Standard Power
Data Sheet
Rev. 1.01, 2009-10-19
IFX25401
Low Dropout Linear Voltage Regulator
IFX25401TBV
IFX25401TEV
IFX25401TBV50
IFX25401TEV50
Type Package Marking
IFX25401TBV PG-TO263-5 25401V
IFX25401TEV PG-TO252-5 25401V
IFX25401TBV50 PG-TO263-5 25401V50
IFX25401TEV50 PG-TO252-5 2540150
PG-TO263-5
PG-TO252-5
Data Sheet 2 Rev. 1.01, 2009-10-19
Low Dropout Linear Voltage Regulator
IFX25401
Features
• Output Voltage Versions: 5V and Adjustable
• Very Low Current Consumption
• 400 mA Output Current Capability
• Very Low Dropout Voltage
• Output Current Limitation
• Overtemperature Shutdown
• Reverse Polarity Protection
• Wide Temperature Range; -40 °C to 125 °C
• Green Product (RoHS compliant)
Applications
• Manufacturing Automation
• Appliances
• HDTV Televisions
• Game Consoles
• Network Routers
For automotive and transportation applications, please refer to the
Infineon TLE and TLF voltage regulator series.
Description
The IFX25401 is a monolithic integrated low dropout voltage regulator for load currents up to 400 mA. An input
voltage up to 40 V is regulated to an adjustable voltage with a precision of ±2%. The device is designed for harsh
environments. Therefore it is protected against overload, short circuit and overtemperature conditions by the
implemented output current limitation and the overtemperature shutdown circuit. The adustable output can be
configured to regulate between 2.5 V and 20 V.
Due to its very low quiescent current the IFX25401 is dedicated for use in applications permanently connected to
a battery.
IFX25401
Block Diagram
Data Sheet 3 Rev. 1.01, 2009-10-19
1 Block Diagram
Figure 1 Block Diagram
Ι1
AEB02044
GND
3
Q
5
Bandgap
Reference
Control
Amplifier
Sensor
Temperature
Buffer
Saturation
Control and
Protection
Circuit
VA
4
EN
2
*)
**)
For fixed Voltage Regulator only
For adjustable Voltage Regulator only
**)
*)
Data Sheet 4 Rev. 1.01, 2009-10-19
IFX25401
Pin Configuration
2 Pin Configuration
2.1 Pin Assignment PG-TO263-5, PG-TO252-5
Figure 2 Pin Configuration (top view)
2.2 Pin Definitions and Functions PG-TO263-5, PG-TO252-5
Pin No. Symbol Function
1IInput
block to ground directly at the IC with a ceramic capacitor
2ENEnable
high level input signal enables the IC;
low level input signal disables the IC;
integrated pull-down resistor
3GNDGround
internally connected to heat slug
4N.C.
VA
Not Connected for IFX25401TBV50, IFX25401TEV50
can be open or connected to GND
Voltage Adjust for IFX25401TBV, IFX25401TEV
connect external voltage divider to configure the output voltage
5QOutput
Connect a capacitor between Q and GND close to the IC pins and respect the values
specified for apacitance and ESR in “Functional Range” on Page 5
Heat Slug – Heat Slug
internally connected to GND;
connect to PCB/System GND and heatsink area
AEP02560
15
EN
I
n.c.
Q
VA
GND
PinC onfig_PG-TO-263-5-1.vsd
12345
I
EN
GND
n.c.
Q
VA
GND
IFX25401
General Product Characteristics
Data Sheet 5 Rev. 1.01, 2009-10-19
3 General Product Characteristics
3.1 Absolute Maximum Ratings
Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
3.2 Functional Range
Absolute Maximum Ratings1)
Tj= -40 °C to 150 °C; all voltages with respect to ground, (unless otherwise specified)
1) not subject to production test, specified by design
Pos. Parameter Symbol Limit Values Unit Test Condition
Min. Max.
