HSF110068R0KLF - WELWYN COMPONENTS

General Note

IRC reserves the right to make changes in product speciﬁ cation without notice or liability.

All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of

TT electronics plc

• 4222 South Staples Street • Corpus Christi Texas 78411 USA

Wire and Film Technologies Division

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com

Metal GlazeTM

thick ﬁ lm element

ﬁ red at 1000°C

to solid ceramic

60/40 Solder over

nickel barrier

High

temperature

dielectric

coating

Electrical Data

• 1 Watt and 1/2 Watt power rating

• 150°C maximum operating temperature

• RoHS - Compatible Components Available

• Up to triple the surge rating of the rugged CHP1

• Replaces costly surface-mount wirewound resistors

Industry

Footprint

IRC

Type

Maximum

Power Rating Working

Voltage

Maximum

Voltage

Resistance

Range (Ω)

Tolerance

(±%)

TCR

(ppm/°C)

Product

Category

2010 HSF-1/2 1/2W @ 70°C 300 700 * 10 ±200 High Surge

2512 HSF-1 1W @ 70°C 350 * * 10 ±200 High Surge

Environmental Data

Characteristics Maximum Change Test Method

Temperature Coefﬁ cient As speciﬁ ed MIL-R-55342H Par 4.7.9 (-55°C +125°C)

Thermal Shock ±0.5% +0.01 ohm MIL-R-55342H Par 4.7.3 (-65°C +150°C, 5 cycles)

Low Temperature Operation ±0.25% +0.01 ohm MIL-R-55342H Par 4.7.4 (-65°C @ working voltage)

Short Time Overload ±0.5% +0.01 ohm MIL-R-55342H Par 4.7.5

2.5 x P x R for 5 seconds

High Temperature Exposure ±0.5% +0.01 ohm MIL-R-55342H Par 4.7.6 (+150°C for 100 hours)

Resistance to Bonding

Exposure ±0.25% +0.01 ohm MIL-R-55342H Par 4.7.7 (reﬂ ow soldered to board at 260°C for 10 seconds)

Solderability 95% min. coverage MIL-STD-202, Method 208 (245°C for 5 seconds)

Moisture Resistance ±0.5% +0.01 ohm MIL-R-55342H Par 4.7.8 (10 cycles, total 240 hours)

Life Test ±0.5% +0.01 ohm MIL-R-55342H Par 4.7.10 (2000 hours at 70°C intermittent)

Terminal Adhesion Strength ±1% +0.01 ohm

no mechanical damage 1200 gram push from underside of mounted chip for 60 seconds

Resistance to Board bending ±1% +0.01 ohm

no mechanical damage

Chip mounted in center of 90mm long board, deﬂ ected 5mm so

as to exert pull on chip contacts for 10 seconds

Note*: Consult factory for available resistance values and maximum voltage.

√

HSF

High Surge Film

Surface Mount Metal GlazeTM

HSF-1 Series Issue October 2010 Sheet 1 of 4

• 4222 South Staples Street • Corpus Christi Texas 78411 USA

Wire and Film Technologies Division

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com

Dimensions (Inches and (mm))

Industry

Footprint IRC Type L

(Length)

(Width/Diameter)

(Termination Width)

2010 HSF-1/2 0.200 ± 0.010

(5.08 ± 0.25)

0.079 ± 0.006

(2.01 ± 0.15)

0.030 ± 0.010

(0.761 ± 0.25)

2512 HSF-1 0.251 ± 0.010

(6.38 ± 0.25)

0.079 ± 0.006

(2.01 ± 0.15)

0.040 ± 0.010

(1.02 ± 0.25)

3612 HSF-2 0.367 ± 0.010

(9.32 ± 0.25)

0.105 ± 0.006

(2.67 ± 0.15)

0.050 ± 0.010

(1.27 ± 0.25)

Physical Data

Recommended Solder Pad Dimensions (Reﬂ ow):

Industry

Footprint

Dimensions (Inches and mm))

ABCDEF

HSF 1/2 2010 0.111

(1.93)

0.126

(2.36)

0.096

(1.47)

0.152

(2.49)

0.040

(0.81)

0.211

(5.36)

HSF 1 2512 0.121

(3.07)

0.126

(3.20)

0.127

(3.23)

0.183

(4.65)

0.040

(1.02)

0.369

(9.37)

HSF 2 3610 0.17

(4.32)

0.16

(4.06)

0.213

(5.41)

0.273

(6.93)

0.044

(1.12)

0.553

(14.05)

ACA

HSF

High Surge Film

Surface Mount Metal GlazeTM

HSF-1 Series Issue October 2010 Sheet 2 of 4

• 4222 South Staples Street • Corpus Christi Texas 78411 USA

Wire and Film Technologies Division

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com

Note 1: Package volume excludes external

terminals (balls, bumps, lands, leads) and/or

non-integral heat sinks.

