Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Ceramic Resonators, Chip Type
Type: JN ( 16 to 50 MHz)
nExplanation of Part Numbers
nFeatures
lLow Profile Type (1.2 mm maximum in thickness)
lDesigned for lead free soldering
lWide Oscillation Frequency : 16 to 50 MHz
lHigh reliability against soldering heat and mechanical
stress
nRecommended Applications
lClock generator for microprocessers
lCarrier between telecommunication equipment
(Telephone to telephone, personal computer to
printer)
nPrecautions for Safety (See Page 237 to 238)
Part Number Oscillation
Frequency Loop Gain Weight Temperature
Bulk Pack Embossed Taping (fo) (G) (g) Characteristics
EFJN1695H5B EFJN1695J5B 16.93 MHz ±0.5 % 14 dB min.
EFJN2005H5B EFJN2005J5B 20.00 MHz ±0.5 %
EFJN2505H5B EFJN2505J5B 25.00 MHz ±0.5 % 0.022 Maximum frequency drift:
EFJN3205H5B EFJN3205J5B 32.00 MHz ±0.5 % 10 dB min. ±0.2 %, Ð20 to 80 ¡C
EFJN3385H5B EFJN3385J5B 33.868 MHz ±0.5 %
EFJN4005H5B EFJN4005J5B 40.00 MHz ±0.5 %
nRatings and Characteristics
Note:
Also available are types other than above standard products in the
frequency range of 16.0 to 50.0 MHz.
lOperating Temperature Range: Ð20 to 80 ûC
lFrequency Drift : 0.2% max./10 years
Ceramic Resonators
(Chip Type)
E F J N2005 5B
Product Code Nominal Oscillation
Frequency
2005
3975
Frequency
Tolerance
±
1.0 %
±
0.3 %
±
0.5 %
0
3
5
Design No.
Packaging Style
Bulk Embossed
Taping
Type
N Chip Type 20.0 MHz
39.70 MHz
123456789101112
JH
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Ceramic Resonators
(Chip Type)
nDimensions in mm (not to scale)
lBulk
[Type JN] EFJN1111H1B
nTypical Characteristics
nPackaging Specifications
Supplied in bulk or taped & reel packing style
lStandard Packing Quantity
Embossed Taping Bulk
3000 pcs./reel 500 pcs./bag
lDimensions for Reel in mm (not to scale)
Dim. P2P0fD0t1t2fC
(mm) 2.0±0.1 4.0±0.1 1.5 0.35 1.65 1.0
+0.1
0
Dim. A B W F E P1
(mm) 2.3 2.8 8.0±0.2 3.5±0.1 1.75±0.1 4.0±0.1
(mm)
Type JN
a 1.0
b 0.5
c 2.0
d 0.8
Dim. fAfBC D E
(mm) 180±5 60 min. 13±0.2 21±0.8 2.0±0.5
Dim. W T t r
(mm) 9.0
14.0 max.
2.5 max. 1.0
+1.0
Ð0.5
nTest Circuits Diagram
n
Recommended Land Dimensions
lEmbossed Taping
[Type JN] EFJN1111J1B
]
2.5
±
0.15
2.0
±
0.15
T
±
0.1
(0.5) (0.5)(0.5)
Serial No.
Oscillating
Frequency
0.4
±
0.2 0.4
±
0.2 0.4
±
0.2
0.5
±
0.2 0.5
±
0.2 0.5
±
0.2
1.0
±
0.2
1.25
±
0.2
1.0
±
0.2
Terminal
t1
t2
AP1P0
f
C
B
P2
f
D0
Feeding holl Chip pocket
Tape running direction
Cthip Componen
FE
W
2.0
2.5
dd
b
aa
bb
c
0.4
0.2
0
Ð0.2
Ð0.4 Ð20020406080
EFJN4005H5B
Temperature (ûC)
Oscillation Frequency Drift (%)
Temperature Characteristics
T
C
E
D
r
f
B
Wt
f
A
Thickness changes with
Products
(40 MHz : 0.80 mm)
Ceramic Resonator
+5V
14 13 11 9
7
5
2
For Oscillation Circuit
Frequency Counter
1M
W
3
1
IC
4
Ceramic Resonator
+5V
14 13 11 9
7
5
2
For Loop Gain
1M
W
1
IN 0.01
G=20 log (V0/V1)
V0
V1
OUT
FET probe
10 M
W
min.
2 pF max.
T.G.
Output
=
Ð
20dBm
IC
4
3
IC : µPD 74HCU04
or similar
