HLMP-Ex1A/1B-xxxDV (15° minimum),
HLMP-Ex3A/3B-xxxDV (30° minimum)
5mm Extra High Brightness AlInGaP LED lamps
Data Sheet
Features
• Viewing Angle: 15° minimum
30° minimum
• High luminous Intensity
• Color
– 590nm Amber
– 626nm Red
• Package options:
– With or without standoff
• Superior resistance to moisture
• Untinted for 15° and 30° lamps
Applications
• Traffic management:
– Traffic signals
– Pedestrian signals
– Work zone warning lights
– Variable message signs
• Solar Power signs
• Commercial outdoor advertising
– Signs
– Marquees
Description
These 5mm Extra High Brightness AlInGaP LEDs provide
superior light output for excellent readability in sunlight
and are extremely reliable. AlInGaP LED technology
provides extremely stable light output over long periods
of time. These Extra High Brightness lamps utilize
the aluminum indium gallium phosphide (AlInGaP)
technology.
These LED lamps are untinted. T-1¾ packages incorpo-
rating second generation optics producing well defined
spatial radiation patterns at specific viewing cone angles.
These lamps are made with an advanced optical grade
epoxy offering superior high temperature and high
moisture resistance performance in outdoor signal and
sign application. The maximum LED junction tempera-
ture limit of +130°C enables high temperature operation
in bright sunlight conditions. The epoxy contain both
uv-a and uv-b inhibitor to reduce the effects of long term
exposure to direct sunlight.
Benefits
• Superior performance for outdoor environment
• Suitable for auto-insertion onto PC board
2
B: Standoff
Viewing Angle d
HLMP-Ex1B 12.39±0.25
(0.476±0.010)
HLMP-Ex3B 11.96±0.25
(0.459±0.010)
Notes:
1. All dimensions are in millimeters (inches)
2. Leads are mild steel with tin plating.
3. The epoxy meniscus is 1.21mm max
4. For Identification of polarity after the leads are
trimmed off, please refer to the illustration below:
CATHODE ANODE
1.14 ± 0.20
(0.045 ± 0.008)
5.80 ± 0.20
(0.228 ± 0.008)
31.60
(1.244) MIN.
0.70 (0.028)
MAX.
1.00
(0.039) MIN.
8.71 ± 0.20
(0.343 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
0.50 ± 0.10
(0.020 ± 0.004) SQ. TYP.
CATHODE
LEAD
2.35 (0.093)
MAX.
CATHODE
FLAT
1.14 ± 0.20
(0.045 ± 0.008)
5.80 ± 0.20
(0.228 ± 0.008)
31.60
(1.244) MIN.
0.70 (0.028)
MAX.
1.00
(0.039) MIN.
8.71 ± 0.20
(0.343 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
0.50 ± 0.10
(0.020 ± 0.004) SQ. TYP.
CATHODE
LEAD
CATHODE
FLAT
d
1.50 ± 0.15
(0.059 ± 0.006)
5.00 ± 0.20
(0.197 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
Package Dimension
A: Non-standoff
3
Part Numbering System
Note: Please refer to AB 5337 for complete information on part numbering system.