Note 2: The maximum component temperature

reached during reﬂ ow depends on package

thickness and volume. The use of convection

reﬂ ow processess reduces the thermal gradients

between packages. However, thermal gradients

due to differences in thermal mass of SMD pack-

ages may still exist.

Note 3: Components intended for use in “lead-

free” assembly process shall be evaluated using

the “lead-free” peak temperature and proﬁ les

deﬁ ned in Table 1, 2 and reﬂ ow proﬁ le whether

or not lead-free.

Tabel 1: SnPb Eutectic Process -

Package Peak Reﬂ ow Temperatures

Package

Thickness Volume mm3 < 350 Volume mm3 ≥ 350

< 2.5 mm 240 +0/-5°C 225 +0/-5°C

≥ 2.5 mm 225 +0/-5°C 225 +0/-5°C

Tabel 2: Pb-free Process -

Package Peak Reﬂ ow Temperatures

Package

Thickness

Volume mm3

< 350

Volume mm3

350 - 2000

Volume mm3

> 2000

< 1.6 mm 260°C * 260°C * 260°C *

1.6 mm - 2.5 mm 260°C * 250°C * 245°C *

≥ 2.5 mm 250°C * 245°C * 245°C *

* Tolerance: The device manufacturer/supplier shall assure process compat-

ibility up to and including the stated classiﬁ cation temperature at the rated MSL

level.

Note 1: All temperatures refer

to topside of the package,

measured on the package

body surface.

Note 2: Time within 5 °C of

actual peak temperature (tp)

speciﬁ ed for the reﬂ ow proﬁ les

is a “supplier” minimum and a

“user” maximum.

Proﬁ le Feature Sn-Pb Eutectic

Assembly Pb-Free

Assembly

Average Ramp-up rate (Tsmax to Tp) 3°C / second max. 3°C / second max.

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

100°C

150°C

60 -120 seconds

150°C

200°C

60 -180 seconds

Time maintained above

- Temperature (TL)

- Time (tL)

183°C

60 - 150 seconds

217°C

60 - 150 seconds

Peak Temperature (TP) See Table 1 See Table 2

Time within 5°C of actual Peak Temperature (tp)210 - 30 seconds 20 - 40 seconds

Ramp-down Rate 6°C / second max. 6°C / second max.

Time 25°C to Peak Temperature 6 minutes max. 8 minutes max.

Sn-Pb Eutectic and Pb-Free Reflow Profiles

Time

Temperature

Critical Zone

TL to TP

Ramp-down

Ramp-up

t 25°C to Peak

Tsmax

Tsmin

Preheat

* Based on Industry Standards and IPC recommendations

IRC Solder Reﬂ ow Recommendations

HSF

High Surge Film

Surface Mount Metal GlazeTM

HSF-1 Series Issue October 2010 Sheet 3 of 4

• 4222 South Staples Street • Corpus Christi Texas 78411 USA

Wire and Film Technologies Division

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com

Surge Capability Data

Power Derating Curve

Ambient Temperature (C)

010 20 30 40 50 60 70 80 90 100 110 120 130 140 150

100

Percent of Rated Power

Surge or Pulse Duration (Seconds)

Peak Power (Watts)

1.0E-09 1.0E-08 1.0E-07 1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01 1.0E+00

1000000

100000

10000

1000

100

For Non-repetitive or Low Repetitive Rate Surges

Note: Use for low repetitive pulses where the average power

dissipation is not to exceed the component rating at 70°C.

Surge handling capacity for low-repetitive surges may be

signiﬁ cantly greater than shown above. Contact factory

Ordering Data

Sample Part No.

IRC Type

HSF-1/2 or HSF-1

Temperature Coefﬁ cient

50 = ±50ppm/°C; 100 = ±100ppm/°C

Resistance Value

Standard 4-digit resistance code. Consult factory for available values.

Tolerance

K = 10%

Lead-Free Construction

Packaging Code

BLK = Bulk, 7 = 7" Reel, 13 = 13" Reel

HSF-1 100 11R0 K LF 13

HSF

High Surge Film

Surface Mount Metal GlazeTM

HSF-1 Series Issue October 2010 Sheet 4 of 4