transient rejection depends on both the duration and amplitude of the transient. Transient amplitude is measured
from the bottom of the transient to the negative threshold voltage (VIT–) of the device, as shown in Figure 12.
Figure 12. Voltage Transient Measurement
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VDD
GND
TPS3831
20 kW
MR
10
15
20
25
30
35
40
45
50
0 5 10 15 20 25 30 35
VDD voltage drop below VIT− (%)
Minimum Pulse Duration Trigger Reset (µs)
Reset Occurs Above Line
G010
TPS3831, TPS3839
SBVS193D –JUNE 2012–REVISED JULY 2015
www.ti.com
Feature Description (continued)
Figure 13 shows the relationship between the transient amplitude and duration required to trigger a reset. Any
combination of duration and amplitude greater than that shown in Figure 13 generates a reset signal.
Figure 13. TPS3839 Transient Rejection
8.3.2 Manual Reset (MR) Input (TPS3831 Only)
The manual reset (MR) input allows a processor, or other logic devices, to initiate a reset (TPS3831 device only).
A logic low (0.3 VDD) on MR causes RESET to assert. After MR returns to a logic high and VDD is greater than
the threshold voltage, RESET is deasserted after the reset delay time, td, elapses. MR is internally tied to VDD
with a 20-kΩresistor; therefore, this pin can be left unconnected if MR is not used. If a logic signal driving MR
does not go fully to VDD, some additional current draws into VDD as a result of the internal pullup resistor on MR.
To minimize current draw, a logic-level FET can be used, as shown in Figure 14.
Figure 14. Using a Logic-Level FET to Minimize Current Draw
8.4 Device Functional Modes
8.4.1 Normal Operation (VDD > VDD(min))
When the voltage on VDD is greater than VDD(min), the RESET output corresponds to the voltage on the VDD pin
relative to VIT–.
8.4.2 Below VDD(min) (V(POR) < VDD < VDD(min)
When the voltage on VDD is less than VDD(min) but greater than the power-on reset voltage (V(POR)), the RESET
output is asserted.
8.4.3 Below Power-On Reset (VDD < V(POR)
When the voltage on VDD is lower than the power-on reset voltage (V(POR)), the RESET output is undefined. Do
not rely on the RESET output for proper device function under this condition.
12 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated
4.7 PH
10 PF
10 PF
5 k:
L
VIN VOUT
RI
GND
FB
EN
One-Cell
Alkaline
VDD
GND
RESET
TPS3839A09
3.3 V at 40 mA
TPS61261
TPS3831, TPS3839
www.ti.com
SBVS193D –JUNE 2012–REVISED JULY 2015
9 Applications and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
Low operating voltage and threshold options make the TPS383x devices well-suited for monitoring single-cell,
alkaline-battery applications.
9.2 Typical Application
Figure 15 shows the TPS3839A09 used to disable a boost converter when the cell voltage reaches 0.9 V, which
is the end of the discharge voltage for a single alkaline battery cell. When the cell voltage reaches 0.9 V, the
TPS61261 enable pin is driven low. This setting disables the TPS61261 and places it in a low-current shutdown
state. The combination of the TPS3839 and TPS61261 devices consumes only 250 nA (typical) from the
discharged battery.
Figure 15. Disabled Boost Converter
9.2.1 Design Requirements
Table 1 lists the design requirements for Figure 15.