Input I
3.1.1 Voltage VI-42 45 V –
Voltage Adjust Input VA
3.1.2 Voltage VVA -0.3 10 V –
Output Q
3.1.3 Voltage VQ-1 40 V –
Temperature
3.1.4 Junction temperature Tj-40 150 °C–
3.1.5 Storage temperature Tstg -50 150 °C–
ESD Susceptibility
3.1.6 ESD Absorption VESD,HBM -2 2 kV Human Body Model
(HBM)2)
2) ESD susceptibility Human Body Model “HBM” according to AEC-Q100-002 - JESD22-A114
3.1.7 VESD,CDM -500 500 V Charge Device
Model (CDM)3)
3) ESD susceptibility Charged Device Model “CDM” according to ESDA STM5.3.1
3.1.8 -750 750 V Charge Device
Model (CDM) at
corner pins3)
Pos. Parameter Symbol Limit Values Unit Remarks
Min. Max.
3.2.9 Input voltage VIVQ +
0.5
40 V IFX25401TBV, IFX25401TEV;
IFX25401TBV50, IFX25401TEV50
VQ > 4 V
3.2.10 Input voltage VI4.5 40 V IFX25401TBV, IFX25401TEV;
VQ < 4 V
Data Sheet 6 Rev. 1.01, 2009-10-19
IFX25401
General Product Characteristics
Note: Within the functional or operating range, the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the Electrical Characteristics table.
3.3 Thermal Resistance
Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go
to www.jedec.org.
3.2.11 Output Capacitor’s
Requirements for Stability
CQ22 – µF 1)
3.2.12 ESR(CQ)–3Ω2)
3.2.13 Junction temperature Tj-40 125 °C–
1) the minimum output capacitance requirement is applicable for a worst case capacitance tolerance of 30%
2) relevant ESR value at f=10kHz
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Typ. Max.
IFX25401TBV, IFX25401TBV50 (PG-TO263-5)
3.3.1 Junction to Case1)
1) Not subject to production test, specified by design.
RthJC – 4 – K/W measured to heat
slug
3.3.2 Junction to Ambient1) RthJA –22–K/W
2)
2) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm³ board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).
Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.
3.3.3 – 74 – K/W footprint only3)
3) Specified RthJA value is according to Jedec JESD 51-3 at natural convection on FR4 1s0p board; The Product
(Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm3 board with 1 copper layer (1 x 70µm Cu).
3.3.4 – 42 – K/W 300 mm² heatsink
area3)
3.3.5 – 34 – K/W 600 mm² heatsink
area3)
IFX25401TEV, IFX25401TEV50 (PG-TO252-5)
3.3.6 Junction to Case1) RthJC – 4 – K/W measured to heat
slug
3.3.7 Junction to Ambient1) RthJA –27–K/W
2)
3.3.8 – 115 – K/W footprint only3)
3.3.9 – 52 – K/W 300 mm² heatsink
area3)
3.3.10 – 40 – K/W 600 mm² heatsink
area3)
Pos. Parameter Symbol Limit Values Unit Remarks
Min. Max.
IFX25401
Electrical Characteristics
Data Sheet 7 Rev. 1.01, 2009-10-19
4 Electrical Characteristics
4.1 Electrical Characteristics Voltage Regulator
Electrical Characteristics
VI =13.5 V; Tj= -40 °C to 125 °C; all voltages with respect to ground (unless otherwise specified)
Pos. Parameter Symbol Limit Values Unit Measuring Condition
Min. Typ. Max.
Output Q
4.1.1 Output Voltage Accuracy1)
Δ
VQ-2 – 2 % IFX25401TBV,
IFX25401TEV
R2 < 50 kΩ;
VQ + 1 V ≤ VI ≤ 40V;
VI > 4.5 V;
5 mA ≤ IQ ≤ 400 mA
4.1.2 Output Voltage VQ4.9 5.0 5.1 V IFX25401TBV50
IFX25401TEV50
6 V ≤ VI ≤ 28 V;
5 mA ≤ IQ ≤ 400 mA
4.1.3 Output Voltage Adjustable Range3) VQ,range 2.5 – 20 V IFX25401TBV,
IFX25401TEV;
Refer to Page 12
4.1.4 Dropout Voltage Vdr –250500mVIQ=250mA
VI > 4.5 V;
Vdr =VI–VQ
2)
4.1.5 Load Regulation ΔVQ, lo –535mVIQ= 5 mA to 400 mA
VI=4.5V
4.1.6 Line Regulation ΔVQ, li – 1525mVVl= 12 V to 32 V
IQ=5mA
4.1.7 Output Current Limitation IQ400 600 1100 mA 2)
4.1.8 Power Supply Ripple Rejection3) PSRR –54–dBfr=100Hz; Vr=0.5Vpp
4.1.9 Temperature Output Voltage Drift3) –0.5–mV/K–
dVQ
dT
-----------
Data Sheet 8 Rev. 1.01, 2009-10-19
IFX25401
Electrical Characteristics
Current Consumption
4.1.10 Current Consumption,
Regulator Disabled
Iq––10μAVEN = 0 V
Tj≤100 °C
4.1.11 Quiescent Current
Iq=II–IQ
Iq–100220μAIQ=1mA; VEN = 5 V
4.1.12 Current Consumption
Iq=II–IQ
Iq–510mAIQ=250mA; VEN = 5 V
4.1.13 Current Consumption
Iq=II–IQ
Iq– 1525mAIQ=400mA; VEN = 5 V
1) influence of resistor divider on accuracy neglected
2) Measured when the output voltage VQ has dropped 100 mV from the nominal value obtained at VI = 13.5 V.