Device Selection Guide
Minimum viewing
Angle
2θ1/2 (Deg) [4]
Color and Dominant
Wavelength (nm),
Typ [3]
Lamps without Standoff
on leads
(Package drawing A)
Lamps with Standoff
on leads
(Package drawing B)
Luminous Intensity Iv
(mcd) [1,2,5] at 20 mA
Min Max
15° Amber 590 HLMP-EL1A-Z1KDV HLMP-EL1B-Z1KDV 12000 21000
HLMP-EL1A-Z1LDV HLMP-EL1B-Z1LDV 12000 21000
Red 626 HLMP-EG1A-Z10DV HLMP-EG1B-Z10DV 12000 21000
30° Amber 590 HLMP-EL3A-WXKDV HLMP-EL3B-WXKDV 5500 9300
HLMP-EL3A-WXLDV HLMP-EL3B-WXLDV 5500 9300
Red 626 HLMP-EG3A-WX0DV HLMP-EG3B-WX0DV 5500 9300
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. Dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. θ½ is the off-axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each bin limit is ±15%
HLMP-E x xx – x x x xx
Packaging Option
DV: Ammo Pack with minimum viewing angle of 15° or 30°
Color Bin Selection
0: Full Distribution
K: Color Bin 2 & 4
L: Color Bin 4 & 6
Maximum Intensity Bin
Refer to Selection Guide
Minimum Intensity Bin
Refer to Devise Selection Guide
Viewing Angle and Lead Standoffs
1A: 15° without lead standoff
1B: 15° with lead standoff
3A: 30° without lead standoff
3B: 30° with lead standoff
Color
G: Red 626
L: Amber 590
4
Absolute Maximum Ratings
TJ = 25°C
Parameter Red/ Amber Unit
DC Forward Current [2] 50 mA
Peak Forward Current 100 [1] mA
Average Forward Current 30 mA
Power Dissipation 120 mW
Reverse Voltage 5 V
Operating Temperature Range -40 to +100 °C
Storage Temperature Range -40 to +100 °C
Notes:
1. Duty Factor 30%, frequency 1KHz.
2. Derate linearly as shown in Figure 4
Electrical / Optical Characteristics
TJ = 25°C
Parameter Symbol Min Typ. Max Units Test Conditions
Forward Voltage
Red / Amber VF1.8 2.1 2.4 V IF = 20 mA
Reverse Voltage VR5VI
R = 100 μA
Dominant Wavelength[1]
Amber
Red
λd
587.0
618.0
590.0
626.0
594.5
630.0
nm IF = 20 mA
Peak Wavelength
Amber
Red
λPEAK
594
634
nm Peak of Wavelength of Spectral
Distribution at IF = 20 mA
Spectral Halfwidth
Amber
Red
Δλ1/2
13
14
nm IF = 20 mA
Thermal resistance RΦJ-PIN 240 °C/W LED junction to anode lead
Luminous Efficacy [2]
Amber
Red
ηv
500
200
lm/W Emitted Luminous Flux/Emitted
Radiant Flux
Luminous Flux
Amber
Red
Φv
2000
1900
mlm IF = 20 mA
Luminous Efficiency [3]
Amber
Red
ηe
50
55
lm/W Emitted Luminous Flux/Electrical
Power
Thermal coefficient of λd
Amber
Red
0.08
0.05
nm/°C IF = 20 mA ; +25°C ≤ TJ ≤ +100°C
Notes:
1. The dominant wavelength, λd is derived from the CIE Chromaticity Diagram referenced to Illuminant E. Tolerance for each color of dominant
wavelength is +/- 0.5nm.
2. The radiant intensity, Ie in watts per steradian, maybe found from the equation Ie = Iv / ηV where Iv is the luminous intensity in candela and ηV is
the luminous efficacy in lumens/ watt.
3. ηe = Φv / IF x VF where Φv is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage.
5
Figure 1. Relative Intensity vs Peak Wavelength Figure 2. Forward Current vs Forward Voltage
Figure 3. Relative Luminous Intensity vs Forward Current
Figure 5. Radiation Pattern for 15° (minimum 15°) Figure 6. Radiation Pattern for 30° (minimum 30°)
Figure 4. Maximum Forward Current vs Ambient Temperature
0.0
0.2
0.4
0.6
0.8
1.0
500 550 600 650 700
WAVELENGTH - nm
RELATIVE INTENSITY
Red
0.0
0.2
0.4
0.6
0.8
1.0
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSITY
0.0
0.2
0.4
0.6
0.8
1.0
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT-DEGREE
NORMALIZED INTENSITY
Amber
0
20
40
60
80
100
0123
FORWARD VOLTAGE-V
FORWARD CURRENT-mA
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0 20406080100
DC FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
0
10
20
30
40
50
60
0 20 40 60 80 100
TA - AMBIENT TEMPERATURE - C
IFMAX - MAXIMUM FORWARD CURRENT - mA
6
Figure 7. Relative Light Output vs Junction Temperature Figure 8. Relative Forward Voltage vs Junction Temperature
0.1
1
10
-40 -20 0 20 40 60 80 100 120 140
TJ - JUNCTION TEMPERATURE - °C
RELATIVE LIGHT OUTPUT
(NORMALIZED AT TJ=25°C)
-0.20
-0.15
-0.10
-0.05
0.00
0.05
0.10
0.15
0.20
-40 -20 0 20 40 60 80 100 120 140
