D Package Code: BGA225C C 25.4mm [1.000"] 1.27mm [0.050"] See BGA pattern code to the right for actual pattern layout Y X 25.4mm [1.000"] Top View (reference only) 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] B 1 1.27mm [0.050"] O 0.64mm pad [O 0.025"] 3 Side View (reference only) Top View: Recommended PCB Layout Scale: 3:1 Note: SMT foot is independent of actual BGA package thickness. 1 Substrate: 1.59mm 0.18mm [0.0625" 0.007"] FR4/G10 or equivalent high temp material. Non-clad. Pin Count 225 Array Size 21 x 21 2 Pins: material- Brass Alloy 360 1/2 hard; finish0.25m [10"] Au over 1.27m [50"] Ni (min.). Pitch 1.27 mm[0.050"] Perimeter size (XxY) 27.0mm[1.142"] x 27.0mm[1.142"] MGA Location (CxD) 1.80mm[0.071"] x 1.80mm[0.071"] Ball Thickness (B) 0.61mm[0.024"] 3 Balls: Eutectic 63/37 SnPb. Thermally isolated from terminal pins Description: BGA Emulator Foot (SM base). 225 position terminal pins (MGA, Mini-grid Array) to solder balls. Surface mounts to target BGA land pattern. SF-BGA225C-B-11 Drawing (c) 20 04 IRONWO OD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 5 5121 Tele: (651 ) 452 -8100 www.ironwoodele ctronics.com Status: Released Scale - Rev: A Drawing: B. Roux Date:10/21/04 File: SF-BGA225C-B-11 Dwg.mcd Modified: Tolera nce s: diameters 0.0 3mm [0.001"], PCB perimeters 0.13mm [0.005 "], PCB th ickne sses 0 .1 8mm [0.007"], pitches (from tr ue positio n) 0.08mm [0.003 "], all other toleran ces 0.13mm [0.00 5"] unl ess stated otherwise. Ma ter ials an d specification s are subject to ch ange with out n otice.