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74ALVCH16825
18-bit buffer/driver (3-State)
Product specification
IC24 Data Handbook
1998 Jul 27
INTEGRATED CIRCUITS
Philips Semiconductors Product specification
74ALVCH1682518-bit buffer/driver (3-State)
2
1998 Jul 27 853-2097 19785
FEATURES
•Wide supply voltage range of 1.2V to 3.6V
•Complies with JEDEC standard no. 8-1A.
•CMOS low power consumption
•Direct interface with TTL levels
•Current drive ± 24 mA at 3.0 V
•MULTIBYTETM flow-through standard pin-out architecture
•Low inductance multiple VCC and GND pins for minimum noise
and ground bounce
•All data inputs have bus hold
•Output drive capability 50Ω transmission lines @ 85°C
DESCRIPTION
The 74ALVCH16825 is an 18–bit non-inverting buffer/driver with
3-State outputs for bus-oriented applications.
The 74ALVCH16825 consists of two 9-bit sections with separate
output enable signals. For either 9-bit buffer section, the two output
enable (1OE1 and 1OE2 or 2OE1 and 2OE2) inputs must both be
LOW for corresponding D outputs to be active. If either output
enable input is HIGH, the outputs of that 9-buffer section are in the
high impedance state.
The 74ALVCH16825 has active bus hold circuitry which is provided
to hold unused or floating data inputs at a valid logic level. This
feature eliminates the need for external pull-up or pull-down
resistors.
PIN CONFIGURATION
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28 29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
561OE1
1Y1
1Y1
1Y2
1Y3
1Y4
1Y5
1Y6
GND
VCC
GND
1Y7
1Y8
GND
GND
2Y0
2Y1
GND
2Y2
2Y3
2Y4
VCC
2Y5
2Y6
GND
2Y7
2OE1
1A0
1A1
GND
1A2
1A3
VCC
1A4
1A5
1A6
GND
1A7
1A8
GND
GND
2A0
2A1
GND
2A2
2A3
2A4
VCC
2A5
2A6
GND
2A7
2A8
2Y8
2OE2
1OE2
SH00139
QUICK REFERENCE DATA
GND = 0V ; Tamb = 25°C; tr = tf ≤ 2.5ns
SYMBOL PARAMETER CONDITIONS TYPICAL UNIT
tPHL/tPLH Propagation delay
CP to Qn VCC = 2.5V, CL = 30pF
VCC = 3.3V, CL = 50pF 2.0
2.0 ns
CIInput capacitance 4.0 pF
CPD
Power dissi
p
ation ca
p
acitance
p
er latch
VI= GND to VCC1
Output enabled 19 p
F
C
PD
Power
dissi ation
ca acitance
er
latch
V
I =
GND
to
V
CC
1
Output disabled 3
F
NOTES:
1. CPD is used to determine the dynamic power dissipation (PD in µW):
PD = CPD × VCC2 × fi + (CL × VCC2 × fo) where: fi = input frequency in MHz; CL = output load capacitance in pF;
fo = output frequency in MHz; VCC = supply voltage in V ; (CL × VCC2 × fo) = sum of outputs.
