TD62064APG/AFG
2011-01-14
1
TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic
TD62064APG, TD62064AFG
4ch High-Current Darlington Sink Driver
The TD62064APG/AFG are high-voltage, high-current
darlington drivers comprised of four NPN darlington pairs.
All units feature integral clamp diodes for switching inductive
loads.
Applications include relay, hammer, lamp and stepping motor
drivers.
Features
• Output current (single output) 1.5 A (max)
• High sustaining voltage output 50 V (min)
• Output clamp diodes
• Input compatible with TTL and 5 V CMOS
• GND terminal = Heat sink
• Package type-APG: DIP-16 pin
• Package type-AFG: HSOP-16 pin
Pin Assignment (top view)
TD62064APG
TD62064AFG
TD62064APG
TD62064AFG
Weight
DIP16-P-300-2.54A: 1.11 g (typ.)
HSOP16-P-300-1.00: 0.50 g (typ.)
O4
16 15 14 13 12 11 10 9
1 2 3 4 5 678
NC I4
Heat sink
& GND I3 NC O3
COM O1 I1 Heat sink
& GND
I2 O2 COM
O4
16 15 14 13 12 11 10 9
1 2 3 4 567 8
NC I4 I3 NC O3
COM O1 I1 I2 O2 COM
Heat sink
& GND
Heat sink
& GND
NC NC
NCNC
TD62064APG/AFG
2011-01-14
2
Schematics (each driver)
Note: The input and output parasitic diodes cannot be used as clamp diodes.
Precautions for Using
(1) This IC does not include built-in protection circuits for excess current or overvoltage.
If this IC is subjected to excess current or overvoltage, it may be destroyed.
Hence, the utmost care must be taken when systems which incorporate this IC are designed.
Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed
due to short-circuit between outputs, air contamination fault, or fault by improper grounding.
(2) This IC is being used to drive an inductive load (such as a motor, solenoid or relay), Toshiba recommends that
the diodes (pins 1 and 8) be connected to the secondary power supply pin so as to absorb the counter
electromotive force generated by the load. Please adhere to the device’s absolute maximum ratings.
Toshiba recommends that zener diodes be connected between the diodes (pins 1 and 8) and the secondary power
supply pin (as the anode) so as to enable rapid absorption of the counter electromotive force. Again, please
adhere to the device’s absolute maximum ratings.
Absolute Maximum Ratings (Ta = 25°C)
Characteristics Symbol Rating Unit
Output sustaining voltage VCE (SUS) −0.5 to 50 V
Output current IOUT 1.5 A/ch
Input current IIN 50 mA
Input voltage VIN −0.5 to 17 V
Clamp diode reverse voltage VR 50 V
Clamp diode forward current IF 1.5 A
APG 1.47/2.7 (Note 1)
Power dissipation
AFG
PD
0.9/1.4 (Note 2)
W
Operating temperature Topr −40 to 85 °C
Storage temperature Tstg −55 to 150 °C
Note 1: On glass epoxy PCB (50 × 50 × 1.6 mm Cu 50%)
Note 2: On glass epoxy PCB (60 × 30 × 1.6 mm Cu 30%)
Input
Output
GND
1.1 kΩ
COMMON
230 Ω
8.2 kΩ
TD62064APG/AFG
2011-01-14
3
Operating Conditions (Ta = −40 to 85°C)
Characteristics Symbol Test Condition
Min Typ. Max Unit
Output sustaining voltage VCE (SUS) ⎯ 0 ⎯ 50 V
DC1 circuit, Ta = 25°C 0 ⎯ 1250
Duty = 10% 0 ⎯ 1250
APG (Note 1)
Duty = 50% 0 ⎯ 390
Duty = 10% 0 ⎯ 907
Output current
AFG (Note 2)
IOUT
tpw = 25 ms
4 circuits
Tj = 120°C
Ta = 85°C Duty = 50% 0 ⎯ 172
mA/ch
V
IN ⎯ 0 ⎯ 8
Output ON VIN (ON) IOUT = 1.25 A 2.5 ⎯ 8
Input voltage
Output OFF VIN (OFF) ⎯ 0 ⎯ 0.4
V
Input current IIN ⎯ 0 ⎯ 20 mA
Clamp diode reverse voltage VR ⎯ 0 ⎯ 50 V
Clamp diode forward current IF ⎯ ⎯ ⎯ 1.25
A
APG Ta = 85°C (Note 1) ⎯ ⎯ 1.4
Power dissipation
AFG
PD
Ta = 85°C (Note 2) ⎯ ⎯ 0.7
W
Note 1: On glass epoxy PCB (50 × 50 × 1.6 mm Cu 50%)
Note 2: On glass epoxy PCB (60 × 30 × 1.6 mm Cu 30%)
Electrical Characteristics (Ta = 25°C)
Characteristics Symbol
Te s t
Circuit Test Condition Min Typ. Max Unit
VCE = 50 V, Ta = 25°C ⎯ ⎯ 50
Output leakage current ICEX 1
VCE = 50 V, Ta = 85°C ⎯ ⎯ 500
μA
IOUT = 1.25 A, IIN = 2 mA ⎯ ⎯ 1.6
Output saturation voltage VCE (sat) 2
IOUT = 0.75 A, IIN = 935 μA ⎯ ⎯ 1.25
V
IOUT = 1.0 A ⎯ 800 ⎯
DC current transfer ratio hFE 2 VCE = 2 V
IOUT = 1.25 A ⎯ 1500 ⎯
⎯
Input voltage (output on) VIN (ON) 3 IOUT = 1.25 A, IIN = 2 mA ⎯ ⎯ 2.4 V
VR = 50 V, Ta = 25°C ⎯ ⎯ 50
Clamp diode leakage current IR 4
VR = 50 V, Ta = 85°C ⎯ ⎯ 100
μA
Clamp diode forward voltage VF 5 IF = 1.25 A ⎯ ⎯ 2.0 V
Input capacitance CIN 6 VIN = 0 V, f = 1 MHz ⎯ 15 ⎯ pF
Turn-ON delay tON 7 CL = 15 pF, VOUT = 50 V,
