CY74FCT2244T
8-BIT BUFFER/LINE DRIVER
WITH 3-STATE OUTPUTS
SCCS074 – OCT OBER 2001
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Function and Pinout Compatible With FCT
and F Logic
D
25-Ω Output Series Resistors Reduce
Transmission-Line Reflection Noise
D
TTL-Output-Level Version of Equivalent
FCT Functions
D
Edge-Rate Control Circuitry for
Significantly Improved Noise
Characteristics
D
Ioff Supports Partial-Power-Down Mode
Operation
D
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
D
Fully Compatible With TTL Input and
Output Logic Levels
D
12-mA Output Sink Current
15-mA Output Source Current
D
3-State Outputs
description
The CY74FCT2244T is an octal buffer and line driver that includes on-chip 25-Ω terminating resistors at each
of the outputs to minimize noise resulting from reflections or standing waves in high-performance applications.
The on-chip resistors reduce overall board space and component count. Designed to be employed as a memory
address driver, clock driver, and bus-oriented transmitter/receiver, this device provides speed and drive
capabilities commensurate with its fastest bipolar logic counterparts, while reducing power dissipation. The
input and output voltage levels allow direct interface with TTL, NMOS, and CMOS devices, without the need
for external components.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TAPACKAGE†SPEED
(ns) ORDERABLE
PART NUMBER TOP-SIDE
MARKING
QSOP – Q Tape and reel 4.3 CY74FCT2244CTQCT FCT2244C
SOIC SO
Tube 4.3 CY74FCT2244CTSOC
FCT2244C
SOIC
–
SO
Tape and reel 4.3 CY74FCT2244CTSOCT
FCT2244C
QSOP – Q Tape and reel 4.6 CY74FCT2244ATQCT FCT2244A
–40°C to 85°C
SOIC SO
Tube 4.6 CY74FCT2244ATSOC
FCT2244A
SOIC
–
SO
Tape and reel 4.6 CY74FCT2244ATSOCT
FCT2244A
QSOP – Q Tape and reel 6.5 CY74FCT2244TQCT FCT2244
SOIC SO
Tube 6.5 CY74FCT2244TSOC
FCT2244
SOIC
–
SO
Tape and reel 6.5 CY74FCT2244TSOCT
FCT2244
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Copyright 2001, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
OEA
DA0
OB0
DA1
OB1
DA2
OB2
DA3
OB3
GND
Q OR SO PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
VCC
OEB
OA0
DB0
OA1
DB1
OA2
DB2
OA3
DB3
CY74FCT2244T
8-BIT BUFFER/LINE DRIVER
WITH 3-STATE OUTPUTS
SCCS074 – OCTOBER 2001
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FUNCTION TABLE
INPUTS OUTPUT
OEAOEBDO
L L L L
LLH H
H H X Z
H = High logic level, L = Low logic level,
X = Don’t care, Z = High-impedance (off)
state
logic diagram
1
218
OEA
317
19
416
515
614
713
812
911
OB0
OB1
OB2
OB3
DA0
DA1
DA2
DA3
OEB
OA0
OA1
OA2
OA3
DB0
DB1
DB2
DB3
CY74FCT2244T
8-BIT BUFFER/LINE DRIVER
WITH 3-STATE OUTPUTS
SCCS074 – OCTOBER 2001
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range to ground potential –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC input voltage range –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC output voltage range –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC output current (maximum sink current/pin) 120 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 1): Q package 68°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SO package 58°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Ambient temperature range with power applied, TA –65°C to +135°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to +150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 2)
MIN NOM MAX UNIT
VCC Supply voltage 4.75 5 5.25 V
VIH High-level input voltage 2 V
VIL Low-level input voltage 0.8 V
IOH High-level output current –15 mA
IOL Low-level output current 12 mA
TAOperating free-air temperature –40 85 °C
NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation.
CY74FCT2244T
8-BIT BUFFER/LINE DRIVER
WITH 3-STATE OUTPUTS
SCCS074 – OCTOBER 2001
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
VIK VCC = 4.75 V, IIN = –18 mA –0.7 –1.2 V
VOH VCC = 4.75 V, IOH = –15 mA 2.4 3.3 V
VOL VCC = 4.75 V, IOL = 12 mA 0.3 0.55 V
ROUT VCC = 4.75 V, IOL = 12 mA 20 25 40 Ω
Vhys All inputs 0.2 V
IIVCC = 5.25 V, VIN = VCC 5µA
IIH VCC = 5.25 V, VIN = 2.7 V ±1µA
IIL VCC = 5.25 V, VIN = 0.5 V ±1µA
IOZH VCC = 5.25 V, VOUT = 2.7 V 10 µA
IOZL VCC = 5.25 V, VOUT = 0.5 V –10 µA
IOS‡VCC = 5.25 V, VOUT = 0 V –60 –120 –225 mA
Ioff VCC = 0 V, VOUT = 4.5 V ±1µA
ICC VCC = 5.25 V, VIN ≤ 0.2 V, VIN ≥VCC – 0.2 V 0.1 0.2 mA
∆ICC VCC = 5.25 V, VIN = 3.4 V§, f1 = 0, Outputs open 0.5 2 mA
ICCDVCC = 5.25 V, One input switching at 50% duty cycle, Outputs open,
OEA = OEB = GND, VIN ≤0.2 V or VIN ≥VCC – 0.2 V 0.06 0.12 mA/
MHz
#
One bit switching
at f1 = 10 MHz VIN ≤0.2 V or
VIN ≥VCC – 0.2 V 0.7 1.4
IC#
VCC = 5.25 V,
Out
p
uts o
p
en
1
at 50% duty cycle VIN = 3.4 V or GND 1 2.4
mA
I
C
#
O
u
t
pu
t
s open,
OEA = OEB = GND Eight bits switching
at f1 = 2.5 MHz VIN ≤0.2 V or
VIN ≥VCC – 0.2 V 1.3 2.6||
mA
1
at 50% duty cycle VIN = 3.4 V or GND 3.3 10.6||
Ci5 10 pF
Co9 12 pF
†Typical values are at VCC = 5 V, TA = 25°C.