ORDERING INFORMATION
PACKAGES TEMPERATURE
RANGE OUTSIDE NORTH
AMERICA NORTH AMERICA DRAWING
NUMBER
56-Pin Plastic Thin Shrink Small Outline (TSSOP) Type II –40°C to +85°C74ALVCH16825 DGG ACH16825 DGG SOT364-1
Philips Semiconductors Product specification
74ALVCH16825
18-bit buffer/driver (3-State)
1998 Jul 27 3
PIN DESCRIPTION
PIN NUMBER SYMBOL NAME AND FUNCTION
1 1OE1 Output enable input
56 1OE2(active LOW)
55, 54, 52, 51, 49,
48, 47, 45, 44 1A0 to 1A8 Data inputs
2, 3, 5, 6, 8,
9, 10, 12, 13 1Y0 to 1Y8 Data outputs
4, 11, 14, 15, 18, 25,
32, 39, 42, 43, 46, 53 GND Ground (0V)
7, 22, 35, 50 VCC Positive supply voltage
28 2OE1Output enable input
29 2OE2(active LOW)
43, 42, 41, 40, 38,
37, 36, 34, 33, 31 2A0 to 2A8 Data inputs
16, 17, 19, 20, 21,
23, 24, 26, 27 2Y0 to 2Y8 Data outputs
LOGIC SYMBOL
55
54
52
51
49
48
47
45
44
41
40
38
37
36
34
33
31
30
3
5
6
8
9
10
12
13
16
17
19
20
21
23
24
26
1A0
1A1
1A2
1A3
1A4
1A5
1A6
1A7
1A8
2A0
2A1
2A2
2A3
2A4
2A5
2A6
2A7
1Y0
1Y1
1Y2
1Y3
1Y4
1Y5
1Y6
1Y7
1Y8
2Y0
2Y1
2Y2
2Y3
2Y4
2Y5
2Y6
2Y7
2
2A8
2Y8
27
SH00142
1OE1 1OE2
2OE1 2OE2
156
28 29
FUNCTION TABLE
INPUTS OUTPUT
nOE1 nOE2 A Y
L L L L
L L H H
H X X Z
X H X Z
H = HIGH voltage level
L = LOW voltage level
X = Don’t care
Z = High impedance “off” state
LOGIC SYMBOL (IEEE/IEC)
1, 1 ∇
1, 2 ∇
56
28
55
54
52
51
49
48
47
45
44
41
40
38
37
36
34
33
31
30
3
5
6
8
9
10
12
13
16
17
19
20
21
23
24
26
1EN1
1A0
1A1
1A2
1A3
1A4
1A5
1A6
1A7
1A8
2A0
2A1
2A2
2A3
2A4
2A5
2A6
2A7
1Y0
1Y1
1Y2
1Y3
1Y4
1Y5
1Y6
1Y7
1Y8
2Y0
2Y1
2Y2
2Y3
2Y4
2Y5
2Y6
2Y7
SH00141
29
2OE2
2OE1
1OE2
1OE1
2
2A82Y8
27
EN2
&
&
Philips Semiconductors Product specification
74ALVCH16825
18-bit buffer/driver (3-State)
1998 Jul 27 4
LOGIC DIAGRAM
nYn
TO 8 OTHER CHANNELS
nAn
nOE2
nOE1
SH00140
BUS HOLD CIRCUIT
To internal circuit
VCC
Data Input
SW00044
RECOMMENDED OPERATING CONDITIONS
SYMBOL PARAMETER CONDITIONS MIN MAX UNIT
VCC
DC supply voltage 2.5V range (for max. speed
performance @ 30 pF output load) 2.3 2.7
V
V
CC DC supply voltage 3.3V range (for max. speed
performance @ 50 pF output load) 3.0 3.6
V
VIDC Input voltage range 0 VCC V
VODC output voltage range 0 VCC V
Tamb Operating free-air temperature range –40 +85 °C
tr, tfInput rise and fall times VCC = 2.3 to 3.0V
VCC = 3.0 to 3.6V 0
020
10 ns/V
ABSOLUTE MAXIMUM RATINGS
In accordance with the Absolute Maximum Rating System (IEC 134)
Voltages are referenced to GND (ground = 0V)
SYMBOL PARAMETER CONDITIONS RATING UNIT
VCC DC supply voltage –0.5 to +4.6 V
IIK DC input diode current VI 0 –50 mA
VI
DC in
p
ut voltage
For control pins2–0.5 to +4.6
V
V
I
DC
in ut
voltage
For data inputs2–0.5 to VCC +0.5
V
IOK DC output diode current VO VCC or VO 0 50 mA
VODC output voltage Note 2 –0.5 to VCC +0.5 V
IODC output source or sink current VO = 0 to VCC 50 mA
IGND, ICC DC VCC or GND current 100 mA
Tstg Storage temperature range –65 to +150 °C
PTOT Power dissipation per package
–plastic medium-shrink (SSOP)
–plastic thin-medium-shrink (TSSOP)
For temperature range: –40 to +125 °C
above +55°C derate linearly with 11.3 mW/K
above +55°C derate linearly with 8 mW/K 850
600 mW
NOTE:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
Philips Semiconductors Product specification
74ALVCH16825
18-bit buffer/driver (3-State)
1998 Jul 27 5
DC ELECTRICAL CHARACTERISTICS
Over recommended operating conditions. Voltage are referenced to GND (ground = 0 V).
