Side View
(reference only)
Top View
(reference only)
Balls: Eutectic 63/37 SnPb. Thermally isolated from
terminal pins
3
Y
X
C
See BGA pattern code to the
right for actual pattern layout
B
13
2
D
3.74mm [0.147"]5.33mm
[0.210"]
0.36mm [0.014"] dia.
Status: Released
Drawing: B. Roux
Scale - Rev: A
Date:10/21/04
Modified:
File: SF-BGA225C-B-11 Dwg.mcd
SF-BGA225C-B-11 Drawing
© 2004 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-8100
www.ironwoodelectronics.com
Tolerances: diameters ±0.03mm [±0.001”],
PCB perimeters ±0.13mm [±0.005”],
PCB thicknesses ±0.18mm [±0.007"],
pitches (from true position) ±0.08mm [±0.003"],
all other tolerances ±0.13mm [±0.005”]
unless stated otherwise. Materials and
specifications are subject to change without notice.
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
FR4/G10 or equivalent high temp material. Non-clad.
1
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
2
Note: SMT foot is independent
of actual BGA package
thickness.
Description: BGA Emulator Foot (SM base).
225 position terminal pins (MGA, Mini-grid Array) to solder balls. Surface mounts to target BGA land pattern.
Top View: Recommended PCB Layout
Scale: 3:1
Perimeter size (XxY)
MGA Location (CxD)27.0mm[1.142"] x 27.0mm[1.142"]
1.80mm[0.071"] x 1.80mm[0.071"]
Ball Thickness (B)0.61mm[0.024"]
Array Size21 x 21
Pitch1.27 mm[0.050"]
Pin Count225
Package Code: BGA225C
25.4mm
[1.000"]
25.4mm [1.000"]
1.27mm [0.050"]
1.27 mm
[0.050"]
1.27mm [0.050"]Ø 0.64mm pad [Ø 0.025"]