3) not subject to production test, specified by design
Electrical Characteristics
VI =13.5 V; Tj= -40 °C to 125 °C; all voltages with respect to ground (unless otherwise specified)
Pos. Parameter Symbol Limit Values Unit Measuring Condition
Min. Typ. Max.
IFX25401
Electrical Characteristics
Data Sheet 9 Rev. 1.01, 2009-10-19
4.2 Typical Performance Characteristics Voltage Regulator
Current Consumption Iq versus
Output Current IQ
Current Consumption Iq versus
Low Output Current IQ
Output Voltage VQ versus
Junction Temperature TJ
Dropout Voltage Vdr versus
Output Current IQ
01_IQ_IQ.VSD
0
2
4
6
8
10
12
14
16
0 100 200 300 400
I
Q
[mA]
I
q
[mA]
V
I
= 13.5 V
T
j
= 25 °C
02_IQ_IQLOW.VSD
0
0,2
0,4
0,6
0,8
1
1,2
1,4
0 20406080100
I
Q
[mA]
I
q
[mA]
VI = 13.5 V
Tj = 25 °C
03_VQ_TJ.VSD
-0,5
-0,4
-0,3
-0,2
-0,1
0
0,1
0,2
0,3
0,4
0,5
-4004080120
T
j
[°C]
Δ
V
Q
[%]
I
Q
= 5 mA
V
I
= 13.5 V
150
04_VDR_IQ.VSD
0
50
100
150
200
250
300
350
400
450
500
0 100 200 300 400
I
Q
[mA]
V
DR
[mV]
T
j
= 150 °C
T
j
= 25 °C
T
j
= -40 °C
Data Sheet 10 Rev. 1.01, 2009-10-19
IFX25401
Electrical Characteristics
Dropout Voltage Vdr versus
Junction Temperature
Maximum Output Current IQ versus
Input Voltage VI
Region Of Stability: Output Capacitor’s ESR
ESR(CQ) versus Output Current IQ
05 _VDR_TJ.VSD
0
50
100
150
200
250
300
350
400
450
500
-40 0 40 80 120 160
Tj [°C]
VDR
[mV]
I
Q
= 400 mA
I
Q
= 100 mA
I
Q
= 10 mA
06_IQMAX_VI.VSD
0
100
200
300
400
500
600
700
800
900
010203040
V
I
[V]
I
Q,max
[mA]
V
Q
=
V
Q,nom
- 100 mV
T
j
= -40 °C
T
j
= 25 °C
T
j
= 150 °C
07_ESR_IQ.VSD
0,01
0,1
1
10
0 100 200 300 400
I
Q
[mA]
ESR(C
Q
) [Ω]
C
Q
= 22 µF
V
I
= 13.5 V
Stable
Region
Unstable
Region
Data Sheet 12 Rev. 1.01, 2009-10-19
IFX25401
Application Information
5 Application Information
Note: The following information is given as a hint for the implementation of the device only and shall not be
regarded as a description or warranty of a certain functionality, condition or quality of the device.
