HLMP-Ex1A/1B-xxxDV (15 minimum), HLMP-Ex3A/3B-xxxDV (30 minimum) 5mm Extra High Brightness AlInGaP LED lamps Data Sheet Description Features These 5mm Extra High Brightness AlInGaP LEDs provide superior light output for excellent readability in sunlight and are extremely reliable. AlInGaP LED technology provides extremely stable light output over long periods of time. These Extra High Brightness lamps utilize the aluminum indium gallium phosphide (AlInGaP) technology. * Viewing Angle: 15 minimum 30 minimum These LED lamps are untinted. T-13/4 packages incorporating second generation optics producing well defined spatial radiation patterns at specific viewing cone angles. * Package options: - With or without standoff These lamps are made with an advanced optical grade epoxy offering superior high temperature and high moisture resistance performance in outdoor signal and sign application. The maximum LED junction temperature limit of +130C enables high temperature operation in bright sunlight conditions. The epoxy contain both uv-a and uv-b inhibitor to reduce the effects of long term exposure to direct sunlight. * Untinted for 15 and 30 lamps Benefits * Superior performance for outdoor environment * Suitable for auto-insertion onto PC board * High luminous Intensity * Color - 590nm Amber - 626nm Red * Superior resistance to moisture Applications * Traffic management: - Traffic signals - Pedestrian signals - Work zone warning lights - Variable message signs * Solar Power signs * Commercial outdoor advertising - Signs - Marquees Package Dimension B: Standoff A: Non-standoff 5.00 0.20 (0.197 0.008) 5.00 0.20 (0.197 0.008) 1.14 0.20 (0.045 0.008) 8.71 0.20 (0.343 0.008) d 8.71 0.20 (0.343 0.008) 1.14 0.20 (0.045 0.008) 2.35 (0.093) MAX. 0.70 (0.028) MAX. 31.60 MIN. (1.244) 1.50 0.15 (0.059 0.006) 31.60 MIN. (1.244) 0.70 (0.028) MAX. CATHODE LEAD CATHODE LEAD 0.50 0.10 SQ. TYP. (0.020 0.004) 1.00 MIN. (0.039) 5.80 0.20 (0.228 0.008) CATHODE FLAT 2.54 0.38 (0.100 0.015) Viewing Angle d HLMP-Ex1B 12.390.25 (0.4760.010) HLMP-Ex3B 11.960.25 (0.4590.010) Notes: 1. All dimensions are in millimeters (inches) 2. Leads are mild steel with tin plating. 3. The epoxy meniscus is 1.21mm max 4. For Identification of polarity after the leads are trimmed off, please refer to the illustration below: CATHODE 2 ANODE 1.00 MIN. (0.039) CATHODE FLAT 0.50 0.10 SQ. TYP. (0.020 0.004) 5.80 0.20 (0.228 0.008) 2.54 0.38 (0.100 0.015) Device Selection Guide Minimum viewing Angle 21/2 (Deg) [4] Color and Dominant Wavelength (nm), Typ [3] 15 Amber 590 Red 626 30 Amber 590 Red 626 Lamps without Standoff on leads (Package drawing A) Lamps with Standoff on leads (Package drawing B) Luminous Intensity Iv (mcd) [1,2,5] at 20 mA Min HLMP-EL1A-Z1KDV HLMP-EL1B-Z1KDV 12000 21000 HLMP-EL1A-Z1LDV HLMP-EL1B-Z1LDV 12000 21000 HLMP-EG1A-Z10DV HLMP-EG1B-Z10DV 12000 21000 HLMP-EL3A-WXKDV HLMP-EL3B-WXKDV 5500 9300 HLMP-EL3A-WXLDV HLMP-EL3B-WXLDV 5500 9300 HLMP-EG3A-WX0DV HLMP-EG3B-WX0DV 5500 9300 Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package. 2. The optical axis is closely aligned with the package mechanical axis. 3. Dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 4. 1/2 is the off-axis angle where the luminous intensity is half the on-axis intensity. 5. Tolerance for each bin limit is 15% Part Numbering System HLMP-E x xx - x x x xx Packaging Option DV: Ammo Pack with minimum viewing angle of 15 or 30 Color Bin Selection 0: Full Distribution K: Color Bin 2 & 4 L: Color Bin 4 & 6 Maximum Intensity Bin Refer to Selection Guide Minimum Intensity Bin Refer to Devise Selection Guide Viewing Angle and Lead Standoffs 1A: 15 without lead standoff 1B: 15 with lead standoff 3A: 30 without lead standoff 3B: 30 with lead standoff Color G: Red 626 L: Amber 590 Note: Please refer to AB 5337 for complete information on part numbering system. 