Table 1. Design Requirements and Results
DESIGN RESULT
DESIGN REQUIREMENTS TPS3839A09 TPS61261 COMBINED
Input voltage range of 0.9 V to 1.7 V 0.9 V to 6.5 V 0.8 V to 4 V 0.9 V to 4 V
Shutdown current < 3 µA 0.5 μA (maximum) 1.5 μA (maximum) 2.0 μA (maximum)
Output voltage of 3.3 V N/A 3.3 V 3.3 V
Output current of 50 mA N/A 100 mA 100 mA
Switching frequency ≥1 MHz N/A 2.5 MHz 2.5 MHz
Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 13
100
110
120
130
140
150
160
170
180
190
200
−40 −15 10 35 60 85
Temperature (°C)
Supply Current (nA)
VDD = 1.2 V
VDD = 3.3 V
VDD = 5.0 V
VDD = 6.5 V
G001
RESET
GND
TPS3839K33
VDD
RST
Microprocessor
3.3 V
VCC
47 k:
TPS3831, TPS3839
SBVS193D –JUNE 2012–REVISED JULY 2015
www.ti.com
9.2.2 Detailed Design Procedure
9.2.2.1 Input Capacitor
The TPS383x devices use a unique sampling scheme to maintain an extremely low average quiescent current of
150 nA. The TPS383x devices typically consume only approximately 100 nA of dc current. However, this current
rises to approximately 15 µA for about 200 µs when the TPS383x devices sample the input voltage. If the source
impedance back to the supply voltage is high, then the additional current during sampling may trigger a false
reset as a result of the apparent voltage drop at VDD. For applications with high-impedance input supplies
(including trace impedance), TI recommends adding a small 0.1-µF bypass capacitor near the TPS3839 VDD
pin. This bypass capacitor effectively keeps the average current at 150 nA and reduces the effects of a high-
impedance voltage source.
9.2.2.2 Bidirectional Reset Pins
Some devices have bidirectional reset pins that act both as an input and an output. For applications where the
TPS383x devices drive a bidirectional reset pin, place a series resistor between the TPS383x output and the
reset pin to protect against excessive current flow when both the TPS383x devices and the reset pin attempt to
drive the reset line. Figure 16 shows the connection of the TPS3839K33 to a bidirectional reset pin of a
microcontroller using a series resistor.
Figure 16. Connection to a Bidirectional Reset Pin
9.2.3 Application Curve
Figure 17. Supply Current vs Temperature
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Input
Supply
1
2
RESET
Flag
3
CVDD
TPS3831, TPS3839
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SBVS193D –JUNE 2012–REVISED JULY 2015
10 Power Supply Recommendations
These devices are designed to operate from an input supply with a voltage range between 0.9 V and 6.5 V. Use
a low-impedance power supply to eliminate inaccuracies caused by the extra current during the input-voltage
sampling discussed in the Input Capacitor section.
11 Layout
11.1 Layout Guidelines
Make sure the connection to the VDD pin is low impedance and able to carry 15 µA without a significant voltage
drop. Place a 0.1-µF bypass capacitor near the VDD pin if the 15-µA sampling current causes too much voltage
droop.
11.2 Layout Example
Figure 18. Recommended Layout
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www.ti.com
12 Device and Documentation Support
12.1 Device Support
12.1.1 Development Support
12.1.1.1 Evaluation Modules
Two evaluation modules (EVMs) are available to assist in the initial circuit performance evaluation using the
TPS3831 and TPS3839. The TPS3831G33EVM-187 and TPS3839K33EVM-112 evaluation modules (and
related user's guides) can be requested at the TI website through the product folders or purchased directly from
the TI eStore.
12.1.1.2 Spice Models
Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of
analog circuits and systems. SPICE models for the TPS3831 and TPS3839 devices are available through each
of the product folders under Tools & Software.
12.2 Documentation Support
12.2.1 Related Documentation
•TPS3831G33EVM-187 User's Guide,SLVU774
•TPS3839K33EVM-112 User's Guide,SLVU758.
• TPS61261 Data Sheet, SLVSA99
12.3 Related Links
Table 2 lists quick access links. Categories include technical documents, support and community resources,
tools and software, and quick access to sample or buy.