Figure 3 Application Diagram
A typical application circuit of the IFX25401 is shown in Figure 3. It shows a generic configuration of the voltage
regulator with a recommended minimum number of components. The small input capacitor is not required but
recommended for high frequency noise filtering. For a normal operation the fixed output voltage regulator only
requires an output capacitor for stability. The adjustable output regulator requires an additional resistor network to
configure the output voltage. Depending on the application conditons, additional components such as an input
buffer capacitor or a reverse polarity protection diode can be considered as well.
Input Filter Capacitor
A small ceramic capacitor (e.g. 100nF in Figure 3) at the device’s input helps filtering high frequency noise. To
reach the best filter effect, this capacitor should be placed as close as possible to the device’s input pin. The input
filter capacitor does not have an influence on the stability of the device’s regulation loop.
Output Capacitor CQ
The output capacitor is the only external component that is required because it is part of the regulation loop. To
maintain stability of this regulation loop, the IFX25401 requires an output capacitor respecting the values given in
“Functional Range” on Page 5.
Adjusting the Output Voltage of Variable Output Regulators IFX25401TBV, IFX25401TEV
The output voltage of the IFX25401TBV and the IFX25401TEV can be adjusted between 2.5 V and 20 V by an
external resistor divider connected to the voltage adjust pin VA.
The VA pin is connected to the internal error amplifier comparing the voltage at this pin with the internal reference
voltage (i.e. 2.5 V).
C
Q
R
1
2
R
Output
Input
IFX25401
Optional for adjustable Voltage Regulator
I
C
Voltage
Adjust
e.g. KL 15
)
*
)
*
)
*
*)
I
1Q5
GND
VA
4
3
2
EN
IFX25401
Application Information
Data Sheet 13 Rev. 1.01, 2009-10-19
Figure 4 External Components at Output for Variable Voltage Regulator
The output voltage can be easily calculated, neglecting the current flowing into the VA pin:
where
to neglect the current flowing into the VA pin,
with:
•Vref: internal reference voltage, typically 2.5V
•R1: resistor between regulator output Q and voltage adjust pin VA
•R2: resistor between voltage adjust pin VA and GND
For a 2.5 V output voltage the output pin Q has to be directly connected to the adjust pin VA.
Take into consideration, that the accuracy of the resistors R1 and R2 adds an additional error to the output voltage
tolerance.
AEB02804
Current
and
Saturation
Control
Internal
Reference
2.5 V Typical
5
V
ref
R
2
R
1
C
Q
22 µF
Q
VA
4
VQ
R1R2
+
R2
------------------- Vref
×=
R250 kΩ<
Data Sheet 14 Rev. 1.01, 2009-10-19
IFX25401
Package Outlines
6 Package Outlines
Figure 5 PG-TO263-5
BA0.25 M
±0.2
GPT09113
10
8.5 1)
(15)
±0.2
9.25
±0.3
1
0...0.15
5 x 0.8 ±0.1
±0.1
1.27
4.4
B
0.5
±0.1
±0.3
2.7
4.7
±0.5
2.4
1.7
0...0.3A
1)
7.55
4 x
All metal surfaces tin plated, except area of cut.
Metal surface min. X = 7.25, Y = 6.9
Typical
1)
0.1 B
0.1
0.05
8˚ MAX.
IFX25401
Package Outlines
Data Sheet 15 Rev. 1.01, 2009-10-19
Figure 6 PG-TO252-5
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e
Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
1) Includes mold flashes on each side.
4.56 0.25
M
A
6.5
5.7 MAX.
±0.1
per side
0.15 MAX.
-0.2
6.22
±0.5
9.98
(4.24) 1
A
1.14
5 x 0.6
±0.15
0.8
±0.1
+0.15
-0.05
0.1
B
-0.04
+0.08
0...0.15
0.51 MIN.
0.5
B
2.3
-0.10
0.5
+0.05
-0.04
+0.08
(5)
-0.01
0.9
+0.20
B
1)
All metal surfaces tin plated, except area of cut.
For further information on packages, please visit our website:
http://www.infineon.com/packages.Dimensions in mm
Data Sheet 16 Rev. 1.01, 2009-10-19
IFX25401
Revision History
7 Revision History
Revision Date Changes
1.01 2009-10-19 Coverpage changed
Overview page: Inserted reference statement to TLE/TLF series.
1.0 2009-04-28 Initial Release
Edition 2009-10-19
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