3 Max Absolute Maximum Ratings TJ = 25C Parameter Red/ Amber Unit DC Forward Current [2] 50 mA Peak Forward Current 100 [1] mA Average Forward Current 30 mA Power Dissipation 120 mW Reverse Voltage 5 V Operating Temperature Range -40 to +100 C Storage Temperature Range -40 to +100 C Notes: 1. Duty Factor 30%, frequency 1KHz. 2. Derate linearly as shown in Figure 4 Electrical / Optical Characteristics TJ = 25C Parameter Symbol Min Typ. Max Units Test Conditions Forward Voltage Red / Amber VF 1.8 2.1 2.4 V IF = 20 mA Reverse Voltage VR 5 V IR = 100 A Dominant Wavelength[1] d nm IF = 20 mA nm Peak of Wavelength of Spectral Distribution at IF = 20 mA nm IF = 20 mA C/W LED junction to anode lead lm/W Emitted Luminous Flux/Emitted Radiant Flux mlm IF = 20 mA lm/W Emitted Luminous Flux/Electrical Power nm/C IF = 20 mA ; +25C TJ +100C Amber Red 587.0 618.0 Peak Wavelength Amber Red PEAK Spectral Halfwidth Amber Red 1/2 Thermal resistance RJ-PIN Luminous Efficacy [2] v 594.5 630.0 594 634 13 14 Amber Red 240 500 200 Luminous Flux Amber Red v Luminous Efficiency [3] Amber Red e Thermal coefficient of d Amber Red 590.0 626.0 2000 1900 50 55 0.08 0.05 Notes: 1. The dominant wavelength, d is derived from the CIE Chromaticity Diagram referenced to Illuminant E. Tolerance for each color of dominant wavelength is +/- 0.5nm. 2. The radiant intensity, Ie in watts per steradian, maybe found from the equation Ie = Iv / V where Iv is the luminous intensity in candela and V is the luminous efficacy in lumens/ watt. 3. e = v / IF x VF where v is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage. 4 1.0 RELATIVE INTENSITY 0.8 Amber FORWARD CURRENT-mA 100 Red 0.6 0.4 0.2 0.0 500 550 600 WAVELENGTH - nm 650 0 20 40 60 DC FORWARD CURRENT - mA 80 40 30 20 10 0 0.8 0.6 0.4 0.2 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES Figure 5. Radiation Pattern for 15 (minimum 15) 20 40 60 80 TA - AMBIENT TEMPERATURE - C 100 Figure 4. Maximum Forward Current vs Ambient Temperature 0.8 -60 3 50 1.0 -90 1 2 FORWARD VOLTAGE-V 60 1.0 0.0 0 0 NORMALIZED INTENSITY NORMALIZED INTENSITY 20 100 Figure 3. Relative Luminous Intensity vs Forward Current 5 40 Figure 2. Forward Current vs Forward Voltage IFMAX - MAXIMUM FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 60 0 700 Figure 1. Relative Intensity vs Peak Wavelength 80 90 0.6 0.4 0.2 0.0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT-DEGREE Figure 6. Radiation Pattern for 30 (minimum 30) 60 90 0.20 10 1 0.1 -40 -20 0 20 40 60 80 100 TJ - JUNCTION TEMPERATURE - C 120 Red Amber 0.15 FORWARD VOLTAGE SHIFT - V RELATIVE LIGHT OUTPUT (NORMALIZED AT TJ=25C) Red Amber 0.10 0.05 0.00 -0.05 -0.10 -0.15 -0.20 140 -40 -20 0 20 40 60 80 100 TJ - JUNCTION TEMPERATURE - C Figure 7. Relative Light Output vs Junction Temperature Figure 8. Relative Forward Voltage vs Junction Temperature Intensity Bin Limit Table (1.3:1 Iv bin ratio) Red Color Range 120 140 Intensity (mcd) at 20mA Min Dom Max Dom X min Y Min X max Y max Bin Min Max 618.0 630.0 0.6872 0.3126 0.6890 0.2943 W 5500 7200 0.6690 0.3149 0.7080 0.2920 X 7200 9300 Y 9300 12000 Z 12000 16000 1 16000 21000 Tolerance for each bin limit is 15% Tolerance for each bin limit is 0.5nm Amber Color Range Bin Min Dom Max Dom Xmin 2 VF Bin Table (V at 20mA) Bin ID Min 1.8 2.0 VA 2.0 2.2 VB 2.2 2.4 6 