Table 2. Related Links
TECHNICAL TOOLS & SUPPORT &
PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY
TPS3831 Click here Click here Click here Click here Click here
TPS3839 Click here Click here Click here Click here Click here
12.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.6 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
16 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated
TPS3831, TPS3839
www.ti.com
SBVS193D –JUNE 2012–REVISED JULY 2015
12.7 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 17
PACKAGE OPTION ADDENDUM
www.ti.com 9-Jul-2015
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TPS3831A09DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 A3
TPS3831A09DQNT ACTIVE X2SON DQN 4 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 A3
TPS3831E16DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 A5
TPS3831E16DQNT ACTIVE X2SON DQN 4 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 A5
TPS3831G12DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 A4
TPS3831G12DQNT ACTIVE X2SON DQN 4 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 A4
TPS3831G18DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 A6
TPS3831G18DQNT ACTIVE X2SON DQN 4 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 A6
TPS3831G33DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 A7
TPS3831G33DQNT ACTIVE X2SON DQN 4 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 A7
TPS3831K33DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 A8
TPS3831K33DQNT ACTIVE X2SON DQN 4 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 A8
TPS3831K50DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 A9
TPS3831K50DQNT ACTIVE X2SON DQN 4 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 A9
TPS3831L30DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 BA
TPS3831L30DQNT ACTIVE X2SON DQN 4 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 BA
TPS3839A09DBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PZDI
PACKAGE OPTION ADDENDUM
www.ti.com 9-Jul-2015
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TPS3839A09DBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PZDI
TPS3839A09DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZJ
TPS3839A09DQNT ACTIVE X2SON DQN 4 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZJ
TPS3839E16DBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PZCI
TPS3839E16DBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PZCI
TPS3839E16DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZK
TPS3839E16DQNT ACTIVE X2SON DQN 4 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZK
TPS3839G12DBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PZBI
TPS3839G12DBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PZBI
TPS3839G12DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZE
TPS3839G12DQNT ACTIVE X2SON DQN 4 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZE
TPS3839G18DBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PZAI
TPS3839G18DBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PZAI
TPS3839G18DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZL
TPS3839G18DQNT ACTIVE X2SON DQN 4 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZL
TPS3839G25DBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PZNI
TPS3839G25DBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PZNI
TPS3839G33DBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PYZI
PACKAGE OPTION ADDENDUM
www.ti.com 9-Jul-2015
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TPS3839G33DBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PYZI
TPS3839G33DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZG
TPS3839G33DQNT ACTIVE X2SON DQN 4 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZG
TPS3839K33DBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PYYI
TPS3839K33DBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PYYI
TPS3839K33DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZF
TPS3839K33DQNT ACTIVE X2SON DQN 4 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZF
TPS3839K50DBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PYXI
TPS3839K50DBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PYXI
TPS3839K50DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZH
TPS3839K50DQNT ACTIVE X2SON DQN 4 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZH
TPS3839L30DBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PYWI
TPS3839L30DBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 PYWI
TPS3839L30DQNR ACTIVE X2SON DQN 4 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZI
TPS3839L30DQNT ACTIVE X2SON DQN 4 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 9-Jul-2015
Addendum-Page 4
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS3831A09DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3831A09DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3831E16DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3831E16DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3831G12DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3831G12DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3831G18DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3831G18DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3831G33DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3831G33DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3831K33DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3831K33DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3831K50DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3831K50DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3831L30DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3831L30DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3839A09DBZR SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3