TJ - JUNCTION TEMPERATURE - °C
FORWARD VOLTAGE SHIFT - V
Red
Amber
Red
Amber
Intensity Bin Limit Table (1.3:1 Iv bin ratio)
Bin
Intensity (mcd) at 20mA
Min Max
W 5500 7200
X 7200 9300
Y 9300 12000
Z 12000 16000
1 16000 21000
Tolerance for each bin limit is ± 15%
Red Color Range
Min Dom Max Dom X min Y Min X max Y max
618.0 630.0 0.6872 0.3126 0.6890 0.2943
0.6690 0.3149 0.7080 0.2920
Tolerance for each bin limit is ± 0.5nm
VF Bin Table (V at 20mA)
Bin ID Min Max
VD 1.8 2.0
VA 2.0 2.2
VB 2.2 2.4
Tolerance for each bin limit is ± 0.05V
Amber Color Range
Bin Min Dom Max Dom Xmin Ymin Xmax Ymax
2 587.0 589.5 0.5570 0.4420 0.5670 0.4250
0.5530 0.4400 0.5720 0.4270
4 589.5 592.0 0.5720 0.4270 0.5820 0.4110
0.5670 0.4250 0.5870 0.4130
6 592.0 594.5 0.5870 0.4130 0.5950 0.3980
0.5820 0.4110 0.6000 0.3990
Tolerance for each bin limit is ± 0.5nm
Note:
All bin categories are established for classification of products. Products
may not be available in all bin categories. Please contact Avago
representative for further information.
7
Avago Color Bin on CIE 1931 Chromaticity Diagram
0.280
0.300
0.320
0.340
0.360
0.380
0.400
0.420
0.440
0.460
0.480
0.500 0.550 0.600 0.650 0.700 0.750 0.800
X
Y
2
4
6
Amber
Red
8
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
• Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
1.59mm
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature 105°C Max. –
Preheat time 60 sec Max –
Peak temperature 260°C Max. 260°C Max.
Dwell time 5 sec Max. 5 sec Max
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
• Wave soldering parameters must be set and
maintained according to the recommended
temperature and dwell time. Customer is advised
to perform daily check on the soldering profile to
ensure that it is always conforming to recommended
soldering conditions.
Anode
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 260°C and the solder
contact time does not exceeding 5sec. Over-stressing the LED
during soldering process might cause premature failure to the LED
due to delamination.
Avago Technologies LED Configuration
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during
wave soldering process.
Note: In order to further assist customer in designing jig accurately
that fit Avago Technologies’ product, 3D model of the product is
available upon request.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
9
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
Ammo Packs Drawing
Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C ± 5°C
(maximum peak temperature = 260°C)
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5 sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
60 sec Max
TIME (sec)
260°C Max
105°C Max
TEMPERATURE (°C)
6.35±1.30
0.250±0.051
12.70±1.00
0.500±0.039
20.5±1.00
0.8070±0.0394
4.00±0.20
0.1575±0.0075 TYP.Ø
0.70±0.20
0.0275±0.0075 AA
VIEW AA
12.70±0.30
0.500±0.012
9.125±0.625
0.3595±0.0245
18.00±0.50
0.7085±0.0195
CATHODE
10
Packaging Box for Ammo Packs
Note: The dimension for ammo pack is applicable for the device with standoff and without standoff.
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Refer to below information
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e3 max temp 260C
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE
AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR
FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE
CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
Customer P/N:
Supplier Code:
QUANTITY: Packing Quantity
CAT: Intensity Bin
BIN: Refer to below information
DATECODE: Date Code
RoHS Compliant
e3 max temp 260C
Lamps Baby Label
Acronyms and Definition:
BIN:
(i) Color bin only or VF bin only
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and no
color bin)
OR
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color
bin and VF bin)
Example:
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
VB: VF bin “VB”
2: Color bin 2 only
(ii) Avago Baby Label (Only available on bulk packaging)
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-2459EN - April 20, 2010
