PC354N Series PC354N Series Mini-flat Package, AC Input Photocoupler Description Agency approvals/Compliance PC354N Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4-pin Mini-flat package. Input-output isolation voltage(rms) is 3.75kV. Collector-emitter voltage is 80V() and CTR is 20% to 400% at input current of 1mA. 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC354) 2. Package resin : UL flammability grade (94V-0) Applications 1. Hybrid substrates that require high density mounting. 2. Programmable controllers Features 1. 4-pin Mini-flat package 2. Double transfer mold package (Ideal for Flow Soldering) 3. AC input type 4. High collector-emitter voltage (VCEO : 80V()) 5. High isolation voltage between input and output (Viso(rms) : 3.75kV) (*) Up to Date code "P9" (September 2002) VCEO : 35V. From the production Date code "J5" (May 1997) to "P9" (September 2002), however the products were screened by BVCEO70V. Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A00601EN Date Sep. 30. 2003 (c) SHARP Corporation PC354N Series Internal Connection Diagram 1 4 1 2 3 3 2 4 Anode Anode/Cathode Cathode/Anode Emitter Collector Outline Dimensions (Unit : mm) 3.60.3 2.540.25 4 3 Date code Primary side mark 354 4.40.2 SHARP mark "S" Rank mark Factory identification mark 1 2 0.1 0.4 5.30.3 Epoxy resin 0.10.1 2.60.2 0.20.05 45 0.5+0.4 -0.2 6 7.0+0.2 -0.7 Product mass : approx. 0.1g Sheet No.: D2-A00601EN 2 PC354N Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M ** N * 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D Mark P R S T U V W X A B C ** * repeats in a 20 year cycle Factory identification mark Factory identification Mark Country of origin no mark Japan Indonesia Philippines China * This factory marking is for identification purpose only. Please contact the local SHARP sales representative to see the actual status of the production. Rank mark Refer to the Model Line-up table Sheet No.: D2-A00601EN 3 PC354N Series Absolute Maximum Ratings Output Input Parameter Symbol IF Forward current *1 Peak forward current IFM P Power dissipation Collector-emitter voltage VCEO Emitter-collector voltage VECO IC Collector current Collector power dissipation PC Ptot Total power dissipation Operating temperature Topr Storage temperature Tstg *2 Isolation voltage Viso (rms) *3 Soldering temperature Tsol Rating 50 1 70 *4 80 6 50 150 170 -30 to +100 -40 to +125 3.75 260 (Ta=25C) Unit mA A mW V V mA mW mW C C kV C *1 Pulse width100s, Duty ratio : 0.001 *2 40 to 60%RH, AC for 1 minute, f=60Hz *3 For 10s *4 Up to Date code "P9" (September 2002) VCEO : 35V. Electro-optical Characteristics Input Output Transfer characteristics Parameter Symbol Forward voltage VF Ct Terminal capacitance Collector dark current ICEO Collector-emitter breakdown voltage BVCEO Emitter-collector breakdown voltage BVECO Collector current IC Collector-emitter saturation voltage VCE (sat) Isolation resistance RISO Cf Floating capacitance tr Rise time Response time Fall time tf Conditions IF=20mA V=0, f=1kHz VCE=50V, IF=0 IC=0.1mA, IF=0 IE=10A, IF=0 IF=1mA, VCE=5V IF=20mA, IC=1mA DC500V, 40 to 60%RH V=0, f=1MHz VCE=2V, IC=2mA, RL=100 MIN. - - - *5 80 6 0.2 - 5x1010 - - - TYP. 1.2 30 - - - - 0.1 1x1011 0.6 4 3 MAX. 1.4 250 100 - - 4.0 0.2 - 1.0 18 18 (Ta=25C) Unit V pF nA V V mA V pF s s *5 From the production Date code "J5" (May 1997) to "P9" (September 2002), however the products were screened by BVCEO70V. Sheet No.: D2-A00601EN 4 PC354N Series Model Line-up Package Model No. Taping 3 000 pcs/reel 750 pcs/reel PC354N PC354N1 PC354NT PC354N1T Rank mark IC [mA] (IF=1mA, VCE=5V, Ta=25C) A or no mark A 0.2 to 4.0 0.5 to 1.5 Please contact a local SHARP sales representative to inquire about production status and Lead-Free options. Sheet No.: D2-A00601EN 5 PC354N Series Fig.2 Diode Power Dissipation vs. Ambient Temperature Fig.1 Forward Current vs. Ambient Temperature 70 Diode power dissipation P (mW) Forward current IF (mA) 60 50 40 30 20 10 0 -30 0 25 50 75 100 Ambient temperature Ta(C) 70 60 40 20 100 300 Total power dissipation Ptot (mW) 150 100 50 0 -30 0 25 50 75 100 Ambient temperature Ta (C) 200 170 150 100 50 500 Pulse width100s Ta=25C Forward current IF (mA) 1 000 500 200 100 50 25C 0C 50 -25C 20 10 5 2 10 1 5 10- 2 2 Duty ratio 10- 1 2 5 1 50C 100 20 5 100 Ta=75C 200 2 000 5 10- 3 2 0 25 50 Ambient temperature Ta (C) Fig.6 Forward Current