Product Guide
Product Guide
Product Guide
■ Electro-Optical Characteristics
Part No.
Water
Clear
TYP. IF
Wavelength
Spectral Line
Half Width
Forward
Voltage VF
TYP. MAX. IF
Reverse
Current IR
MAX. V R
Viewing
Angle
(2 θ1/2)
Red
Orange
Yellow
180
200
180
70
70
70
20
20
20
635
609
592
626
605
590
15
15
15
20
20
20
1.9
1.9
1.9
2.4
2.4
2.4
20
20
20
100
100
100
5
5
5
AlInGaP
AlInGaP
AlInGaP
FR1105W
FA1105W
FY1105W
Units mcd mA nm mA mA µA V Deg.V
MIN. ∆λλ
TYP.
Peak
λλp
TYP.
Dominant
λλd
TYP. IF
Luminous
Intensity IV
Lens
Color
Emitted
Color
50°
■ Outline Dimensions
■ Features
• High brightness AllnGaP die material
• Dome lens provides intensified narrow, bright beam
• Available for both standard and reverse mounting
• Wider operating temperature: -40° ~ +100°C
■ Applications
• High-beam indicator for automotive use
• Backlighting for automotive dashboards
• Indoor / outdoor full-color signboards
Anode
Polarity Mark
PCB
Cathode
Cathode Mark
0.5
3.2
0.6 0.6
1.6
0.5
1.55
R0.8
0.3
1.6
(1.6)
(2)
(4.6)
2.3+0.05
1.6
HOLE
1.5
2.1 + 0.05
1.5
F_1105W Series, Dome Lens Type AlInGaP SMT LED
F_1105W Series, Dome Lens Type AlInGaP SMT LED
Material
Unit: mm
Tolerance + 0.1
(Ta=25°C)
■ Recommended Solder Pad
at Surface Mount ■ Recommended Solder Pad
at reverse mount
1.0 (DC) 3.33 (Pulse)
-40 to +100
-40 to +120
Red-Orange
FR
81
30
100
5
Orange-Red
FA
81
30
100
5
■Absolute Maximum Ratings
Power Dissipation
Forward Current
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Derating*
Symbol
Pd
IF
IFM
VR
Topr
Tstg
∆IF
Amber
FY
81
30
100
5
mW
mA
mA
V
°C
°C
mA/°C
* Ta=25°C, IFM applies for the pulse width ≤1msec. and duty cycle ≤1/20.
Units
Item
FR, FA, FY
(X & Y)
■Spatial Distribution
Stanley Electric Sales of Amer ica, Inc.
2660 Barranca Parkway, Irvine, CA 92606 •
• Tel: 800-LED-LCD1 (533-5231) •
• Fax: 949-222-0555
Website: www.stanley-electric.com
(Ta=25°C)
■Precautions
Please follow these handling precautions to prevent damage to the chip and
ensure its reliability.
1. Soldering conditions:
• Soldering iron: Temperature at tip of iron: 280°C max. (30W max.)
Soldering time: 3 sec. max.
• Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.)
60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max.
• Reflow Soldering:
2. Cleaning:
• If cleaning is required, use the following solutions for less than 1 minute,
at less than 40°C.
• Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
• Effect of ultrasonic cleaning on the LED resin body differs depending on such
factors as the oscillator output, size of PCB and LED mounting method. The
use of ultrasonic cleaning should be enforced at proper output after confirming
there is no problem.
Product specifications subject to change without notice. PGF_1105W-0301
Operation Heating
Pre-heating
LED Surface Temperature
Temperature
rise: 5°C/sec.
Cooling:
—5°C/sec.
60 to 120 sec. 5 sec. max
0
120
150
240
°C
~
■Operation Current Derating Chart (DC)
FR, FA, FY
■Taping Specifications
(3.45)
(0.25)
(2.1)
Center
Hole
Center
Hole
(1.85)
4+0.1
φ 1.5
+0.1
0
8+0.2
2+0.05
4+0.1
3.5+0.05
1.75+0.1
φ 1.1)
(
Quantity on tape:
2000 pieces
per reel
φ 21+0.8
9+0.3
11.4+1
φ 13+0.2
φ 180+0
3
φ 60 +1
-0
φ 13+0.2
2+0.5
■Taping Specifications
φ 1.5 (1.8) (0.25)
(0.5)
(2.2)
(3.5)
+0.1
0
4+0.1
4+0.1
2+0.05
1.75 + 0.1
3.5+0.05
8+0.2
Center
Hole
φ 1.1)
(
Quantity on tape:
2000 pieces
per reel
Cathode
RR
Direction to pull Cathode
TR
Direction to pull
for Reverse
Mount Type
for Standard
Mount Type