LIMITS
SYMBOL PARAMETER TEST CONDITIONS Temp = -40°C to +85°C UNIT
MIN TYP1MAX
V
p
VCC = 2.3 to 2.7V 1.7 1.2
V
V
IH
v
u
v
VCC = 2.7 to 3.6V 2.0 1.5
V
V
p
VCC = 2.3 to 2.7V 1.2 0.7
V
V
IL
v
u
v
VCC = 2.7 to 3.6V 1.5 0.8
V
VCC =23to36V
;
V=V or V
;
IO= 100µA
VCC 02
VCC
V
CC =
2
.
3
to
3
.
6V
;
V
I =
V
IH
or
V
IL;
I
O = –
100
µ
A
V
CC
0
.
2
V
CC
VCC = 2.3V ; V I = VIH or VIL; IO = –6mA VCC0.3 VCC0.08
VO
p
VCC = 2.3V ; V I = VIH or VIL; IO = –12mA VCC0.6 VCC0.26
V
V
OH
v
u
u
v
VCC = 2.7V ; V I = VIH or VIL; IO = –12mA VCC0.5 VCC0.14
V
VCC = 3.0V ; V I = VIH or VIL; IO = –12mA VCC0.6 VCC0.09
VCC = 3.0V ; V I = VIH or VIL; IO = –24mA VCC1.0 VCC0.28
V=23to36V
;
V=V or V
;
I = 100µA
GND
020
V
V
CC =
2
.
3
to
3
.
6V
;
V
I =
V
IH
or
V
IL;
I
O =
100
µ
A
GND
0
.
20
V
VCC = 2.3V ; V I = VIH or VIL; IO = 6mA 0.07 0.40 V
VOL LOW level output voltage VCC = 2.3V ; V I = VIH or VIL; IO = 12mA 0.15 0.70
VCC = 2.7V ; V I = VIH or VIL; IO = 12mA 0.14 0.40 V
VCC = 3.0V ; V I = VIH or VIL; IO = 24mA 0.27 0.55
VCC =23to36V
;
IIInput leakage current
V
CC =
2
.
3
to
3
.
6V
;
V V or GND
0.1 5
µ
A
I
V
I =
V
CC or
GND
µ
IOZ 3-State output OFF-state current VCC = 2.3 to 3.6V; VI = VIH or VIL;
VO = VCC or GND 0.1 10 µA
ICC Quiescent supply current VCC = 2.3 to 3.6V ; VI = VCC or GND; IO = 0 0.2 40 µA
∆ICC Additional quiescent supply current VCC = 2.3V to 3.6V; VI = VCC – 0.6V; IO = 0 150 750 µA
IBHL2
VCC = 2.3V ; V I = 0.7V 45 –
µA
I
BHL
2
VCC = 3.0V ; V I = 0.8V 75 150
µA
IBHH2
VCC = 2.3V ; V I = 1.7V –45
µA
I
BHH
2
VCC = 3.0V ; V I = 2.0V –75 –175
µA
IBHLO2Bus hold LOW overdrive current VCC = 3.6V 500 µA
IBHHO2Bus hold HIGH overdrive current VCC = 3.6V –500 µA
NOTES:
1. All typical values are at Tamb = 25°C.
2. Valid for data inputs of bus hold parts.
Philips Semiconductors Product specification
74ALVCH16825
18-bit buffer/driver (3-State)
1998 Jul 27 6
AC CHARACTERISTICS FOR VCC = 2.3V TO 2.7V RANGE
GND = 0V ; tr = tf ≤ 2.0ns; C L = 30pF LIMITS
SYMBOL PARAMETER WAVEFORM VCC = 2.3 to 2.7V UNIT
MIN TYP1MAX
tPHL/tPLH Propagation delay
nAn to nYn 1, 3 1.0 2.0 4.1 ns
tPZH/tPZL 3-State output enable time
nOEn to nYn 2, 3 1.0 2.9 6.0 ns
tPHZ/tPLZ 3-State output disable time
nOEn to nYn 2,3 1.2 2.2 5.6 ns
NOTE:
1. All typical values are at VCC = 3.3V and Tamb = 25°C.
AC CHARACTERISTICS FOR VCC = 3.0V TO 3.6V RANGE AND VCC = 2.7V
GND = 0V ; tr = tf ≤ 2.5ns; C L = 50pF LIMITS LIMITS
SYMBOL PARAMETER WAVEFORM VCC = 3.3 ± 0.3V VCC = 2.7V UNIT
MIN TYP1, 2MAX MIN TYP1MAX
tPHL/tPLH Propagation delay
nAn to nYn 1, 3 1.0 2.0 3.4 1.0 2.1 3.9 ns
tPZH/tPZL 3-State output enable time
nOEn to nYn 2, 3 1.0 2.8 4.7 1.0 2.9 5.7 ns
tPHZ/tPLZ 3-State output disable time
nOEn to nYn 2, 3 1.3 2.9 4.5 1.3 3.0 4.9 ns
NOTES:
1. All typical values are measured Tamb = 25°C.
2. Typical value is measured at VCC = 3.3V
AC WAVEFORMS FOR VCC = 2.3V TO 2.7V AND
VCC < 2.3V RANGE
VM = 0.5 VCC
VX = VOL + 0.15V
VY = VOH –0.15V
VOL and VOH are the typical output voltage drop that occur with the
output load.
AC WAVEFORMS FOR VCC = 3.0V TO 3.6V AND
VCC = 2.7V RANGE
VM = 1.5 V
VX = VOL + 0.3V
VY = VOH –0.3V
VOL and VOH are the typical output voltage drop that occur with the
output load.
VI = 2.7V
VI = VCC
An
INPUT
tPHL tPLH
VOL
VI
GND
VOH
Yn
OUTPUT
SH00132
VM
VM
W aveform 1. Input (Dn) to output (Yn) propagation delay
tPLZ tPZL
VI
nOE INPUT
GND
VCC
OUTPUT
LOW-to-OFF
OFF-to-LOW
VOL
VOH
OUTPUT
HIGH-to-OFF
OFF-to-HIGH
GND outputs
enabled outputs
enabled
outputs
disabled
tPHZ
VM
VM
VM
tPZH
VX
VY
SH00137
W aveform 2. 3-State enable and disable times
Philips Semiconductors Product specification
74ALVCH16825
18-bit buffer/driver (3-State)
1998 Jul 27 7
TEST CIRCUIT
SWITCH POSITION
PULSE
GENERATOR
RT
VID.U.T.
VO
CL
VCC
RL = 500 Ω
Test Circuit for switching times
Open
GND
S1
DEFINITIONS
VCC VI
< 2.7V VCC
TEST S1
tPLH/tPHL Open
RL = Load resistor
CL = Load capacitance includes jig and probe capacitance
RT = Termination resistance should be equal to ZOUT of pulse generators.
2 VCC
tPLZ/tPZL 2.7V2.7–3.6V
tPHZ/tPZH GND
RL = 500 Ω
2 * VCC
SV00906
W aveform 3. Load circuitry for switching times
Philips Semiconductors Product specification
74ALVCH16825
18-bit buffer/driver (3-State)
1998 Jul 27 8
TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1mm SOT364-1
Philips Semiconductors Product specification
74ALVCH16825
18-bit buffer/driver (3-State)
1998 Jul 27 9
NOTES
Philips Semiconductors Product specification
74ALVCH16825
18-bit buffer/driver (3-State)
1998 Jul 27 10
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may af fect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print code Date of release: 07-98
Document order number: 9397-750-04555
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Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition [1]
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
Data sheet status
[1] Please consult the most recently issued datasheet before initiating or completing a design.