DISCRETE SEMICONDUCTORS DATA SHEET BAP51-03 General purpose PIN diode Product specification Supersedes data of 1999 Aug 16 2004 Feb 11 Philips Semiconductors Product specification General purpose PIN diode BAP51-03 FEATURES PINNING * Low diode capacitance PIN * Low diode forward resistance. DESCRIPTION 1 cathode 2 anode APPLICATIONS * General RF applications. DESCRIPTION 1 General purpose PIN diode in a SOD323 small plastic SMD package. 2 sym006 Top view Marking code: A5. The marking bar indicates the cathode. Fig.1 Simplified outline (SOD323) and symbol. ORDERING INFORMATION TYPE NUMBER BAP51-03 PACKAGE NAME - DESCRIPTION VERSION plastic surface mounted package; 2 leads SOD323 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VR continuous reverse voltage - 50 V IF continuous forward current - 50 mA Ptot total power dissipation - 500 mW Tstg storage temperature -65 +150 C Tj junction temperature -65 +150 C 2004 Feb 11 TS = 90 C 2 Philips Semiconductors Product specification General purpose PIN diode BAP51-03 ELECTRICAL CHARACTERISTICS Tj = 25 C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VF forward voltage IF = 50 mA - 0.95 1.1 V VR reverse voltage IR = 10 A 50 - - V IR reverse current VR = 50 V - - 100 nA Cd diode capacitance rD L diode forward resistance charge carrier life time VR = 0; f = 1 MHz - 0.4 - pF VR = 1 V; f = 1 MHz - 0.3 0.55 pF VR = 5 V; f = 1 MHz - 0.2 0.35 pF IF = 0.5 mA; f = 100 MHz; note 1 - 5.5 9 IF = 1 mA; f = 100 MHz; note 1 - 3.6 6.5 IF = 10 mA; f = 100 MHz; note 1 - 1.5 2.5 when switched from IF = 10 mA to IR = 6 mA; RL = 100 ; measured at IR = 3 mA - 550 - ns Note 1. Guaranteed on AQL basis: inspection level S4, AQL 1.0. THERMAL CHARACTERISTICS SYMBOL Rth(j-s) 2004 Feb 11 PARAMETER thermal resistance from junction to soldering point 3 VALUE UNIT 120 K/W Philips Semiconductors Product specification General purpose PIN diode BAP51-03 GRAPHICAL DATA MGS322 MGS323 10 500 handbook, halfpage handbook, halfpage Cd (fF) rD () 400 5 300 200 2 100 1 10-1 1 0 10 I F (mA) 4 0 8 12 16 Tj = 25 C; f = 100 MHz. Tj = 25 C; f = 1 MHz. Fig.2 Fig.3 Forward resistance as a function of forward current; typical values. Diode capacitance as a function of reverse voltage; typical values. MGS660 MGS659 0 0 handbook, halfpage |S | 2 handbook, halfpage |S | 2 21 (dB) -5 21 (dB) -0.5 (1) (2) (3) -1 -10 -1.5 -15 -2 -20 -2.5 0.5 1 1.5 2 -25 0.5 3 2.5 (2) IF = 1 mA. 2 2.5 3 Diode zero biased and inserted in series with a 50 stripline circuit. Tamb = 25 C. Insertion loss (|S21|2) of the diode as a function of frequency; typical values. 2004 Feb 11 1.5 (3) IF = 0.5 mA. Diode inserted in series with a 50 stripline circuit and biased via the analyzer Tee network. Tamb = 25 C. Fig.4 1 f (GHz) f (GHz) (1) IF = 10 mA. 20 VR (V) Fig.5 4 Isolation (|S21|2) of the diode as a function of frequency; typical values. Philips Semiconductors Product specification General purpose PIN diode BAP51-03 PACKAGE OUTLINE Plastic surface mounted package; 2 leads SOD323 A D E X v HD M A Q 1 2 bp A A1 (1) c Lp detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E HD Lp Q v mm 1.1 0.8 0.05 0.40 0.25 0.25 0.10 1.8 1.6 1.35 1.15 2.7 2.3 0.45 0.15 0.25 0.15 0.2 Note 1. The marking bar indicates the cathode OUTLINE VERSION SOD323 2004 Feb 11 REFERENCES IEC JEDEC JEITA SC-76 5 EUROPEAN PROJECTION ISSUE DATE 99-09-13 03-12-17 Philips Semiconductors Product specification General purpose PIN diode BAP51-03 DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2004 Feb 11 6 Philips Semiconductors - a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. SCA76 (c) Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R77/04/pp7 Date of release: 2004 Feb 11 Document order number: 9397 750 12631