‡Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus
and/or sample-and-hold techniques are preferable to minimize internal chip heating and more accurately reflect operational values. Otherwise,
prolonged shorting of a high output can raise the chip temperature well above normal and cause invalid readings in other parametric tests. In
any sequence of parameter tests, IOS tests should be performed last.
§Per TTL-driven input (VIN = 3.4 V); all other inputs at VCC or GND
This parameter is derived for use in total power-supply calculations.
#IC= ICC + ∆ICC × DH × NT + ICCD (f0/2 + f1 × N1)
Where:
IC= Total supply current
ICC = Power-supply current with CMOS input levels
∆ICC = Power-supply current for a TTL high input (VIN = 3.4 V)
DH= Duty cycle for TTL inputs high
NT= Number of TTL inputs at DH
ICCD = Dynamic current caused by an input transition pair (HLH or LHL)
f0= Clock frequency for registered devices, otherwise zero
f1= Input signal frequency
N1= Number of inputs changing at f1
All currents are in milliamperes and all frequencies are in megahertz.
|| Values for these conditions are examples of the ICC formula.
CY74FCT2244T
8-BIT BUFFER/LINE DRIVER
WITH 3-STATE OUTPUTS
SCCS074 – OCTOBER 2001
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics over operating free-air temperature range (see Figure 1)
PARAMETER
FROM TO CY74FCT2244T CY74FCT2244AT CY74FCT2244CT
UNIT
PARAMETER
(INPUT) (OUTPUT) MIN MAX MIN MAX MIN MAX
UNIT
tPLH
1.5 6.5 1.5 4.6 1.5 4.1
ns
tPHL
1.5 6.5 1.5 4.6 1.5 4.1
ns
tPZH
1.5 8 1.5 6.2 1.5 5.8
ns
tPZL
1.5 8 1.5 6.2 1.5 5.8
ns
tPHZ
1.5 7 1.5 5.6 1.5 5.2
ns
tPLZ
1.5 7 1.5 5.6 1.5 5.2
ns
CY74FCT2244T
8-BIT BUFFER/LINE DRIVER
WITH 3-STATE OUTPUTS
SCCS074 – OCTOBER 2001
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
3 V
3 V
0 V
0 V
th
tsu
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
Data Input
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
3 V
0 V
Input
Out-of-Phase
Output
In-Phase
Output
Timing Input
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Control
Output
W aveform 1
(see Note B)
Output
W aveform 2
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
≈3.5 V
0 V
VOL + 0.3 V
≈0 V
3 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
7 V
Open
TEST S1
3 V
0 V
tw
VOLTAGE WAVEFORMS
PULSE DURATION
Input
NOTES: A. CL includes probe and jig capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
W aveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. The outputs are measured one at a time with one input transition per measurement.
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT FOR
3-STATE OUTPUTS
S1 7 V
500 ΩGND
From Output
Under Test
CL = 50 pF
(see Note A)
Test
Point
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
Open
VOH – 0.3 V
500 Ω
500 Ω
1.5 V1.5 V
1.5 V 1.5 V
1.5 V 1.5 V
1.5 V 1.5 V
1.5 V
1.5 V1.5 V
1.5 V 1.5 V
1.5 V
1.5 V
Figure 1. Load Circuit and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
74FCT2244CTSOCTE4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74FCT2244CTSOCTG4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CY74FCT2244ATQCT ACTIVE SSOP DBQ 20 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
CY74FCT2244ATQCTE4 ACTIVE SSOP DBQ 20 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
CY74FCT2244ATQCTG4 ACTIVE SSOP DBQ 20 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
CY74FCT2244ATSOC ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CY74FCT2244ATSOCE4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CY74FCT2244ATSOCG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CY74FCT2244CTQCT ACTIVE SSOP DBQ 20 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
CY74FCT2244CTQCTE4 ACTIVE SSOP DBQ 20 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
CY74FCT2244CTQCTG4 ACTIVE SSOP DBQ 20 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
CY74FCT2244CTSOC ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CY74FCT2244CTSOCE4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CY74FCT2244CTSOCG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CY74FCT2244CTSOCT ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CY74FCT2244TQCT ACTIVE SSOP DBQ 20 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
CY74FCT2244TQCTE4 ACTIVE SSOP DBQ 20 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
CY74FCT2244TQCTG4 ACTIVE SSOP DBQ 20 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
CY74FCT2244TSOC ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CY74FCT2244TSOCE4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CY74FCT2244TSOCG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
CY74FCT2244ATQCT SSOP DBQ 20 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CY74FCT2244CTQCT SSOP DBQ 20 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CY74FCT2244CTSOCT SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1
CY74FCT2244TQCT SSOP DBQ 20 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CY74FCT2244ATQCT SSOP DBQ 20 2500 367.0 367.0 38.0
CY74FCT2244CTQCT SSOP DBQ 20 2500 367.0 367.0 38.0
CY74FCT2244CTSOCT SOIC DW 20 2000 367.0 367.0 45.0
CY74FCT2244TQCT SSOP DBQ 20 2500 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 2
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