TPS3839A09DBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Jul-2015
Pack Materials-Page 1
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS3839A09DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3839A09DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3839E16DBZR SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3
TPS3839E16DBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3
TPS3839E16DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3839E16DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3839G12DBZR SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3
TPS3839G12DBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3
TPS3839G12DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3839G12DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3839G18DBZR SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3
TPS3839G18DBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3
TPS3839G18DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3839G18DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3839G25DBZR SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3
TPS3839G25DBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3
TPS3839G33DBZR SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3
TPS3839G33DBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3
TPS3839G33DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3839G33DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3839K33DBZR SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3
TPS3839K33DBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3
TPS3839K33DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3839K33DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3839K50DBZR SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3
TPS3839K50DBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3
TPS3839K50DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3839K50DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3839L30DBZR SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3
TPS3839L30DBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3
TPS3839L30DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
TPS3839L30DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Jul-2015
Pack Materials-Page 2
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS3831A09DQNR X2SON DQN 4 3000 184.0 184.0 19.0
TPS3831A09DQNT X2SON DQN 4 250 184.0 184.0 19.0
TPS3831E16DQNR X2SON DQN 4 3000 184.0 184.0 19.0
TPS3831E16DQNT X2SON DQN 4 250 184.0 184.0 19.0
TPS3831G12DQNR X2SON DQN 4 3000 184.0 184.0 19.0
TPS3831G12DQNT X2SON DQN 4 250 184.0 184.0 19.0
TPS3831G18DQNR X2SON DQN 4 3000 184.0 184.0 19.0
TPS3831G18DQNT X2SON DQN 4 250 184.0 184.0 19.0
TPS3831G33DQNR X2SON DQN 4 3000 184.0 184.0 19.0
TPS3831G33DQNT X2SON DQN 4 250 184.0 184.0 19.0
TPS3831K33DQNR X2SON DQN 4 3000 184.0 184.0 19.0
TPS3831K33DQNT X2SON DQN 4 250 184.0 184.0 19.0
TPS3831K50DQNR X2SON DQN 4 3000 184.0 184.0 19.0
TPS3831K50DQNT X2SON DQN 4 250 184.0 184.0 19.0
TPS3831L30DQNR X2SON DQN 4 3000 184.0 184.0 19.0
TPS3831L30DQNT X2SON DQN 4 250 184.0 184.0 19.0
TPS3839A09DBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0
TPS3839A09DBZT SOT-23 DBZ 3 250 203.0 203.0 35.0
TPS3839A09DQNR X2SON DQN 4 3000 184.0 184.0 19.0
TPS3839A09DQNT X2SON DQN 4 250 184.0 184.0 19.0
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Jul-2015
Pack Materials-Page 3
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS3839E16DBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0
TPS3839E16DBZT SOT-23 DBZ 3 250 203.0 203.0 35.0
TPS3839E16DQNR X2SON DQN 4 3000 184.0 184.0 19.0
TPS3839E16DQNT X2SON DQN 4 250 184.0 184.0 19.0
TPS3839G12DBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0
TPS3839G12DBZT SOT-23 DBZ 3 250 203.0 203.0 35.0
TPS3839G12DQNR X2SON DQN 4 3000 184.0 184.0 19.0
TPS3839G12DQNT X2SON DQN 4 250 184.0 184.0 19.0
TPS3839G18DBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0
TPS3839G18DBZT SOT-23 DBZ 3 250 203.0 203.0 35.0
TPS3839G18DQNR X2SON DQN 4 3000 184.0 184.0 19.0
TPS3839G18DQNT X2SON DQN 4 250 184.0 184.0 19.0
TPS3839G25DBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0
TPS3839G25DBZT SOT-23 DBZ 3 250 203.0 203.0 35.0
TPS3839G33DBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0
TPS3839G33DBZT SOT-23 DBZ 3 250 203.0 203.0 35.0
TPS3839G33DQNR X2SON DQN 4 3000 184.0 184.0 19.0
TPS3839G33DQNT X2SON DQN 4 250 184.0 184.0 19.0
TPS3839K33DBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0
TPS3839K33DBZT SOT-23 DBZ 3 250 203.0 203.0 35.0
TPS3839K33DQNR X2SON DQN 4 3000 184.0 184.0 19.0
TPS3839K33DQNT X2SON DQN 4 250 184.0 184.0 19.0
TPS3839K50DBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0
TPS3839K50DBZT SOT-23 DBZ 3 250 203.0 203.0 35.0
TPS3839K50DQNR X2SON DQN 4 3000 184.0 184.0 19.0
TPS3839K50DQNT X2SON DQN 4 250 184.0 184.0 19.0
TPS3839L30DBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0
TPS3839L30DBZT SOT-23 DBZ 3 250 203.0 203.0 35.0
TPS3839L30DQNR X2SON DQN 4 3000 184.0 184.0 19.0
TPS3839L30DQNT X2SON DQN 4 250 184.0 184.0 19.0
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Jul-2015
Pack Materials-Page 4
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