vs. Forward Voltage 10 000 5 000 250 0 -30 125 Fig.5 Peak Forward Current vs. Duty Ratio 5 0 50 55 Ambient temperature Ta (C) Fig.4 Total Power Dissipation vs. Ambient Temperature 200 Collector power dissipation PC (mW) 80 0 -30 125 Fig.3 Collector Power Dissipation vs. Ambient Temperature Peak forward current IFM (mA) 100 0 0.5 1.0 1.5 2.0 2.5 Forward voltage VF (V) 3.0 3.5 Sheet No.: D2-A00601EN 6 PC354N Series Fig.7 Current Transfer Ratio vs. Forward Current Fig.8 Collector Current vs. Collector-emitter Voltage 50 500 Ta=25C 40 400 Collector current IC (mA) Current transfer ratio CTR (%) VCE=5V Ta=25C 300 200 IF=30mA 20mA 30 PC (MAX.) 10mA 20 5mA 10 100 1mA 0 0.1 1 10 Forward current IF (mA) 0 100 Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 1 2 3 4 5 6 7 8 Collector-emitter voltage VCE (V) 9 10 Fig.10 Collector - emitter Saturation Voltage vs. Ambient Temperature 0.16 IF=5mA VCE=5V Collector-emitter saturation voltage VCE (sat) (V) Relative current transfer ratio (%) 150 0 100 50 IF=20mA IC=1mA 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0 -30 0 20 40 60 80 Ambient temperature Ta (C) 0 -30 100 Fig.11 Collector Dark Current vs. Ambient Temperature 500 VCE=2V 200 IC=2mA Ta=25C 100 VCE=50V 10-6 5 -7 10 5 10-8 5 10-9 5 50 tr 20 tf 10 5 2 1 td ts 0.5 10-10 5 10-11 -30 100 Fig.12 Response Time vs. Load Resistance Response time (s) Collector dark current ICEO (A) 10-5 5 0 20 40 60 80 Ambient temperature Ta (C) 0 20 40 60 80 Ambient temperature Ta (C) 0.2 0.1 0.01 100 0.1 1 10 Load resistance RL (k) 50 Sheet No.: D2-A00601EN 7 PC354N Series Fig.13 Test Circuit for Response Time Fig.14 Collector-emitter Saturation Voltage vs. Forward Current 5.6 VCC Ta=25C Input RD RL Collector-emitter saturation voltage VCE (sat) (V) Input Output Output 10% 90% VCE td ts tr tf Please refer to the conditions in Fig.12 IC=0.5mA 4.2 1mA 3mA 5mA 7mA 2.8 1.4 0 0 1 2 3 4 5 6 7 8 Forward current IF (mA) 9 10 Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D2-A00601EN 8 PC354N Series Design Considerations Design guide While operating at IF<1.0mA, CTR variation may increase. Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5years) into the design consideration. Recommended Foot Print (reference) 0.8 2.54 6.3 1.5 (Unit : mm) For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A00601EN 9 PC354N Series Manufacturing Guidelines Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (C) 300 Terminal : 260C peak ( package surface : 250C peak) 200 Reflow 220C or more, 60s or less Preheat 150 to 180C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 260C and within 10s. Preheating is within the bounds of 100 to 150C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A00601EN 10 PC354N Series Cleaning instructions Solvent cleaning: Solvent temperature should be 45C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this device. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. Sheet No.: D2-A00601EN 11 PC354N Series Package specification Tape and Reel package 1. 3 000pcs/reel Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F E G D J MAX . H H A B C I Dimensions List A B 12.00.3 5.50.1 H I 7.40.1 0.30.05 5 K C 1.750.1 J 3.10.1 D 8.00.1 K 4.00.1 E 2.00.1 F 4.00.1 (Unit : mm) G +0.1 1.5-0 Reel structure and Dimensions e d c g Dimensions List a b 370 13.51.5 e f 211.0 2.00.5 f a b (Unit : mm) c d 801.0 130.5 g 2.00.5 Direction of product insertion Pull-out direction [Packing : 3 000pcs/reel] Sheet No.: D2-A00601EN 12 PC354N Series 2. 750pcs/reel Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F E G D J 5 MAX . H H A B C I K Dimensions List A B 12.00.3 5.50.1 H I 7.40.1 0.30.05 C 1.750.1 J 3.10.1 D 8.00.1 K 4.00.1 E 2.00.1 (Unit : mm) F G +0.1 4.00.1 1.5-0 Reel structure and Dimensions e d c g Dimensions List a b 180 13.51.5 e f 211.0 2.00.5 f a b (Unit : mm) c d 1.0 80 130.5 g 2.00.5 Direction of product insertion Pull-out direction [Packing : 750pcs/reel] Sheet No.: D2-A00601EN 13 PC354N Series Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). * The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. * Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. * If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. * Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection * This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. * Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: D2-A00601EN 14