RL = 42 Ω ⎯ 0.1 ⎯ μs
Turn-OFF delay tOFF 7 CL = 15 pF, VOUT = 50 V,
RL = 42 Ω ⎯ 1.0 ⎯ μs
TD62064APG/AFG
2011-01-14
4
Test Circuit
1. ICEX
2. VCE (sat), hFE 3. VIN (ON)
4. IR
5. VF 6. CIN
7. tON, tOFF
Note 1: Pulse Width 50 μs, Duty Cycle 10%
Output Impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns
Note 2: CL includes probe and jig capacitance
ICEX
Open
Open
VCE VCE, VCE (sat)
Open
IIN IOUT
Open
VIN (ON) VCE
IOUT
Open
Open
IR
VR Open
Open
IF
VF
Capacitance
bridge
fi
Open
Open
VIN
LO
Input
CL = 15 pF
(Note 2)
(Note 1)
Open VOUT
Output
VIN
Pulse
generator
RL
10% 10%
50%
tON tOFF
t
f
t
r
VIH
=
2.4 V
0
VOH
VOL
Input 50%
90% 90%
50
μ
s
Output 50% 50%
(Note 1)
TD62064APG/AFG
2011-01-14
5
Collector-emitter saturation voltage
VCE (sat) (V)
IOUT – VCE (sat)
Output current IOUT (A)
Input voltage VIN (V)
IIN – VIN
Input current IIN (mA)
Input current IIN (μA)
IOUT – IIN
Output current IOUT (mA)
Ambient temperature Ta (°C)
PD – Ta
Power dissipation PD (W)
Duty Cycle (%)
IOUT – Duty cycle
Output current IOUT (mA)
Duty Cycle (%)
IOUT – Duty cycle
Output current IOUT (mA)
0
50
VCE = 2 V
400
300
100
150 200
200
100
Ta = 75 °C 25 −30
0
1.0
max
TD62064APG
12
8
4
2.0 3.0 4.0 5.0
typ. min
1.5
0
0
TD62064APG
1.0
0.5
0.5 1.0 1.5 2.0
25°C max
typ.
0
0
1500
900
300
60 100
600
40
n = 1
1200
20 80
n = 2 n = 3 n = 4
TD62064APG
Ta = 85°C
n-ch ON
0
0
TD62064APG
Ta = 25°C
n-ch ON
1500
900
300
60 100
600
40
n = 1
1200
20 80
n = 2
n = 3
n = 4
(1)
(2)
(3)
(4)
0
0
(1) DIP-16 pin
on glass epoxy PCB
(50 × 50 × 1.6 mm Cu 50%)
(2) DIP-16 pin free air
(3) HSOP-16 pin
on glass epoxy PCB
(60 × 30 × 1.6 mm Cu 30%)
(4) HSOP-16 pin free air
3.0
1.8
0.6
120 200
1.2
80
2.4
40 160
TD62064APG/AFG
2011-01-14
6
Duty Cycle (%)
IOUT – Duty cycle
Output current IOUT (mA)
Duty Cycle (%)
IOUT – Duty cycle
Output current IOUT (mA)
0
0
1500
900
300
60 100
600
40
1200
20 80
n = 1
n = 2
n = 3
TD62064AFG
Ta = 85°C
n-ch ON
n = 4
0
0
1500
900
300
60 100
600
40
n = 1
1200
20 80
n = 2 n = 3 n = 4
TD62064AFG
Ta = 25°C
n-ch ON
TD62064APG/AFG
2011-01-14
7
Package Dimensions
Weight: 1.11 g (typ.)
TD62064APG/AFG
2011-01-14
8
Package Dimensions
Weight: 0.50 g (typ.)
TD62064APG/AFG
2011-01-14
9
Notes on Contents
1. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
2. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case
of over current and/or IC failure. The IC will fully break down when used under conditions that exceed
its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise
occurs from the wiring or load, causing a large current to continuously flow and the breakdown can
lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown,
appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.
(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.
(4) Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or
incorrectly even just one time.
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input
withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load
(BTL) connection type IC that inputs output DC voltage to a speaker directly.
TD62064APG/AFG
2011-01-14
10
Points to Remember on Handling of ICs
(1) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device
so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time
and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation
design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition,
please design the device taking into considerate the effect of IC heat radiation with peripheral
components.
(2) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the
motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply
is small, the device’s motor power supply and output pins might be exposed to conditions beyond
maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system
design.
About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-37Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
TD62064APG/AFG
2011-01-14
11
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public
impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the
aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology
products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign
Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software
or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
