HSF High Surge Film Surface Mount Metal GlazeTM * * * * * Metal GlazeTM thick film element fired at 1000C to solid ceramic 1 Watt and 1/2 Watt power rating 150C maximum operating temperature RoHS - Compatible Components Available Up to triple the surge rating of the rugged CHP1 Replaces costly surface-mount wirewound resistors High temperature dielectric coating 60/40 Solder over nickel barrier Electrical Data Industry Footprint IRC Type Maximum Power Rating 2010 HSF-1/2 1/2W @ 70C 300 2512 HSF-1 1W @ 70C 350 Resistance Range () Tolerance (%) TCR (ppm/C) Product Category 700 * 10 200 High Surge * * 10 200 High Surge Working Maximum Voltage Voltage Note*: Consult factory for available resistance values and maximum voltage. Environmental Data Characteristics Maximum Change Temperature Coefficient As specified Test Method MIL-R-55342H Par 4.7.9 (-55C +125C) Thermal Shock 0.5% +0.01 ohm MIL-R-55342H Par 4.7.3 (-65C +150C, 5 cycles) Low Temperature Operation 0.25% +0.01 ohm MIL-R-55342H Par 4.7.4 (-65C @ working voltage) Short Time Overload 0.5% +0.01 ohm High Temperature Exposure 0.5% +0.01 ohm MIL-R-55342H Par 4.7.6 (+150C for 100 hours) Resistance to Bonding Exposure 0.25% +0.01 ohm MIL-R-55342H Par 4.7.7 (reflow soldered to board at 260C for 10 seconds) Solderability 95% min. coverage MIL-STD-202, Method 208 (245C for 5 seconds) Moisture Resistance 0.5% +0.01 ohm MIL-R-55342H Par 4.7.8 (10 cycles, total 240 hours) Life Test 0.5% +0.01 ohm MIL-R-55342H Par 4.7.10 (2000 hours at 70C intermittent) MIL-R-55342H Par 4.7.5 2.5 x P x R for 5 seconds Terminal Adhesion Strength 1% +0.01 ohm 1200 gram push from underside of mounted chip for 60 seconds no mechanical damage Resistance to Board bending Chip mounted in center of 90mm long board, deflected 5mm so 1% +0.01 ohm no mechanical damage as to exert pull on chip contacts for 10 seconds General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC's own data and is considered accurate at time of going to print. Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com A subsidiary of TT electronics plc HSF-1 Series Issue October 2010 Sheet 1 of 4 HSF High Surge Film Surface Mount Metal GlazeTM Physical Data L C W Dimensions (Inches and (mm)) Industry Footprint IRC Type L (Length) W (Width/Diameter) C (Termination Width) 2010 HSF-1/2 0.200 0.010 (5.08 0.25) 0.079 0.006 (2.01 0.15) 0.030 0.010 (0.761 0.25) 2512 HSF-1 0.251 0.010 (6.38 0.25) 0.079 0.006 (2.01 0.15) 0.040 0.010 (1.02 0.25) 3612 HSF-2 0.367 0.010 (9.32 0.25) 0.105 0.006 (2.67 0.15) 0.050 0.010 (1.27 0.25) Recommended Solder Pad Dimensions (Reflow): F B A C A E D Industry Footprint Dimensions (Inches and mm)) A B C D E F HSF 1/2 2010 0.111 (1.93) 0.126 (2.36) 0.096 (1.47) 0.152 (2.49) 0.040 (0.81) 0.211 (5.36) HSF 1 2512 0.121 (3.07) 0.126 (3.20) 0.127 (3.23) 0.183 (4.65) 0.040 (1.02) 0.369 (9.37) HSF 2 3610 0.17 (4.32) 0.16 (4.06) 0.213 (5.41) 0.273 (6.93) 0.044 (1.12) 0.553 (14.05) Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com HSF-1 Series Issue October 2010 Sheet 2 of 4 HSF High Surge Film Surface Mount Metal GlazeTM IRC Solder Reflow Recommendations Sn-Pb Eutectic and Pb-Free Reflow Profiles tP TP Ramp-up Critical Zone TL to TP TL tL Temperature Tsmax Tsmin ts Preheat 25 Ramp-down t 25C to Peak Time * Based on Industry Standards and IPC recommendations Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly 3C / second max. 3C / second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100C 150C 60 -120 seconds 150C 200C 60 -180 seconds Time maintained above - Temperature (TL) - Time (tL) 183C 60 - 150 seconds 217C 60 - 150 seconds Peak Temperature (TP) See Table 1 See Table 2 Average Ramp-up rate (Tsmax to Tp) Time within 5C of actual Peak Temperature (tp)2 Ramp-down Rate Time 25C to Peak Temperature 10 - 30 seconds 20 - 40 seconds 6C / second max. 6C / second max. 6 minutes max. 8 minutes max. Note 1: All temperatures refer to topside of the package, measured on the package body surface. Note 2: Time within 5 C of actual peak temperature (tp) specified for the reflow profiles is a "supplier" minimum and a "user" maximum. Note 1: Package volume excludes external terminals (balls, bumps, lands, leads) and/or non-integral heat sinks. Tabel 1: SnPb Eutectic Process Package Peak Reflow Temperatures Package Thickness Volume mm3 < 350 Volume mm3 350 < 2.5 mm 240 +0/-5C 225 +0/-5C 2.5 mm 225 +0/-5C 225 +0/-5C Tabel 2: Pb-free Process Package Peak Reflow Temperatures Package Thickness Volume mm3 < 350 Volume mm3 350 - 2000 Volume mm3 > 2000 < 1.6 mm 260C * 260C * 260C * 1.6 mm - 2.5 mm 260C * 250C * 245C * 2.5 mm 250C * 245C * 245C * Note 2: The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processess reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist. Note 3: Components intended for use in "leadfree" assembly process shall be evaluated using the "lead-free" peak temperature and profiles defined in Table 1, 2 and reflow profile whether or not lead-free. * Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature at the rated MSL level. Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com HSF-1 Series Issue October 2010 Sheet 3 of 4 HSF High Surge Film Surface Mount Metal GlazeTM Surge Capability Data For Non-repetitive or Low Repetitive Rate Surges 1000000 Peak Power (Watts) 100000 10000 1000 100 10 1 1.0E-09 1.0E-08 1.0E-07 1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01 1.0E+00 Surge or Pulse Duration (Seconds) Power Derating Curve Note: Percent of Rated Power 100 80 Use for low repetitive pulses where the average power dissipation is not to exceed the component rating at 70C. Surge handling capacity for low-repetitive surges may be significantly greater than shown above. Contact factory 60 40 20 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 Ambient Temperature (C) Ordering Data Sample Part No. HSF-1 100 11R0 K LF 13 IRC Type HSF-1/2 or HSF-1 Temperature Coefficient 50 = 50ppm/C; 100 = 100ppm/C Resistance Value Standard 4-digit resistance code. Consult factory for available values. Tolerance K = 10% Lead-Free Construction Packaging Code BLK = Bulk, 7 = 7" Reel, 13 = 13" Reel Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com HSF-1 Series Issue October 2010 Sheet 4 of 4