589.5 4 589.5 592.0 6 592.0 594.5 Max VD Tolerance for each bin limit is 0.05V 587.0 Ymin Xmax Ymax 0.5570 0.4420 0.5670 0.4250 0.5530 0.4400 0.5720 0.4270 0.5720 0.4270 0.5820 0.4110 0.5670 0.4250 0.5870 0.4130 0.5870 0.4130 0.5950 0.3980 0.5820 0.4110 0.6000 0.3990 Tolerance for each bin limit is 0.5nm Note: All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact Avago representative for further information. Avago Color Bin on CIE 1931 Chromaticity Diagram 0.480 0.460 0.440 Amber 2 0.420 4 6 Y 0.400 0.380 0.360 0.340 0.320 Red 0.300 0.280 0.500 7 0.550 0.600 0.650 X 0.700 0.750 0.800 Precautions: Lead Forming: * The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. * For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. * If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies' high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 260C and the solder contact time does not exceeding 5sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED Configuration Soldering and Handling: * Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. * LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron's tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59mm * ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. * Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature 105C Max. - Preheat time 60 sec Max - Peak temperature 260C Max. 260C Max. Dwell time 5 sec Max. 5 sec Max Note: 1. Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. * Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. 8 Anode Note: Electrical connection between bottom surface of LED die and the lead frame is achieved through conductive paste. * Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. Note: In order to further assist customer in designing jig accurately that fit Avago Technologies' product, 3D model of the product is available upon request. * At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. * If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. * Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) * Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED 260C Max TEMPERATURE (C) Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 255C 5C (maximum peak temperature = 260C) 105C Max Dwell time: 3.0 sec - 5.0 sec (maximum = 5 sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 60 sec Max TIME (sec) Ammo Packs Drawing 6.351.30 0.2500.051 12.701.00 0.5000.039 CATHODE 20.51.00 0.80700.0394 9.1250.625 0.35950.0245 18.000.50 0.70850.0195 12.700.30 0.5000.012 0.700.20 0.02750.0075 A O A VIEW AA Note: The ammo-packs drawing is applicable for packaging option -DD & -ZZ and regardless standoff or non-standoff 9 4.000.20 TYP. 0.15750.0075 Packaging Box for Ammo Packs Note: The dimension for ammo pack is applicable for the device with standoff and without standoff. Packaging Label: (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information RoHS Compliant e3 max temp 260C (P) Customer Item: (V) Vendor ID : DeptID: 10 (9D) Date Code: Date Code Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 260C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Definition: BIN: Example: (i) Color bin only or VF bin only (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin "VB" only) (ii) Color bin incorporate with VF Bin OR (ii) Color bin incorporated with VF Bin BIN: 2VB VB: VF bin "VB" (Applicable for part number that have both color bin and VF bin) 2: Color bin 2 only DISCLAIMER: AVAGO'S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright (c) 2005-2010 Avago Technologies. All rights reserved. AV02-2459EN - April 20, 2010